CN111584389A - Automatic burn-in test equipment - Google Patents
Automatic burn-in test equipment Download PDFInfo
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- CN111584389A CN111584389A CN202010538095.8A CN202010538095A CN111584389A CN 111584389 A CN111584389 A CN 111584389A CN 202010538095 A CN202010538095 A CN 202010538095A CN 111584389 A CN111584389 A CN 111584389A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses an automatic burn-in test device, which comprises: a loading area for placing the carrying disc carrying the wafer to be tested; a blanking region for collecting the carrier plate carrying the tested wafer; the test units are arranged between the feeding area and the discharging area side by side and comprise at least one layer of frame and a plurality of test modules, and the layer of frame is formed by a plurality of platforms with different heights into a plurality of test areas; the plurality of test modules are respectively arranged in the test areas with corresponding heights, and the test modules can perform preheating, temperature rising and test operation; the feeding and discharging transfer area is connected with the feeding area, the discharging area and the plurality of test units and comprises a mechanical arm, a moving mechanism and a track group, the moving mechanism bears the mechanical arm to move to a preset position on the track group, and the mechanical arm transfers the carrying disc from the feeding area to the test area or from the test area to the discharging area; the invention utilizes the three-dimensional multi-layer test area, reduces the occupied area of equipment, improves the test yield and efficiency and reduces the cost.
Description
Technical Field
The invention belongs to the technical field of automatic pre-burning test equipment, and particularly provides equipment which is provided with a plurality of three-dimensional and multi-layer test areas and can perform preheating and temperature rising tests.
Background
As shown in fig. 1, a schematic diagram of a conventional wafer burn-in test apparatus includes a burn-in board 11, a lifting mechanism 12, a card-buckling mechanism 13, a conveyor belt 14, and a control computer 15. A plurality of wafers (not shown) to be tested are carried by a metal carrier 16. The metal carrier 16 advances by the conveyer 14 in sequence, the burn-in board 11 is controlled by the lifting mechanism 12 to descend and contact with the metal carrier 16, the latch mechanism 13 is locked when contacting, the burn-in board 11 is also provided with a pin base responsible for contacting with the chip to be tested besides the heating device, the heating temperature is controlled by the control computer 15, and the pin base is used for electrical connection and related burn-in test operation.
Because the pre-burning test operation needs preheating and heating, and then the related electrical test can be performed, the required test time is long, the operation mode of the conveyer belt 13 is that after all test operations are completed, the conveyer belt can move into the next group of metal carrying discs 16, so that a lot of invalid waiting time is wasted, although manufacturers can place a plurality of groups of metal trays 16 and a plurality of groups of pre-burning boards 11 on the conveyer belt 13 for efficiency improvement and simultaneously perform the test, by increasing the test quantity and improving the efficiency, the long conveying waiting time is a problem which cannot be overcome, the mode still cannot meet the requirements of the manufacturers, and a large-area factory building is needed to install the production line, so the inventor designs the automatic pre-burning test equipment.
Disclosure of Invention
The invention aims to provide automatic pre-burning test equipment, which mainly designs a plurality of test areas with a three-dimensional multilayer structure, and can carry out transfer on other carrier discs to be tested or tested in the waiting processes of pre-burning, heating and testing, thereby improving the overall test efficiency and solving the problems in the prior art.
In order to achieve the above object, an embodiment of the present invention provides the following technical solutions:
in one embodiment, an automated burn-in test apparatus is provided, comprising: a loading area for placing the carrying disc carrying the wafer to be tested; a blanking area for collecting the carrier plate carrying the tested wafer; the test units are arranged between the feeding area and the discharging area side by side and comprise at least one layer of frame and a plurality of test modules, and the layer of frame is formed by a plurality of platforms with different heights into a plurality of test areas; the plurality of test modules are respectively arranged in the test areas with corresponding heights, and the test modules can perform preheating, temperature rising and test operation; the feeding and discharging transfer area is connected with the feeding area, the discharging area and the plurality of test units and comprises a mechanical arm, a moving mechanism and a track group, wherein the moving mechanism bears the mechanical arm to move to a preset position on the track group, and the mechanical arm transfers the carrying disc from the feeding area to the test area or from the test area to the discharging area.
Preferably, the test unit is provided with two layer frames, and the two layer frames are respectively arranged at the positions on two opposite sides of the feeding and discharging transfer area, so that the number of the test areas can be increased, and the test efficiency is improved.
Preferably, the number of the test units arranged between the loading area and the unloading area can be increased or decreased according to requirements, so that the test units can be adjusted to the optimal test configuration according to the test time required by different wafers.
Preferably, the feeding area comprises: the loading device comprises at least one loading storage area, a loading exchange area and a loading carrying module, wherein the loading discs are stacked in the loading storage area, and the loading carrying module moves the loading discs from the loading storage area to the loading exchange area.
Preferably, the loading tray is moved to the testing area from the loading exchange area by a mechanical arm.
Preferably, the loading area further comprises at least one empty tray storage area and a wafer taking and placing module, and at least one empty carrier tray is placed in the empty tray storage area; the wafer taking and placing module is used for taking out the wafer to be tested at the specific position on the carrying tray in the loading exchange area and moving the wafer to be tested on the empty carrying tray.
Preferably, the blanking area comprises: the unloading transport module moves the carrier disc from the unloading exchange area to the loading storage area for storage.
Preferably, the blanking area further comprises at least one good product storage area, at least one bad area storage area and a blanking wafer taking and placing module, and the good product storage area is provided with at least one good product carrying disc; at least one defective product carrying disc is placed in the defective area storage area; the blanking wafer picking and placing module is used for moving the defective wafers on the carrying disc in the blanking exchange area to the defective carrying disc and transferring the defective wafers on the defective carrying disc to vacant positions on the carrying disc in the blanking exchange area.
Preferably, the loading disc is moved to the blanking exchange area from the test area by a mechanical arm.
Compared with the prior art, the invention has the following specific effects:
1. the layer frame comprises a plurality of test areas formed by a plurality of platforms with different heights, and the plurality of test areas of the multilayer framework can carry other load trays for bearing wafers to be tested or tested in the waiting process of pre-burning, heating and testing of a single load tray, so that the integral test efficiency is improved.
2. A plurality of test areas are arranged on the two opposite sides of the feeding and discharging transfer area, so that the yield is increased, and the efficiency is improved.
3. The test units can increase or decrease the number between the material loading area and the material discharging area according to the requirement, so that the optimal working configuration can be adjusted according to the pre-burning temperature rise and the test time required by different wafers, and the optimal working efficiency can be exerted.
4. The chips that are not necessary to be tested can be picked out from the loading area, and then the defective products are removed and filled up according to the testing result, so as to satisfy the requirement of actual mass production.
5. By adopting the three-dimensional multi-layer test area structure, the number of tests can be increased on the unit area, the required plant area is saved, the plant investment cost is reduced, and the profit is also improved by increasing the test quantity.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Figure 1 is a schematic diagram of a prior art wafer burn-in test apparatus;
FIG. 2 is a schematic plan view of an automated burn-in test apparatus according to an embodiment of the present application;
FIG. 3 is a longitudinal configuration diagram of an automated burn-in test apparatus according to an embodiment of the present application;
FIG. 4 is an enlarged schematic view of a test module of an automated burn-in test apparatus according to an embodiment of the present disclosure;
figure 5 is an illustration of a plan view of an automated burn-in test apparatus according to one embodiment of the present application.
The reference numbers illustrate:
11, pre-burning a board; 12, a lifting mechanism; 13, a buckling mechanism; 14, a conveying belt; 15, a control computer, 16, a metal carrying disc;
20, a feeding area; 21, a feeding storage area; 211, a lifting mechanism; 22, a feeding exchange area; 23, a loading and carrying module; 24, an empty disc storage area; 25, a chip picking and placing module;
30, a blanking area; 31, a blanking storage area; 311, a lifting mechanism; 32, a blanking exchange area; 33, a blanking and carrying module; 34, a good product storage area; 35, a bad area storage area; 36, a blanking wafer picking and placing module;
40, a test unit; 41, a shelf; 411 is a platform; 412, a test area; 42, a test module; 421 a needle measuring seat; 4211 testing the circuit board; 422, a heating seat; 423, a lifting mechanism;
50, a feeding and discharging transfer area; 51, a mechanical arm; 52, a moving mechanism; 53, track group;
60, a carrying disc; 61, good product carrying disc; 62, defective goods carrying disc.
Detailed Description
The present invention will be described in detail below with reference to embodiments shown in the drawings. The embodiments are not intended to limit the present invention, and structural, methodological, or functional changes made by those skilled in the art according to the embodiments are included in the scope of the present invention.
As shown in fig. 2, a plan view of an automated burn-in test apparatus according to an embodiment of the present invention is shown. An embodiment of the present invention provides an automatic burn-in test apparatus, including: a loading area 20, a unloading area 30, a plurality of test units 40, and a loading and unloading transfer area 50. The loading area 20 is placed with a carrier tray 60 carrying wafers to be tested. The blanking zone 30 collects the carrier tray 60 carrying the tested wafers. A plurality of test units 40 are arranged side by side between the feeding section 20 and the discharging section 30. The mechanism in the loading/unloading transfer area 50 is responsible for transferring the carrier tray 60 from the loading area 20 to the test unit 40 or from the test unit 40 to the unloading area 30. Fig. 3 is a longitudinal configuration diagram of an automated burn-in test apparatus according to an embodiment of the present invention, in which a test unit 40 is designed as a three-dimensional multi-layer test environment, so as to improve test throughput and efficiency.
Next, a detailed description is given of the components, with reference to fig. 2 and 3:
the loading area 20 is used for placing a plurality of carrier trays 60 for carrying wafers to be tested. The feeding area 20 includes: at least a loading storage area 21, a loading exchange area 22, and a loading carrying module 23. The tray 60 for carrying the wafer to be tested can be stacked on the loading and storing area 21. In this embodiment, the loading storage area 11 has two parts and is respectively located at two sides of the loading exchange area 22. The loading storage area 21 has a lifting mechanism 211 therein to maintain one of the trays 60 at a level equal to the loading exchange area 22. The loading and transporting module 23 is used to move the tray 60 from the loading storage area 21 to the loading exchange area 22. The material loading and carrying module 23 may be a push rod or a slide rail mechanism to facilitate the movement of the tray 60.
In long-term operation, the testing unit 40 may have a failure in an internal testing station (Site) of a probe pin 421 (please refer to fig. 4) of a part of the testing modules 42, so that the corresponding wafer to be tested on the carrier 60 needs to be taken out in advance before the testing operation, thereby avoiding unnecessary burn-in and testing operations. Therefore, the loading area 20 of the present embodiment further includes at least one empty tray storage area 24 and a wafer pick-and-place module 25. The hollow disc storage area 24 has two in this embodiment. The empty tray storage area 24 is configured to receive at least one empty carrier tray 60 therein. When the wafer picking and placing module 25 is a set of mechanical picking and placing arms capable of moving horizontally (XY axis), and the carrier tray 60 carrying the wafers to be tested moves to the loading exchange area 22, the controller inside the automatic burn-in test equipment starts the wafer picking and placing module 25 to pick out the wafers to be tested at the specific positions on the carrier tray 60 in the loading exchange area 22 according to the specific positions which cannot be tested, and moves the carrier tray 60 in the empty tray storage area 24 to allow the carrier tray 60 in the loading exchange area 22 to carry the wafers to be tested at the correct number and position.
The blanking area 30 is used to collect the carrier tray 60 carrying the tested wafers. The blanking area 30 at least comprises: at least a blanking storage area 31, a blanking exchange area 32, and a blanking conveying module 33. The carrier plate 60 carrying the tested wafers is placed in the unloading exchange area 32, and then the unloading carrying module 33 moves the carrier plate 60 from the unloading exchange area 32 to the unloading storage area 31 for storage and collection. The material storage area 31 has a lifting mechanism 311, so that the trays 60 moved to this area can be stacked in sequence. The unloading carrying module 33 can be a push rod or a slide rail mechanism for moving the carrying tray 60.
In addition, the present invention is designed to make the wafers on the carrier tray 60 in the unloading storage area 31 all good. The feeding area 30 further includes at least one good area 34, at least one bad area 35 and a feeding chip pick-and-place module 36. The good product storage area 34 is disposed with at least one good product carrying tray 61, and the good product carrying tray 61 can be filled with good product chips in advance. The defect area storage area 35 is used for placing at least one defect carrier 62, and the defect carrier 62 can be an empty carrier. The unloading wafer pick-and-place module 36 is a mechanical pick-and-place arm capable of moving horizontally. The unloading wafer picking and placing module 36 can move the defective wafers on the carrier tray 60 in the unloading exchange area 32 to the defective carrier tray 62 according to the wafer test result, and move the good wafers on the good carrier tray 61 to the empty space on the carrier tray 60 in the unloading exchange area 32, or fill the empty space. The tray 60 is then moved to the material storage area 31 by the material transporting module 33 for stacking and collecting.
A plurality of test units 40 are arranged side by side between the feeding section 20 and the discharging section 30. The number of test units 40 disposed between the loading area 20 and the unloading area 30 can be increased or decreased as required to achieve the most efficient production configuration. The test unit 40 includes: at least one shelf 41, which is composed of a plurality of platforms 411 with different heights to form a plurality of test areas 412; the plurality of test modules 42 are respectively disposed in the test areas 412 with corresponding heights, and the test modules 42 perform preheating and testing operations.
The testing module 42 is a device capable of performing preheating, temperature raising and testing operations, and can be designed in different ways according to the needs of manufacturers. As shown in fig. 4, the test module 42 includes a probe seat 421, a heating seat 422, and a lifting mechanism 423. The probe seat 421 has a plurality of test circuit boards 4211 mounted on the top thereof, and a plurality of probe sets (not shown) disposed on the bottom thereof, each probe set corresponding to one of the wafers to be tested for contacting with the wafer to be tested and testing the wafer. The heating base 422 may be elevated by an elevating mechanism 423. The boat 60 carrying the wafer to be tested is moved in and placed on the heating stage 422. The heating base 422 can be preheated to a temperature higher than the testing temperature before testing, so that when the carrying tray 60 contacts the heating base 422, the heating time of the internal wafer to be tested to the testing temperature can be shortened, and the testing efficiency can be improved. The operation mode of the test module 42 is that the carrier plate 60 is placed on the heating base 422 to heat synchronously, the lifting mechanism 423 is also operated synchronously, when the carrier plate is lifted to the highest point position, the wafer to be tested in the carrier plate 60 contacts with the probe seat 421, and the related electrical test operation is performed when the predetermined temperature is reached.
The material inlet and outlet transfer area 50 is connected to the material inlet area 20, the material outlet area 30 and the plurality of test units 40. The charging/discharging transfer area 50 includes: a robot arm 51, a moving mechanism 52, and a track group 53. The track set 53 is formed by connecting a plurality of tracks in series, and the length corresponds to the number of the test units 40, so that the moving mechanism 52 can move on the track set 53. The moving mechanism 52 is responsible for moving the carrying robot arm 51 to predetermined positions, which include: adjacent to the loading zone 20, to the individual test units 40 or to the unloading zone 30. The robot arm 51 is an automated robot arm that can be rotationally moved in three axes. The robot 51 can remove the tray 60 from the loading exchange area 22 of the loading area 20, move the tray to the testing unit 40 at the corresponding position by the moving mechanism 52, turn to the testing unit to be placed in the testing area 412 at the corresponding height, and then perform the preheating and testing operations by the testing module 42. During the time waiting for the test result, the robot arm 51 is driven by the moving mechanism 52 to move again, and the pick-up tray 60 moves to a different test area 412, thereby improving the test efficiency. After the test is completed, the robot arm 51 takes the boat 60 out of the test area 212, and the boat 60 is transported to the blanking area 30 by the moving mechanism 52, and then the boat 60 is placed in the blanking exchange area 33.
In this embodiment, in order to increase the number and efficiency of tests, the test unit 40 may be provided with two sets of shelves 41 respectively located at two sides of the material inlet/outlet transfer area 50, so as to increase the overall test amount, and the multi-layer structure can further reduce the area occupied by the overall equipment. In addition, when the number of the test units 40 between the loading area 20 and the unloading area 30 is increased or decreased according to the requirement, the length of the track set 53 disposed in the loading/unloading transfer area 50 is also increased or decreased synchronously to meet the actual requirement.
Next, an operation flow of the automated burn-in test apparatus in this embodiment is described: referring to fig. 3 and 5:
the operation mode in the feeding area 20 is: the carrier tray 60 carrying the wafers to be tested is stacked in the loading storage area 21 and then moved to the loading exchange area 22 through the loading transfer module 23. In each station (Site) of the probe card seat 421 of the test module 42 in the test unit 40, the abnormal station data that cannot be tested and the position data of the wafer to be tested at the specific position on the carrier tray 60 corresponding to the abnormal station are transmitted back to the internal controller, so that the wafer picking and placing module 25 first picks up the wafer to be tested by the wafer picking and placing module 25 according to the position data of the wafer to be tested at the specific position on the carrier tray 60 corresponding to the abnormal station, and moves the carrier tray 60 in the empty tray storage area 24 to allow the carrier tray 60 in the loading exchange area 22 to carry the wafers to be tested at the correct number and position. Once the boat 60 is removed for testing, the loading area 20 cycles through the above-described pattern to provide the next boat 60 carrying the wafer to be tested in the loading exchange area 22.
The operation mode in the discharging transfer area 50 is as follows: the moving mechanism 52 continuously moves on the track set 53, and the robot 51 moves the carrier tray 60 from the loading exchange area 22 to the test area 412 of the test unit 40 in the opposite position for testing. Or the tested carrier plate 60 is moved from the test area 412 to the blanking exchange area 32. By such design, in a long time of the single-chip temperature rise test, the movement of other sets of the carrier trays 60 is completed in cooperation with the operations of the multi-layer three-dimensional test areas 412 and the robot arm 51, thereby improving the test efficiency.
The operation mode of the test unit 40 is: the heating base 422 can be pre-burned and heated to a temperature higher than a test temperature value before testing, the loading disc 60 is placed on the heating base 422 by the manipulator arm 51, the heating time of the internal wafer to be tested to the test temperature can be shortened, the test time can be shortened, then the lifting mechanism 423 is lifted, the wafer to be tested in the loading disc 60 can be in contact with the needle testing base 421, and relevant test operation can be carried out when the preset temperature is reached.
The operation mode of the unloading area 30 is that when the robot 51 places the carrier tray 60 carrying the tested wafers in the unloading exchange area 32, the wafer picking and placing module 36 can move the defective wafers on the carrier tray 60 in the unloading exchange area 32 onto the defective carrier tray 62 according to the test result, and then move the good wafers on the good carrier tray 61 to and fill the empty spaces on the carrier tray 60 in the unloading exchange area 32. Then, the tray 60 is moved from the unloading carrying module 33 to the unloading storage area 31 for stacking and collection, and the efficiency is improved by using an automatic operation mode.
In summary, the automatic pre-burning test equipment of the present invention comprises a test unit 40, and platforms 411 with different heights of a shelf 41 form a three-dimensional multi-layer test area 412, so that other carrier trays 60 carrying wafers to be tested or tested can be synchronously moved during the waiting process of pre-burning, temperature raising and testing of a single carrier tray 60, thereby improving the overall test efficiency, increasing the test quantity and increasing the profit, and the equipment can also reduce the overall occupied area, reduce the investment cost of factory equipment, and increase the market competitiveness.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (9)
1. An automated burn-in test apparatus, comprising:
a loading area for placing the carrying disc carrying the wafer to be tested;
a blanking region for collecting the carrier plate carrying the tested wafer;
a plurality of test unit sets up side by side between this material loading district and this unloading district, and this test unit includes: the at least one layer of shelf is used for forming a plurality of test areas by a plurality of platforms with different heights; the plurality of test modules are respectively arranged in the test areas with corresponding heights, and can be used for preheating, heating and testing; and
a business turn over material moves and carries the district, connects this material loading district, this unloading district and these a plurality of test unit, and this business turn over material moves and carries the district and includes: the loading tray is moved to the testing area from the loading area or moved to the unloading area from the testing area by the mechanical arm.
2. The automated burn-in test apparatus of claim 1, wherein the test unit has two shelves, the two shelves being disposed at opposite sides of the input/output transfer area.
3. The automated burn-in testing apparatus of claim 1, wherein the number of test units disposed between the loading area and the unloading area can be increased or decreased as desired.
4. The automated burn-in testing apparatus of claim 1, wherein the loading area includes: at least a loading storage area, a loading exchange area and a loading carrying module, wherein the loading tray is stacked in the loading storage area, and the loading carrying module moves the loading tray from the loading storage area to the loading exchange area.
5. The automated burn-in testing apparatus of claim 4, wherein said robot arm moves said carrier tray from said load swap area to said testing area.
6. The automated burn-in testing apparatus of claim 4, wherein the loading area further comprises at least one empty tray storage area and a wafer pick-and-place module, the empty tray storage area being configured to receive at least one empty carrier tray; the chip taking and placing module is used for taking out the chip to be tested at a specific position on the carrying disc in the loading exchange area and displacing the chip to be tested on the empty carrying disc.
7. The automated burn-in testing apparatus of claim 1, wherein the blanking region comprises: at least a blanking storage area, a blanking exchange area and a blanking carrying module, wherein the blanking carrying module moves the carrier disc from the blanking exchange area to the loading storage area for storage.
8. The automated pre-burning test equipment according to claim 7, wherein the blanking area further comprises at least one good product storage area, at least one bad area storage area and a blanking wafer pick-and-place module, and the good product storage area is provided with at least one good product carrying disc; at least one defective product carrying disc is placed in the defective area storage area; the discharging chip taking and placing module is used for moving the defective chips on the carrying disc in the discharging exchange area to the defective carrying disc and transferring the good chips on the good carrying disc to vacant positions on the carrying disc in the discharging exchange area.
9. The automated burn-in testing apparatus of claim 8, wherein said robot arm moves said tray from said testing area to said blanking exchange area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010538095.8A CN111584389A (en) | 2020-06-12 | 2020-06-12 | Automatic burn-in test equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010538095.8A CN111584389A (en) | 2020-06-12 | 2020-06-12 | Automatic burn-in test equipment |
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| CN111584389A true CN111584389A (en) | 2020-08-25 |
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| CN202010538095.8A Pending CN111584389A (en) | 2020-06-12 | 2020-06-12 | Automatic burn-in test equipment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112763756A (en) * | 2020-12-04 | 2021-05-07 | 联宝(合肥)电子科技有限公司 | Aging test system, method and device for notebook computer |
| CN114843215A (en) * | 2022-04-29 | 2022-08-02 | 深圳格芯集成电路装备有限公司 | Chip testing device |
| CN117079709A (en) * | 2023-09-07 | 2023-11-17 | 广东长兴半导体科技有限公司 | Flash memory test equipment and test method |
-
2020
- 2020-06-12 CN CN202010538095.8A patent/CN111584389A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112763756A (en) * | 2020-12-04 | 2021-05-07 | 联宝(合肥)电子科技有限公司 | Aging test system, method and device for notebook computer |
| CN114843215A (en) * | 2022-04-29 | 2022-08-02 | 深圳格芯集成电路装备有限公司 | Chip testing device |
| CN117079709A (en) * | 2023-09-07 | 2023-11-17 | 广东长兴半导体科技有限公司 | Flash memory test equipment and test method |
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