CN111583792A - Display panel and preparation method thereof - Google Patents
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- CN111583792A CN111583792A CN202010386103.1A CN202010386103A CN111583792A CN 111583792 A CN111583792 A CN 111583792A CN 202010386103 A CN202010386103 A CN 202010386103A CN 111583792 A CN111583792 A CN 111583792A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 102
- 239000002184 metal Substances 0.000 claims abstract description 102
- 238000000034 method Methods 0.000 claims description 35
- 238000005530 etching Methods 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 8
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 238000000059 patterning Methods 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 230000001965 increasing effect Effects 0.000 abstract description 11
- 206010040844 Skin exfoliation Diseases 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 239000000725 suspension Substances 0.000 description 4
- 229920001621 AMOLED Polymers 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the invention discloses a display panel and a preparation method thereof. In the embodiment of the invention, the display panel comprises the binding area, the binding area comprises the insulating layer, the first metal layer and the chip on film which are sequentially stacked on the insulating layer, the non-display area also comprises the conductive medium, the conductive medium is positioned between the insulating layer and the first metal layer as well as between the first metal layer and the chip on film, and the conductive medium wraps the upper surface and the lower surface of the terminal, so that the binding contact area is increased, the binding strength is improved, the risk of peeling between the conductive medium and the terminal is reduced, and the good product and the service life of the display panel are improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel and a preparation method thereof.
Background
The conventional flat panel Display devices on the market include Liquid Crystal Display (LCD) devices and Active-matrix organic light emitting diode (AMOLED) Display devices.
The conventional flat Panel display device generally includes a display Panel (Panel) and an external circuit, where the display Panel needs to use the external circuit, such as a Flexible Printed Circuit (FPC) or a Chip On Film (COF), when displaying normally, and the electrical connection between the external circuit and the display Panel is completed through a Bonding process, where the display Panel is first bonded to the chip on Film and then connected to the flexible printed circuit through the chip on Film, so as to connect the display Panel and the flexible printed circuit. As shown in fig. 1, a structure diagram of a bonding area of a display panel in the prior art is shown, in the bonding area of the display panel, a second metal layer 10, an insulating layer 20, a first metal layer 30, a conductive medium 40, a chip on film 50, and a contact hole 60 are sequentially included from bottom to top, in order to bond the first metal layer with the chip on film, a bonding pad (also known as a terminal) located in the first metal layer is disposed in the bonding area of the display panel, and the bonding pad is connected to the terminal by using a pin of a chip in the chip on film, so as to bond the chip on film with the first metal layer. However, with the vigorous development of the folding and flexible display technologies, a new challenge is provided for the binding strength of the display panel, and at present, the contact of the conductive medium in the binding region is limited to the upper surface of the terminal, and the contact area with the terminal is small, so that the conductive medium is easily peeled (peeling) from the terminal during the flexible folding process, the contact of the terminal is poor, the probability of bright and dark lines appearing on the display panel is greatly increased, and the display effect is finally influenced.
Disclosure of Invention
The embodiment of the invention provides a display panel and a preparation method thereof, aiming at solving the problems that a conductive medium is easy to peel off from a terminal and the contact of the terminal is poor in a flexible folding process, so that the probability of bright and dark lines of the display panel is greatly increased, and the display effect is finally influenced.
In order to solve the above problem, in a first aspect, the present application provides a display panel, the display panel includes a binding region, the binding region includes an insulating layer, and is stacked in sequence on the insulating layer, the binding region further includes a conductive medium, the conductive medium is located the insulating layer with the first metal layer, and the first metal layer with between the chip on film. Thereby increasing the contact area of the terminal in the first metal layer with the conductive medium.
Furthermore, the insulating layer comprises a first insulating layer and a second insulating layer, the first insulating layer is arranged on one side close to the first metal layer, and the etching rate of the material of the first insulating layer is greater than that of the material of the second insulating layer.
Further, the first insulating material is silicon nitride, and the second insulating material is silicon oxide.
Further, the Conductive medium is Anisotropic Conductive Film (ACF) or silver paste.
Furthermore, the bonding region further comprises a second metal layer, and the second metal layer is arranged on one side of the insulating layer far away from the first metal layer.
Furthermore, a plurality of contact holes are formed in the insulating layer, and the first metal layer penetrates through the conductive medium and the insulating layer through the contact holes until reaching the surface of the second metal layer.
Furthermore, the material of the first metal layer is a tough material, such as metallic silver, which is beneficial to preventing the first metal layer from breaking and enhancing the stability.
In a second aspect, the present application provides a method for manufacturing a display panel, comprising the following steps:
patterning the insulating layer;
depositing a metal material on the insulating layer to form a first metal layer;
patterning the first metal layer, and coating a front photoresist on the first metal layer;
performing local edge exposure on the first metal layer in the binding region to obtain a locally patterned first metal layer;
performing an etching process by using the first metal layer as a mask, and partially hollowing out a part of the insulating layer close to the first metal layer to form a gap between the insulating layer and the first metal layer;
and coating a conductive medium between the gap between the insulating layer and the second metal layer and between the second metal layer and the chip on film to bind the chip on film.
Furthermore, the insulating layer comprises a first insulating layer and a second insulating layer, the first insulating layer is arranged on one side close to the first metal layer, and the etching rate of the material of the first insulating layer is greater than that of the material of the second insulating layer. By utilizing the difference of the rates, the first insulating layer material is favorably hollowed out in the etching process, so that the terminal part or all of the first metal layer is suspended.
Further, the first insulating material is silicon nitride, and the second insulating material is silicon oxide.
Further, the conductive medium is anisotropic conductive adhesive or silver paste.
Further, before the step of patterning the insulating layer, the method further includes the steps of: a second metal layer is patterned and an insulating layer is deposited on the second metal layer.
Furthermore, a plurality of contact holes are formed in the insulating layer, and the first metal layer penetrates through the conductive medium and the insulating layer through the contact holes until reaching the surface of the second metal layer.
In a third aspect, the present application provides a display device including the display panel according to any one of the first aspect.
Has the advantages that: according to the display panel provided by the embodiment of the invention, the upper surface and the lower surface of the terminal are wrapped by the conductive medium, so that the defect that the traditional conductive medium only wraps the upper surface of the terminal is overcome, the binding contact area is increased, the binding strength is improved, the risk that the conductive medium and the terminal are peeled off is reduced, and the good product and the service life of the display panel are improved.
In addition, because the upper and lower surfaces of the terminal are wrapped by the conductive medium, the cross section of the conductive adhesive and the terminal which are added together is increased, and the conduction resistivity of the terminal can be reduced.
The embodiment of the invention provides a preparation method of a display panel, wherein an insulating layer part is partially hollowed through an etching process, so that suspension of a binding region terminal is realized, when a conductive adhesive is used for carrying out pressing, the terminal is wrapped, the binding contact area is increased, the binding strength is improved, the risk of stripping of a conductive medium 40 and the terminal is reduced, the yield and the service life of the display panel are improved, the conduction resistivity of the terminal can be reduced, and a new idea is provided for the preparation method of the display panel.
The embodiment of the invention also provides a preparation method of the display panel, which utilizes the difference of etching selection ratios of the double-layer non-metal film layers, namely the etching rate of the first insulating layer is greater than that of the second insulating layer, and the etched part of the first insulating layer is more than that of the second insulating layer under the same condition through an etching process, so that the first insulating layer is partially or completely hollowed, the suspension of terminals in a binding area is realized, the binding strength is improved, and the yield and the service life of the display panel are improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of a conventional bonding area of a display panel;
FIG. 2 is a schematic diagram illustrating a structure of a display panel bonding area according to an embodiment of the present invention;
FIG. 3 is a diagram illustrating another structure of a display panel bonding area according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of step S10 in a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of step S20 in a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of step S40 in a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a method for manufacturing a display panel according to an embodiment of the present invention.
Wherein the reference numbers indicate:
10-a second metal layer; 20-an insulating layer; 21-a second insulating layer; 22-a first insulating layer; 30-a first metal layer; (40, 41, 42) -a conductive medium; 50-chip on film; 60-contact holes; 70-gap.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
When the flexible folding process of the display panel is performed, the conductive medium 40 in the binding area of the panel is easily peeled off from the terminal, and the terminal is in poor contact, so that the probability of bright and dark lines appearing on the display panel is greatly increased, and the display effect is finally influenced.
Accordingly, embodiments of the present invention provide a display panel and a method for manufacturing the same, which are described in detail below.
First, a display panel is provided in an embodiment of the present invention, referring to fig. 2, and fig. 2 is a schematic structural diagram of a display panel bonding area in an embodiment of the present invention.
The display panel comprises a binding region, wherein the binding region comprises an insulating layer 20, a first metal layer 30 and a chip on film 50 which are sequentially stacked on the insulating layer 20, the binding region further comprises a conductive medium 40, and the conductive medium 40 is positioned between the insulating layer 20 and the first metal layer 30, and between the first metal layer 30 and the chip on film 50.
Specifically, a gap 70 is formed between the insulating layer 20 and the first metal layer 30, and the conductive medium 40 is located in the gap 70.
Specifically, the material of the first metal layer 30 is a flexible material, such as metallic silver, which is beneficial to preventing the first metal layer 30 from breaking and enhancing the stability.
According to the display panel provided by the embodiment of the invention, the upper surface and the lower surface of the terminal are wrapped by the conductive medium 40, so that the defect that the traditional conductive medium 40 only wraps the upper surface of the terminal is overcome, the binding contact area is increased, the binding strength is improved, the risk that the conductive medium 40 and the terminal are peeled off is reduced, and the good product and the service life of the display panel are improved.
In addition, since the conductive medium 40 wraps the upper and lower surfaces of the terminal, the cross section of the conductive adhesive and the terminal is increased, and the conductive resistivity is also decreased.
On the basis of the above embodiment, referring to fig. 3, in another specific embodiment of the present application, the insulating layer 20 includes a first insulating layer 22 and a second insulating layer 21, the first insulating layer 22 is disposed on a side close to the first metal layer 30, and an etching rate of the material of the first insulating layer 22 is greater than that of the material of the second insulating layer 21.
It is understood that the insulating layer 20 may also include other insulating layers 20, such as a third insulating layer 20 located beside the second insulating layer 21 and far from the first insulating layer 22, as long as the etching rate of the insulating layer 20 close to the side of the first metal layer 30 is greater than that of the other layers, which is not limited herein.
The difference in etching rate of the insulating layer 20 is beneficial to the first metal layer 30 and the insulating layer 20 to be hollowed out, so that the terminal portion of the first metal layer 30 is suspended or completely suspended.
Preferably, the material used for the first insulating layer 22 is silicon nitride (SIN)χOr SIN, χ is greater than1) and the material used for the second insulating layer 21 is silicon oxide (SIO)χOr SIO).
The silicon oxide and the silicon nitride have larger etching rate difference, and the terminal in the first metal layer 30 can be better suspended.
In another embodiment of the present application, the conductive medium 40 is Anisotropic Conductive Film (ACF) or silver paste.
Preferably, a material with certain fluidity, such as silver paste, is selected to enable the conductive medium 40 to better wrap the terminal.
In another specific embodiment of the present application, the bonding region further includes a second metal layer 10, and the second metal layer 10 is disposed on a side of the insulating layer 20 away from the first metal layer 30.
The insulating layer 20 is provided with a plurality of contact holes 60, and the first metal layer 30 penetrates through the conductive medium 40 and the insulating layer 20 through the contact holes 60 to reach the surface of the second metal layer 10. Specifically, the first metal layer 30 has a horizontal portion and a vertical portion protruding downward from the horizontal portion, and the vertical portion extends through the contact hole 60 and is connected to the second metal layer 10. In one embodiment, the gap 70 is located between the horizontal portion of the first metal layer 30 and the insulating layer 20, i.e., the conductive medium 40 is coated between the horizontal portion of the first metal layer 30 and the insulating layer 20; the vertical portion of the first metal layer 30 is in direct contact with the insulating layer 20 in the contact hole 60, i.e., the conductive medium 40 is not coated between the vertical portion of the first metal layer 30 and the insulating layer 20.
On the basis of the above embodiment, in another specific embodiment of the present application, a plurality of contact holes 60 are provided in the insulating layer 20, and the first metal layer 30 penetrates through the conductive medium 40 and the insulating layer 20 through the contact holes 60 to reach the surface of the second metal layer 10.
The contact hole 60 has an effect of supporting the first metal layer 30, and is more beneficial to suspending the terminal in the first metal layer 30. It should be noted that the effect of suspending the terminal in the first metal layer 30 can be achieved without providing the contact hole 60.
The display panel may be an LCD or an AMOLED.
Only the above structures are described in the foregoing display panel embodiments, and it is understood that, in addition to the above structures, the display panel bonding region according to the embodiments of the present invention may further include any other necessary structures, such as a flexible substrate, a buffer layer, a third metal layer, and the like, as needed, and the details are not limited herein.
On the basis of the display panel, the embodiment of the present invention further provides a method for manufacturing a display panel, and referring to fig. 2, fig. 4, fig. 5, and fig. 6, a schematic diagram of a display panel binding region in steps S10 to S50 in the method for manufacturing a display panel according to the embodiment of the present invention is provided. The method comprises the following steps:
s10: as shown in fig. 4, the insulating layer is patterned;
s20: as shown in fig. 5, depositing a metal material on the insulating layer to form a first metal layer;
s30: patterning the first metal layer, and coating a front photoresist on the first metal layer;
s40: as shown in fig. 6, an etching process is performed by using the first metal layer as a mask, and a portion of the insulating layer close to the first metal layer is partially hollowed out, so that a gap is formed between the insulating layer and the first metal layer;
s50: as shown in fig. 2, a conductive medium is coated between the gap between the insulating layer and the second metal layer and between the second metal layer and the chip on film to bind the chip on film.
Specifically, the etching process in the above steps is a dry etching process or a wet etching process, and preferably, dry etching is selected.
The embodiment of the invention provides a preparation method of a display panel, and the insulating layer part is partially hollowed through an etching process, so that suspension of a binding region terminal is realized, when a conductive adhesive is used for carrying out pressing, the terminal is wrapped, the binding contact area is increased, the binding strength is improved, the risk of stripping of a conductive medium 40 and the terminal is reduced, the yield and the service life of the display panel are improved, the conduction resistivity of the terminal can be reduced, and a new idea is provided for the preparation method of the display panel.
On the basis of the above embodiment, in another specific embodiment of the present application, the insulating layer includes a first insulating layer and a second insulating layer, the first insulating layer is disposed on a side close to the first metal layer, and an etching rate of the material of the first insulating layer is greater than an etching rate of the material of the second insulating layer.
Specifically, the material used for the first insulating layer is silicon nitride, and the material used for the second insulating layer is silicon oxide.
According to the preparation method of the display panel, provided by the embodiment of the invention, by utilizing the difference of etching selection ratios of the double-layer non-metal film layers, namely the etching rate of the first insulating layer is greater than that of the second insulating layer, through an etching process, under the same condition, the etched part of the first insulating layer is more than that of the second insulating layer, so that the first insulating layer is partially or completely hollowed, and the suspension of the terminal in the binding area is realized, thereby the binding strength is improved, and the yield and the service life of the display panel are improved.
In another embodiment of the present application, the conductive medium 40 is anisotropic conductive adhesive or silver paste.
As shown in fig. 7, before step S10, the method further includes the steps of: the second metal layer is patterned and an insulating layer is deposited on the second metal layer.
On the basis of the above embodiment, in another specific embodiment of the present application, a plurality of contact holes 60 are provided in the insulating layer 20, and the first metal layer 30 penetrates through the conductive medium 40 and the insulating layer 20 through the contact holes 60 to reach the surface of the second metal layer 10
It should be noted that, in the above embodiment of the method for manufacturing a display panel, only the above steps are described, and it is understood that, in addition to the above steps, any other steps may be included as needed in the method for manufacturing a display panel according to the embodiment of the present invention, and the method is not limited herein.
On the basis of the display panel, the embodiment of the invention also provides a display device which comprises the display panel or is manufactured by using the preparation method of the display panel.
In a specific implementation, each unit or structure may be implemented as an independent entity, or may be combined arbitrarily to be implemented as one or several entities, and the specific implementation of each unit or structure may refer to the foregoing method embodiment, which is not described herein again.
The above operations can be implemented in the foregoing embodiments, and are not described in detail herein.
The display panel and the method for manufacturing the same provided by the embodiment of the present invention are described in detail above, and the principle and the embodiment of the present invention are explained in detail herein by applying specific examples, and the description of the above embodiments is only used to help understanding the method and the core idea of the present invention; meanwhile, for those skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A display panel comprises a binding area, wherein the binding area comprises an insulating layer, a first metal layer and a chip on film, the first metal layer and the chip on film are sequentially stacked on the insulating layer, the binding area further comprises a conductive medium, and the conductive medium is located between the insulating layer and the first metal layer, and between the first metal layer and the chip on film.
2. The display panel according to claim 1, wherein the insulating layer comprises a first insulating layer and a second insulating layer, the first insulating layer is provided on a side close to the first metal layer, and an etching rate of the material of the first insulating layer is greater than an etching rate of the material of the second insulating layer.
3. The display panel according to claim 2, wherein the first insulating material is silicon nitride and the second insulating material is silicon oxide.
4. The display panel of claim 1, wherein the conductive medium is anisotropic conductive paste or silver paste.
5. The display panel of claim 1, wherein the bonding region further comprises a second metal layer disposed on a side of the insulating layer away from the first metal layer.
6. The display panel according to claim 5, wherein the insulating layer has a plurality of contact holes formed therein, and the first metal layer penetrates through the conductive medium and the insulating layer through the contact holes to a surface of the second metal layer.
7. A preparation method of a display panel is characterized by comprising the following steps:
patterning the insulating layer;
depositing a metal material on the insulating layer to form a first metal layer;
patterning the first metal layer, and coating a front photoresist on the first metal layer;
performing local edge exposure on the first metal layer of the binding region to obtain a locally patterned first metal layer;
performing an etching process by using the first metal layer as a mask, and partially hollowing out a part of the insulating layer close to the first metal layer to form a gap between the insulating layer and the first metal layer;
and coating a conductive medium between the gap between the insulating layer and the second metal layer and between the second metal layer and the chip on film to bind the chip on film.
8. The method according to claim 7, wherein the insulating layer comprises a first insulating layer and a second insulating layer, the first insulating layer is provided on a side close to the first metal layer, and an etching rate of the material of the first insulating layer is higher than an etching rate of the material of the second insulating layer.
9. The method for manufacturing a display panel according to claim 7, further comprising, before the step of patterning the insulating layer, the steps of: a second metal layer is patterned and an insulating layer is deposited on the second metal layer.
10. The method according to claim 9, wherein a plurality of contact holes are formed in the insulating layer, and the first metal layer penetrates through the conductive medium and the insulating layer through the contact holes to a surface of the second metal layer.
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| CN202010386103.1A CN111583792B (en) | 2020-05-09 | 2020-05-09 | Display panel and preparation method thereof |
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| CN202010386103.1A CN111583792B (en) | 2020-05-09 | 2020-05-09 | Display panel and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114333578A (en) * | 2021-12-17 | 2022-04-12 | 深圳市华星光电半导体显示技术有限公司 | Flexible display panel and display device |
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