CN111575753A - Processing technology of primary copper printing roller - Google Patents
Processing technology of primary copper printing roller Download PDFInfo
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- CN111575753A CN111575753A CN202010273428.9A CN202010273428A CN111575753A CN 111575753 A CN111575753 A CN 111575753A CN 202010273428 A CN202010273428 A CN 202010273428A CN 111575753 A CN111575753 A CN 111575753A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/52—After-treatment of electroplated surfaces by brightening or burnishing
Abstract
The invention relates to a one-time copper plate roller processing technology, which comprises the following steps: machining → surface cleaning → nickel plating → copper plating → grinding and polishing. Wherein, the plating solution comprises: copper flowing acid: 200-280 g/L, sulfuric acid: 55-70 g/L, chloride ion: 80-150 g/L, cylinder opening agent: 6-8 g/L, hardening agent (cylinder opening): 2-3 mg/L, hardening agent (supplement): 80-120 mg/KAH, leveling agent (supplement): 80-120 mg/KAH; in the copper plating process, the copper plating temperature is as follows: 35-45 ℃, current density: 15-30A/dm 2, area ratio of cathode to anode: 1: (4-8), cathode moving speed: 0.8-1.0 μm/s, phosphor copper anode: 0.06P%, cathode-anode distance: 100 to 150 μm. The processing precision before nickel plating is improved, after the nickel plating, copper plating is carried out once, after the copper plating is carried out to the required copper layer thickness, the copper roller is ground and polished, the mirror surface effect is achieved, then the copper roller is sent to be carved, the middle loading and unloading and grinding times are reduced, materials are saved, time is saved, and the efficiency is improved.
Description
Technical Field
The invention relates to a processing technology of a printing roller, in particular to a processing technology of a one-step copper printing roller.
Background
The intaglio printing is characterized by thick ink layer, bright color, rich layers, high saturation, stable quality, high printing plate printing durability, stable quality of printed matters, high printing speed and diversified printing materials, so that the intaglio printing occupies an important position in the field of packaging. The gravure plate roller is one of the most important parts of a web gravure printing machine, and the plate roller is formed by plating copper on the surface of a roller, carving patterns by a gravure electronic carving machine and then plating a layer of chromium.
The plate roller base material is generally a seamless steel pipe, nickel plating is firstly carried out after the surface of the seamless steel pipe is treated, then copper plating is carried out, and chromium plating is carried out after the surface of a copper layer is carved.
The traditional copper plating process is to plate bottom copper and surface copper, wherein a layer of bottom copper is plated firstly, the thickness is generally 50 microns, a printing roller is disassembled after the plating is finished, the surface is ground once on a grinding machine by using a grinding wheel, the roughness of the surface is mainly eliminated, then the surface is assembled on a plate frame, after the cleaning is finished, a layer of silver nitrate solution is poured on the surface to enable the surface of the copper to have a layer of silver simple substance, and then secondary copper is plated.
Disclosure of Invention
The invention solves the defects of two times of copper plating, long time consumption and large material loss in the prior art, increases the processing precision before nickel plating, and grinds and polishes the copper roller after plating to the required copper layer thickness by one time of copper plating after nickel plating, so as to achieve the mirror surface effect and then send the mirror surface effect to be carved, thereby reducing the middle times of loading, unloading and grinding, saving materials, saving time and improving efficiency.
The specific technical scheme of the invention is as follows: a primary copper plate roller processing technology comprises the following steps:
(1) and machining: calculating to obtain the size of the steel roller, and carrying out lapping on the surface of the steel roller to obtain a lapping layout of the steel roller, wherein Ra of the lapping layout is less than or equal to 0.3 mu m;
(2) and surface cleaning: removing oil stains on the surface of the steel roller by cleaning;
(3) and nickel plating: nickel is plated on the surface of the steel roller, the thickness of a nickel layer is controlled to be 0.3-0.5 mu m, and the surface of the nickel layer is polished by water sand paper after nickel plating;
(4) and copper plating: the method is carried out in the plating solution in a full-immersion or semi-immersion mode;
(5) grinding and polishing: cleaning the copper roller after copper plating, and grinding and polishing the copper roller after cleaning to achieve a mirror surface effect;
wherein, the plating solution comprises: copper flowing acid: 200-280 g/L, sulfuric acid: 55-70 g/L, chloride ion: 80-150 g/L, cylinder opening agent: 6-8 g/L, hardening agent (cylinder opening): 2-3 mg/L, hardening agent (supplement): 80-120 mg/KAH, leveling agent (supplement): 80-120 mg/KAH;
in the copper plating process, the copper plating temperature is as follows: 35-45 ℃, current density: 15-30A/dm 2, area ratio of cathode to anode: 1: (4-8), cathode moving speed: 1.0-1.3 m/s, phosphor copper anode: 0.06P%, cathode-anode distance: 80-150 mm.
The method has the advantages that the final working procedure of machining is finely ground, high surface roughness of the steel roller is obtained through the fine grinding, the surface quality of the steel roller is improved, copper plating is carried out after nickel plating, and a plating solution is improved, so that the copper plating working procedure can be carried out once. Copper sulfate is used as main salt in the plating solution, the content must be well controlled, if the content is low, the requirement of high current density cannot be met, the defects of rough plating layer, sand holes, burrs and the like can be caused, the possibility of scorching in a high current density area is increased, but the content is improved and is limited by the solubility of the copper sulfate, the solubility of the copper sulfate is reduced along with the increase of the content of sulfuric acid, meanwhile, the temperature is reasonably controlled, once the temperature of the plating solution is low, the copper sulfate can be crystallized on the surface of a plate roller, the binding force of the plating layer is influenced, small crystals are mixed in copper layer lattices, the hybrid stress can be generated, and an electric engraving needle is easily abraded. The sulfuric acid is strong electrolyte, can obviously improve the conductivity of the plating solution, and can also prevent the hydrolysis and precipitation of the copper sulfate. The content of sulfuric acid in the plating solution needs to be reasonably controlled, the sulfuric acid content is low, the dispersing capacity and the deep plating capacity of the plating solution are poor, the brightness and the leveling degree of the plating layer are reduced (especially in a low current density area), the anode is passivated, the voltage of a tank is increased, and energy is wasted; too high a sulfuric acid content will reduce the solubility of copper sulfate and too fast a copper sulfate content during production, which also brings about quality concerns. In addition, the content of sulfuric acid also has a certain influence on the hardness and the storage time of the hardness of the copper layer. The electrochemical polarization of the cathode can be improved by increasing the concentration of sulfuric acid, so that the formation rate of crystal nuclei is greater than the growth rate of the crystal nuclei, the crystallization is fine and compact, and the interatomic force in crystal lattices is also greater, so that the hardness of a plating layer can be improved. The jar opening agent MU is mainly a carrier of some brightening agents and hardening agents, and the main component of the jar opening agent MU belongs to a surfactant. When the cathode is used in the open cylinder, the upper limit of the cathode current density can be greatly widened. When the content is too low, the effect of the leveling agent is adversely affected, the high current density region is easily burnt, and the internal stress of the copper layer is too large, which is disadvantageous to electronic engraving. Because the adsorption capacity of the surfactants on the surface of the electrode is particularly strong, the excessive addition of the surfactants also affects the effects of a hardening agent and a brightening agent, so that the brightness, the hardness and the storage time of the hardness of a coating are reduced, the content is too high, a layer of hydrophobic film invisible to naked eyes is easily formed on the surface of a cathode, and the binding force of the coating is reduced. The hardening agent has both hardening and brightening effects. The cathode polarization can be effectively improved in the electroplating process, the generation rate of crystal nuclei is far greater than the growth rate of the crystal nuclei in the cathode electrochemical crystallization process, the crystallization can be fine, and the copper layer is bright; meanwhile, the micro-dispersion capability of the coating can be effectively improved, the precipitation of metal ions at the micro-protruding parts on the surface of the electrode is hindered, the influence on the concave parts is small, the leveling of fine unevenness on the surface of the electrode is facilitated, and the brightness of the coating can be effectively improved. The leveling agent mainly comprises surfactants with larger difference in molecular structure, and has the function of improving the leveling performance of the plating solution.
Further preferably, the steel roller after surface cleaning is moved into a nickel plating tank, the nickel plating time is controlled to be 4.5-5.5min, after nickel plating, the steel roller is transferred into a cleaning tank, and the nickel plating surface is polished by No. 800 waterproof abrasive paper.
Further preferably, the thickness of the copper layer to be plated is controlled to 100. mu.m. In the traditional copper plating process, the thickness of the copper layer plated with copper twice is 150 microns, the scheme reduces the thickness of the copper layer by 50 microns, the copper consumption is obviously reduced, the copper plating time is shortened, the copper plating efficiency is improved, and the thickness of the copper layer removed for subsequent plate changing is also reduced.
Preferably, the copper liquid is monitored for the Baume degree in the copper plating process, the Baume degree is controlled to be stabilized at 18-20be, and phosphorus-containing copper balls are added moderately in the monitoring process, wherein the phosphorus content of the phosphorus-containing copper balls is 0.3-0.6 per thousand.
Further preferably, the machining comprises: blanking, installing a reinforcing ring, installing a plug, roughly turning a layout, finely turning a layout and finely grinding the layout; during blanking, a steel pipe or a coiled plate is selected according to the specification of the plate roller, a finish turning allowance is reserved after a plate surface is roughly turned to be at least 700 mu m, and the ellipse of the steel roller after finish turning is not more than 30 mu m.
Further preferably, a steel pipe is adopted during blanking, the wall thickness is more than or equal to 6mm, and the hoof opening error of the steel pipe after sawing and blanking is less than or equal to 1 mm; the plate is rolled when blanking, the wall thickness is more than or equal to 5.5mm, the diagonal error after the steel plate is cut is less than or equal to 3mm, and the width of the closing gap of the plate rolling machine is controlled within 3 mm.
Preferably, the method comprises the steps of roughly turning the layout, then carrying out secondary hole machining, fixing a steel roller on a lathe, adjusting the position of a center frame, setting the angle of a middle supporting plate, controlling the middle supporting plate to carry out tool setting, and controlling a small supporting plate to carry out cutting machining after tool setting, wherein the tool feeding amount is less than 300 mu m each time.
Further preferably, when the plate surface is finely ground, the grinding is carried out by using a 100-mesh grinding wheel, and the pressure of the grinding head is controlled at 5 KG.
Further preferably, the steel roller is cleaned by a cleaning agent after machining, wherein the cleaning agent mainly comprises alkali liquor, the cleaning agent is coated on the surface of the steel roller by a cleaning agent solution with the concentration of 5%, and then the steel roller is polished and cleaned by No. 240 waterproof abrasive paper.
More preferably, after the copper plating, the plate roll is transferred to a grinder to be ground, and the surface of the copper layer is ground by using a 800 # and a 3000 # grinding wheel in sequence as required.
The invention has the beneficial effects that: the processing precision before nickel plating is improved, after the nickel plating, copper plating is carried out once, after the copper plating is carried out to the required copper layer thickness, the copper roller is ground and polished, the mirror surface effect is achieved, then the copper roller is sent to be carved, the middle loading and unloading and grinding times are reduced, materials are saved, time is saved, and the efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of a copper plating process route of the present invention.
Detailed Description
The invention is further described by the following specific embodiments in conjunction with the accompanying drawings.
Example (b):
as shown in fig. 1, a primary copper plate roller processing technology comprises the following steps: machining → surface cleaning → nickel plating → copper plating → grinding and polishing.
(1) And machining: the machining includes: blanking, installing a reinforcing ring, installing a plug, roughly turning a layout, processing a secondary hole, finely turning the layout and finely grinding the layout. The method specifically comprises the following steps:
blanking; firstly, calculating to obtain the size of a steel roller, selecting a steel pipe or a steel plate, blanking the steel pipe, wherein the wall thickness of the steel pipe is not less than 6mm, and the hoof opening error of the steel pipe after the steel pipe is sawn and blanked is less than or equal to 1 mm; the method comprises the following steps of blanking a steel plate, controlling the wall thickness not to be lower than 5.5mm, cutting the steel plate, enabling the diagonal error to be smaller than or equal to 3mm, rolling the steel plate by using a plate rolling machine after blanking, controlling the width of a joint closing gap of the plate rolling machine within 3mm, fixing a roller subjected to joint closing on a copper bar after plate rolling, polishing the inside and the outside by using a copper brush, welding an arc striking block and an arc retreating block at the head and the tail of a plate, welding a seam by using a welding vehicle, ensuring that a welding wire is positioned in the middle of the welding seam from the head to the end of the welding seam, ensuring that the welding wire is not welded to be deviated, placing a welding flux frame on the welding seam, and uniformly scattering a welding flux on the welding. And after welding, the roller is arranged on a circle correcting machine for correcting the circle.
Installing a reinforcing ring: and transferring the roller to a support frame, enabling the opening of the reinforcing ring to be upward, standing the reinforcing ring to be placed in the roller, enabling the end face of the reinforcing ring to be flat, and welding the reinforcing ring on the inner wall of the roller by using a welding gun when the end face of the reinforcing ring is required to be tightly attached to the inner wall of the roller.
Installing a plug: and selecting a proper inner hole specification and processing plugs according to requirements, and then loading the plugs into two ends of the roller.
Rough turning the layout: the roller is loaded on a lathe, after the roller is subjected to tool setting, the roller is firstly turned for 3mm, the dimension is measured by a micrometer, a margin of 700 mu m is reserved for finish turning, and the roughness of the surface and the end face is 3.2.
And (3) secondary hole machining: adjusting the position of the center frame, setting the angle of the middle supporting plate, controlling the middle supporting plate to carry out tool setting, and controlling the small supporting plate to carry out cutting processing after the tool setting, wherein the tool feed amount is less than 300 mu m each time. And (5) measuring whether the standard is met or not by using a block gauge, turning around after one end is turned, and re-processing the other end.
Finishing the layout: after finish turning, the ellipse of the steel roller is not more than 30 μm, one abrasive belt needs to be replaced for one roller turned each time, and a cutting knife needs to be replaced after 5 rollers are turned.
Finely grinding the layout: the grinding machine is loaded to the roller that the car is good, grinds after setting up the grinding machine parameter, chooses for use the emery wheel model to be: 100 meshes; grinding head pressure: 5 KG; grinding times: one working stroke. And in the lapping process, the ground mud is salvaged twice per roller. Ra of the lapping plate is less than or equal to 0.3 mu m.
(2) And surface cleaning: the oil stain on the surface of the steel roller is removed by cleaning, the main component of the cleaning agent is alkali liquor, the cleaning agent solution with the concentration of 5% is coated on the surface of the steel roller, then No. 240 waterproof abrasive paper is used for polishing and cleaning, and after the roller is cleaned, whether the surface of the roller has sand holes, bruises and oil stain is checked until the roller is cleaned.
(3) And nickel plating: moving the steel roller with the cleaned surface into a nickel plating tank, plating nickel on the surface of the steel roller, controlling the nickel plating time to be 4.5-5.5min, controlling the thickness of a nickel layer to be 0.3-0.5 mu m, transferring the roller into a cleaning tank after nickel plating, and polishing the nickel plated surface by using No. 800 waterproof abrasive paper.
(4) And copper plating: the method is carried out in a plating solution in a full-immersion or semi-immersion mode, and the thickness of a copper layer plated with copper is controlled to be 100 mu m; the plate roller is hung in a copper groove, the current displayed on two sides is checked to be balanced after a rectifier is started, and deviation on two sides cannot occur, wherein the plating solution in an aqueduct comprises: copper flowing acid: 200-280 g/L, sulfuric acid: 55-70 g/L, chloride ion: 80-150 g/L, cylinder opening agent: 6-8 g/L, hardening agent (cylinder opening): 2-3 mg/L, hardening agent (supplement): 80-120 mg/KAH, leveling agent (supplement): 80-120 mg/KAH; in the copper plating process, the copper plating temperature is as follows: 35-45 ℃, current density: 15-30A/dm 2, area ratio of cathode to anode: 1: (4-8), cathode moving speed: 1.0-1.3 m/s, phosphor copper anode: 0.06P%, cathode-anode distance: 80-150 mm. Monitoring the Baume degree of the copper liquid in the copper plating process, controlling the Baume degree to be stable at 18-20be, and properly adding phosphorus-containing copper balls in the monitoring process, wherein the phosphorus content of the phosphorus-containing copper balls is 0.3-0.6 per mill.
(5) Grinding and polishing: and cleaning the copper roller after copper plating, grinding and polishing the copper roller to a mirror surface effect after cleaning, and sequentially polishing the surface of the copper layer by using No. 800 and No. 3000 grinding wheels according to requirements during grinding, wherein the roughness Ra is less than or equal to 0.03 mu m.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and all simple modifications, alterations and equivalents of the above embodiments according to the technical spirit of the present invention are still within the protection scope of the technical solution of the present invention.
Claims (10)
1. A one-time copper plate roller processing technology is characterized by comprising the following steps:
(1) and machining: calculating to obtain the size of the steel roller, and carrying out lapping on the surface of the steel roller to obtain a lapping layout of the steel roller, wherein Ra of the lapping layout is less than or equal to 0.3 mu m;
(2) and surface cleaning: removing oil stains on the surface of the steel roller by cleaning;
(3) and nickel plating: nickel is plated on the surface of the steel roller, the thickness of a nickel layer is controlled to be 0.3-0.5 mu m, and the surface of the nickel layer is polished by water sand paper after nickel plating;
(4) and copper plating: the method is carried out in the plating solution in a full-immersion or semi-immersion mode;
(5) grinding and polishing: cleaning the copper roller after copper plating, and grinding and polishing the copper roller after cleaning to achieve a mirror surface effect;
wherein, the plating solution comprises: copper flowing acid: 200-280 g/L, sulfuric acid: 55-70 g/L, chloride ion: 80-150 g/L, cylinder opening agent: 6-8 g/L, hardening agent (cylinder opening): 2-3 mg/L, hardening agent (supplement): 80-120 mg/KAH, leveling agent (supplement): 80-120 mg/KAH;
in the copper plating process, the copper plating temperature is as follows: 35-45 ℃, current density: 15-30A/dm 2, area ratio of cathode to anode: 1: (4-8), cathode moving speed: 1.0-1.3 m/s, phosphor copper anode: 0.06P%, cathode-anode distance: 80-150 mm.
2. The primary processing technology of a copperplate roller as claimed in claim 1, wherein the steel roller after surface cleaning is moved into a nickel plating tank, the nickel plating time is controlled to be 4.5-5.5min, after nickel plating, the steel roller is transferred into a cleaning tank, and the nickel plating surface is polished by No. 800 waterproof abrasive paper.
3. The primary processing technique for copper plate rolls according to claim 1, characterized in that the thickness of the copper layer plated with copper is controlled to 100 μm.
4. The one-time copperplate roller processing technology as claimed in claim 1 or 3, characterized in that the copper liquid is monitored for the Baume degree during the copper plating process, the Baume degree is controlled to be stabilized at 18-20be, and phosphorus-containing copper balls are added moderately during the monitoring process, and the phosphorus content of the phosphorus-containing copper balls is 0.3-0.6 per mill.
5. A primary halftone roller processing according to claim 1, 2 or 3, wherein the machining includes: blanking, installing a reinforcing ring, installing a plug, roughly turning a layout, finely turning a layout and finely grinding the layout; during blanking, a steel pipe or a coiled plate is selected according to the specification of the plate roller, a finish turning allowance is reserved after a plate surface is roughly turned to be at least 700 mu m, and the ellipse of the steel roller after finish turning is not more than 30 mu m.
6. The primary processing technology for the copperplate roller as claimed in claim 5, wherein a steel pipe is adopted during blanking, the wall thickness is more than or equal to 6mm, and the hoof error of a horse hoof after the steel pipe is sawn and blanked is less than or equal to 1 mm; the plate is rolled when blanking, the wall thickness is more than or equal to 5.5mm, the diagonal error after the steel plate is cut is less than or equal to 3mm, and the width of the closing gap of the plate rolling machine is controlled within 3 mm.
7. The primary processing technology of copper plate roller according to claim 5, characterized in that, the rough turning of the plate surface is followed by the secondary hole processing, the steel roller is fixed on the lathe, the position of the center frame is adjusted, the angle of the middle supporting plate is set, the middle supporting plate is controlled to carry out tool setting, the small supporting plate is controlled to carry out cutting processing after the tool setting, and the tool feeding amount is less than 300 μm each time.
8. The primary processing technology for a copperplate roller according to claim 5, characterized in that when the plate surface is finely ground, a grinding wheel of 100 meshes is adopted for grinding, and the pressure of the grinding head is controlled at 5 KG.
9. The one-time copper plate roller processing technology is characterized in that cleaning is carried out by adopting a cleaning agent after machining, wherein the main component of the cleaning agent is alkali liquor, the cleaning agent is coated on the surface of a steel roller by using a cleaning agent solution with the concentration of 5%, and then grinding and cleaning are carried out by using No. 240 water sand paper.
10. The process of one-time copper plate roller processing according to claim 1, 2 or 3, characterized in that after copper plating, the plate roller is transferred to a grinding machine for grinding, and the surface of the copper layer is ground by using a 800 # and a 3000 # grinding wheel in sequence according to requirements.
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| CN112941610A (en) * | 2021-02-01 | 2021-06-11 | 林元霞 | Internet of things-based gravure roller plate making system |
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Application publication date: 20200825 |