CN111584395B - Processing method and processing system beneficial to uniform adhesive climbing height of chip bottom sealing adhesive - Google Patents
Processing method and processing system beneficial to uniform adhesive climbing height of chip bottom sealing adhesive Download PDFInfo
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- CN111584395B CN111584395B CN202010287384.5A CN202010287384A CN111584395B CN 111584395 B CN111584395 B CN 111584395B CN 202010287384 A CN202010287384 A CN 202010287384A CN 111584395 B CN111584395 B CN 111584395B
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- 238000012545 processing Methods 0.000 title claims abstract description 25
- 230000009194 climbing Effects 0.000 title claims abstract description 24
- 238000003672 processing method Methods 0.000 title claims abstract description 13
- 239000000853 adhesive Substances 0.000 title description 14
- 230000001070 adhesive effect Effects 0.000 title description 14
- 230000009286 beneficial effect Effects 0.000 title description 9
- 239000012945 sealing adhesive Substances 0.000 title description 3
- 239000003292 glue Substances 0.000 claims abstract description 176
- 238000003466 welding Methods 0.000 claims abstract description 66
- 238000007789 sealing Methods 0.000 claims abstract description 57
- 238000004806 packaging method and process Methods 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 14
- 230000008901 benefit Effects 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 39
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000004891 communication Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83909—Post-treatment of the layer connector or bonding area
- H01L2224/83951—Forming additional members, e.g. for reinforcing, fillet sealant
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The application discloses a do benefit to chip die seal and glue climbing highly uniform processing method and processing system, processing method includes: according to the specification parameters of the chip to be packaged, calculating the total amount of the primer required by chip packaging, wherein the specification parameters comprise: the number of bare chips, the length of a single bare chip, the width of a single bare chip, the number of welding spots, the radius of a single welding spot, the height of a single welding spot, the overflow height of the bottom sealing glue and the overflow width of the bottom sealing glue; dividing the total amount of the bottom sealing glue into two parts, wherein one part is the diagonal glue dispensing amount of the chip, and the other part is the glue filling amount of the glue filling edge of the chip; glue filling is carried out on the glue filling edges according to the glue filling amount, and glue dispensing is carried out on the opposite corners according to the glue dispensing amount. According to the method, the existing glue filling mode is changed, the amount of the bottom sealing glue is divided into two parts, after the glue filling edge is filled in the shape of a Chinese character 'in' and the opposite angle of the glue filling edge is used for dispensing, the problem of uneven glue climbing height is solved, and the reliability of a product is improved.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a processing method and a processing system which are beneficial to the uniform glue climbing height of chip underfilling.
Background
The underfill is applied by using a siphon (Capillary) phenomenon to fill the gap with the underfill. The method can be applied to the gap between the SMT device and the PCB in the flip chip manufacturing process, so that the reliability is improved, and the service life of the device is prolonged.
In the process of filling the bottom sealing glue of a plurality of chips, the height difference between the chips and the substrate can influence the fluidity of glue, so that the glue climbing height at the opposite corners of the glue filling edges is uneven, and the reliability risk is increased.
Disclosure of Invention
In view of the above-mentioned drawbacks or shortcomings in the prior art, it is desirable to provide a processing method and a processing system that are beneficial to the uniformity of the adhesive climbing height of the underfill, so as to effectively solve the problem of uneven adhesive climbing height of the underfill caused by the height difference between the chip and the substrate after the flip chip is flipped, and improve the reliability of the product.
In a first aspect, the present invention provides a method for facilitating a highly uniform adhesive climbing of a chip underfill, including:
according to the specification parameters of the chip to be packaged, calculating the total amount of the primer required by chip packaging, wherein the specification parameters comprise: the number of bare chips, the length of a single bare chip, the width of a single bare chip, the number of welding spots, the radius of a single welding spot, the height of a single welding spot, the overflow height of the bottom sealing glue and the overflow width of the bottom sealing glue;
dividing the total amount of the bottom sealing glue into two parts, wherein one part is the diagonal glue dispensing amount of the chip, and the other part is the glue filling amount of the glue filling edge of the chip;
and controlling the glue filling equipment to fill glue at the glue filling edge according to the glue filling amount, and controlling the glue dispensing equipment to dispense glue at opposite angles according to the glue dispensing amount.
Further, before the step of calculating the total amount of the underfill required for packaging the chip according to the specification parameters of the chip to be packaged, the method further comprises:
and inputting specification parameters of the chip to be packaged, wherein the specification parameters are directly read from a drawing of the chip delivery.
Further, the total amount of primer required includes: filling amount in gap between bare chip and substrate and overflow amount of underfill.
Further, the filling amount in the gap between the bare chip and the substrate is equal to the product of the sequential multiplication of the length of the bare chip, the width of the bare chip, the height of the welding spot and the number of the bare chips, and the density of the bottom sealing glue is multiplied after the difference between the volume of the gap between the bare chip and the substrate and the volume of the welding spot; the volume of the welding spot is equal to the product of the square of the radius of the welding spot, the height of the welding spot and the number of welding spots multiplied in sequence by 3.14 times.
Further, the overflow amount of the underfill is equal to the product of the overflow height of the underfill, the overflow width of the underfill, the sum of the lengths of the individual bare chips and the widths of the individual bare chips, and the density of the underfill multiplied in sequence.
Further, the diagonal dispensing amount is the number of die multiplied by the diagonal dispensing amount required by a single die, and the diagonal dispensing amount required by the single die is at least 2mg according to the length of the single die and the width of the single die.
In a second aspect, the present invention provides a processing system for facilitating a uniform adhesive climbing height of a chip underfill, where the processing system is respectively connected to an adhesive filling device and an adhesive dispensing device, and the processing system includes:
the calculating unit is used for calculating the total amount of the primer required by chip packaging according to the specification parameters of the chip to be packaged, wherein the specification parameters comprise: the number of bare chips, the length of a single bare chip, the width of a single bare chip, the number of welding spots, the radius of a single welding spot, the height of a single welding spot, the overflow height of the bottom sealing glue and the overflow width of the bottom sealing glue;
the component unit is used for dividing the total amount of the bottom sealing glue into two parts, wherein one part is the amount of the corner aligning glue of the chip, and the other part is the glue filling amount of the glue filling edge;
the control unit is used for controlling the glue filling equipment to fill glue at the glue filling edge according to the glue filling amount, and controlling the glue dispensing equipment to dispense glue at opposite angles according to the glue dispensing amount.
Further, the method further comprises the following steps:
the input unit is used for inputting specification parameters of the chip to be packaged, and the specification parameters are directly read from a drawing of the chip delivery.
Further, the calculating unit calculates the total amount of the underfill required for packaging the chip according to the specification parameters of the chip to be packaged, where the total amount of the underfill required includes: filling amount in gap between bare chip and substrate and overflow amount of underfill.
Further, the calculating unit calculates the total amount of the underfill required for packaging the chip according to the specification parameters of the chip to be packaged, and the method further includes:
the filling amount in the gap between the bare chip and the substrate is equal to the product of the sequential multiplication of the length of the bare chip, the width of the bare chip, the height of the welding spot and the number of the bare chips, and the density of the bottom sealing glue is multiplied after the difference between the volume of the gap between the bare chip and the substrate and the volume of the welding spot; the volume of the welding spot is equal to the product of the square of the radius of the welding spot, the height of the welding spot and the number of the welding spots which are multiplied in sequence, wherein the square is 3.14 times;
the overflow amount of the bottom sealing glue is equal to the product of the overflow height of the bottom sealing glue, the overflow width of the bottom sealing glue, the sum of the length of the single bare chip and the width of the single bare chip and the density of the bottom sealing glue, which are multiplied in sequence.
According to the processing method and the processing system which are beneficial to the uniform glue climbing height of the chip bottom sealing glue, the total amount of the filling glue needed by the chip packaging is determined according to the size of the chip, the size of the salient point and the height and width of the overflow of the bottom sealing glue, the glue is filled in a straight shape at the glue filling edge, then the glue is aligned at the diagonal position of the glue filling edge by using a glue dispensing tool, the uniform glue climbing height of the bottom sealing glue is realized, the newly increased quality problem is not brought, and the reliability of products is improved.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the following drawings, in which:
FIG. 1 is a flow chart of a method for facilitating a highly uniform dispensing of a underfill encapsulant for a chip according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of underfill between a bare chip and a substrate in an embodiment of the invention;
fig. 3 is a schematic diagram of a processing system for facilitating a highly uniform dispensing of a die attach adhesive according to another embodiment of the present invention.
Detailed Description
The present application is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be noted that, for convenience of description, only the portions related to the invention are shown in the drawings.
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
The semiconductor production process comprises wafer manufacturing, wafer testing, chip packaging and post-packaging testing. And in the chip packaging process, the chip is inverted and welded on the substrate, and then the sealing is realized by filling the underfill.
The primer protects the chip from being polluted by environment such as moisture, ions and the like, is beneficial to the chip to work normally under severe environment, is resistant to mechanical vibration and impact, reduces the influence of thermal expansion mismatch between the chip and the substrate, can avoid too concentrated stress and strain at the bump connection positions far away from the center and four corners of the chip, and finally greatly improves the reliability of the chip.
However, since the solder joints of the chips have a difference in size in the manufacturing process, after the flip chip bonding is completed, the height between each chip and the substrate has a difference, which is unavoidable, and when the plurality of chips are filled together, the glue climbing height unevenness of the diagonal corners of the glue filling edges is affected, thereby affecting the reliability of the product.
Based on the above-mentioned problem, the embodiment of the application provides a do benefit to chip underfilling to climb and glue highly even processing method, and the application provides a do benefit to chip underfilling to climb and glue highly even processing method can be implemented based on processing system, also can install on other terminal equipment, cooperates outside to fill gluey equipment, fills gluey at the play of gluing limit to the chip, then cooperates the point to glue equipment and carries out the point to glue at the diagonal angle.
The embodiment of the application provides a processing method beneficial to the uniformity of the adhesive climbing height of the chip under-sealing adhesive, as shown in fig. 1, specifically comprising the following steps:
s10, inputting specification parameters of a chip to be packaged, wherein the specification parameters comprise: the number of bare chips, the length of a single bare chip, the width of a single bare chip, the number of welding spots, the radius of a single welding spot, the height of a single welding spot, the overflow height of the bottom sealing glue and the overflow width of the bottom sealing glue;
in the above steps, in the chip package, a plurality of bare chips exist on a single substrate, the bare chips are soldered on the substrate, and the gap between the bare chips and the substrate needs to be filled with the underfill. The usage amount of the underfill seriously affects the reliability of the product, if the usage amount of the underfill is too small, the underfill can not completely fill the gap between the whole bare chip and the substrate due to the fluidity of the underfill and the difference of the welding heights between the bare chip and the substrate, and if the usage amount of the underfill is too large, the bare chip can be polluted, so that the reliability risk of the product is increased. Therefore, the dosage of the primer is required to be calculated, the reliable sealing of the gap between the bare chip and the substrate is ensured, and the problem of uneven height due to the climbing of the primer is avoided.
In the above steps, the number of bare chips refers to the number of bare chips simultaneously provided on one substrate, where the number of bare chips can be manually obtained; the length, width and height of a single bare chip can be measured and recorded by a microscope in the outside, and can also be directly inquired from a factory drawing of the chip by people; the welding spots are the bumps formed by welding flux and are welded on the substrate, the welding bumps can be regarded as columnar, and the quantity of the welding spots and the radius and the height of a single welding spot are measured, so that the consumption of the bottom sealing glue occupied by the welding spots in the process of climbing glue is conveniently calculated. The number, radius and height of the welding spots are generally determined during wafer processing and can be obtained through drawings. Since the contact between the solder joint and the substrate and the bare chip can be regarded as surface contact, the underfill can be considered to flow completely through the entire solder joint during the flow process; in order to ensure the reliability of the product, the underfill is required to overflow to a proper height in the process of climbing, and likewise, the overflow height and the overflow width of the underfill can be selected in advance, wherein the reference chip refers to a batch of chips with the dimension specification meeting the standard, the height between the bare chip and the substrate after welding is uniform, the reference chip is filled with the underfill, and the overflow height and the overflow width of the underfill are observed under a microscope. The underfill height and width of a single reference chip may be considered the overflow height and width of a single chip to be packaged.
S20, calculating the total amount of the primer required by chip packaging according to the specification parameters of the chip to be packaged;
it should be noted that:
because the reliable seal of chip, the bottom seal needs to follow the edge of filling glue and starts, evenly climbs the gap between whole bare chip and the base plate in proper order to the opposite side at the edge of filling glue of bare chip climbs the glue height and needs to reach certain height, and other both sides of bare chip also can need the overflow of certain height and thickness to glue, just can realize sealedly. Here, the gap volume between the bare chip and the substrate should be the height of the solder joint multiplied by the area of the bare chip, while the volume of the solder joint should be considered. Thus, the total amount of primer required includes: filling quantity in gaps between the chip to be packaged and the substrate and overflow quantity of the underfill. Namely, the total amount of the underfill required for chip packaging is equal to the volume of the gap between the bare chip and the substrate minus the volume of the solder joint plus the volume of the overflowed quantity multiplied by the density of the underfill, and 0.00165g/mm is taken in the embodiment 3 . Wherein, the volume of the gap between the bare chip and the substrate is equal to the product of the sequential multiplication of the length of the bare chip, the width of the bare chip, the height of the welding spot and the number of the bare chips; the volume of the welding spot is equal to the product of the square of the radius of the welding spot, the height of the welding spot and the number of the welding spots which are multiplied in sequence, wherein the square is 3.14 times; the overflow amount of the bottom sealing glue is equal to the product of the overflow height of the bottom sealing glue, the overflow width of the bottom sealing glue, the sum of the length of the single bare chip and the width of the single bare chip and the density of the bottom sealing glue, which are multiplied in sequence. As shown in fig. 2, fig. 2 shows a schematic structure of filling an underfill between a bare chip and a substrate, wherein 1. The bare chip, 2. The substrate, 3. The solder joints, the gray part is the underfill, the overflow amount part is approximately a triangular prism shape, the volume of which is equal to the area of the triangle of the bottom surface multiplied by the height, wherein the area of the triangle of the bottom surface is 1/2 times the overflow height C multiplied by the overflow width a, the height of the prism is the expansion of the triangular prism, and the height is the length of the bare chip plus the width of the bare chip. Here, since the four sides of the bare chip all need to overflow to the same extent, it is necessary to multiply by 2 again.
S30, dividing the total amount of the bottom sealing glue into two parts according to a preset rule, wherein one part is the chip diagonal glue amount, and the other part is the glue filling amount of the glue filling edge.
In this step, the total amount of the underfill in S20 is divided into two parts, wherein the predetermined rule is that, according to experience and experiment, during the chip packaging process, glue is filled in a certain amount at the glue filling edge, and after the edge-climbing glue, the glue amount of the diagonal point glue of each bare chip is generally set to at least 2mg due to the influence of the length of the bare chip and the width of the bare chip in consideration of the fluidity of the glue and the height difference between the chip and the substrate. Therefore, the amount of the diagonal glue is at least the number of bare chips multiplied by 2mg, and the glue filling amount of the glue filling edge is equal to the total amount of the bottom sealing glue minus the amount of the diagonal glue.
And S40, glue filling is carried out on the glue filling edges according to the glue filling amount, and glue dispensing is carried out on the opposite corners according to the glue dispensing amount.
Here, glue filling is performed on the glue filling edge according to a normal glue filling mode, and spot dispensing is performed on the diagonal spot by a dispensing machine.
In a second aspect, the present application provides a processing system for facilitating a high uniformity of a glue climbing of a chip underfill, where the processing system is connected to a glue filling device and a glue dispensing device, respectively, as shown in fig. 3, and the processing system includes:
the calculating unit 100 is configured to calculate, according to a specification parameter of a chip to be packaged, a total amount of underfill required for packaging the chip, where the specification parameter includes: the number of bare chips, the length of a single bare chip, the width of a single bare chip, the number of welding spots, the radius of a single welding spot, the height of a single welding spot, the overflow height of the bottom sealing glue and the overflow width of the bottom sealing glue;
the component unit 200 is configured to divide the total amount of the underfill into two parts, wherein one part is a dispensing amount of the opposite corners of the chip, and the other part is a filling amount of the filling edge;
the control unit 300 is configured to control the glue filling device to fill glue on the glue filling edge according to the glue filling amount, and control the glue dispensing device to perform glue dispensing on the opposite corners according to the glue dispensing amount.
Further, the packaging device also comprises an input unit for inputting specification parameters of the chip to be packaged, wherein the specification parameters are directly read from a drawing of the chip delivery. The input unit can be on a man-machine interaction interface, different areas can be arranged on the man-machine interaction interface, the areas are respectively the number of bare chips, the length of single bare chips, the width of single bare chips, the number of welding spots, the radius of single welding spots, the height of single welding spots, the overflow height of the bottom sealing glue and the overflow width of the bottom sealing glue, and an operator can directly input specific values in the corresponding areas to adjust the operation of the calculation unit. The input unit can also set a database in the system to store the specification parameters of the chip to be packaged in the database in advance, and can directly call the specification parameters in the database through the command.
Further, the calculating unit calculates the total amount of the underfill required for packaging the chip according to the specification parameters of the chip to be packaged, where the total amount of the underfill required includes: filling amount in gap between bare chip and substrate and overflow amount of underfill.
The filling amount in the gap between the bare chip and the substrate is equal to the product of the sequential multiplication of the length of the bare chip, the width of the bare chip, the height of the welding spot and the number of the bare chips, and the density of the bottom sealing glue is multiplied after the difference between the volume of the gap between the bare chip and the substrate and the volume of the welding spot; the volume of the welding spot is equal to the product of the square of the radius of the welding spot, the height of the welding spot and the number of the welding spots which are multiplied in sequence, wherein the square is 3.14 times;
the overflow amount of the bottom sealing glue is equal to the product of the overflow height of the bottom sealing glue, the overflow width of the bottom sealing glue, the sum of the length of the single bare chip and the width of the single bare chip and the density of the bottom sealing glue, which are multiplied in sequence.
It should be noted that, the application provides a do benefit to chip underfilling to climb high even processing system of gluing, this system for need cooperate outside to fill gluey equipment and some gluey equipment use, can pass through the network interconnect between this processing system and outside fill gluey equipment and the some gluey equipment, and communication network includes various connection types, for example wired communication link, wireless communication link or optic fibre. The processing system and the external glue filling equipment and the glue dispensing equipment can be connected through wires, the processing system can be arranged on a terminal equipment, the terminal equipment is hardware, and the processing system can be various electronic equipment, including but not limited to electronic equipment such as a smart phone, a tablet computer, a notebook computer, a personal digital terminal, a desktop computer, a smart sound box, a smart watch and the like. Likewise, the processing system can be built in the existing glue filling equipment or the glue dispensing equipment, and is realized by changing the control systems in the existing glue filling equipment and the glue dispensing equipment.
In summary, the processing method and the processing system beneficial to the uniformity of the adhesive climbing height of the chip underfilling adhesive can effectively solve the problem of non-uniformity of the adhesive climbing heights of the opposite angles of the adhesive filling edges of a plurality of chips, can not bring about the newly increased quality problem, and improves the reliability of products. According to the processing method beneficial to the uniform glue climbing height of the chip bottom sealing glue, the total quantity of the bottom sealing glue required by the chip packaging is obtained through quantitative calculation, the existing glue filling mode is changed, glue filling is carried out on the glue filling edges, then glue dispensing is carried out on the opposite corners, and the problem of nonuniform glue climbing height of the existing glue filling edges is solved.
The foregoing description is only of the preferred embodiments of the present application and is presented as a description of the principles of the technology being utilized. It will be appreciated by persons skilled in the art that the scope of the invention referred to in this application is not limited to the specific combinations of features described above, but it is intended to cover other embodiments in which any combination of features described above or equivalents thereof is possible without departing from the spirit of the invention. Such as the above-described features and technical features having similar functions (but not limited to) disclosed in the present application are replaced with each other.
Claims (8)
1. A processing method for facilitating the uniform climbing of chip bottom sealing glue is characterized by comprising the following steps:
calculating the total amount of the primer required for chip packaging according to specification parameters of the chip to be packaged, wherein the specification parameters comprise: the number of bare chips, the length of a single bare chip, the width of a single bare chip, the number of welding spots, the radius of a single welding spot, the height of a single welding spot, the overflow height of the bottom sealing glue and the overflow width of the bottom sealing glue; the total amount of the required primer includes: filling quantity in gaps between the bare chip and the substrate and overflow quantity of the underfill; the overflow amount of the bottom sealing glue is equal to the product of the overflow height of the bottom sealing glue, the overflow width of the bottom sealing glue, the sum of the length of the single bare chip and the width of the single bare chip, and the density of the bottom sealing glue which are multiplied in sequence;
dividing the total amount of the bottom sealing glue into two parts, wherein one part is the glue dispensing amount of the opposite corners of the chip, and the other part is the glue filling amount of the glue filling edges of the chip;
and controlling the glue filling equipment to fill glue on the glue filling edge according to the glue filling amount, and controlling the glue dispensing equipment to dispense glue on opposite angles according to the glue dispensing amount.
2. The method of claim 1, further comprising, prior to the step of calculating the total amount of underfill required for chip packaging based on the specification parameters of the chip to be packaged:
inputting the specification parameters of the chip to be packaged, wherein the specification parameters are directly read from a drawing of the chip delivery.
3. The method of claim 1, wherein the filling amount in the gap between the die and the substrate is equal to a product of sequentially multiplying a length of the die, a width of the die, a height of the solder joint, and a number of the die by a density of the underfill after a difference between a volume of the gap between the die and the substrate and a volume of the solder joint; the volume of the welding spot is equal to 3.14 times of the product of the square of the radius of the welding spot, the height of the welding spot and the number of the welding spots multiplied in sequence.
4. The method of claim 1, wherein the diagonal dispensing amount is the number of die times the diagonal dispensing amount required for the single die, the diagonal dispensing amount required for the single die being at least 2mg based on the length of the single die and the width of the single die.
5. Do benefit to chip die seal and glue climbing highly uniform processing system, a serial communication port, processing system connects filling equipment and some gluey equipment respectively, processing system includes:
the calculating unit is used for calculating the total amount of the primer required by chip packaging according to the specification parameters of the chip to be packaged, wherein the specification parameters comprise: the number of bare chips, the length of a single bare chip, the width of a single bare chip, the number of welding spots, the radius of a single welding spot, the height of a single welding spot, the overflow height of the bottom sealing glue and the overflow width of the bottom sealing glue;
the component unit is used for dividing the total amount of the bottom sealing glue into two parts, wherein one part is the glue dispensing amount of the opposite corners of the chip, and the other part is the glue filling amount of the glue filling edges;
and the control unit is used for controlling the glue filling equipment to fill glue on the glue filling edge according to the glue filling amount, and controlling the glue dispensing equipment to perform glue dispensing on opposite angles according to the glue dispensing amount.
6. The system of claim 5, further comprising:
the input unit is used for inputting the specification parameters of the chip to be packaged, and the specification parameters are directly read from a drawing of the chip delivery.
7. The system of claim 5, wherein the calculating unit calculates a total amount of underfill required for packaging the chip according to the specification parameters of the chip to be packaged, the total amount of the required underfill including: filling amount in gap between bare chip and substrate and overflow amount of underfill.
8. The system of claim 7, wherein the calculating unit calculates the total amount of underfill required for chip packaging according to the specification parameters of the chip to be packaged, further comprising:
the filling amount in the gap between the bare chip and the substrate is equal to the product of the sequential multiplication of the length of the bare chip, the width of the bare chip, the height of the welding spot and the number of the bare chips, wherein the product is obtained by multiplying the volume of the gap between the bare chip and the substrate by the density of the underfill after the difference is made between the volume of the gap between the bare chip and the substrate and the volume of the welding spot; the volume of the welding spot is equal to 3.14 times of the product of the square of the radius of the welding spot, the height of the welding spot and the number of the welding spots multiplied in sequence;
the overflow amount of the bottom sealing glue is equal to the product of the overflow height of the bottom sealing glue, the overflow width of the bottom sealing glue, the sum of the length of the single bare chip and the width of the single bare chip, and the density of the bottom sealing glue which are multiplied in sequence.
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| CN112833799B (en) * | 2021-01-07 | 2022-07-08 | 甬矽电子(宁波)股份有限公司 | Soldering flux glue climbing height detection device and detection method |
| CN114529525A (en) * | 2022-02-18 | 2022-05-24 | 岳阳珞佳智能科技有限公司 | Chip glue climbing height extraction method and system based on full convolution network |
| CN114637352B (en) * | 2022-03-17 | 2023-01-03 | 杭州名光微电子科技有限公司 | Chip preparation point gum machine on-line control management system based on machine vision |
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