CN110699718A - Method for electroplating alkali copper on gravure roller - Google Patents
Method for electroplating alkali copper on gravure roller Download PDFInfo
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- CN110699718A CN110699718A CN201911063099.9A CN201911063099A CN110699718A CN 110699718 A CN110699718 A CN 110699718A CN 201911063099 A CN201911063099 A CN 201911063099A CN 110699718 A CN110699718 A CN 110699718A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Chemical Kinetics & Catalysis (AREA)
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Abstract
The invention relates to a method for electroplating alkali copper on a gravure roller, which comprises the following steps: step 1: cleaning the nickel plating bath to obtain a re-grooving electroplating bath; step 2: slotting the alkali-plated copper groove by using a cylinder opening agent; and step 3: electroplating is carried out, wherein alkali copper is electroplated in the alkali copper plating solution, and copper sulfate is electroplated in the acid copper plating solution. Compared with the prior art, the invention has the advantages of environmental protection, low cost and the like.
Description
Technical Field
The invention relates to the technical field of gravure roller processing and manufacturing, in particular to a method for electroplating alkali copper on a gravure roller.
Background
At present, the domestic technological process of gravure roller copper electroplating supply and demand is steel roller-clear-nickel plating-copper sulfate plating. Nickel plating is an important work which must be carried out before copper plating of a gravure cylinder, but the bonding force of direct copper plating on a steel pipe is poor, because the steel pipe is put into an acid copper plating solution, iron and copper can generate a replacement reaction, and the replaced copper is adhered to the surface of the steel pipe. This produces a displacement coating. The plating layer is not firmly combined with the substrate, and the surface is in a loose state, so that nickel plating treatment is carried out firstly. Nickel is a white metal with good chemical stability and can resist dilute acid and dilute alkali. Plating a layer of metal nickel on the gravure cylinder so as to plate copper on the nickel layer. Because nickel is a heavy metal which is difficult to treat, the method of nickel plating has the main problem that special nickel treatment facilities are needed, which brings great difficulty to subsequent water treatment and has high cost.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a method for electroplating alkali copper on a gravure roller.
The purpose of the invention can be realized by the following technical scheme:
the method for electroplating the alkali copper on the gravure roller is characterized by comprising the following steps of:
step 1: cleaning the nickel plating bath to obtain a plating bath capable of being re-grooved;
step 2: slotting the alkali-plated copper groove by using a cylinder opening agent;
and step 3: electroplating is carried out, wherein alkali copper is electroplated in the alkali copper plating solution, and copper sulfate is electroplated in the acid copper plating solution.
Preferably, the step 1 specifically comprises the following steps:
step 1-1: emptying the plating solution, the anode and the auxiliary device in the nickel plating bath;
step 1-2: cleaning a nickel plating bath door cover, removing an air box at the back of the bath, and cleaning impurities in the air box;
step 1-3: polishing the copper bar to be clean;
step 1-4: cleaning the electroplating bath by using clean water;
step 1-5: cleaning nickel liquid crystals accumulated at the welding position of the upper tank and the lower tank;
step 1-6: cleaning the nickel plating bath by using acid liquor to obtain a re-grooving electroplating bath;
step 1-7: washing the nickel plating bath by using clear water;
step 1-8: installing a titanium anode;
step 1-9: cleaning the nickel plating bath by using alkali liquor to obtain a re-grooving plating bath;
step 1-10: cleaning the nickel plating bath by using clear water to obtain a re-grooving electroplating bath;
step 1-11: and a heating pipe, a thermometer probe, an anode and an air box are installed, and a water spray pipe is adjusted.
Preferably, the specific steps of steps 1-6 are:
step 1-6-1: filling the electroplating bath with dilute sulfuric acid in the volume ratio of 3%, and soaking until the impurities are completely dissolved;
step 1-6-2: carrying out acid liquor circulation, cleaning a filter vat, a pipeline and an overflow port of an upper tank, wherein the circulation time is 4 hours;
step 1-6-3: and draining the dilute sulfuric acid in the electroplating bath.
Preferably, the specific steps of steps 1-9 are:
step 1-9-1: filling the electroplating bath with 5 wt% sodium hydroxide solution for circulation of alkali solution for 4 hr;
step 1-9-2: and draining the alkali liquor.
Preferably, the area of the copper bar is 1.2 times of the effective area of the plate roller.
Preferably, the ratio of pure water, additive No. 1 and additive No. 2 in the cylinder opening agent is as follows: pure water 55%, additive No. 1: 35%, additive No. 2: 10 percent.
Preferably, the step 2 specifically comprises the following steps:
step 2-1: calculating the total volume of the cylinder opening agent required to be prepared;
step 2-2: adding quarter volume of water into the electroplating bath, then adding the No. 1 additive, and circulating for 2 minutes;
step 2-3: after the circulation is completed, adding the No. 2 additive under the condition of stirring;
step 2-4: heating the solution to more than 50 ℃;
step 2-5: slowly adding potassium carbonate under the condition of stirring to ensure that the capacity of the finally obtained potassium carbonate in the tank opening agent is 55-60 g/L;
step 2-6: supplying pure water to the calculated volume in step 2-1;
step 2-7: adjusting the pH value of the solution to 9.5 by using a No. 3 additive;
step 2-8: adding hydrogen peroxide until the concentration of the hydrogen peroxide in the solution is 6 g/L;
step 2-9: circulating for 40 minutes;
step 2-10: adding an active carbon filter element for filtering for 3 hours, and electrolyzing for 1 hour;
step 2-11: replacing the activated carbon filter elements, and putting 2 or 3 new activated carbon filter elements into each filter barrel;
step 2-12: the solution is heated to 48-50 ℃ and the plating test is started.
Preferably, the method for calculating the total volume in step 2-1 comprises:
V＝x*y*h*1000
wherein x represents the length of the plating bath, y represents the width of the plating bath, h represents the depth of the plating bath, V is in liters, and x, y and h are all in meters.
Preferably, the specific steps of step 3 are:
step 3-1: selecting a plate roller with the surface roughness Ra of less than or equal to 0.3 for electroplating;
step 3-2: cleaning copper powder on the front and back surfaces of the copper bar in the electroplating bath and at the bottom of the electroplating bath;
step 3-3: installing a printing roller;
step 3-4: cleaning the printing roller;
step 3-5: using a voltage of 1.5V and 0.6-1A/dm2Electroplating alkali copper at the current density;
step 3-6: after the electroplating of the alkali copper is finished, flushing the electroplating bath with water, and then polishing the coating by using abrasive paper to prevent small particles from being adhered to the alkali copper layer after the alkali copper layer is dried;
step 3-7: copper sulfate is electroplated.
Compared with the prior art, the invention has the following advantages:
firstly, environmental protection: the invention cancels nickel layer electroplating on the plate roller, and replaces metal nickel with alkali copper, so the process is more environment-friendly.
Secondly, the cost is low: the invention replaces the nickel layer in the prior art with the alkali copper layer, and no treatment facility aiming at metallic nickel is needed when the wastewater after the plate roller is manufactured is treated, thereby greatly reducing the cost of the plate roller manufacturing process.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, shall fall within the scope of protection of the present invention.
Example (b):
the process flow of electroplating the alkali copper on the gravure printing roller in the embodiment is steel roller cleaning, alkali copper plating and copper sulfate plating.
First, preparation before plating is performed: the method comprises the steps of opening a cylinder, carrying out anaerobic calendering on a copper bar (the area of the copper bar is 1.2 times of the effective area of a printing roller), potassium carbonate, hydrogen peroxide and an active carbon filter element.
The method for electroplating the alkali copper in the embodiment comprises the following steps:
step 1: cleaning the nickel plating bath to obtain a plating bath capable of being re-grooved;
step 2: slotting the alkali-plated copper groove by using a cylinder opening agent;
and step 3: electroplating is carried out, wherein alkali copper is electroplated in the alkali copper plating solution, and copper sulfate is electroplated in the acid copper plating solution.
The above three steps are described in detail below:
step 1: and cleaning the nickel plating bath.
If the existing nickel plating bath needs to be replaced by an alkali copper plating bath, the plating bath must be strictly cleaned, pollutants cannot be gathered, otherwise, the alkali copper plating bath has certain influence, and the specific cleaning steps are as follows:
1. the plating solution, the anode and the auxiliary device in the existing plating bath are emptied.
2. Cleaning a nickel plating bath door cover, removing an air box at the back of the bath, and washing impurities in the air box with clear water;
3. checking whether the copper bar is corroded or not, and polishing the copper bar;
4. cleaning the nickel plating bath by using clear water;
5. cleaning nickel liquid crystals at the welding positions of the upper tank and the lower tank;
6. cleaning the nickel plating bath by using acid liquor:
the method comprises the following steps: filling the electroplating bath with 3 vol% dilute sulfuric acid, soaking the lower bath for over 30 min to dissolve all the impurities in the bath wall, and circulating for 4 hr to clean the filtering barrel, pipeline, overflow port and other parts.
When the acid liquor is circulated, the float boxes on the two sides of the upper groove are firstly blocked in the first two hours, the acid liquor overflows to the lower groove from the groove, then the two sides of the groove are placed, and the acid liquor enters the lower groove liquor from overflow ports on the two sides of the groove. During circulation, the parts such as the cover plate, the heating pipe, the titanium anode of the upper tank, the thermometer and the like after the tank are all immersed in the acid liquor, so that impurities on the surfaces of the parts are cleaned by the acid liquor.
And finally, draining the dilute sulfuric acid in the electroplating bath, checking all inner bath walls, and repeating the steps if yellow attachments exist until the impurities are completely dissolved.
7. Flushing nickel plating bath with clear water
The upper tank is washed by clean water, then the lower tank is washed, the loose joint at the lower part of the filter barrel is unscrewed to discharge the acid liquor, and the loose joint at the lower part of the filter barrel is screwed again after being washed by water. Then the pure water is drained, and no water can be contained in the electroplating tank. Repeating for 2-3 times to ensure that the acid liquor is completely cleaned.
8. Mounting titanium anodes
9. Cleaning nickel plating bath by using alkali liquor
And (3) filling the electroplating bath with a sodium hydroxide solution with the weight ratio of 5%, circulating for 4 hours in the same way as the acid liquor circulation, and draining the alkali liquor after circulation is finished.
10. Cleaning nickel plating bath by clear water
Washing the upper tank with clear water, removing the filter element, unscrewing the loose joint at the lower part of the filter barrel, discharging the alkali liquor in the filter barrel, flushing the filter barrel with pure water, and screwing the loose joint.
And then the lower tank is flushed by clear water, the water is completely drained every time of flushing, and the flushing is repeated for 3-4 times, so that the alkali liquor is completely cleaned.
11. And a heating pipe, a thermometer probe, an anode and an air box are installed, and a water spray pipe is adjusted.
Step 2: slotting of alkaline-plated copper slots using a pot opening agent
The ratio of the cylinder opening agent is as follows: pure water 55%, additive No. 1: 35%, additive No. 2: 10 percent. Wherein the additive No. 1 adopts cyanide-free alkali copper cylinder opener SF-638CU of Guangzhou Sanfu new material science and technology Limited, and the additive No. 2 adopts cyanide-free alkali copper accelerator SF-638E of Guangzhou Sanfu new material science and technology Limited;
1. calculating the total volume of the required cylinder opening agent by the following method:
V＝x*y*h*1000
wherein x represents the length of the plating bath, y represents the width of the plating bath, h represents the depth of the plating bath, V is in liters, and x, y and h are all in meters.
2. One quarter volume of water was added to the plating bath, followed by addition of additive No. 1, and the cycle was two minutes.
3. With stirring, additive No. 2 was added.
4. The solution was heated to above 50 ℃.
5. Slowly adding potassium carbonate under stirring, wherein the weight of the added potassium carbonate is obtained according to the volume of the tank-opening agent and the required concentration of the potassium carbonate, and the finally obtained concentration of the potassium carbonate in the tank-opening agent is 55-60 g/L.
6. Pure water was supplied to the total volume of the opening agent calculated above.
7. Adjusting pH of the solution to 9.5 with additive No. 3, wherein additive No. 3 is K2CO3。
8. Adding hydrogen peroxide until the solubility of the hydrogen peroxide in the solution is 6g/L, diluting the hydrogen peroxide by 10 times and then slowly adding the diluted hydrogen peroxide when adding the hydrogen peroxide, wherein the concentrated hydrogen peroxide cannot be directly added to prevent the additive from being decomposed.
9. And circulating for 40 minutes.
10. Adding active carbon filter element, filtering for 3 hr, and electrolyzing for 1 hr.
11. And (4) completely replacing new filter cores, and placing 2-3 new active carbon filter cores in each filter barrel.
12. Heating the electroplating solution to 48-50 ℃ to start trial plating.
And step 3: electroplating is carried out, wherein alkali copper is electroplated in the alkali copper plating solution, and copper sulfate is electroplated in the acid copper plating solution.
1. Selecting a printing roller with the surface roughness Ra of less than or equal to 0.3 for electroplating;
2. cleaning copper powder on the front and back surfaces of the copper bar in the electroplating bath and at the bottom of the electroplating bath;
3. installing a printing roller;
4. and cleaning the printing roller, cleaning the plate surface, the end surface and the chamfer, and completely cleaning the printing roller by using pure water after cleaning.
5. The electroplating of alkali copper was carried out using a voltage of 1.5V and a current density of 0.6-1.2A/dm 2.
The initial current density of the electroplating alkali copper is less than 0.8A/dm2The binding force is obviously reduced, the current opening time is shortened as much as possible to ensure the binding force, the current is required to be opened within 10 seconds after the printing roller enters the alkali copper bath, the steel roller generally can have electrochemical reaction with the plating solution within about 10 seconds after entering the alkali copper bath, a small current can be generated after a primary battery is generated, and adverse influence can be generated on the binding force of the printing roller. The current of the rectifier cabinet is increased to the calculated current immediately after being opened, and the step current cannot be used.
6. After the electroplating of the alkali copper is finished, flushing the electroplating bath for 5-10 seconds generally, and then directly hanging the electroplating bath into an acid copper bath without polishing or spraying acid in the middle. The residence time after the alkali copper plating is finished cannot exceed 3 minutes, and if the residence time is in the process, the coating is lightly polished twice by No. 2000 abrasive paper before entering the acid copper tank, and then enters the copper plating tank, so that the small particles are prevented from being adhered to the alkali copper layer after the alkali copper layer is dried.
7. Copper sulfate is electroplated in the acid copper plating tank.
The process criteria for the alkaline copper plating of the present invention are shown in the following table:
while the invention has been described with reference to specific embodiments, the invention is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. The method for electroplating the alkali copper on the gravure roller is characterized by comprising the following steps of:
step 1: cleaning the nickel plating bath to obtain a plating bath capable of being re-grooved;
step 2: slotting the alkaline copper plating groove on the electroplating groove by using a cylinder opening agent;
and step 3: electroplating is carried out, wherein alkali copper is electroplated in the alkali copper plating solution, and copper sulfate is electroplated in the acid copper plating solution.
2. The method for electroplating alkali copper by using the gravure roll according to claim 1, wherein the step 1 specifically comprises the following steps:
step 1-1: emptying the plating solution, the anode and the auxiliary device in the nickel plating bath;
step 1-2: cleaning a nickel plating bath door cover, removing an air box at the back of the bath, and cleaning impurities in the air box;
step 1-3: polishing the copper bar to be clean;
step 1-4: cleaning the nickel plating bath by using clear water to obtain a re-grooving electroplating bath;
step 1-5: cleaning nickel liquid crystals accumulated at the welding position of the upper tank and the lower tank;
step 1-6: cleaning the nickel plating bath by using acid liquor to obtain a re-grooving electroplating bath;
step 1-7: washing the nickel plating bath by using clear water;
step 1-8: installing a titanium anode;
step 1-9: cleaning the nickel plating bath by using alkali liquor to obtain a re-grooving plating bath;
step 1-10: cleaning the nickel plating bath by using clear water to obtain a re-grooving electroplating bath;
step 1-11: and a heating pipe, a thermometer probe, an anode and an air box are installed, and a water spray pipe is adjusted.
3. The method for electroplating alkali copper by adopting the intaglio roller as recited in claim 2, wherein the specific steps of the steps 1 to 6 are as follows:
step 1-6-1: filling the nickel plating tank with dilute sulfuric acid with the volume ratio of 3%, and soaking until impurities are completely dissolved;
step 1-6-2: carrying out acid liquor circulation, cleaning a filter vat, a pipeline and an overflow port of an upper tank, wherein the circulation time is 4 hours;
step 1-6-3: and draining the dilute sulfuric acid in the nickel plating bath.
4. The method for electroplating alkali copper by adopting the intaglio roller as recited in claim 2, wherein the specific steps of the steps 1 to 9 are as follows:
step 1-9-1: filling the nickel plating bath with 5 wt% sodium hydroxide solution for circulation of alkali solution for 4 hr;
step 1-9-2: and draining the alkali liquor.
5. The method of claim 2, wherein the area of the copper bar is 1.2 times the effective area of the plate roll.
6. The method for electroplating alkali copper by using the gravure roller according to claim 1, wherein the ratio of the pure water, the additive No. 1 and the additive No. 2 in the cylinder opening agent is as follows: pure water 55%, additive No. 1: 35%, additive No. 2: 10 percent.
7. The method for electroplating alkali copper by using the gravure roll according to claim 1, wherein the step 2 specifically comprises the following steps:
step 2-1: calculating the total volume of the cylinder opening agent required to be prepared;
step 2-2: adding quarter volume of water into the electroplating bath, then adding the No. 1 additive, and circulating for 2 minutes;
step 2-3: after the circulation is completed, adding the No. 2 additive under the condition of stirring;
step 2-4: heating the solution to more than 50 ℃;
step 2-5: slowly adding potassium carbonate under the condition of stirring to ensure that the capacity of the finally obtained potassium carbonate in the tank opening agent is 55-60 g/L;
step 2-6: supplying pure water to the calculated volume in step 2-1;
step 2-7: adjusting the pH value of the solution to 9.5 by using a No. 3 additive;
step 2-8: adding hydrogen peroxide until the concentration of the hydrogen peroxide in the solution is 6 g/L;
step 2-9: circulating for 40 minutes;
step 2-10: adding an active carbon filter element for filtering for 3 hours, and electrolyzing for 1 hour;
step 2-11: replacing the activated carbon filter elements, and putting 2 or 3 new activated carbon filter elements into each filter barrel;
step 2-12: the solution is heated to 48-50 ℃ and the plating test is started.
8. The method for electroplating alkali copper by using the intaglio roller according to claim 5, wherein the total volume in the step 2-1 is calculated by the following method:
V＝x*y*h*1000
wherein x represents the length of the plating bath, y represents the width of the plating bath, h represents the depth of the plating bath, V is in liters, and x, y and h are all in meters.
9. The method for electroplating alkali copper by adopting the intaglio roller according to claim 1, wherein the specific steps in the step 3 are as follows:
step 3-1: selecting a printing roller with the surface roughness Ra of less than or equal to 0.3 for electroplating;
step 3-2: cleaning copper powder on the front and back surfaces of the copper bar in the electroplating bath and at the bottom of the electroplating bath;
step 3-3: installing a printing roller;
step 3-4: cleaning the printing roller;
step 3-5: using a voltage of 1.5V and 0.6-1A/dm2Electroplating alkali copper at the current density;
step 3-6: after the electroplating of the alkali copper is finished, flushing the electroplating bath with water, and then polishing the coating by using abrasive paper to prevent small particles from being adhered to the alkali copper layer after the alkali copper layer is dried;
step 3-7: copper sulfate is electroplated in the acid copper plating tank.
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| CN201911063099.9A CN110699718A (en) | 2019-10-31 | 2019-10-31 | Method for electroplating alkali copper on gravure roller |
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| CN201911063099.9A CN110699718A (en) | 2019-10-31 | 2019-10-31 | Method for electroplating alkali copper on gravure roller |
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Cited By (1)
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| CN111575753A (en) * | 2020-04-09 | 2020-08-25 | 杭州运城制版有限公司 | Processing technology of primary copper printing roller |
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