CN111571498B - Device for assembling multiband detector chip - Google Patents
Device for assembling multiband detector chip Download PDFInfo
- Publication number
- CN111571498B CN111571498B CN202010389877.XA CN202010389877A CN111571498B CN 111571498 B CN111571498 B CN 111571498B CN 202010389877 A CN202010389877 A CN 202010389877A CN 111571498 B CN111571498 B CN 111571498B
- Authority
- CN
- China
- Prior art keywords
- fixture
- assembling
- assembly
- microscope
- cold finger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/02—Assembly jigs
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Lenses (AREA)
Abstract
The invention discloses a device for assembling a multiband detector chip, which breaks through the traditional chip assembling mode, designs and manufactures a special assembling device, and comprises an assembling clamp, a fixing clamp, a reflecting mirror and a microscope. The cold finger is positioned through the assembling clamp, the image is formed in the microscope through the reflector, and the optical debugging is carried out through the microscope, so that the assembly of the infrared detector component achieves high precision.
Description
Technical Field
The invention relates to the technical field of photoelectricity, in particular to a device for assembling a multiband detector chip.
Background
The infrared detector assembly is a core device of an infrared imaging system, and the performance of the infrared imaging system is closely related to the performance of the detector assembly. Generally, a refrigeration type infrared detector assembly comprises a detector chip, a cold finger, a cold stage, a cold diaphragm, a window seat, a window and the like, infrared radiation enters the window of the detector assembly after passing through an imaging system and then reaches the detector chip to perform photoelectric conversion, and finally a required image is formed.
The parts of the infrared detector assembly need to be assembled according to a certain sequence and precision so as to ensure that the assembly has good performance and meet the use requirement. However, the assembly precision of the existing infrared detector assembly is low, so that the performance of the infrared detector is influenced.
Disclosure of Invention
The invention provides a device for assembling multiband detector chips, which aims to solve the problem that in the prior art, the assembly precision of an infrared detector assembly is not high enough.
The invention provides a device for assembling multiband detector chips, which is characterized by comprising the following components: the assembling fixture comprises an assembling fixture, a reflecting mirror and a microscope, wherein the reflecting mirror is arranged on an objective table of the microscope; the assembling clamp is used for fixing the cold finger; and the microscope adjusts the positions of the assembling clamp and the cold finger according to the reflection of the reflector, so that the central lines of the assembling clamp and the cold finger are superposed, and multiband detector chip assembly is carried out based on the central lines.
Optionally, the assembly fixture further comprises a positioning surface and a positioning hole;
the assembly fixture is cylindrical, the positioning hole is formed in the first bottom surface of the assembly fixture and is a through hole, the positioning hole is sleeved outside a reference circle of the cold finger, the aperture of the positioning hole is the same as the outer diameter of the reference circle of the cold finger, and the cold finger penetrates through the assembly fixture;
the first bottom surface on the periphery of the positioning hole is the positioning surface and is attached to the reference surface of the cold finger through the positioning surface;
the first bottom surface is the bottom surface of one side, away from the reflective mirror, of the assembling clamp.
Optionally, a ball is arranged on the positioning hole, and the reference circle for cold finger is matched and installed with the positioning hole of the assembling fixture under the matching of the ball.
Optionally, the assembly fixture further comprises a fixing fixture;
the second bottom surface of the assembling fixture is provided with the fixing fixture, the second bottom surface is the bottom surface of the assembling fixture facing one side of the reflector, and the assembling fixture is fixed through the fixing fixture.
Optionally, the diameter of the fixing jig is larger than the diameter of the assembly jig.
Optionally, the apparatus further comprises: assembling the fixture fixing piece;
the assembly fixture fixing part is connected with the fixing fixture to fix the assembly fixture, and the fixing fixture is fixed on the optical platform.
Optionally, the apparatus further comprises: a mirror fixture;
the reflector clamp is used for fixing the reflector on an objective table of the microscope.
Optionally, the mirror is a 45 ° mirror.
Optionally, the microscope is a digital microscope.
Optionally, the assembly fixture and the microscope are both disposed on an optical platform.
The invention has the following beneficial effects:
the invention breaks through the traditional chip assembly mode, designs and manufactures a special assembly device, and the whole device comprises an assembly fixture, a reflector and a microscope. The cold finger is positioned through the assembling clamp, and then optical debugging is carried out through the microscope through the reflecting mirror, so that the assembly of the infrared detector component achieves higher precision.
Drawings
FIG. 1 is a schematic diagram of an apparatus for assembling a multiband detector chip according to an embodiment of the present invention;
fig. 2 is a side view of an assembly jig provided in a second embodiment of the present invention.
Description of the drawings: 1. the device comprises a cold finger, 2 reference surfaces, 3 reference circles, 4 assembly fixtures, 5 fixing fixtures, 6 cold stages, 7.45-degree reflectors and fixtures, 8 microscope stages, 9 microscope observation mirrors, 10 optical platforms, 11 positioning surfaces, 12 balls and 13 positioning holes.
Detailed Description
According to the embodiment of the invention, a special assembly device is designed and manufactured, the cold finger is positioned by the assembly fixture, and then the assembly of the infrared detector component achieves higher precision by performing optical debugging by the microscope through the reflector. The present invention will be described in further detail below with reference to the drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
A first embodiment of the invention provides an apparatus for multiband detector chip assembly, see fig. 1, comprising: the assembling fixture comprises an assembling fixture, a reflecting mirror and a microscope, wherein the reflecting mirror is arranged on an objective table of the microscope;
the assembling clamp is used for fixing the cold finger;
and the microscope adjusts the positions of the assembling clamp and the cold finger according to the reflection of the reflector, so that the central lines of the assembling clamp and the cold finger are superposed, and multiband detector chip assembly is carried out based on the central lines.
That is to say, the embodiment of the invention fixes the cold finger through a special assembly fixture, and then carries out optical debugging through a microscope by a reflector, so that the assembly of the infrared detector component achieves higher precision.
Further, the assembly fixture further comprises a positioning surface and a positioning hole;
the assembly fixture is cylindrical, the positioning hole is formed in the first bottom surface of the assembly fixture and is a through hole, the positioning hole is sleeved outside a reference circle of the cold finger, the aperture of the positioning hole is the same as the outer diameter of the reference circle of the cold finger, and the cold finger penetrates through the assembly fixture;
the first bottom surface on the periphery of the positioning hole is the positioning surface and is attached to the reference surface of the cold finger through the positioning surface;
the first bottom surface is the bottom surface of one side, away from the reflective mirror, of the assembling clamp.
In specific implementation, the positioning hole is provided with a ball, and the reference circle of the cold finger is matched and installed with the positioning hole of the assembling fixture under the matching of the ball.
Further, in the embodiment of the present invention, the assembling jig further includes a fixing jig;
the second bottom surface of the assembling fixture is provided with the fixing fixture, the second bottom surface is the bottom surface of the assembling fixture facing one side of the reflector, and the assembling fixture is fixed through the fixing fixture.
Wherein the diameter of the fixing jig is larger than the diameter of the assembling jig.
In specific implementation, in the embodiment of the present invention, the apparatus further includes: assembling the fixture fixing piece;
the assembly fixture fixing piece is connected with the fixing fixture to fix the assembly fixture, and the fixing fixture is fixed on the optical platform.
In specific implementation, the embodiment of the invention is also provided with a reflector clamp; and the reflector clamp is used for fixing the reflector on the objective table of the microscope.
The reflector in the embodiment of the invention is a 45-degree reflector. Of course, those skilled in the art can also use other mirrors to implement specific adjustment according to actual needs, and the present invention is not limited to this.
In specific implementation, in the embodiment of the invention, the microscope is a digital microscope. And the assembly fixture and the microscope are both arranged on an optical platform.
That is, all of the structures of the present invention are mounted on an optical platform and associated commissioning is performed on the optical platform.
Generally speaking, the invention breaks through the traditional chip assembly mode, designs and manufactures a special assembly device, and the whole device comprises an assembly clamp, a fixing clamp, a 45-degree reflector and reflector clamp, a digital microscope and an optical platform. When the assembly fixture is used, the assembly fixture is fixed on the optical platform through the fixing fixture, the cold finger is fixed on the assembly fixture, and the reference surface and the reference circle of the cold finger are matched with the positioning surface and the positioning hole of the assembly fixture; the 45-degree reflector and the reflector clamp are optically debugged to achieve higher precision and then are placed on an objective table of a microscope. The image of the cold finger passes through a 45 ° mirror and into the microscope.
The detector assembly starts to be assembled, the cold table is directly welded to the top end of the cold finger, and the test shows that the outer circle of the cold table 6 and the reference circle of the cold finger have better coaxiality, and the surface of the cold table and the reference plane of the cold finger have better parallelism, so that the assembly requirement is met; then fixing the cold finger-cold stage component on an assembly fixture, transferring a reference surface and a reference circle of the cold finger in subsequent assembly, taking the surface of the cold stage as the reference surface and the excircle of the cold stage as the reference circle, imaging the cold stage into a digital microscope through a 45-degree reflector, accurately finding the center of the cold stage in the digital microscope (the precision is in micron level), and putting the center of a cross wire in the microscope at the center position of the cold stage to keep the center of the cross wire; taking the cold finger-cold table component off the assembly fixture, coating a small amount of glue on the surface of the cold table, primarily fixing the chip, matching the cold finger-cold table-infrared detector chip component with the assembly fixture again, keeping the center of the cross wire in the microscope still, rotating the cold finger-cold table-infrared detector chip component, moving the vertical line of the cross wire in the microscope to the position tangent to the excircle of the chip, slightly adjusting the infrared chip simultaneously, and enabling the vertical line of the cross wire to be completely tangent to the excircle of the chip after the excircle of the chip rotates for one circle. In this way, the same method is adopted for assembling the bracket, the ultraviolet detector chip and the diaphragm. In the assembly process, the cross-hair in the microscope is kept still all the time until the assembly is completely finished.
The set of assembly device successfully solves the problem of accurate assembly of 2 detector chips, is also suitable for assembly of a plurality of detector chips, and is a simple and efficient assembly mode.
The method according to the invention will be explained and illustrated in detail below by means of a specific example in connection with fig. 1 and 2:
the device of the embodiment of the invention is a device for high-precision assembly of a dual-band detector chip, the structure of which is schematically shown in figure 1 and comprises the following components from left to right: the device comprises a cold finger 1, a reference surface 2, a reference circle 3, an assembling clamp 4, a fixing clamp 5, a cold table 6, a 45-degree reflector and clamp 7, a microscope objective table 8, a microscope observation mirror 9 and an optical platform 10. The microscope is placed on the optical platform 10, the fixing clamp is fixed on the optical platform 10, the assembling clamp 4 is connected on the fixing clamp, the 45-degree reflecting mirror and the clamp are placed on the microscope stage, and the position relationship is as shown in fig. 1.
And assembling the cold table 6 on the cold finger 1 for welding, and measuring the coaxiality of the excircle of the cold table 6 and the reference circle of the cold finger 1, wherein the coaxiality needs to be less than phi 0.02 mm. The cold finger 1-cold table 6 parts are clamped on the assembling clamp 4, and the balls 12 on the assembling clamp can ensure that the clamping force of the parts is proper in tightness, can rotate and has no influence on the coaxiality. That is, the ball 12, the reference surface 2 and the reference circle 3 of the cold finger 1 are matched with the positioning surface 11 and the positioning hole 13 of the assembling jig 4, the center of the cold stage 6 is observed and found by a digital microscope, and the center of the cross wire in the microscope is fixed at the center of the cold stage 6. Taking the cold finger 1-cold stage 6 part from the assembling fixture 4, coating a small amount of glue on the cold stage 6, sticking the infrared detector chip on the cold stage 6, installing and clamping the cold finger 1-cold stage 6-infrared detector chip part on the assembling fixture 4, observing under a microscope, keeping the position of the center of the cross-shaped cross shaped. The coaxiality of the measuring chip and the cold finger reference circle 3 needs to be less than or equal to phi 0.02 mm.
And carrying out lead bonding on the infrared detector chip. Adhering a support according to the same assembly mode of the cold finger 1-the cold table 6-the infrared detector chip, and after the glue is solidified, measuring the coaxiality of the support and the cold finger reference circle 3 to be less than phi 0.03 mm.
Gluing on a support, adhering an ultraviolet detector chip with the support, adjusting the ultraviolet detector chip according to the same assembly mode of the cold finger 1-the cold stage 6-the infrared detector chip, enabling the center of the chip to coincide with the center of the cross-shaped cross wire, then taking down the cold finger 1-the cold stage 6-the infrared detector chip-the ultraviolet detector chip component, and measuring the coaxiality of the ultraviolet detector chip and the cold finger reference circle 3 to be less than or equal to phi 0.03mm after the glue is solidified.
And carrying out lead bonding on the ultraviolet detector chip. Adhering the diaphragm according to the same assembly mode of the cold finger 1, the cold platform 6 and the infrared detector chip to ensure that the center of the diaphragm is superposed with the center of the cross-shaped cross wire, then taking down the cold finger 1, the cold platform 6, the infrared detector chip, the ultraviolet detector chip and the diaphragm component, and waiting for glue solidification.
And adhering the window seat-window sheet component, and finishing the assembly of the detector assembly.
In the assembly process of the same assembly, the assembly fixture 4, the fixing fixture 5, the 45-degree reflector and the fixture 7, and the centers of the cross hairs in the microscope and the microscope are kept unchanged at the adjusted positions when the cold fingers 1 and the cold stage 6 are assembled until the assembly of the detector assembly is completed.
That is to say, the embodiment of the invention provides a high-precision, high-efficiency and simple and feasible assembly mode, and solves the problem of large accumulated error in the assembly of multilayer chips. The device is already used for mass production of the detector, and the assembly precision is tested and verified by use to meet the requirements.
Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, and the scope of the invention should not be limited to the embodiments described above.
Claims (9)
1. An apparatus for multiband detector chip assembly, comprising: the assembling fixture comprises an assembling fixture, a reflecting mirror and a microscope, wherein the reflecting mirror is arranged on an objective table of the microscope;
the assembling clamp is used for fixing the cold finger;
the microscope adjusts the positions of the assembling clamp and the cold finger according to the reflection of the reflector, so that the central lines of the assembling clamp and the cold finger are superposed, and multiband detector chip assembly is carried out based on the central lines;
the assembling clamp further comprises a positioning surface and a positioning hole;
the assembly fixture is cylindrical, the positioning hole is formed in the first bottom surface of the assembly fixture and is a through hole, the positioning hole is sleeved outside a reference circle of the cold finger, the aperture of the positioning hole is the same as the outer diameter of the reference circle of the cold finger, and the cold finger penetrates through the assembly fixture;
the first bottom surface on the periphery of the positioning hole is the positioning surface and is attached to the reference surface of the cold finger through the positioning surface;
the first bottom surface is the bottom surface of one side, away from the reflective mirror, of the assembling clamp.
2. The apparatus of claim 1,
the positioning hole is provided with a ball, and the cold finger reference circle is matched with the positioning hole of the assembling clamp to be installed together under the matching of the ball.
3. The apparatus of claim 1, wherein the assembly fixture further comprises a fixture;
the second bottom surface of the assembling fixture is provided with the fixing fixture, the second bottom surface is the bottom surface of the assembling fixture facing one side of the reflector, and the assembling fixture is fixed through the fixing fixture.
4. The apparatus of claim 3,
the diameter of the fixing clamp is larger than that of the assembling clamp.
5. The apparatus of claim 3, further comprising: assembling the fixture fixing piece;
the assembly fixture fixing part is connected with the fixing fixture to fix the assembly fixture, and the fixing fixture is fixed on the optical platform.
6. The apparatus of any one of claims 1-5, further comprising: a mirror fixture;
the reflector clamp is used for fixing the reflector on an objective table of the microscope.
7. The apparatus of any one of claims 1-5,
the reflector is a 45-degree reflector.
8. The apparatus of any one of claims 1-5,
the microscope is a digital microscope.
9. The apparatus of claim 1,
the assembly fixture and the microscope are both arranged on an optical platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010389877.XA CN111571498B (en) | 2020-05-11 | 2020-05-11 | Device for assembling multiband detector chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010389877.XA CN111571498B (en) | 2020-05-11 | 2020-05-11 | Device for assembling multiband detector chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111571498A CN111571498A (en) | 2020-08-25 |
| CN111571498B true CN111571498B (en) | 2021-11-05 |
Family
ID=72120767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010389877.XA Active CN111571498B (en) | 2020-05-11 | 2020-05-11 | Device for assembling multiband detector chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111571498B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112504090A (en) * | 2020-10-30 | 2021-03-16 | 中国电子科技集团公司第十一研究所 | Dewar cold finger concentricity detection tool and detection method |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101360251B1 (en) * | 2007-11-23 | 2014-02-11 | 삼성전자 주식회사 | Reviewing apparatus of wafer defect and Method thereof |
| CN202895047U (en) * | 2012-09-29 | 2013-04-24 | 上海航天汽车机电股份有限公司传感器分公司 | Hall chip positioning device |
| CN103681401A (en) * | 2013-10-25 | 2014-03-26 | 深圳市恒睿智达科技有限公司 | Die bonder detection mechanism and continuous detection method |
| CN205898305U (en) * | 2016-04-15 | 2017-01-18 | 中国科学院上海技术物理研究所 | Miniature dewar inner tube of integrated form |
| CN105928621A (en) * | 2016-04-18 | 2016-09-07 | 中国电子科技集团公司第十研究所 | Double-band infrared detector assembly |
| CN107340061B (en) * | 2017-05-31 | 2020-01-24 | 中国电子科技集团公司第十一研究所 | Infrared detector cold box |
| CN109084902A (en) * | 2018-08-14 | 2018-12-25 | 中国电子科技集团公司第十研究所 | Dewar and Dewar component are surveyed in chip testing alternating temperature |
| CN110932087A (en) * | 2018-09-20 | 2020-03-27 | 潍坊华光光电子有限公司 | Semiconductor laser chip correcting device and correcting method |
| CN110676187B (en) * | 2019-09-09 | 2022-04-12 | 西安北方光电科技防务有限公司 | Device and method for accurately measuring center of photosensitive surface of photoelectric detector |
-
2020
- 2020-05-11 CN CN202010389877.XA patent/CN111571498B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN111571498A (en) | 2020-08-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106908961B (en) | Optical module adjustment method and tool based on infrared imaging | |
| CN102200623B (en) | Micro-stress assembly flexible supporting method of small-calibre micro-crystal glass material reflector | |
| CN111571498B (en) | Device for assembling multiband detector chip | |
| CN110531531B (en) | Method for assembling and adjusting primary and secondary reflectors of Cassegrain optical system | |
| CN109343197A (en) | A kind of adhering method and mirror assembly of mirror assembly | |
| CN106371189A (en) | Mechanical structure for turning optical path optical system | |
| CN109343198A (en) | A kind of microstress adhesive asserably method for large-diameter non-spherical reflecting mirror | |
| KR101524541B1 (en) | A Assembly Method of Reflective Optical System | |
| CN206193319U (en) | Mechanical structure for turning optical path optical system | |
| CN108747269B (en) | Pendulum piece subassembly assembly quality based on CCD counterpoint | |
| CN116577883A (en) | Single-tube tail fiber tube penetrating machine device and method | |
| US5452142A (en) | Approach for positioning, fabricating, aligning and testing grazing, convex, hyperbolic mirrors | |
| CN215725650U (en) | Assembly coaxiality control and measurement device for laser output head glass column | |
| CN210360683U (en) | Centering positioning fixture for pyramid prism blank optical cement to pyramid leaning body | |
| CN212749413U (en) | Simple centering, assembling and adjusting device for combined mirror | |
| JP2015197599A (en) | Lens fixing structure, lens, lens unit, and lens fixing method | |
| CN114739323A (en) | System and method for testing deviation between optical axis and mechanical axis of optical element and deviation correction method | |
| US7728988B2 (en) | Method and apparatus for testing conic optical surfaces | |
| CN114942506B (en) | Calibration method of assembly system for periscope type camera module based on collimator | |
| TWI734947B (en) | Multifunctional and fast portable laser marking positioning device | |
| CN114967297B (en) | Optical module and assembly method thereof | |
| CN113701609B (en) | Method and device for controlling and measuring assembly coaxiality of glass column of laser output head | |
| CN220270757U (en) | Objective lens transmission wavefront inspection device | |
| CN112882186B (en) | Welding fixing structure and fixing method suitable for adjustable reflector group | |
| CN215183867U (en) | Identification device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |