CN111578221A

CN111578221A - Car headlight assembly and radiating LED headlight bulb of semiconductor refrigeration thereof

Info

Publication number: CN111578221A
Application number: CN202010416278.2A
Authority: CN
Inventors: 王公利; 李尚英; 杨成秋
Original assignee: Jinan Dede Environmental Protection Technology Co ltd
Current assignee: Guangzhou JieChuang Industrial Co.,Ltd.
Priority date: 2020-05-17
Filing date: 2020-05-17
Publication date: 2020-08-25
Anticipated expiration: 2040-05-17
Also published as: CN111578221B

Abstract

The application provides a semiconductor refrigeration and heat dissipation LED headlamp bulb which comprises an LED lamp bead, a lamp post, a semiconductor refrigeration piece, a rotating base, a clamp, a rolling bearing I, a rolling bearing II, a rolling bearing III, a plastic insulating ring I, a plastic insulating ring II, a direct current motor, a motor base, a transmission disc and a mounting ring; the semiconductor refrigeration piece is driven to rotate by the direct current motor, heat on the lamp post is transferred to the cold surface of the semiconductor refrigeration piece through the rolling bearing I, direct current is provided for the rotating semiconductor refrigeration piece by the rolling bearing II and the rolling bearing III, the hot surface of the semiconductor refrigeration piece is directly exposed in the atmosphere, heat dissipation fins are not required to be arranged, stronger heat convection heat dissipation is directly generated with air, a plurality of semiconductor refrigeration pieces can be arranged in a unit volume, the heat dissipation mode of the hot surface and the refrigeration mode of the cold surface are changed, and the heat dissipation effect and the heat dissipation efficiency of the LED lamp bead are improved. The application also provides an automobile headlamp assembly.

Description

Car headlight assembly and radiating LED headlight bulb of semiconductor refrigeration thereof

Technical Field

The invention relates to the technical field of LED headlamp bulbs, in particular to an automobile headlamp assembly and a semiconductor refrigeration and heat dissipation LED headlamp bulb thereof.

Background

With the development of technology, halogen headlamps, xenon headlamps and the most advanced LED headlamps are used as headlamps (including high beam and low beam) in automotive headlamp assemblies. The light-emitting principle of the LED lamp determines that the LED lamp needs to be forcibly, timely and well radiated, and the radiating problem is a main factor influencing the service life of the LED lamp.

The semiconductor refrigerating sheet, also called as thermoelectric refrigerating sheet, is a heat pump, when the direct current passes through the semiconductor refrigerating sheet, the two long and wide surfaces of the semiconductor refrigerating sheet can respectively absorb heat and emit heat, wherein the long and wide surface of the semiconductor refrigerating sheet absorbing heat is called as cold surface, and the long and wide surface of the semiconductor refrigerating sheet emitting heat is called as hot surface, so that the semiconductor refrigerating sheet can realize refrigeration.

Therefore, how to adopt semiconductor refrigeration to radiate the LED lamp bead and improve the radiating effect and radiating efficiency of the LED lamp bead in the LED headlamp bulb is a technical problem which needs to be solved urgently by technical personnel in the field.

Disclosure of Invention

The invention aims to provide a semiconductor refrigeration and heat dissipation LED headlamp bulb. The invention also provides an automobile headlamp assembly comprising the semiconductor cooling and heat dissipating LED headlamp bulb.

In order to solve the technical problems, the technical scheme provided by the invention is as follows:

an LED headlamp bulb for semiconductor refrigeration and heat dissipation comprises a left LED lamp bead and a right LED lamp bead for light emitting, a long columnar lamp post, a plurality of semiconductor refrigeration pieces for refrigeration, a rotary base for mounting the semiconductor refrigeration pieces and made of an aluminum alloy material, a clamp for clamping and fixing the semiconductor refrigeration pieces, a rolling bearing I made of a metal material for supporting rotation and heat conduction, a rolling bearing II made of a metal material for supporting rotation and electricity conduction, a rolling bearing III made of a metal material for supporting rotation and electricity conduction, a plastic insulating ring I, a plastic insulating ring II, a direct current motor, a motor base, a transmission disc made of a plastic material, a mounting ring for mounting and fixing the LED headlamp bulb in a mounting through hole in a rear shell of an automobile headlamp assembly, and a driving power supply circuit board;

the lamp post comprises a post body and a disc arranged at the bottom end of the post body;

the rolling bearing I comprises an inner ring I, an outer ring I, a rolling body I and a retainer I;

a disc at the bottom of the lamp post is welded and inserted and fixed in a first inner ring of the first rolling bearing, and the outer diameter surface of the disc is welded and connected with the inner diameter surface of the first inner ring to form mechanical connection and heat conduction connection between the disc and the first inner ring;

the rotating base comprises a metal heat pipe and at least 2 metal heat conducting fins, and the at least 2 metal heat conducting fins are uniformly arranged on the outer surface of the pipe wall of the metal heat pipe so as to form integrated connection and heat conduction connection between the metal heat pipe and the metal heat conducting fins;

the motor base comprises a plastic pipe and a plastic flange, the plastic flange is arranged at the top end of the plastic pipe, the motor base is sleeved in the pipe cavity of the metal heat conduction pipe and is positioned below the disc, and a screw of the second bolt penetrates through the plastic flange to form a bolt connection with the disc so as to fix the motor base on the lower disc surface of the disc;

the direct current motor is arranged in a bottom pipe orifice of the plastic pipe, the transmission disc is positioned in a pipe cavity of the metal heat conduction pipe and below the direct current motor, a rotating shaft of the direct current motor is inserted and fixed in an axial central through hole of the transmission disc, an axial central line of the rotating shaft in the direct current motor is superposed with an axial central line of the metal heat conduction pipe, and the outer diameter surface of the transmission disc is in adhesive connection with the inner surface of the pipe wall of the metal heat conduction pipe so as to drive the metal heat conduction pipe to rotate through the rotation of the rotating shaft;

the metal heat conduction pipe rotates to drive the metal heat conduction sheet to rotate;

the top pipe orifice of the metal heat conduction pipe is welded and sleeved on the first outer ring of the first rolling bearing, and the outer diameter surface of the first outer ring is welded and connected with the inner surface of the pipe wall of the top pipe orifice of the metal heat conduction pipe so as to drive the first outer ring to rotate by the rotation of the metal heat conduction pipe and form heat conduction connection between the first outer ring and the metal heat conduction pipe;

the semiconductor refrigeration piece is clamped and fixed on the long and wide surface of the metal heat conducting piece by the clamp so as to be driven to rotate by the rotation of the metal heat conducting piece, and heat-conducting silicone grease is coated between the cold surface of the semiconductor refrigeration piece and the long and wide surface of the metal heat conducting piece to form heat-conducting connection between the cold surface of the semiconductor refrigeration piece and the long and wide surface of the metal heat conducting piece;

the outer surface of the pipe wall of the metal heat conduction pipe is coated with a layer of heat preservation material for heat preservation and heat insulation, and the rest outer surface of the metal heat conduction sheet except the outer surface provided with the semiconductor refrigeration sheet is coated with a layer of heat preservation material for heat preservation and heat insulation;

the second rolling bearing comprises a second inner ring, a second outer ring, a second rolling body and a second retainer, the second inner ring of the second rolling bearing is sleeved and fixed on the outer surface of the pipe wall of the plastic pipe, the outer diameter surface of the second outer ring of the second rolling bearing is in adhesive connection with the inner diameter surface of the first plastic insulating ring through an adhesive, and the outer diameter surface of the first plastic insulating ring is in adhesive connection with the inner surface of the pipe wall of the metal heat conduction pipe through the adhesive so as to drive the second outer ring to rotate through the rotation of the metal heat conduction pipe;

the third rolling bearing comprises a third inner ring, a third outer ring, a third rolling body and a third retainer, the third inner ring of the third rolling bearing is sleeved and fixed on the outer surface of the pipe wall of the plastic pipe, the third rolling bearing is positioned below the second rolling bearing, the outer diameter surface of the third outer ring of the third rolling bearing is in adhesive connection with the inner diameter surface of the second plastic insulating ring through an adhesive, and the outer diameter surface of the second plastic insulating ring is in adhesive connection with the inner surface of the pipe wall of the metal heat conduction pipe through the adhesive so as to drive the third outer ring to rotate through the rotation of the metal heat conduction pipe;

a first positive wire and a first negative wire for supplying power to the semiconductor refrigeration piece penetrate through the through holes in the lamp post and enter the tube cavity of the plastic tube, then the first positive wire penetrates through the tube wall of the plastic tube and is electrically connected with a second inner ring of the second rolling bearing so as to provide direct current for the second rolling bearing, and then the first negative wire penetrates through the tube wall of the plastic tube and is electrically connected with a third inner ring of the third rolling bearing so as to provide direct current for the third rolling bearing;

the first plastic insulating ring is provided with a radial through hole for communicating the outer diameter surface and the inner diameter surface of the first plastic insulating ring, and a positive electrode conducting wire of the semiconductor refrigerating sheet firstly penetrates through the pipe wall of the metal heat conducting pipe and then penetrates through the radial through hole in the first plastic insulating ring to be finally electrically connected with the second outer ring of the rolling bearing so as to be used for providing direct current to the rotating semiconductor refrigerating sheet by taking the rotating second outer ring as the positive electrode of a direct current power supply;

the second plastic insulating ring is provided with a radial through hole for communicating the outer diameter surface and the inner diameter surface of the second plastic insulating ring, and a negative electrode conducting wire of the semiconductor refrigerating sheet firstly penetrates through the pipe wall of the metal heat conducting pipe and then penetrates through the radial through hole in the second plastic insulating ring to be finally electrically connected with the third outer ring of the rolling bearing, so that the third rotating outer ring serves as a negative electrode of a direct-current power supply to provide direct current for the third rotating semiconductor refrigerating sheet;

and the axial line surrounded by the rotation of the outer ring I of the rolling bearing I, the axial line surrounded by the rotation of the outer ring II of the rolling bearing II, the axial line surrounded by the rotation of the outer ring III of the rolling bearing III and the axial center line of the rotating shaft of the direct current motor are superposed.

Preferably, the lamp post comprises a left aluminum substrate for mounting and fixing the left LED lamp bead, electric conduction and heat conduction, a right aluminum substrate for mounting and fixing the right LED lamp bead, electric conduction and heat conduction, a left half lamp post and a right half lamp post;

the left half lamp post and the right half lamp post are overlapped to be spliced into a complete lamp post, the left half lamp post comprises a left half cylinder and a left half disc arranged at the bottom end of the left half cylinder, the right half lamp post comprises a right half cylinder and a right half disc arranged at the bottom end of the right half cylinder, a primary groove is arranged on the inner length and width surface of the left half lamp post, a primary groove is arranged on the inner length and width surface of the right half lamp post, the primary groove on the left half lamp post and the primary groove on the right half lamp post are spliced into a post inner cavity, a wide secondary groove is further arranged on the inner bottom surface of the middle upper part of the primary groove, a narrow secondary groove used for accommodating a concealed wire is further arranged on the inner bottom surface of the middle lower part of the primary groove, and the wide secondary groove and the narrow secondary groove are communicated;

the top parts of the left half lamp post and the right half lamp post are respectively provided with a bolt hole, and the left half lamp post and the right half lamp post are connected and spliced into a complete lamp post through a bolt I inserted into the bolt holes;

the left half disc and the right half disc at the bottom of the lamp post which are connected and spliced by the bolts are welded and inserted and fixed in the first inner ring of the first rolling bearing, the outer diameter surface of the left half disc is welded and connected with the inner diameter surface of the first inner ring to form mechanical connection and heat conduction connection between the left half disc and the first inner ring, and the outer diameter surface of the right half disc is welded and connected with the inner diameter surface of the first inner ring to form mechanical connection and heat conduction connection between the right half disc and the first inner ring;

the motor base is positioned below the left semicircular disc, the screw of the second bolt penetrates through the plastic flange plate to form bolted connection with the left semicircular disc so as to fix the motor base on the lower disc surface of the left semicircular disc, and the screw of the other second bolt penetrates through the plastic flange plate to form bolted connection with the right semicircular disc so as to fix the motor base on the lower disc surface of the right semicircular disc;

each long and wide surface of each metal heat conducting sheet is provided with a semiconductor refrigerating sheet;

and a positive wire I and a negative wire I for supplying power to the semiconductor refrigeration piece enter the narrow secondary groove on the left half lamp post from the through hole at the bottom of the left half cylinder, then the positive wire I downwards enters the tube cavity of the plastic tube, and then the negative wire I downwards enters the tube cavity of the plastic tube.

Preferably, the heat pipe is used for heat conduction;

the left aluminum substrate and the right aluminum substrate respectively comprise a circuit layer, an insulating layer and an aluminum base layer which are sequentially superposed, the left LED lamp bead is arranged on the circuit layer in the left aluminum substrate, and the right LED lamp bead is arranged on the circuit layer in the right aluminum substrate;

the left aluminum substrate is arranged in a wide secondary groove on the inner length and width surface of the left half lamp post, and the left LED lamp bead is exposed out of a rectangular through hole in the wall of the left half lamp post;

the right aluminum substrate is arranged in a wide secondary groove on the inner length and width surface of the right half lamp post, and the right LED lamp bead is exposed out of a rectangular through hole in the wall of the right half lamp post;

the shape of the heat pipe is a flattened flat long bar shape, the heat pipe is placed in the cavity in the column, the left long and wide surface of the heat pipe is in close contact with the bottom surface of the inner groove of the primary groove on the left half lamp column, the right long and wide surface of the heat pipe is in close contact with the bottom surface of the inner groove of the primary groove on the right half lamp column, so that the heat pipe is clamped and fixed in the lamp column by the left half lamp column and the right half lamp column, and the primary groove on the left half lamp column and the primary groove on the right half lamp column extend downwards to the bottom end surface of the lamp column to enable the bottom end of the cavity in the column to be exposed out of the bottom end of the heat pipe;

the left aluminum substrate, the heat pipe and the right aluminum substrate are stacked together in sequence from left to right and are clamped and fixed in the lamp post by the left half lamp post and the right half lamp post from left to right.

Preferably, the exposed long and wide surface of the aluminum base layer of the left aluminum substrate and the left long and wide surface of the heat pipe are connected by brazing by filling solder paste and then reflowing, and the exposed long and wide surface of the aluminum base layer of the right aluminum substrate and the right long and wide surface of the heat pipe are connected by brazing by filling solder paste and then reflowing.

Preferably, the driving power supply circuit board is located outside the metal heat conduction pipe, and the semiconductor refrigeration sheet is electrically connected with the driving power supply circuit board;

a positive electrode wire II and a negative electrode wire II for supplying power to the left LED lamp bead enter the narrow secondary groove on the left half lamp post from the through hole at the bottom of the left half cylinder, then the positive electrode wire II and the negative electrode wire II penetrate the narrow secondary groove on the left half lamp post and are finally and respectively electrically connected with the positive electrode and the negative electrode of the left LED lamp bead;

a positive wire III and a negative wire III for supplying power to the right LED lamp bead enter the narrow secondary grooves on the right half lamp post from the through hole at the bottom of the right half cylinder, then the positive wire III and the negative wire III penetrate the narrow secondary grooves on the right half lamp post and are finally electrically connected with the positive electrode and the negative electrode of the right LED lamp bead respectively;

a positive wire IV and a negative wire IV for supplying power to the direct current motor enter the narrow secondary grooves on the right half lamp post from the through holes at the bottom of the right half cylinder, then the positive wire IV and the negative wire IV downwards penetrate through the plastic tube and are finally electrically connected with the positive electrode and the negative electrode of the direct current motor respectively;

the LED lamp comprises a left LED lamp bead, a right LED lamp bead, a driving power supply circuit board, a direct current motor, a semiconductor refrigeration piece, a left LED lamp bead, a right LED lamp bead and a direct current motor, wherein the left LED lamp bead is electrically connected with the driving power supply circuit board, the right LED lamp bead is electrically connected with the driving power supply circuit board, the direct current motor is electrically connected with the driving power supply circuit board, and the semiconductor refrigeration piece.

Preferably, the metal heat conducting fins are planar and flaky, the length and width surfaces of the metal heat conducting fins are parallel to the axial center line of the metal heat conducting pipe, the outer surface of the pipe wall of the metal heat conducting pipe is integrally connected with one of the metal heat conducting fins in a side-to-side manner, and a gap is reserved between every two adjacent metal heat conducting fins to form an air duct so that cooling air can pass through the gap.

Preferably, the clamp comprises an aluminum strip A, an aluminum strip B, an upper plastic bolt and a lower plastic bolt;

bolt through holes are respectively formed in the two ends of the aluminum strip A in the length direction, and bolt through holes are respectively formed in the two ends of the aluminum strip B in the length direction;

the two long and wide surfaces of the metal heat conducting sheet are respectively a long and wide surface A and a long and wide surface B;

the semiconductor refrigerating sheet on the long and wide surface A is clamped between the long and wide surface A and the inner long and wide surface of the aluminum strip A, and the hot surface of the semiconductor refrigerating sheet on the long and wide surface A is in close contact with the inner long and wide surface of the aluminum strip A;

the semiconductor refrigerating sheet on the long and wide surface B is clamped between the long and wide surface B and the inner long and wide surface of the aluminum strip B, and the hot surface of the semiconductor refrigerating sheet on the long and wide surface B is in close contact with the inner long and wide surface of the aluminum strip B;

the screw rod of the upper plastic bolt sequentially penetrates through the bolt through hole at the upper end of the aluminum strip A, the heat insulation material on the long and wide surface A, the metal heat conducting sheet, the heat insulation material on the long and wide surface B and the bolt through hole at the upper end of the aluminum strip B, the screw rod of the lower plastic bolt sequentially penetrates through the bolt through hole at the lower end of the aluminum strip A, the heat insulation material on the long and wide surface A, the metal heat conducting sheet, the heat insulation material on the long and wide surface B and the bolt through hole at the lower end of the aluminum strip B, the aluminum strip A, the aluminum strip B, the upper plastic bolt and the lower plastic bolt are connected end to form a rectangular frame, the upper end of the aluminum strip A is connected with the upper end of the aluminum strip B through a bolt, the lower end of the aluminum strip A is connected with the lower end of the aluminum strip B through a bolt, the semiconductor refrigerating sheet is clamped and fixed on the metal heat conducting sheet by screwing the upper plastic bolt and the lower plastic bolt through the aluminum strips A and B.

Preferably, the first rolling bearing is a cylindrical roller bearing, and an inner ring I, an outer ring I and a rolling body I in the first rolling bearing are all made of aluminum alloy materials, pure copper materials or steel materials;

the second rolling bearing and the third rolling bearing are ball bearings, and the second inner ring, the second outer ring, the second rolling element, the third inner ring, the third outer ring and the third rolling element are all made of aluminum alloy materials, pure copper materials or steel materials.

Preferably, the mounting ring is detachably arranged in a mounting through hole in a rear shell of the automobile headlamp assembly, an internal thread is arranged on the inner diameter surface of the mounting ring, external threads are arranged on the outer wall surfaces of the left half lamp post and the right half lamp post exposed out of the rotating base, and the lamp posts are connected and fixed in the mounting ring through the threads of the external threads in an inserting manner, so that the LED headlamp bulb is detachably fixed in the mounting ring in an inserting manner;

the transmission disc is provided with a plurality of circular through holes, so that fingers or clamping tools of a person can extend into the circular through holes on the transmission disc, then the fingers or the clamping tools of the person can grasp the bottom end of the plastic tube and screw the plastic tube, and the lamp post is further screwed and inserted into the mounting ring;

the bottom surface of the transmission disc is adhered with a layer of heat insulation material, and the circular through hole in the transmission disc is covered and sealed by the heat insulation material on the transmission disc so as to prevent hot air from entering the metal heat conduction pipe from the circular through hole.

An automobile headlamp assembly comprises a light distribution lens positioned on the front side, a rear shell positioned on the back side, a reflecting cup used for reflecting and condensing light, a lamp cavity in the automobile headlamp assembly is enclosed by the light distribution lens and the rear shell in a sealing connection mode, a rear side protruding tube is arranged on the outer wall surface of the rear shell, an outer opening of the rear side protruding tube is covered by a dustproof cover, and the LED headlamp bulb capable of achieving semiconductor refrigeration and heat dissipation is further included;

the LED headlamp bulb is inserted and fixed in a mounting through hole in a rear shell of the automobile headlamp assembly through a mounting ring, the part of the LED headlamp bulb exposed out of a lamp cavity is concealed in a tube cavity of the rear side protruding tube, and the rear side protruding tube covers and wraps the part of the LED headlamp bulb exposed out of the lamp cavity.

Drawings

Fig. 1 is a schematic sectional view of an axial central plane of a semiconductor cooling and heat dissipating LED headlamp bulb according to an embodiment of the present invention (a headlamp assembly in the prior art is not the structure shown in fig. 1, fig. 1 is a structure obtained by cutting out one of a low beam lamp and a high beam lamp from a complete set of the headlamp assembly, and fig. 1 is a schematic structural illustration only;

FIG. 1 is a schematic diagram of a structure in which a plurality of fine components are drawn in slightly larger dimensions for clarity in FIG. 1, actual dimensions in practical applications include, but are not limited to, the dimensions of FIG. 1, and actual dimensions in practical applications include, but are not limited to, the dimensions of FIG. 1;

in order to embody the semiconductor refrigeration sheet in fig. 1, the metal heat-conducting sheet, the semiconductor refrigeration sheet, the heat-insulating material on the metal heat-conducting sheet, the aluminum strip a, the aluminum strip B, the upper plastic bolt and the lower plastic bolt are not cut in fig. 1;

in view of the complex internal structure of the dc motor, the dc motor is not cut in fig. 1;

to avoid the small lines being so much that they appear confused and unclear, the bolts in the bolt holes in fig. 1 are not shown. ) (ii) a

FIG. 2 is an enlarged 2-fold view of a sectional structure diagram of an axial center plane of the LED headlamp bulb in FIG. 1;

FIG. 3 is a schematic cross-sectional view of the lamp post and its internal components and motor base shown in FIG. 2;

FIG. 4 is a schematic sectional view taken along the line A-A of the lamp post of FIG. 2;

FIG. 5 is a schematic cross-sectional view of the lamp post of FIG. 2 along the direction B-B;

FIG. 6 is a schematic perspective view of the rotating base in FIG. 2;

fig. 7 is a schematic sectional structure view of the metal heat conducting sheet of fig. 2 cut along the axial center plane where the upper plastic bolt and the lower plastic bolt coincide with each other;

FIG. 8 is a schematic perspective view of the drive plate of FIG. 2;

fig. 9 is a schematic perspective view of the first plastic insulating ring in fig. 2.

In the figure: 101 left LED lamp bead, 102 right LED lamp bead;

2 lamp post, 201 left aluminum base plate, 202 right aluminum base plate, 203 left half lamp post, 2031 left half cylinder, 2032 left half disc, 204 right half lamp post, 2041 right half cylinder, 2042 right half disc, 207 narrow secondary groove, 208 heat pipe, 209 bolt hole, 210 solder paste brazing layer, 211 positive electrode wire one, 212 negative electrode wire one, 213 positive electrode wire two, 214 negative electrode wire two, 215 positive electrode wire three, 216 negative electrode wire three, 217 positive electrode wire four, 218 negative electrode wire four, 219 through hole at the bottom of left half cylinder of left half lamp post, 220 through hole at the bottom of right half cylinder of right half lamp post;

3 rolling bearing one, inner ring one 301, outer ring one 302 and rolling body one 303;

4, a rotating base, a 401 metal heat conduction pipe, a 402 metal heat conduction sheet, a heat insulation material on a 403 metal heat conduction pipe, a heat insulation material on a 404 metal heat conduction sheet, and a through hole which allows an anode conductive wire of a semiconductor refrigeration sheet to pass through on a 405 metal heat conduction pipe;

5, a motor base, 501 plastic pipes, 502 plastic flange plates and 503 bolts II;

6 DC motor, 601 rotation axis;

7, a transmission disc, 701 circular through holes and 702 heat insulation materials on the transmission disc;

8 semiconductor refrigerating plates, 801 positive electrode conducting wires and 802 negative electrode conducting wires;

9, a second rolling bearing, a second inner ring 901, a second outer ring 902 and a second rolling body 903;

10, a third rolling bearing, a third inner ring 1001, a third outer ring 1002 and a third rolling body 1003;

11 a first plastic insulating ring, 1101 a radial through hole on the first plastic insulating ring;

12, a second plastic insulating ring, 1201 and a radial through hole on the second plastic insulating ring;

1301 aluminum strip A, 1302 aluminum strip B, 1303 upper plastic bolt and 1304 lower plastic bolt;

14 mounting a ring;

15 lens, 16 back shell, 17 reflecting cup, 18 lamp cavity;

19 rear convex tube, 20 dust cover, 2001 dust cover round tube side wall, 2002 dust cover bottom wall.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention.

In the description of the present invention, it is to be understood that the terms "central," "axial," "radial," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "vertical," "horizontal," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present invention and to simplify the description, but are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the present invention.

Referring to fig. 1 to 9, fig. 1 to 9 include: a left LED lamp bead 101 and a right LED lamp bead 102; the lamp post 2, the left aluminum substrate 201, the right aluminum substrate 202, the left half lamp post 203, the left half cylinder 2031, the left half disc 2032, the right half lamp post 204, the right half cylinder 2041, the right half disc 2042, the narrow secondary groove 207, the heat pipe 208, the bolt hole 209, the solder paste brazing layer 210, the positive electrode wire one 211, the negative electrode wire one 212, the positive electrode wire two 213, the negative electrode wire two 214, the positive electrode wire three 215, the negative electrode wire three 216, the positive electrode wire four 217, the negative electrode wire four 218, the through hole 219 at the bottom of the left half cylinder of the left half lamp post, and the through hole 220 at the bottom of the right half cylinder of the right half lamp post; the rolling bearing I3 comprises an inner ring I301, an outer ring I302 and a rolling body I303; the semiconductor refrigeration device comprises a rotating base 4, a metal heat conduction pipe 401, a metal heat conduction sheet 402, a heat insulation material 403 on the metal heat conduction pipe, a heat insulation material 404 on the metal heat conduction sheet, and a through hole 405 on the metal heat conduction pipe for allowing a positive electrode conductive wire of a semiconductor refrigeration sheet to pass through; a motor base 5, a plastic pipe 501, a plastic flange 502 and a second bolt 503; a direct current motor 6, a rotating shaft 601; the transmission disc 7, the circular through hole 701 and the heat insulation material 702 on the transmission disc; the refrigerating device comprises a semiconductor refrigerating sheet 8, a positive electrode conducting wire 801 and a negative electrode conducting wire 802; a rolling bearing II 9, an inner ring II 901, an outer ring II 902 and a rolling body II 903; a rolling bearing III 10, an inner ring III 1001, an outer ring III 1002 and a rolling body III 1003; a first plastic insulating ring 11, wherein a radial through hole 1101 is formed in the first plastic insulating ring; a second plastic insulating ring 12, and a radial through hole 1201 on the second plastic insulating ring; aluminum strip A1301, aluminum strip B1302, upper plastic bolt 1303 and lower plastic bolt 1304; a mounting ring 14; a lens 15, a rear shell 16, a reflecting cup 17 and a lamp cavity 18; a rear protruding tube 19, a dust cover 20, a tubular side wall 2001 of the dust cover, and a bottom wall 2002 of the dust cover.

The application provides a semiconductor refrigeration and heat dissipation LED headlamp bulb which comprises a left LED lamp bead 101 and a right LED lamp bead 102 for emitting light, a long columnar lamp post 2, a plurality of semiconductor refrigeration sheets 8 for refrigeration, a rotating base 4 which is used for mounting the semiconductor refrigeration sheets 8 and is made of an aluminum alloy material, a clamp for clamping and fixing the semiconductor refrigeration sheets 8, a rolling bearing I3 which is used for supporting rotation and heat conduction and is made of a metal material, a rolling bearing II 9 which is used for supporting rotation and electricity conduction and is made of a metal material, a rolling bearing III 10 which is used for supporting rotation and electricity conduction and is made of a metal material, a plastic insulating ring I11, a plastic insulating ring II 12, a direct current motor 6, a motor base 5, a driving disc 7 made of a plastic material, a mounting ring 14, a mounting hole and a mounting hole which are used for mounting and fixing the LED headlamp bulb in a mounting hole in a rear shell 16 of, A driving power supply circuit board;

the rolling bearing I3 comprises an inner ring I301, an outer ring I302, a rolling body I303 and a retainer I;

the direct current motor 6 is arranged in the bottom pipe orifice of the plastic pipe 501, the transmission disc 7 is located in the pipe cavity of the metal heat conduction pipe 401 and below the direct current motor 6, a rotating shaft 601 of the direct current motor 6 is fixedly inserted into an axial central through hole of the transmission disc 7, an axial central line of the rotating shaft 601 in the direct current motor 6 is overlapped with an axial central line of the metal heat conduction pipe 401, and an outer diameter surface of the transmission disc 7 is in adhesive connection with an inner surface of the pipe wall of the metal heat conduction pipe 401 so that the rotating shaft rotates to drive the metal heat conduction pipe 401 to rotate;

the semiconductor refrigeration sheet is arranged on the long and wide surface of the metal heat conducting sheet, the semiconductor refrigeration sheet is clamped and fixed on the long and wide surface of the metal heat conducting sheet by the clamp so as to be driven by the rotation of the metal heat conducting sheet to rotate, and heat-conducting silicone grease is coated between the cold surface of the semiconductor refrigeration sheet and the long and wide surface of the metal heat conducting sheet to form heat-conducting connection between the cold surface of the semiconductor refrigeration sheet and the long and wide surface of the metal heat conducting sheet;

the second rolling bearing 9 comprises a second inner ring 901, a second outer ring 902, a second rolling body 903 and a second retainer, the second inner ring 901 of the second rolling bearing 9 is fixedly sleeved on the outer surface of the pipe wall of the plastic pipe 501, the outer diameter surface of the second outer ring 902 of the second rolling bearing 9 is in adhesive connection with the inner diameter surface of the first plastic insulating ring 11 through an adhesive, and the outer diameter surface of the first plastic insulating ring 11 is in adhesive connection with the inner surface of the pipe wall of the metal heat conduction pipe 401 through the adhesive so as to drive the second outer ring 902 to rotate through the rotation of the metal heat conduction pipe 401;

the third rolling bearing 10 comprises a third inner ring 1001, a third outer ring 1002, a third rolling body 1003 and a third retainer, the third inner ring 1001 of the third rolling bearing 10 is fixedly sleeved on the outer surface of the pipe wall of the plastic pipe 501, the third rolling bearing 10 is located below the second rolling bearing 9, the outer diameter surface of the third outer ring 1002 of the third rolling bearing 10 is in adhesive connection with the inner diameter surface of the second plastic insulating ring 12 through an adhesive, and the outer diameter surface of the second plastic insulating ring 12 is in adhesive connection with the inner surface of the pipe wall of the metal heat conduction pipe 401 through an adhesive, so that the third outer ring 1002 is driven to rotate by the rotation of the metal heat conduction pipe 401;

a radial through hole for communicating the outer diameter surface and the inner diameter surface of the plastic insulating ring I11 is formed in the plastic insulating ring I11, and a positive conductive wire 801 of the semiconductor chilling plate 8 firstly penetrates through the pipe wall of the metal heat conduction pipe 401, then penetrates through the radial through hole in the plastic insulating ring I11 and is finally electrically connected with the outer ring II 902 of the rolling bearing II 9, so that the rotating outer ring II 902 is used as a positive electrode of a direct-current power supply to provide direct current for the rotating semiconductor chilling plate 8;

a radial through hole for communicating the outer diameter surface and the inner diameter surface of the plastic insulating ring II 12 is formed in the plastic insulating ring II 12, a negative electrode conducting wire 802 of the semiconductor chilling plate 8 firstly penetrates through the pipe wall of the metal heat conducting pipe 401, then penetrates through the radial through hole in the plastic insulating ring II 12 and is finally electrically connected with an outer ring III 1002 of the rolling bearing III 10, and the rotating outer ring III 1002 serves as a negative electrode of a direct-current power supply to provide direct current for the rotating semiconductor chilling plate 8;

the four straight lines of the axis around which the outer ring I302 of the rolling bearing I3 rotates, the axis around which the outer ring II 902 of the rolling bearing II 9 rotates, the axis around which the outer ring III 1002 of the rolling bearing III 10 rotates and the axial center line of the rotating shaft 601 of the direct current motor 6 coincide with each other.

In an embodiment of the present application, the lamp post 2 includes a left aluminum substrate 201 for mounting and fixing the left LED lamp bead 101 and conducting electricity and heat, a right aluminum substrate 202 for mounting and fixing the right LED lamp bead 102 and conducting electricity and heat, a left half lamp post 203 and a right half lamp post 204;

the left half lamppost 203 and the right half lamppost 204 are overlapped together to form a complete lamppost 2, the left half light column 203 comprises a left half column 2031 and a left half disc 2032 arranged at the bottom end of the left half column 2031, the right lamppost half 204 comprises a right column half 2041 and a right disc half 2042 disposed at the bottom end of the right column half 2041, the inner length and width surface of the left half lamppost 203 is provided with a primary groove, the inner length and width surface of the right half lamppost 204 is provided with a primary groove, the primary groove on the left half lamp post 203 and the primary groove on the right half lamp post 204 are spliced into a post inner cavity, a wide secondary groove is also arranged on the bottom surface of the inner groove at the middle upper part of the primary groove, a narrow secondary groove 207 for accommodating a concealed wire is also arranged on the bottom surface of the inner groove at the middle lower part of the primary groove, and the wide secondary groove is communicated with the narrow secondary groove 207;

the top parts of the left half lamp post 203 and the right half lamp post 204 are both provided with bolt holes 209, and the left half lamp post 203 and the right half lamp post 204 are connected and spliced into a complete lamp post through a first bolt inserted into the bolt holes 209;

the motor base 5 comprises a plastic pipe 501 and a plastic flange plate 502, the plastic flange plate 502 is arranged at the top end of the plastic pipe 501, the motor base 5 is sleeved in the pipe cavity of the metal heat conducting pipe 401 and is located below the left semicircular disc 2032, the screw of the second bolt 503 penetrates through the plastic flange plate 502 and the left semicircular disc 2032 to form a bolt connection so as to fix the motor base 5 on the lower disc surface of the left semicircular disc 2032, and the screw of the other second bolt 503 penetrates through the plastic flange plate 502 and the right semicircular disc 2042 to form a bolt connection so as to fix the motor base 5 on the lower disc surface of the right semicircular disc 2042;

the first positive wire 211 and the first negative wire 212 for supplying power to the semiconductor refrigeration piece 8 enter the narrow secondary groove 207 on the left half lamppost 203 from the through hole at the bottom of the left half column 2031, then the first positive wire 211 enters the tube cavity of the plastic tube 501 downwards, then the first positive wire 211 penetrates through the tube wall of the plastic tube 501 to be electrically connected with the second inner ring 901 of the second rolling bearing 9 for supplying direct current to the second rolling bearing 9, then the first negative wire 212 enters the tube cavity of the plastic tube 501 downwards, and then the first negative wire 212 penetrates through the tube wall of the plastic tube 501 to be electrically connected with the third inner ring 1001 of the third rolling bearing 10 for supplying direct current to the third rolling bearing 10.

In this application, left LED lamp pearl 101 and right LED lamp pearl 102 are SMD LED.

In the present application, the connection between the metal heat conduction pipe 401 and the metal heat conduction fin 402 in the rotating base 4 is a casting connection, but not a welding connection, so as to prevent poor heat conduction existing in the welding connection between the metal heat conduction pipe 401 and the metal heat conduction fin 402; the metal heat conduction pipe 401 and the metal heat conduction sheet 402 may be integrally cast, and the metal heat conduction pipe 401 and the metal heat conduction sheet 402 are simultaneously cast; or casting an aluminum alloy rod, then hot-extruding the metal heat conduction pipe 401 and the metal heat conduction sheet 402 thereon simultaneously by hot extrusion molding, and then cutting into small sections to obtain the rotating base 4.

In the application, the lamp post is preferably divided into a left half lamp post and a right half lamp post, the cylinder of the lamp post is preferably divided into a left half cylinder and a right half cylinder, and the disk at the bottom end of the cylinder is preferably divided into a left half disk and a right half disk; the left half-disc 2032 and the right half-disc 2042 at the bottom of the lamp post 2 are preferably welded and connected with the inner ring-one 301 by brazing, and more preferably by brazing, wherein the brazing is firstly adopted because the connection strength between the inner ring-one 301 and the lamp post can be improved, and is most importantly because a small gap which can not be seen by naked eyes is formed between the inner diameter surface of the inner ring-one 301 and the outer diameter surface of the left half-disc 2032, and a small gap which can not be seen by naked eyes is formed between the inner diameter surface of the inner ring-one 301 and the outer diameter surface of the right half-disc 2042, and the gap can cause poor heat conduction, and after brazing, the melted brazing filler metal is sucked into and filled in the gap by capillary action, and the liquid brazing filler metal is mutually diffused and dissolved with the inner ring-one 301, the left half-disc 2032 and the right half-disc 2042, namely, the gap is filled with the solidified liquid brazing filler metal, so that the heat conduction strength between the inner ring-one 301 and, poor heat conduction due to a gap between the two which is hardly visible to the naked eye is avoided.

Similarly, the top tube opening of the first metal heat conducting tube is welded and sleeved on and fixed to the first outer ring of the first rolling bearing, the outer diameter surface of the first outer ring is welded and connected with the inner surface of the tube wall of the top tube opening of the first metal heat conducting tube, the welding here preferably adopts brazing, more preferably adopts brazing, firstly, the welding strength between the first outer ring 302 and the metal heat conducting tube 401 can be improved, most preferably, a tiny gap which can not be seen by naked eyes is formed between the outer diameter surface of the first outer ring 302 and the inner surface of the tube wall of the metal heat conducting tube 401, the gap can cause poor heat conduction, after the brazing is adopted, the melted brazing filler metal can be sucked into and filled in the gap by virtue of capillary action, the liquid brazing filler metal is mutually diffused and dissolved with the first outer ring 302 and the metal heat conducting tube 401, namely, the gap is filled by using solidified substances of the liquid brazing filler metal, so that the heat conducting strength between the first outer ring 302 and, poor heat conduction due to a gap between the two which is hardly visible to the naked eye is avoided.

In this application, motor cabinet 5 includes plastic tubing 501 and plastic flange 502, motor cabinet 5 is plastic molding's integral type structure, and plastic tubing 501 is connected with plastic flange 502 for plastic molding's integral type. In this application, the motor cabinet is fixed after the lower quotation of right half disc, narrow second grade recess and the lumen 207 of plastic tubing are the intercommunication.

In this application, since the metal heat-conducting strip 402 has two long and wide surfaces, it is preferable that two semiconductor cooling fins 8 are respectively disposed on the two long and wide surfaces of the metal heat-conducting strip 402, that is, 2 semiconductor cooling fins 8 are disposed on one metal heat-conducting strip 402.

In this application, the cold insulation of the cold side of the semiconductor chilling plate 8, the cold insulation of the metal heat conducting plate 402 and the cold insulation of the metal heat conducting pipe 401 are the same as the cold insulation of the refrigerator by filling a large amount of hard foam polyurethane heat insulating materials in the interlayer in the shell of the refrigerator, which is a problem that important attention needs to be paid to, because the semiconductor chilling plate 8, the metal heat conducting plate 402 and the metal heat conducting pipe 401 are all rotary, if the three are in direct contact with air in the rotary process, heat convection heat transfer can be performed with the air, the cold made by consuming electric energy is heated by the air again, the cold is dissipated in the air, like opening the door when the refrigerator is refrigerating, and the cold generated by the semiconductor chilling plate 8 is wasted in vain. In order to avoid the situation, the outer surface of the pipe wall of the metal heat conduction pipe is coated with a layer of heat preservation material (the thickness of the heat preservation material is 2mm-5mm) for heat preservation and heat insulation, the rest outer surface of the metal heat conduction sheet except the outer surface provided with the semiconductor refrigeration sheet is coated with a layer of heat preservation material (the thickness of the heat preservation material is 1 mm-3 mm larger than that of the semiconductor refrigeration sheet 8), the long thick surface and the wide thick surface of the semiconductor refrigeration sheet 8 are sleeved and coated with the heat preservation material on the metal heat conduction sheet 402 for heat preservation and heat insulation of the semiconductor refrigeration sheet 8, and the heat preservation material is like a large amount of hard foam polyurethane heat preservation material filled in a refrigerator for cold preservation.

In this application, with the insulation material cladding the whole pipe wall surface of metal heat pipe is with the insulation material cladding metal conducting strip all the surplus surface (including long wide surface, long thick surface and wide thick surface) except that set up the surface of semiconductor refrigeration piece to avoid this metal heat pipe and the surface of metal conducting strip to expose and take place the heat convection with the air, the cold volume that the cold side of extravagant semiconductor refrigeration piece 8 made.

In the application, the second inner ring 901 of the second rolling bearing 9 is sleeved and fixed on the outer surface of the pipe wall of the plastic pipe 501 through an adhesive.

In the application, the inner ring three 1001 of the rolling bearing three 10 is sleeved and fixed on the outer surface of the pipe wall of the plastic pipe 501 through an adhesive.

In the present application, the inner ring one 301 of the rolling bearing one 3 made of metal material is fixed and does not rotate but the outer ring one 302 rotates, and the rolling bearing one 3 functions as: one is for supporting the rotation of the rotating base 4 and the metal heat conduction pipe 401, although the metal heat conduction pipe 401 is powered by the dc motor 6 to rotate, there is a support of the outer ring one 302 in the rolling bearing one 3, the stability of the rotation of the rotating base 4 and the metal heat conducting pipe 401 can be improved, and the second is used for heat conduction and used as a bridge for heat transfer, firstly, the heat on the lamp post is conducted to the inner ring 301, then the heat on the inner ring I301 is conducted to the rolling bodies I303 in the rolling bearing I3, then, the heat of the first rolling element 303 is conducted to the first outer ring 302, and then the heat of the first outer ring 302 is conducted to the metal heat conduction pipe 401, thus transferring the heat from the lamp post to the metal heat conduction pipe 401 through the rolling bearing-3 bridge, then, the heat on the metal heat conduction pipe 401 is transferred to the metal heat conduction sheet 402, and then the heat on the metal heat conduction sheet 402 is transferred to the cold surface of the semiconductor refrigeration sheet 8.

In the present application, the second inner ring 901 of the second rolling bearing 9 made of a metal material is fixed and does not rotate, but the second outer ring 902 of the second rolling bearing 9 rotates, and the second rolling bearing 9 acts as: used as a positive pole for supplying power in a rotating way, firstly the driving power circuit board supplies direct current to the inner ring II 901 through the positive pole wire I211, since the second rolling bearing 9 is made of metal material and can conduct electricity, then the direct current on the second inner ring 901 is transmitted to the second rolling element 903, then the direct current on the second rolling element 903 is transmitted to the second outer ring 902, then the second outer ring 902 is in rigid transmission connection with the metal heat conduction pipe 401 through the first plastic insulation ring 11, the rotating speed of the second outer ring 902 is the same as that of the metal heat conduction pipe 401, the second outer ring 902 and the metal heat conduction pipe 401 are in a relative synchronous static state, the rotating speed of the second outer ring 902 is the same as that of the semiconductor chilling plate 8, the second outer ring 902 and the semiconductor chilling plate 8 are in a relative synchronous static state, and the second outer ring 902 rotates and conducts electricity to the rotating semiconductor chilling plate 8 through the positive electrode conducting wire 801.

In the present application, the inner ring three 1001 of the rolling bearing three 10 made of a metal material is fixed against rotation but the outer ring three 1002 rotates, and the rolling bearing three 10 functions as: serving as a negative electrode for supplying power while rotating, the drive power supply circuit board first supplies direct current to the inner ring three 1001 through the negative electrode wire one 212, since the rolling bearing three 10 is made of metal material and can conduct electricity, then the direct current on the inner ring three 1001 is transmitted to the rolling bearing three 1003, then the direct current on the rolling body III 1003 is transmitted to the outer ring III 1002, the outer ring III 1002 is in rigid transmission connection with the metal heat conduction pipe 401 through the plastic insulation ring II 12, the rotating speed of the outer ring III 1002 is the same as that of the metal heat conduction pipe 401, the outer ring III 1002 and the metal heat conduction pipe 401 are in a relative synchronous static state, and the rotating speed of the outer ring three 1002 is the same as that of the semiconductor chilling plate 8, the outer ring three 1002 and the semiconductor chilling plate 8 are in a relative synchronous static state, and the outer ring three 1002 rotates and conducts electricity to the rotating semiconductor chilling plate 8 through the negative electrode conducting wire 802.

In this application, the above-mentioned axis refers to a straight line around which an object or a three-dimensional figure rotates or around which it can be assumed that the rotation is imaginary.

In this application, the dc motor 6 is disposed in the bottom nozzle of the plastic pipe 501 in the motor base 5, that is, the housing or the main body of the dc motor 6 is disposed in the bottom nozzle of the plastic pipe 501 in the motor base 5 by an adhesive.

In the present application, the rotating shaft of the dc motor 6 is also referred to as an output shaft, and the rotating shaft 601 of the dc motor 6 is inserted and fixed (preferably, adhesively connected) in the axial central through hole of the transmission disc 7; the transmission disc 7 is in the shape of a flat circular plate, and the transmission disc 7 is made of hard plastic, mainly the hard plastic does not conduct heat, and can cut off the heat conduction between the metal heat conduction pipe 401 and the rotating shaft 601 of the direct current motor 6.

In this application, since the plastic pipe 501 is made of hard plastic, the plastic pipe 501 does not conduct heat, so that heat on the lamppost cannot be transferred to the dc motor 6 through the plastic pipe 501 and then transferred to the metal heat conducting pipe 401 by the dc motor 6, and therefore heat on the lamppost 2 can only be transferred to the metal heat conducting pipe 401 and the metal heat conducting strip 402 through the rolling bearing one 3.

The power of the semiconductor refrigerating sheet is power consumption, not refrigerating capacity, and the refrigerating efficiency of the existing semiconductor refrigerating sheet is about 60%, namely the energy efficiency ratio is about 0.6, and is very low (the heat pump of a compressor is at least more than 2.0). Taking 100 watts as an example: the refrigerating capacity of about 60 watts (about 60 joules per second can be absorbed from the cold surface) can be generally generated by the refrigerating sheet of 100 watts, while the heat generated by the hot surface is very large, about 60 watts of heat absorbed from the cold surface is added to the heat generated by the power consumption of 100 watts, the sum of the heat and the heat is about 160 watts, and the temperature difference of the cold surface and the hot surface is quite different.

The application obtains the following beneficial technical effects:

1) firstly, no matter how, the LED lamp bead is radiated by adopting semiconductor refrigeration, the radiating effect and the radiating efficiency of the LED lamp bead in the LED headlamp bulb are improved, and the technical problems mentioned in the background technology part are solved; here, the whole heat dissipation process of the LED headlight bulb that this application provided does: the heat generated by the LED lamp bead → the aluminum base layer in the aluminum substrate → the heat pipe 208 → the lamp post 2 → the inner ring one 301 → the rolling body one 303 → the outer ring one 302 → the metal heat conduction pipe 401 → the metal heat conduction sheet 402 → the cold surface of the semiconductor refrigeration sheet 8 → the hot surface of the semiconductor refrigeration sheet 8 → the cooling air generated by the rotation of the rotating base 4 (mainly the rotation of the metal heat conduction sheet 402), thereby improving the heat dissipation effect and the heat dissipation efficiency of the LED lamp bead in the LED headlamp bulb and the LED chip in the LED headlamp bulb.

2) Semiconductor refrigeration piece 8 has two length wide surfaces, and a length wide surface (cold side) is used for the refrigeration, and another length wide surface (hot side) is used for the heat dissipation, and in fact, to realizing that semiconductor refrigeration piece 8's long-time normal work does not damage, guarantee that the good of semiconductor refrigeration piece 8's hot side, fully, enough dispel the heat is first order, guarantee on the contrary that the good refrigeration of semiconductor refrigeration piece 8's cold side is second order.

In view of the refrigeration principle of the semiconductor refrigeration piece 8, the heat surface of the semiconductor refrigeration piece 8 must be actively radiated, so that the whole semiconductor refrigeration piece 8 is prevented from being burned out due to overheating of the heat surface.

Therefore, in the prior art, generally, the heat radiating fins are arranged on the hot surface of the semiconductor chilling plate 8, then the heat radiating fan is arranged on the heat radiating fins, the heat radiating fan is used for generating cooling air, the cooling air passes through the surfaces of the heat radiating fins, and as the hot surface of the semiconductor chilling plate 8 is in direct contact with the heat radiating fins, the heat on the hot surface of the semiconductor chilling plate 8 is transferred to the heat radiating fins, and the heat at the hot surface of the semiconductor chilling plate 8 is finally taken away by the cooling air generated by the heat radiating fan, so that the heat radiation of the hot surface of the semiconductor chilling plate 8 is realized.

Above-mentioned, the heat dissipation to the hot side of semiconductor refrigeration piece 8 is the heat convection formula heat dissipation that the air flows through heat radiation fins, and semiconductor refrigeration piece 8 is the rigid among the prior art, and heat radiation fins is also the rigid, and sets up an axial fan simultaneously and carries out convulsions to heat radiation fins for the air flows to get up and passes through from heat radiation fins's surface, takes place heat convection formula heat dissipation, so mainly has following 4 defects: (1) the volume of the semiconductor refrigeration piece 8 is very small, the thickness is 3mm to 5mm, for example, the length is 40mm × the width is 40mm × the thickness is 3.5mm, but compared with the volume of the semiconductor refrigeration piece 8, the volume of the heat dissipation fin and the heat dissipation fan is too large, the sum of the volumes of the heat dissipation fin and the heat dissipation fan is dozens or even hundreds of times of the volume of the semiconductor refrigeration piece 8, the proportion of the volumes is very inconsistent, and the volume is too large, and the larger the refrigeration capacity of the semiconductor refrigeration piece 8 is, the larger the heat dissipation capacity of the matched heat dissipation fin and the heat dissipation fan is, the larger the sum of the volumes of the matched heat dissipation fin and the heat dissipation fan is, which corresponds to the technical problem that the refrigeration capacity of the semiconductor refrigeration component in the prior art is enough but the volume is too large and cannot be put into the heat dissipation fan or the volume can be put into the heat: for example, a semiconductor cooling plate 8 with 60W cooling capacity is required for good and sufficient heat dissipation of a certain LED headlamp bulb, but the volume of a heat dissipation fin and a heat dissipation fan which are matched with each other and have 160W cooling capacity is too large, and is close to half or more of the volume of an automobile headlamp assembly, so that the heat dissipation fin and the heat dissipation fan which are matched with each other cannot enter the automobile headlamp assembly, and insufficient space is not available for installation, so that at this time, the sum of the volume of the heat dissipation fin and the volume of the heat dissipation fan is controlled, the heat dissipation fin and the heat dissipation fan which have smaller volumes and can be placed in the automobile headlamp assembly are selected, for example, an 80W heat dissipation fin and the heat dissipation fan are selected, and then the matched semiconductor cooling plate 8 is selected, for example, a 30W cooling capacity semiconductor cooling plate 8 is selected, and obviously, the 30W cooling capacity semiconductor cooling plate 8 is not enough for good and sufficient heat dissipation of the LED headlamp, however, the method has the disadvantages that the size is allowed to be placed in the automobile headlamp assembly, and the refrigerating capacity is not enough if the size is too large;

(2) the heat really needs to be dissipated by the hot surface of the semiconductor refrigerating sheet 8, but the cooling air directly blows the heat dissipating fins, the cooling air does not directly blow the semiconductor refrigerating sheet 8, the heat dissipating fins are also separated between the cooling air and the semiconductor refrigerating sheet 8, like a first-level intermediary is separated between a buyer and a seller, the intermediary earns a difference, the first-level thermal resistance is increased by increasing the first-level intermediary every time in the heat transfer process, the total heat transfer efficiency is reduced, and the heat dissipating effect and the heat dissipating efficiency of the hot surface of the semiconductor refrigerating sheet 8 are reduced;

(3) cooling air (air) only lightly sweeps over the surfaces of the heat dissipation fins, and the convection strength is low, so that the heat dissipation effect and the heat dissipation efficiency are low;

(4) the heat dissipation fins in the prior art are always in a passive state with equal wind, the amount of the wind is not controlled, the heat dissipation fins are always in an equal, reliable and necessary passive state with the initiative in the heat dissipation fan, the heat dissipation fins are not actively struggled not to actively knock out the heat dissipation fins, the heat dissipation fins wait for the wind quietly, and like people do nothing in life, the passive attitude such as the passive attitude and the necessary attitude can cause passive idling, low efficiency and difficult success, and the heat dissipation effect and the heat dissipation efficiency of the hot surface of the semiconductor refrigeration sheet 8 are also lower.

Therefore, how to improve the heat dissipation effect and the heat dissipation efficiency of the hot surface of the semiconductor cooling plate 8 is a technical problem that needs to be solved urgently by those skilled in the art.

Therefore, the application creatively provides a novel heat dissipation mode of the hot surface of the semiconductor refrigeration sheet 8: the semiconductor refrigeration piece is fixed on the rotary metal heat conduction piece, similar to the operation principle that wet clothes are directly tied on the rotary blade in the fan blade of a ceiling fan, the hot surface of the semiconductor refrigeration piece 8 is directly exposed, the hot surface of the semiconductor refrigeration piece 8 is not covered by any object except an aluminum strip, the hot surface of the semiconductor refrigeration piece 8 is directly exposed in the atmosphere and is directly contacted with the air, and the semiconductor refrigeration piece 8 rotates, the rotary semiconductor refrigeration piece 8 has kinetic energy and can do work on the air, the hot surface of the rotary semiconductor refrigeration piece 8 can extrude, cut, rub and stir the air, so that the hot surface of the semiconductor refrigeration piece 8 directly conducts heat convection type heat transfer with the air, the heat on the hot surface of the semiconductor refrigeration piece 8 is transferred to the air, and then the heat is taken away by the air, thus the operation principle of radiating the hot surface of the semiconductor refrigeration piece 8 in the application is realized, this enables good and sufficient heat dissipation from the hot side of the semiconductor cooling plate 8.

The application adopts the novel heat radiation mode of the hot surface of the semiconductor refrigerating sheet 8 to obtain the following beneficial technical effects:

(a) after the novel heat dissipation mode of the hot surface of the semiconductor refrigeration piece 8 is adopted, a large-size heat dissipation fin and a heat dissipation fan do not need to be arranged on the hot surface of the semiconductor refrigeration piece 8, and the refrigeration function and the heat dissipation function can be realized only by one thin semiconductor refrigeration piece 8, so that the volume of the refrigeration assembly is remarkably reduced, the refrigeration assembly is favorable for being installed and used in a narrow space, and the technical problems that the refrigeration amount of the semiconductor refrigeration assembly in the prior art is enough but the volume is too large and cannot be put into the refrigeration assembly or the volume can be put into the refrigeration assembly but the refrigeration amount is not enough are solved;

(b) the hot surface of the semiconductor refrigeration piece 8 is directly exposed in the atmosphere and is directly contacted with the air, and the semiconductor refrigeration piece 8 is rotated, so that the hot surface of the semiconductor refrigeration piece 8 can directly generate heat convection type heat transfer with the air, a heat transfer medium such as a heat dissipation fin is not arranged between the hot surface of the semiconductor refrigeration piece 8 and the air, and a thermal resistance generated by the medium is not arranged, so that the heat dissipation effect and the heat dissipation efficiency of the hot surface of the semiconductor refrigeration piece 8 are improved;

(c) according to the semiconductor refrigeration device, the hot surface of the semiconductor refrigeration piece 8 is directly exposed in the atmosphere and directly contacted with the air, the semiconductor refrigeration piece 8 rotates, the rotating semiconductor refrigeration piece 8 has kinetic energy and can do work on the air, and the hot surface of the rotating semiconductor refrigeration piece 8 can extrude, shear, rub and stir the air, so that the heat convection strength between the hot surface of the semiconductor refrigeration piece 8 and the air is obviously improved, the heat transfer efficiency of transferring heat on the hot surface of the semiconductor refrigeration piece 8 to the air is obviously improved, more heat can be transferred to the air in unit time and further taken away by the air, the heat dissipation effect and the heat dissipation efficiency of the hot surface of the semiconductor refrigeration piece 8 are improved, and the heat dissipation effect and the heat dissipation efficiency of the LED lamp bead are finally improved;

for example, it is all the more true that, if a T-shirt is washed in summer, the washed T-shirt is aired indoors, and the room is naturally ventilated, and the T-shirt is aired completely, the time is generally 10 hours; further, if the washed T-shirt is wrapped with a layer of water-absorbing dry sponge and then placed under an indoor ceiling fan, the wind generated by the ceiling fan blows directly towards the dry sponge, and the wet T-shirt can be dried completely for 5 hours; furthermore, if the washed T-shirt is tightly bound on the blades in the fan blades of the ceiling fan, the wet T-shirt rotates along with the blades of the ceiling fan, and the complete drying may only need 1-2 hours; the principle is convection drying, but the convection intensity is gradually improved, so that the drying time is gradually and obviously reduced;

the semiconductor refrigerating sheet 8 in the application is just like the wet T-shirt which is just washed and has water, and the layer of water-absorbing dry sponge wrapping the wet T-shirt is just like the heat dissipation fins on the hot surface of the semiconductor refrigerating sheet 8 in the prior art;

in the prior art, the semiconductor refrigerating sheet 8 is fixed, the radiating fins are also fixed, and an axial flow fan is arranged to exhaust air to the radiating fins, so that air flows through the surfaces of the radiating fins to generate heat convection type heat dissipation, namely the washed T-shirt is wrapped by a layer of water-absorbing dry sponge and placed right below an indoor ceiling fan, and then the air generated by the ceiling fan is blown directly towards the dry sponge, so that the heat convection intensity is low, and the heat dissipation effect and the heat dissipation efficiency of the hot surface of the semiconductor refrigerating sheet 8 are low;

according to the ceiling fan, the hot surface of the semiconductor refrigerating sheet 8 is directly exposed in the atmosphere and rotates, the hot surface of the semiconductor refrigerating sheet 8 actively hits and squeezes air, cuts air, rubs air and stirs air, and the washed T-shirt is tightly bound on the blades in the fan blades of the ceiling fan, so that the wet T-shirt rotates along with the blades of the ceiling fan, the heat convection strength is obviously improved, and the heat dissipation effect and the heat dissipation efficiency of the hot surface of the semiconductor refrigerating sheet 8 are obviously improved;

(d) the semiconductor refrigerating sheet 8 is rotated, the hot surface of the semiconductor refrigerating sheet 8 is actively knocked out to extrude air, cut air, friction air and stir air, the active knocking out is used for generating air and capturing air, the active knocking out is used for some reason, the situation is not equal, and is not required, and the heat radiation fan is not required to provide air for the semiconductor refrigerating sheet 8, the wind comes and the amount of the wind comes are controlled by the semiconductor refrigerating sheet 8, the active right is firmly controlled at the semiconductor refrigerating sheet 8, and the active knocking out is actively performed, so that the heat radiation effect and the heat radiation efficiency of the hot surface of the semiconductor refrigerating sheet 8 are obviously improved.

3) In the actual use process of the semiconductor refrigerating sheet 8, when the refrigerating capacity of a single semiconductor refrigerating sheet 8 is larger and cannot meet the actual requirement, a plurality of semiconductor refrigerating sheets 8 are used for refrigerating together.

The semiconductor refrigerating sheet 8 is a plane sheet, so that the semiconductor refrigerating sheet cannot be folded or bent; furthermore, in view of the refrigeration principle of the semiconductor refrigeration sheet 8, in the prior art, a plurality of semiconductor refrigeration sheets 8 are not usually overlapped together for refrigeration, although the overlapping is feasible in principle, the operation is difficult in reality, and the semiconductor refrigeration sheets 8 consume large electric energy and are not paid, so that the significance is not great; therefore, in order to realize the common refrigeration of the plurality of semiconductor refrigeration sheets 8 in the prior art, usually, the plurality of refrigeration assemblies are simply and repeatedly arranged, each refrigeration assembly comprises 1 semiconductor refrigeration sheet 8 and a heat radiation fin and a heat radiation fan which are matched with the semiconductor refrigeration sheet 8, the final assembled finished product has a large volume due to the repeated arrangement, for example, if 4 semiconductor refrigeration sheets 8 are needed for refrigeration, 4 heat radiation fins and 4 heat radiation fans must be matched, the volume is too large, the semiconductor refrigeration sheets 8 cannot be installed in a general installation space, and the popularization and application of the common refrigeration of the plurality of semiconductor refrigeration sheets 8 in the industry are severely limited.

Therefore, how to set several semiconductor refrigeration pieces 8 in a limited crowded installation space in practical application, a plurality of semiconductor refrigeration pieces 8 can refrigerate together, so as to improve the total refrigeration capacity (namely, improve the total refrigeration capacity of all semiconductor refrigeration pieces 8 in a unit volume), or put it another way, on the premise of keeping the total refrigeration capacity sufficient and unchanged, the volume occupied by all semiconductor refrigeration pieces 8 is minimized (the volume occupied by the semiconductor refrigeration pieces 8 is reduced in the unit refrigeration capacity), which is a technical problem that technicians in the field need to solve urgently.

Therefore, the refrigeration mode of the cold surface of the semiconductor refrigeration sheet 8 is changed, a plurality of semiconductor refrigeration sheets 8 can be arranged in the refrigeration device, each metal heat conduction sheet 402 comprises two long and wide surfaces, each long and wide surface of each metal heat conduction sheet 402 is provided with one semiconductor refrigeration sheet 8, namely 2 semiconductor refrigeration sheets 8 are arranged on one metal heat conduction sheet 402, and preferably, the rotating base 4 in the refrigeration device comprises 2-8 metal heat conduction sheets 402, namely, 4-16 semiconductor refrigeration sheets 8 can be arranged at most in the refrigeration device;

in the application, one semiconductor chilling plate 8 rotates around the axial center line of the metal heat conduction pipe 401, so that the semiconductor chilling plate occupies a large volume, 2 semiconductor chilling plates 8 also rotate around the axial center line of the metal heat conduction pipe 401, so that the semiconductor chilling plates occupy a large volume, and the semiconductor chilling plates 8 rotate around the axial center line of the metal heat conduction pipe 401, so that the semiconductor chilling plates occupy a large volume, the volumes occupied by 1 semiconductor chilling plate, 2 semiconductor chilling plates and a plurality of semiconductor chilling plates 8 are not different, and the occupied volume is not increased along with the increase of the number of the semiconductor chilling plates 8;

in the application, as for the number of the finally set semiconductor refrigerating sheets 8 and the refrigerating capacity of each semiconductor refrigerating sheet 8, the number needs to be determined according to the total refrigerating capacity required by the bulb of the LED headlamp, and the total refrigerating capacity is determined according to the actual requirement on the site, which is the sum of the refrigerating capacities of all the semiconductor refrigerating sheets 8;

so, this application has solved in crowded limited installation space in practical application, can set up several semiconductor refrigeration pieces 8 more, polylith semiconductor refrigeration piece 8 refrigerates jointly, has improved total refrigerating output (having improved the total refrigerating output of whole semiconductor refrigeration pieces 8 in unit volume promptly), or has traded one to say, keeps under the enough and unchangeable prerequisite of total refrigerating output, has reduced the shared volume of all semiconductor refrigeration pieces 8 (having reduced the shared volume of semiconductor refrigeration piece 8 in unit refrigerating output).

To sum up, in fact, the overall idea of solving the technical problem of the present application is: in the prior art, a method for radiating a bulb of an LED headlamp by using a semiconductor cooling plate 8 is already available, but the prior art has a plurality of technical problems, one of which is as follows: the problem that the semiconductor refrigeration assembly in the prior art has enough refrigeration capacity but too large volume and cannot be put in the semiconductor refrigeration assembly or has enough volume but insufficient refrigeration capacity is caused by the fact that the volume of the semiconductor refrigeration piece 8 is small but the sizes of the matched heat dissipation fins and the heat dissipation fan are too large;

therefore, the heat dissipation mode of the hot surface of the semiconductor refrigeration piece 8 is changed, the heat dissipation fins and the heat dissipation fan are removed, and the refrigeration mode of the cold surface of the semiconductor refrigeration piece 8 is changed on the basis of changing the heat dissipation mode;

thus, the present application solves the problems in the above example as follows: the requirement that 60W of semiconductor refrigeration sheets 8 are required for good and sufficient heat dissipation of an LED headlamp bulb cannot be reduced is met, then 4 semiconductor refrigeration sheets 8 with 15W of refrigeration capacity are selected, 4 semiconductor refrigeration sheets 8 with 15W of refrigeration capacity are respectively arranged on two metal heat conducting sheets 402, 2 semiconductor refrigeration sheets 8 with 15W of refrigeration capacity are arranged on each metal heat conducting sheet 402, the total refrigeration capacity of a refrigeration assembly comprising the 4 semiconductor refrigeration sheets 8 with 15W of refrigeration capacity is enough, the size is small, the semiconductor refrigeration sheet assembly can be placed into a rear side raised pipe 19 on the outer wall surface of a rear shell 16 of an automobile headlamp assembly, the heat dissipation capacity of the hot surface of each semiconductor refrigeration sheet 8 is about 40W and is small as the refrigeration capacity (only 15W) divided by each semiconductor refrigeration sheet 8, the heat dissipation capacity of about 40W can be easily realized by rotating the hot surface of each semiconductor refrigerating sheet 8 and directly contacting with air, so that the technical problems that the refrigerating capacity of the semiconductor refrigerating assembly in the prior art is enough but the volume is too large and cannot be put into the semiconductor refrigerating assembly or the volume can be put into the semiconductor refrigerating assembly but the refrigerating capacity is not enough are solved.

In this application, this application has changed the radiating mode of the hot side of semiconductor refrigeration piece 8, has torn heat radiation fin and radiator fan down, and whether the heat dissipation capacity of the radiating mode of the hot side of semiconductor refrigeration piece 8 in this application is enough problem, and this application adopts following mode to solve: 1) increasing the rotating speed of the rotating shaft 601 of the direct-current motor to enable the semiconductor chilling plate 8 to rotate faster, so that the heat convection intensity between the hot surface of the semiconductor chilling plate 8 and air is further increased, and the larger the rotating speed of the semiconductor chilling plate 8 is, the larger the heat dissipation capacity of the hot surface of the semiconductor chilling plate 8 is; 2) at most 4-16 semiconductor refrigerating sheets 8 can be arranged in the application, if the phenomenon that the heat dissipation capacity of the hot surface of each semiconductor refrigerating sheet is insufficient really occurs, the problem can be solved by adopting a method of further increasing the number of the semiconductor refrigerating sheets so as to further reduce the heat dissipation capacity shared by each semiconductor refrigerating sheet, and the heat dissipation capacity of the smaller hot surface can be easily realized by rotating the hot surface of each semiconductor refrigerating sheet 8 and directly contacting with air.

In this application, this application has changed the refrigeration mode of the cold side of semiconductor refrigeration piece 8, and the refrigeration mode about the cold side of semiconductor refrigeration piece 8 in this application whether can cause the problem of dewfall frost condensation, this application adopts following mode to solve: 1) the LED headlight bulb further comprises a controller and a temperature sensor, the controller is electrically connected with each semiconductor refrigerating piece, the controller is electrically connected with the driving power supply circuit board, the controller is electrically connected with the temperature sensor, the temperature sensor and the controller are located outside the metal heat conducting pipe, the temperature sensor is arranged on the top surface of the left half disc and used for detecting the temperature of the left half disc, when a driver opens the LED headlight bulb of the automobile to illuminate, and when the temperature detected by the temperature sensor is less than or equal to 15 ℃, the controller cuts off the power supply of the driving power supply circuit board to the semiconductor refrigerating pieces, so that the semiconductor refrigerating pieces are powered off and stop refrigerating, and the phenomenon that condensation and frost are generated on the LED headlight bulb due to too low temperature is avoided.

In an embodiment of the present application, the above-mentioned LED headlamp bulb for semiconductor cooling further includes a heat pipe 208 for conducting heat;

the left aluminum substrate 201 and the right aluminum substrate 202 respectively comprise a circuit layer, an insulating layer and an aluminum base layer which are sequentially overlapped, the left LED lamp bead 101 is arranged on the circuit layer in the left aluminum substrate 201, and the right LED lamp bead 102 is arranged on the circuit layer in the right aluminum substrate 202;

the left aluminum substrate 201 is arranged in a wide secondary groove on the inner length and width surface of the left half lamp post 203, and the left LED lamp bead 101 is exposed out of a rectangular through hole on the wall of the left half lamp post 203;

the right aluminum substrate 202 is arranged in a wide secondary groove on the inner length and width surface of the right half lamp post 204, and the right LED lamp bead 102 is exposed from a rectangular through hole on the post wall of the right half lamp post 204;

the shape of the heat pipe 208 is a flattened flat long bar shape, the heat pipe 208 is placed in the cavity in the column, the left long wide surface of the heat pipe 208 is in close contact with the bottom surface of the inner groove of the primary groove on the left half lamp column 203, the right long wide surface of the heat pipe 208 is in close contact with the bottom surface of the inner groove of the primary groove on the right half lamp column 204, so that the heat pipe 208 is clamped and fixed in the lamp column by the left half lamp column 203 and the right half lamp column 204, and the primary groove on the left half lamp column 203 and the primary groove on the right half lamp column 204 extend downwards to the bottom end surface of the lamp column, so that the bottom end of the cavity in the column is exposed out of the bottom end of the heat pipe 208;

the left aluminum substrate 201, the heat pipe 208 and the right aluminum substrate 202 are stacked together in a left-to-right sequence and are clamped and fixed in the lamp post by the left half lamp post 203 and the right half lamp post 204 from the left and right directions.

In an embodiment of the present application, the exposed long and wide surface of the aluminum base layer of the left aluminum substrate 201 and the left long and wide surface of the heat pipe 208 are first filled with solder paste and then reflowed to form a solder connection, and the exposed long and wide surface of the aluminum base layer of the right aluminum substrate 202 and the right long and wide surface of the heat pipe 208 are first filled with solder paste and then reflowed to form a solder connection; here, the solder paste becomes the solder paste soldering layer 210 after the soldering process, and the design is that the micro gap at the contact surface of the left aluminum substrate 201 and the heat pipe 208 causes poor heat conduction, the micro gap at the contact surface of the right aluminum substrate 202 and the heat pipe 208 causes poor heat conduction, and the solder paste is melted by heat and then solidified during the reflow soldering to become the solder paste soldering layer 210, so that the micro gap is completely filled, thereby avoiding the poor heat conduction caused by the micro gap.

In one embodiment of the present application, the driving power circuit board is located outside the metal heat conduction pipe 401, and the semiconductor chilling plate 8 is electrically connected to the driving power circuit board;

a second positive electric wire 213 and a second negative electric wire 214 for supplying power to the left LED lamp bead 101 enter the narrow secondary groove 207 on the left half lamp post 203 from the through hole 219 at the bottom of the left half column 2031, and then the second positive electric wire 213 and the second negative electric wire 214 pass through the narrow secondary groove 207 on the left half lamp post 203 and are finally electrically connected with the positive electrode and the negative electrode of the left LED lamp bead 101 respectively;

a third positive electrode wire 215 and a third negative electrode wire 216 for supplying power to the right LED lamp bead 102 enter the narrow secondary grooves 207 on the right half lamp post 204 from the through hole 220 at the bottom of the right half column 2041, and then the third positive electrode wire 215 and the third negative electrode wire 216 pass through the narrow secondary grooves 207 on the right half lamp post 204 and are finally electrically connected to the positive electrode and the negative electrode of the right LED lamp bead 102 respectively;

a positive electrode wire four 217 and a negative electrode wire four 218 for supplying power to the direct current motor 6 enter the narrow secondary groove 207 on the right half lamppost 204 from the through hole 220 at the bottom of the right half cylinder 2041, and then the positive electrode wire four 217 and the negative electrode wire four 218 downwards pass through the plastic tube 501 and are finally electrically connected with the positive electrode and the negative electrode of the direct current motor 6 respectively;

the left LED lamp bead 101 is electrically connected with the driving power supply circuit board, the right LED lamp bead 102 is electrically connected with the driving power supply circuit board, the direct-current motor 6 is electrically connected with the driving power supply circuit board, and the semiconductor refrigeration sheet 8, the left LED lamp bead 101, the right LED lamp bead 102 and the direct-current motor 6 are electrically connected in parallel.

In an embodiment of the present application, the metal heat conducting fins 402 are planar fins, the long and wide surfaces of the metal heat conducting fins 402 are parallel to the axial center line of the metal heat conducting pipe 401, the outer surface of the pipe wall of the metal heat conducting pipe is integrally connected to one of the thicknesses of the metal heat conducting fins towards the side, and a gap is left between two adjacent metal heat conducting fins to form an air duct for passing cooling air therethrough.

In one embodiment of the present application, the rotating base 4 comprises 2 pieces of metal heat-conducting fins 402; the LED headlight bulb comprises 4 semiconductor chilling plates 8, wherein 1 semiconductor chilling plate 8 is arranged on each of the two long and wide surfaces of each metal heat conducting plate 402, and the 4 semiconductor chilling plates 8 correspond to the 2 metal heat conducting plates 402 one by one.

In one embodiment of the present application, the rotating base 4 comprises 3 pieces of metal heat-conducting fins 402; the LED headlight bulb comprises 6 semiconductor chilling plates 8, wherein 1 semiconductor chilling plate 8 is arranged on each of two long and wide surfaces of each metal heat conducting plate 402, and the 6 semiconductor chilling plates 8 correspond to the 3 metal heat conducting plates 402 one by one.

In one embodiment of the present application, the rotating base 4 comprises 4 pieces of metal heat-conducting fins 402; the LED headlight bulb comprises 8 semiconductor chilling plates 8, wherein 1 semiconductor chilling plate 8 is arranged on each of two long and wide surfaces of each metal heat conducting plate 402, and the 8 semiconductor chilling plates 8 correspond to the 4 metal heat conducting plates 402 one by one.

In one embodiment of the present application, the clamp includes an aluminum bar a1301, an aluminum bar B1302, an upper plastic bolt 1303, and a lower plastic bolt 1304;

bolt through holes are respectively formed in the two ends of the aluminum strip A1301 in the length direction, and bolt through holes are respectively formed in the two ends of the aluminum strip B1302 in the length direction;

the two length and width surfaces of the metal heat conducting strip 402 are a length and width surface a and a length and width surface B, respectively;

the semiconductor refrigeration piece 8 on the long and wide surface A is clamped between the long and wide surface A and the inner long and wide surface of the aluminum strip A1301, and the hot surface of the semiconductor refrigeration piece 8 on the long and wide surface A is in close contact with the inner long and wide surface of the aluminum strip A1301;

the semiconductor refrigerating sheet 8 on the long and wide surface B is clamped between the long and wide surface B and the inner long and wide surface of the aluminum strip B1302, and the hot surface of the semiconductor refrigerating sheet 8 on the long and wide surface B is in close contact with the inner long and wide surface of the aluminum strip B1302;

the screw of the upper plastic bolt 1303 penetrates through the bolt through hole at the upper end of the aluminum strip A1301, the heat insulating material on the long and wide surface A, the metal heat conducting strip 402, the heat insulating material on the long and wide surface B and the bolt through hole at the upper end of the aluminum strip B1302 in sequence, the screw of the lower plastic bolt 1304 penetrates through the bolt through hole at the lower end of the aluminum strip A1301, the heat insulation material on the long and wide surface A, the metal heat conducting fin 402, the heat insulation material on the long and wide surface B and the bolt through hole at the lower end of the aluminum strip B1302 in sequence, the aluminum strip A1301, the aluminum strip B1302, the upper plastic bolt 1303 and the lower plastic bolt 1304 are connected end to form a rectangular frame, so that the upper end of the aluminum strip A1301 is connected with the upper end of the aluminum strip B1302 through a bolt, the lower end of the aluminum strip A1301 is connected with the lower end of the aluminum strip B1302 through a bolt, the semiconductor chilling plate 8 is clamped and fixed on the metal heat conducting plate 402 by screwing the upper plastic bolt and the lower plastic bolt to enable the aluminum strips A1301 and B1302 to be clamped and fixed.

In this application, aluminium strip A and aluminium strip B are wide 10mm x thick 4 mm's cuboid shape, and length can be long or short according to actual need, and length is long 30mm ~ 60mm, is the aluminum alloy material.

In this application, choose for use plastic bolt and lower plastic bolt to be the duroplastic material, mainly because the duroplastic material is not heat-conducting, avoids taking place heat-conduction through plastic bolt.

In an embodiment of the present application, the rolling bearing one 3 is a cylindrical roller bearing, and the inner ring one 301, the outer ring one 302 and the rolling element one 303 in the rolling bearing one 3 are all made of an aluminum alloy material, a pure copper material or a steel material; the second rolling bearing 9 and the third rolling bearing 10 are ball bearings (also called ball bearings), and the second inner ring 901, the second outer ring 902, the second rolling element 903, the third inner ring 1001, the third outer ring 1002 and the third rolling element 1003 are all made of aluminum alloy materials, pure copper materials or steel materials; the left half lamp post 203 and the right half lamp post 204 are made of aluminum alloy materials;

here, the rolling bearing one 3 is selected to be a cylindrical roller bearing, mainly because the rolling elements of the cylindrical roller bearing are cylindrical, and compared with a ball bearing, a needle bearing, a tapered roller bearing, and the like, the contact area between the cylindrical rolling element one 303 and the inner ring one 301 and the outer ring one 302 is larger, that is, the heat conduction area is larger, so that the heat transfer efficiency of the heat conduction from the inner ring one 301 to the outer ring one 302 can be improved;

here, the inner ring one 301, the outer ring one 302 and the rolling element one 303 in the rolling bearing one 3 are all made of aluminum alloy, and the inner ring two 901, the outer ring two 902, the rolling element two 903, the inner ring three 1001, the outer ring three 1002 and the rolling element three 1003 are all made of aluminum alloy, and the rolling bearing is actually divided into a ceramic bearing, a plastic bearing, a steel bearing and the like according to the materials, and since the rolling bearing can be made of ceramic materials and also can be made of plastic materials, it is not difficult to make the rolling bearing by using aluminum alloy materials; in view of the special requirements of the application, a batch of rolling bearings made of aluminum alloy materials can be specially customized and processed.

In one embodiment of the present application, the mounting ring 14 is configured to be detachably disposed in a mounting through hole on a rear shell 16 of an automotive headlamp assembly, an inner diameter surface of the mounting ring 14 is provided with an internal thread, an outer wall surface of the left half lamp post 203 exposed out of the rotary base 4 is provided with an external thread, an outer wall surface of the right half lamp post 204 exposed out of the rotary base 4 is provided with an external thread, and the lamp posts are inserted and fixed in the mounting ring 14 through threaded connection of the external thread so that the LED headlamp bulb is detachably inserted and fixed in the mounting ring 14;

a plurality of circular through holes 701 are formed in the transmission disc 7, so that fingers or clamping tools of a person can extend into the circular through holes 701 in the transmission disc 7, then the fingers or the clamping tools of the person can grasp the bottom end of the plastic tube 501 to screw the plastic tube 501, and further the lamp post is screwed and inserted into the mounting ring 14;

a layer of heat insulating material is adhered to the bottom surface of the transmission disc 7, and the circular through hole 701 on the transmission disc 7 is covered and sealed by the heat insulating material on the transmission disc 7 so as to prevent hot air from entering the metal heat conduction pipe 401 from the circular through hole 701.

The mounting ring 14 in the present application is called a chuck, a buckle or a snap ring in the prior art, and compared with the mounting ring 14 in the prior art, the mounting ring 14 in the present application has the difference that the inner diameter surface of the mounting ring 14 in the present application is provided with an internal thread, and other structures are the same as the structure of the mounting ring 14 in the prior art, so that the LED headlamp bulb provided in the present application is a universal headlamp bulb, is suitable for most automobile models, and can be replaced in situ without damage; the mounting ring 14 is connected with the mounting through hole in a snap-fit manner, and the mounting ring 14 is fixed in the mounting through hole and does not rotate and does not move in the inner and outer directions.

In this application, preferably, the adhesive connections are hot melt adhesive connections that are achieved after the hot melt gun melts the hot melt rod.

In this application, the preferred rubber and plastic heat preservation cotton that is of above-mentioned insulation material, the rubber and plastic heat preservation cotton is a novel heat preservation and insulation material, uses butadiene acrylonitrile rubber and polyvinyl chloride as the main material, through banburying, special processes such as vulcanization foaming make, have low density, closed bubble mechanism, resistant inflexion, coefficient of heat conductivity is low, the steam transmissivity is low, characteristics such as water absorption rate is low, compliance and elasticity, construction convenience, green, coefficient of heat conductivity (average temperature is 0 ℃) is less than or equal to 0.034W/(m.K), for example: the outer surface of a copper pipe for connecting an indoor unit and an outdoor unit of the air conditioner is sleeved with a rubber and plastic heat preservation pipe. A rectangular through hole for embedding the semiconductor refrigerating sheet 8 is cut in the rubber and plastic heat-insulating cotton in advance, and the semiconductor refrigerating sheet 8 is placed in the rectangular through hole in the rubber and plastic heat-insulating cotton after the rubber and plastic heat-insulating cotton on the metal heat-conducting sheet 402 is well adhered. The rubber and plastic heat insulation cotton is mostly of a single-sided adhesive type, one side of the rubber and plastic heat insulation cotton is provided with an adhesive, the other side of the rubber and plastic heat insulation cotton is provided with no adhesive, and the layer of paper on the adhesive side is torn off, so that the rubber and plastic heat insulation cotton can be directly pasted for use.

The application also provides an automobile headlamp assembly, which comprises a light distribution lens 15 positioned on the front surface, a rear shell 16 positioned on the back surface and a reflecting cup 17 for reflecting and condensing light, wherein the light distribution lens 15 and the rear shell 16 are hermetically connected to form a lamp cavity 18 in the automobile headlamp assembly, a rear convex tube 19 is arranged on the outer wall surface of the rear shell 16, the outer opening of the rear convex tube 19 is covered by a dustproof cover 20, and the LED headlamp bulb for refrigerating and radiating heat of the semiconductor is also comprised;

Methods and devices not described in detail in the present invention are all the prior art and are not described in detail.

The principles and embodiments of the present invention are explained herein using specific examples, which are set forth only to help understand the method and its core ideas of the present invention. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.

Claims

1. An LED headlight bulb with semiconductor refrigeration and heat dissipation is characterized in that, the LED headlamp bulb comprises a left LED lamp bead and a right LED lamp bead which are used for emitting light, a long columnar lamp post, a plurality of semiconductor refrigerating sheets which are used for refrigerating, a rotating base which is used for installing the semiconductor refrigerating sheets and is made of an aluminum alloy material, a clamp which is used for clamping and fixing the semiconductor refrigerating sheets, a rolling bearing I which is used for supporting rotation and conducting and is made of a metal material, a rolling bearing II which is used for supporting rotation and conducting and is made of a metal material, a rolling bearing III which is used for supporting rotation and conducting and is made of a metal material, a plastic insulating ring I, a plastic insulating ring II, a direct current motor, a motor base, a transmission disc which is made of a plastic material, an installation ring which is used for installing and fixing the LED headlamp bulb in an installation through hole in a rear shell of an automobile headlamp assembly;

2. The LED headlamp bulb as claimed in claim 1, wherein the lamp post comprises a left aluminum substrate for mounting and fixing the left LED lamp bead and conducting electricity and heat, a right aluminum substrate for mounting and fixing the right LED lamp bead and conducting electricity and heat, a left half lamp post and a right half lamp post;

3. The LED headlamp bulb for cooling and dissipating heat of the semiconductor according to claim 2, further comprising a heat pipe for conducting heat;

4. The LED headlamp bulb as claimed in claim 3, wherein the solder joint is formed by filling solder paste and then reflowing between the exposed long and wide surface of the aluminum base layer of the left aluminum substrate and the left long and wide surface of the heat pipe, and the solder joint is formed by filling solder paste and then reflowing between the exposed long and wide surface of the aluminum base layer of the right aluminum substrate and the right long and wide surface of the heat pipe.

5. The LED headlamp bulb with the semiconductor refrigeration and heat dissipation function as claimed in claim 2, wherein the driving power circuit board is located outside the metal heat conduction pipe, and the semiconductor refrigeration piece is electrically connected with the driving power circuit board;

6. The LED headlight bulb with the semiconductor function of cooling and dissipating heat of claim 1, wherein the metal heat conducting fins are planar and plate-shaped, the long and wide surfaces of the metal heat conducting fins are parallel to the axial center line of the metal heat conducting pipe, the outer surface of the pipe wall of the metal heat conducting pipe is integrally connected with one of the thicknesses of the metal heat conducting fins towards the side, and a gap is formed between every two adjacent metal heat conducting fins so as to form an air duct for cooling air to pass through.

7. The LED headlamp bulb for cooling and dissipating heat of a semiconductor according to claim 1, wherein the clamp comprises an aluminum strip A, an aluminum strip B, an upper plastic bolt and a lower plastic bolt;

8. The LED headlamp bulb with the semiconductor for refrigerating and radiating as claimed in claim 1, wherein the first rolling bearing is a cylindrical roller bearing, and an inner ring I, an outer ring I and a rolling body I in the first rolling bearing are all made of aluminum alloy, pure copper or steel;

9. The LED headlamp bulb with the semiconductor function of cooling and heat dissipation as claimed in claim 2, wherein the mounting ring is detachably disposed in a mounting through hole formed in a rear shell of the automobile headlamp assembly, an inner diameter surface of the mounting ring is provided with an inner thread, outer wall surfaces of the left half lamp post and the right half lamp post exposed outside the rotating base are provided with an outer thread, and the lamp posts are fixed in the mounting ring in an inserting manner through threaded connection of the outer threads, so that the LED headlamp bulb is detachably fixed in the mounting ring in an inserting manner;

10. An automobile headlamp assembly, which comprises a light distribution lens positioned on the front side, a rear shell positioned on the back side and a reflecting cup used for reflecting and condensing light, wherein the light distribution lens and the rear shell are hermetically connected to enclose a lamp cavity in the automobile headlamp assembly, a rear side protruding tube is arranged on the outer wall surface of the rear shell, the outer opening of the rear side protruding tube is covered by a dustproof cover, and the automobile headlamp assembly is characterized by further comprising the LED headlamp bulb for refrigerating and radiating heat by using a semiconductor as claimed in any one of claims 1 to 9;