CN111571368A - Central liquid supply planetary polishing device and method - Google Patents
Central liquid supply planetary polishing device and method Download PDFInfo
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- CN111571368A CN111571368A CN202010438339.5A CN202010438339A CN111571368A CN 111571368 A CN111571368 A CN 111571368A CN 202010438339 A CN202010438339 A CN 202010438339A CN 111571368 A CN111571368 A CN 111571368A
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- 238000005498 polishing Methods 0.000 title claims abstract description 157
- 239000007788 liquid Substances 0.000 title claims abstract description 85
- 238000000034 method Methods 0.000 title claims description 11
- 230000005540 biological transmission Effects 0.000 claims abstract description 35
- 230000007246 mechanism Effects 0.000 claims abstract description 29
- 238000003754 machining Methods 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 229910003460 diamond Inorganic materials 0.000 claims description 12
- 239000010432 diamond Substances 0.000 claims description 12
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 4
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 4
- 238000007517 polishing process Methods 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 239000002113 nanodiamond Substances 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 230000008859 change Effects 0.000 abstract description 2
- 238000012545 processing Methods 0.000 description 17
- 230000003287 optical effect Effects 0.000 description 9
- 238000003780 insertion Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000001931 thermography Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a central liquid supply planetary polishing device which comprises a base plate, a revolution unit, an autorotation unit, a liquid supply and gas supply unit, a loading unit and a polishing shaft assembly, wherein the base plate is provided with a base plate; a revolution motor in the revolution unit transmits power to a hollow revolution shaft through a primary belt transmission pair, one end of the hollow revolution shaft is provided with a connecting flange, and the connecting flange is provided with an eccentric adjusting mechanism; the rotation unit comprises a rotation motor, a transmission flexible shaft and a polishing disc; the hollow rotating shaft of the liquid and gas supply unit is connected with the other end of the hollow revolution shaft, and the hollow polishing shaft in the polishing shaft assembly is connected with the liquid supply pipe and the rotation unit in the liquid and gas supply unitThe polishing disc is connected; the revolution motor drives the eccentric adjusting mechanism to rotate around the axis O1Revolution; the self-rotating motor drives the polishing disc to wind the axis O thereof2The polishing liquid is supplied from the center of the tool by autorotation, so that the liquid supply is more sufficient; the revolution and rotation speed and the eccentricity can be adjusted in a stepless change manner, and the adjustment is convenient; the rotation motor does not participate in revolution, and the rotational inertia is reduced.
Description
Technical Field
The invention relates to a planet polishing device in the field of optical manufacturing, in particular to a planet polishing device and method for central liquid supply.
Background
With the rapid development of modern optical systems, large-caliber aspheric optical elements are widely applied to the national defense and civil advanced technical fields such as laser nuclear fusion devices, large astronomical telescopes, infrared thermal imaging and medical imaging equipment due to the excellent characteristics of high precision, light weight, good reliability, low cost and the like compared with common spherical lenses, and the processing technology of the large-caliber aspheric optical elements is developed in the direction of high precision, high efficiency and high quality.
At present, the polishing technique of the aspherical optical element is mainly computer controlled optical surface forming (CCOS). A great deal of foreign research shows that the shape of the removal function is an important factor influencing the polishing quality and efficiency, and directly determines whether the final surface type error can be converged and the convergence degree. In the traditional self-rotating grinding head polishing, because the central linear velocity of the grinding head is zero, the center of a removal function is zero according to the Preston assumption, and an annular removal function with the center of zero is obtained, so that the convergence of a surface type error is limited or cannot be converged. However, the planetary polishing can overcome the defects, obtain a better Gauss-like type removal function, quickly converge the surface type error of the workpiece, and improve the processing precision and the processing efficiency, so that the planetary polishing is widely applied to the CCOS technology. However, the existing planetary polishing device has the defects of excessively complex structure, incapability of centrally supplying liquid, large moment of inertia, poor dynamic performance and the like. For example, patent document No. 201710546844.X discloses a planetary polishing device with a double-parallelogram mechanism, wherein rotation and revolution of the device are respectively driven by two servo motors, revolution transmission is realized by the double-parallelogram mechanism, the rotation motor is fixed on a base, and motion is transmitted to a polishing disk by two-stage belt transmission. Although, this technical scheme can realize the central liquid supply; the mechanism is too complex and the motion is not smooth. For another example, patent document No. 201910266143.X discloses a planetary polishing device, planetary motion of which is realized by a planetary gear train, the device has compact structure, revolution and rotation of a polishing disk can be realized by only one motor, and inertia force is small; however, the liquid can not be supplied centrally, the gears and belt wheels with different tooth numbers need to be replaced for adjusting the eccentricity and the revolution-rotation speed ratio, the operation is troublesome, and the adjusting range is small.
Disclosure of Invention
Aiming at the problems of high ultraprecision machining difficulty, high machining cost, low machining efficiency and the like of modern large-caliber aspheric optical elements, the invention provides the planetary polishing device for central liquid supply, so that polishing liquid is supplied from the center of a tool, and the liquid supply is more sufficient; the revolution and rotation speed and the eccentricity can be adjusted in a stepless change way (within an allowable range), and the adjustment is convenient; the rotation motor does not participate in revolution, and the rotational inertia is reduced.
In order to solve the technical problem, the invention provides a central liquid supply planetary polishing device which comprises a base plate, a revolution unit, a rotation unit, a liquid and gas supply unit, a loading unit and a polishing shaft assembly, wherein the base plate is provided with a base plate; the revolution unit comprises a revolution motor and a hollow revolution shaft, the revolution motor is fixed on a base plate, the output end of the revolution motor transmits power to the hollow revolution shaft through a primary belt transmission pair, and two ends of the hollow revolution shaft are respectively supported by two belt seat bearings fixed on the base plate; one end of the hollow revolution shaft is provided with a connecting flange, and the connecting flange is provided with an eccentric adjusting mechanism; the rotation unit comprises a rotation motor, a transmission flexible shaft and a polishing disc; the rotation motor is fixed on the base plate, and one end of the transmission flexible shaft is connected with the output end of the rotation motor; the liquid and gas supply unit comprises a hollow gas circuit rotary joint, a hollow water circuit rotary joint, a hollow rotating shaft, a gas supply pipe and a liquid supply pipe; the hollow rotating shaft is connected with the other end of the hollow revolution shaft, the rotor part of the hollow air path rotating joint and the rotor part of the hollow water path rotating joint are connected in series on the hollow rotating shaft, and the stator part of the hollow air path rotating joint and the stator part of the hollow water path rotating joint are connected in series on the hollow rotating shaftThe stator part of the hollow waterway rotary joint is fixed with the base plate; one end of the gas supply pipe is connected with the hollow gas path rotary joint; one end of the liquid supply pipe is connected with the hollow waterway rotary joint; the loading unit comprises a supporting seat fixed with the eccentric adjusting mechanism, a thin-wall cylinder and an L-shaped connecting piece are arranged on the supporting seat, and the L-shaped connecting piece is connected with the supporting seat in a sliding mode through a linear guide rail pair; the thin-wall cylinder is communicated with the other end of the gas supply pipe of the liquid and gas supply unit; the polishing shaft assembly comprises a transmission shaft, a pair of opening and closing cavities and a hollow polishing shaft, the input end of the transmission shaft is connected with the other end of the transmission flexible shaft, the pair of opening and closing cavities are arranged on the L-shaped connecting piece, the hollow polishing shaft is supported by the pair of opening and closing cavities, and one end of the hollow polishing shaft is communicated with the other end of a liquid supply pipe in the liquid and gas supply unit; the other end of the hollow polishing shaft is connected with a polishing disc in the autorotation unit; the revolution motor drives the eccentric adjusting mechanism to rotate around the axis O through the primary belt transmission pair1Revolution; the rotation motor drives the polishing disc to wind the axis O thereof through the transmission flexible shaft, the transmission shaft in the polishing shaft assembly and the gear pair in sequence2Autorotation; the rotation and revolution speed ratio range of the polishing disk is (0-500)]。
Further, the central liquid supply planetary polishing device comprises an eccentric adjusting mechanism, a central liquid supply mechanism and a central liquid supply mechanism, wherein the eccentric adjusting mechanism comprises a sliding seat, a sliding block, an adjusting screw rod and a locking screw, the sliding seat is fixed with the connecting flange, and the sliding block and the sliding seat are in dovetail groove-dovetail block sliding fit; the eccentric adjustment mechanism is around an axis O1The revolution radius is e, and e is 0-32 mm. And when the eccentric adjusting mechanism reaches the set eccentric distance, the locking screw is used for locking.
When the loading unit is used for loading, compressed air is pressed in from the stator part of the hollow air path rotary joint and is transmitted to the thin-wall cylinder through the air supply pipe in sequence to realize loading; the moving stroke of the thin-wall cylinder piston rod is the maximum stroke of the cylinder. The thin-wall cylinder drives the polishing shaft component fixed on the L-shaped connecting piece to move up and down through the linear guide rail pair, so that transverse pressure loading of the polishing disc on a workpiece is realized in the polishing process, and the loading range is 0-100N.
The hollow polishing shaft is connected with the polishing disc through a single-diaphragm flexible coupling. The hollow polishing shaft is connected with the liquid supply pipe through a quick-insertion rotary joint.
The method for processing by using the central liquid supply planetary polishing device is characterized in that the polishing disc is provided with a central through hole, and during processing, polishing liquid is injected from a stator part of the hollow gas circuit rotary joint, sequentially passes through the liquid supply pipe, the quick-insertion rotary joint and the hollow polishing shaft, and finally flows to a processing area from the central through hole of the polishing disc, so that central liquid supply is realized.
The polishing solution is any one of deionized water, cerium oxide polishing solution, aluminum oxide polishing solution, silicon carbide polishing solution and diamond polishing solution. The diamond polishing solution is any one of a polycrystalline diamond polishing solution, a single crystal diamond polishing solution and a nano diamond polishing solution.
Compared with the prior art, the invention has the beneficial effects that:
1) polishing solution is supplied from the center of the polishing disc, the polishing disc is prevented from being thrown out due to overlarge rotating speed, abrasive particles are more uniformly distributed, and the machining process is more stable.
2) The rotation motor does not participate in revolution motion, so that the rotational inertia is reduced, and the dynamic characteristic is better.
3) Different revolution radiuses can be obtained by adjusting the eccentric mechanism, different process requirements are met, an ideal Gauss-like removal function is obtained more easily, surface shape errors are converged rapidly, and surface machining quality and machining efficiency are improved.
4) And the adaptability is strong. Can be randomly arranged on the tail end of a common numerical control machine tool or a robot or a self-built test bed without special equipment.
Drawings
FIG. 1 is a front view of the central liquid feed planetary polishing apparatus of the present invention;
FIG. 2 is a side view of the central liquid feed planetary polishing apparatus shown in FIG. 1;
FIG. 3 is a schematic view of the construction of the burnishing shaft assembly shown in FIG. 1.
In the figure:
101-revolution motor 102-hollow revolution shaft 103-eccentric adjusting mechanism
104-primary belt transmission pair 105-bearing with seat 106-connecting flange
201-self-rotating motor 202-transmission flexible shaft 203-polishing disk
301-hollow gas circuit rotary joint 302-hollow water circuit rotary joint 303-hollow rotating shaft
304-gas supply pipe 305-liquid supply pipe 401-thin-walled cylinder
402-L-shaped connecting piece 403-linear guide rail pair 404-supporting seat
501-hollow polishing shaft 502-gear pair 503-split cavity
504-quick-insertion rotary joint 505-transmission shaft 1031-adjusting screw rod
1032-locking screw 600-base plate
Detailed Description
The invention will be further described with reference to the following figures and specific examples, which are not intended to limit the invention in any way.
The invention provides a central liquid supply planetary polishing device which comprises a base plate 600, a revolution unit, a rotation unit, a liquid supply and gas supply unit, a loading unit and a polishing shaft assembly.
As shown in fig. 1 and 2, the revolution unit includes a revolution motor 101 and a hollow revolution shaft 102, the revolution motor 101 is fixed on a base plate 600, an output end of the revolution motor 101 transmits power to the hollow revolution shaft 102 through a primary belt transmission pair 104, and two ends of the hollow revolution shaft 102 are respectively supported by two belt bearing 05 fixed on the base plate 600; one end of the hollow revolution shaft 102 is provided with a connecting flange 106, and the connecting flange 106 is provided with an eccentric adjustmentA mechanism 103; the eccentric adjusting mechanism 103 comprises a sliding seat, a sliding block, an adjusting screw 1031 and a locking screw 1032, the sliding seat is fixed with the connecting flange 106, and the sliding block and the sliding seat are in sliding fit by adopting a dovetail groove-dovetail block; said eccentric adjustment mechanism 103 being about an axis O1The revolution radius is e, e is 0-32mm, different revolution radii can be selected or an optimal Gauss-like removal function can be found according to different process requirements, and therefore the processing quality and the processing efficiency of the surface of the workpiece are improved. And when the eccentric adjusting mechanism 103 reaches the set eccentric distance, the locking screw 1032 is used for locking.
As shown in fig. 1 and fig. 2, the rotation unit includes a rotation motor 201, a flexible transmission shaft 202 and a polishing disk 203; the rotation motor 201 is fixed on the base plate 600, and one end of the transmission flexible shaft 202 is connected with the output end of the rotation motor 201.
As shown in fig. 1 and 2, the liquid and gas supply unit comprises a hollow gas path rotary joint 301, a hollow water path rotary joint 302, a hollow rotating shaft 303, a gas supply pipe 304 and a liquid supply pipe 305; the hollow rotating shaft 303 is connected with the other end of the hollow revolution shaft 102, a rotor part of the hollow air path rotating joint 301 and a rotor part of the hollow water path rotating joint 302 are both connected in series on the hollow rotating shaft 303, and a stator part of the hollow air path rotating joint 301 and a stator part of the hollow water path rotating joint 302 are fixed with the base plate 600; one end of the air supply pipe 304 is connected with the hollow air path rotary joint 301; one end of the liquid supply pipe 305 is connected to the hollow waterway rotary joint 302.
As shown in fig. 1 and fig. 2, the loading unit includes a supporting base 404 fixed to the eccentric adjustment mechanism 103, the supporting base 404 is provided with a thin-walled cylinder 401 and an L-shaped connecting member 402, and the L-shaped connecting member 402 is slidably connected to the supporting base 404 through a linear guide pair 403; the thin-wall air cylinder 401 is communicated with the other end of the air supply pipe 304 of the liquid and air supply unit.
As shown in fig. 1, 2 and 3, the polishing shaft assembly includes a transmission shaft 505, a pair of open-close cavities 503 and a hollow polishing shaft 501, an input end of the transmission shaft 505 is connected with the other end of the transmission flexible shaft 202, the pair of open-close cavities 503 is disposed on the L-shaped connector 402, the hollow polishing shaft 501 is supported by the pair of open-close cavities 503, one end of the hollow polishing shaft 501 is communicated with the other end of the liquid supply pipe 305 in the liquid and gas supply unit, and the connection between the hollow polishing shaft 501 and the liquid supply pipe 305 is connected by a quick-plug rotary joint 504; the other end of the hollow polishing shaft 501 is connected with a polishing disc 203 in the rotation unit, and the hollow polishing shaft 501 is connected with the polishing disc 203 through a single-diaphragm flexible coupling to compensate clamping and installation errors of workpieces or polishing discs.
As shown in fig. 1 and 3, in the present invention, the revolution motor 101 drives the eccentric adjustment mechanism 103 around the axis O by the primary belt transmission pair 1041Revolution; the invention adopts the arc tooth synchronous belt to transmit the motion of the revolution motor 101 to the hollow revolution shaft 102, thereby driving the polishing disc 203 to realize revolution motion.
The rotation motor 201 sequentially passes through the transmission flexible shaft 202, the transmission shaft 505 in the polishing shaft assembly and the gear pair 502 (primary gear transmission) to transmit the motion of the transmission flexible shaft 202 to the hollow polishing shaft 501, and then drives the polishing disc 203 to rotate around the axis O of the polishing disc2Realizing autorotation; the invention adopts the transmission flexible shaft 202 to flexibly transmit the motion of the rotation motor 201 to the polishing disk 203 staying at any position, and the rotation motor 201 does not participate in revolution, thereby reducing the rotational inertia and enabling the polishing process to be more stable. In the invention, the rotation and revolution speed ratio range of the polishing disk 203 is (0-500)]。
In the invention, when the loading unit is used for loading, compressed air is pressed in from the stator part of the hollow air path rotary joint 301 and is transmitted to the thin-wall air cylinder 401 through the air supply pipe 304 in sequence to realize loading; the moving stroke of the piston rod of the thin-wall cylinder 401 is the maximum stroke of the cylinder. The thin-wall cylinder 401 drives the polishing shaft component fixed on the L-shaped connecting piece 402 to move up and down through the linear guide rail pair 403, so that the transverse pressure loading of the polishing disc 203 on a workpiece is realized in the polishing process, and the loading range is 0-100N.
In the invention, the polishing disk 203 is provided with a central through hole, when the device of the invention is used for processing, the pre-mixed polishing solution is injected from the water inlet of the stator part of the hollow air path rotary joint 302 under a certain pressure, passes through the liquid supply pipe 305, the quick-insertion rotary joint 504 and the hollow polishing shaft 501 in sequence, and finally flows to a processing area from the central through hole of the polishing disk 203, so as to realize central liquid supply. The polishing solution may be any one of deionized water, cerium oxide polishing solution, aluminum oxide polishing solution, silicon carbide polishing solution, and diamond polishing solution. The diamond polishing solution may be any one of a polycrystalline diamond polishing solution, a single crystal diamond polishing solution, and a nano diamond polishing solution.
When the central liquid supply planetary polishing device is used, the device is arranged on a moving shaft of a common numerical control machine tool or the tail end of an industrial robot or a self-built test bed through the base plate 600, and the removal amount and the machining precision of materials in a machining area are controlled by controlling parameters such as the supply pressure, the loading pressure, the revolution and rotation speed, the residence time of a machining point and the like of polishing liquid, so that the ultraprecise machining of a large-caliber aspheric optical element is realized.
Example 1:
as shown in fig. 1, 2 and 3, in this example, it is necessary to mount the central liquid-feeding planetary polishing apparatus of the present invention vertically on a movable shaft above a numerically-controlled machine tool table, connect the apparatus to a polishing liquid circulation system and an air pump by pipes, and fix a workpiece on the machine tool table. The polishing disk 203 is moved to a proper position on the surface of the workpiece, the polishing liquid is pressurized to working pressure by a pressure pump, injected from a water inlet hole of the hollow waterway rotary joint 302, and finally flows out from the center of the polishing disk 203 to flow to the workpiece surface processing area. Compressed air is injected from the air inlet hole of the hollow air path rotary joint 301 by an air pump at a set pressure and flows to the loaded thin-wall air cylinder 401, so that the polishing disc 203 loads the surface of the workpiece in the machining process. In the machining process, firstly setting a revolution speed of 80rmp/min, a rotation speed of 500rmp/min, an eccentricity e of 10mm, an air pressure load of 0.1MPa and a liquid supply pressure of 0.5MPa, selecting cerium oxide polishing liquid with a particle size of 5 mu m, grinding for 5min in a single time, walking a planetary motion track, calculating residence time according to an initial surface type error of a workpiece to generate a numerical control machining program, guiding the machining program into a machine tool, and polishing the surface of the workpiece deterministically.
Example 2:
as shown in fig. 1, 2 and 3, in the present example, the central liquid feed planetary polishing apparatus of the present invention is mounted on the end of an industrial robot, and the attitude of the polishing disk with respect to the surface of the workpiece is changed by controlling the attitude of the end of the industrial robot to accommodate the machining of the free-form surface element.
The device can be installed on a moving shaft of a common numerical control machine tool, can also be installed at the tail end of an industrial robot, and can even be installed on a self-built simple test bed, so that the universality is strong; an ideal Gauss-like type removing function can be obtained by adjusting the magnitude of the eccentricity e, so that the surface type error is rapidly converged, and the processing precision and efficiency are improved; polishing liquid is supplied from the center of the polishing disc through the hollow polishing shaft, so that the polishing disc is prevented from being thrown out due to overhigh rotating speed in polishing, and liquid supply is more sufficient; the rotation motor is fixed on the base plate and does not participate in revolution motion, so that the rotational inertia is reduced. In the processing process, the revolution and rotation speed of the polishing disc is controlled by adjusting the revolution motor and the rotation motor, and the removal amount and the processing precision of materials in a processing area are controlled by controlling parameters such as eccentricity, liquid supply pressure, loading force, residence time of a processing point and the like, so that the ultraprecise processing of the large-caliber aspheric optical element is realized.
While the present invention has been described with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments, which are illustrative only and not restrictive, and various modifications which do not depart from the spirit of the present invention and which are intended to be covered by the claims of the present invention may be made by those skilled in the art.
Claims (10)
1. A central liquid supply planetary polishing device is characterized in that: comprises a base plate (600), a revolution unit, a rotation unit, a liquid and gas supply unit, a loading unit and a polishing shaft assembly;
the revolution unit comprises a revolution motor (101) and a hollow revolution shaft (102), the revolution motor (101) is fixed on a base plate (600), the output end of the revolution motor (101) transmits power to the hollow revolution shaft (102) through a primary belt transmission pair (104), and two ends of the hollow revolution shaft (102) are respectively supported by two belt seat bearings (105) fixed on the base plate (600); one end of the hollow revolution shaft (102) is provided with a connecting flange (106), and the connecting flange (106) is provided with an eccentric adjusting mechanism (103);
the rotation unit comprises a rotation motor (201), a transmission flexible shaft (202) and a polishing disc (203); the rotation motor (201) is fixed on the base plate (600), and one end of the transmission flexible shaft (202) is connected with the output end of the rotation motor (201);
the liquid and gas supply unit comprises a hollow gas path rotary joint (301), a hollow water path rotary joint (302), a hollow rotating shaft (303), a gas supply pipe (304) and a liquid supply pipe (305); the hollow rotating shaft (303) is connected with the other end of the hollow revolution shaft (102), a rotor part of the hollow air path rotating joint (301) and a rotor part of the hollow water path rotating joint (302) are connected in series on the hollow rotating shaft (303), and a stator part of the hollow air path rotating joint (301) and a stator part of the hollow water path rotating joint (302) are fixed with the base plate (600); one end of the air supply pipe (304) is connected with the hollow air path rotary joint (301); one end of the liquid supply pipe (305) is connected with the hollow waterway rotary joint (302);
the loading unit comprises a supporting seat (404) fixed with the eccentric adjusting mechanism (103), a thin-wall cylinder (401) and an L-shaped connecting piece (402) are arranged on the supporting seat (404), and the L-shaped connecting piece (402) is connected with the supporting seat (404) in a sliding mode through a linear guide rail pair (403); the thin-wall cylinder (401) is communicated with the other end of the gas supply pipe (304) of the liquid and gas supply unit;
the polishing shaft assembly comprises a transmission shaft (505), a pair of opening and closing cavities (503) and a hollow polishing shaft (501), the input end of the transmission shaft (505) is connected with the other end of the transmission flexible shaft (202), the pair of opening and closing cavities (503) are arranged on the L-shaped connecting piece (402), the hollow polishing shaft (501) is supported by the pair of opening and closing cavities (503), and one end of the hollow polishing shaft (501) is communicated with the other end of a liquid supply pipe (305) in a liquid and gas supply unit; the other end of the hollow polishing shaft (501) is connected with a polishing disc (203) in the rotation unit;
the revolution motor (101) drives the eccentric adjusting mechanism (103) to rotate around an axis O through the primary belt transmission pair (104)1Revolution;
the rotation motor (201) drives the polishing disc (203) to rotate around the axis O of the polishing disc sequentially through the transmission flexible shaft (202), the transmission shaft (505) in the polishing shaft assembly and the gear pair2Autorotation;
the rotation and revolution speed ratio range of the polishing disk (203) is (0-500).
2. The central liquid supply planetary polishing device according to claim 1, characterized in that the eccentric adjusting mechanism (103) comprises a sliding base, a sliding block, an adjusting screw rod (1031) and a locking screw (1032), the sliding base is fixed with the connecting flange (106), and the sliding block and the sliding base are in dovetail groove-dovetail block sliding fit; the eccentric adjustment mechanism (103) is around an axis O1The revolution radius is e, and e is 0-32 mm.
3. The central liquid supply planetary polishing device according to claim 2, characterized in that the locking screw (1032) is used for locking when the eccentricity adjusting mechanism (103) reaches a set eccentricity.
4. The planetary polishing device with central liquid supply as claimed in claim 1, wherein when the loading unit is loaded, compressed air is pressed in from the stator part of the hollow air path rotary joint (301) and is transmitted to the thin-wall air cylinder (401) through the air supply pipe (304) in sequence to realize loading; the moving stroke of the piston rod of the thin-wall cylinder (401) is the maximum stroke of the cylinder.
5. The planetary polishing device with the central liquid supply function according to claim 4, characterized in that the thin-wall air cylinder (401) drives the polishing shaft assembly fixed on the L-shaped connecting piece (402) to move up and down through the linear guide rail pair (403), so that the transverse pressure loading of the polishing disc (203) on a workpiece is realized in the polishing process, and the loading range is 0-100N.
6. The central liquid supply planetary polishing device according to claim 1, characterized in that the connection between the hollow polishing shaft (501) and the polishing disk (203) is a single-diaphragm flexible coupling connection.
7. The central liquid supply planetary polishing device according to claim 1, characterized in that the connection between the hollow polishing shaft (501) and the liquid supply pipe (305) is connected by a quick-plug rotary joint (504).
8. A center-feed planetary polishing method, characterized by using the center-feed planetary polishing apparatus as claimed in claim 1, wherein said eccentric adjustment mechanism (103) is disposed around an axis O1The revolution radius is e, and e is 0-32 mm; the polishing disc (203) is provided with a central through hole, and during machining, polishing liquid is injected from a stator part of the hollow air path rotary joint (302), sequentially passes through the liquid supply pipe (305) and the hollow polishing shaft (501), and finally flows to a machining area from the central through hole of the polishing disc (203), so that central liquid supply is realized.
9. The central liquid supply planetary polishing method according to claim 8, wherein the polishing liquid is any one of deionized water, cerium oxide polishing liquid, aluminum oxide polishing liquid, silicon carbide polishing liquid and diamond polishing liquid.
10. The planetary polishing method with central liquid supply according to claim 9, wherein the diamond polishing liquid is any one of polycrystalline diamond polishing liquid, single crystal diamond polishing liquid and nano diamond polishing liquid.
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