CN111571028A

CN111571028A - Board splitting method

Info

Publication number: CN111571028A
Application number: CN202010182642.3A
Authority: CN
Inventors: 卢勇勇
Original assignee: Vega CNC Technology Suzhou Co Ltd
Current assignee: Vega CNC Technology Suzhou Co Ltd
Priority date: 2020-03-16
Filing date: 2020-03-16
Publication date: 2020-08-25
Anticipated expiration: 2040-03-16
Also published as: WO2021184813A1; CN111571028B

Abstract

The invention relates to the technical field of PCB processing and discloses a board splitting method. The plate dividing method comprises the following steps: s1, cutting partial edges of the daughter boards by using a mechanical cutting tool, separating the cut edges of the daughter boards from the mother board, and keeping the uncut edges connected with the mother board; s2, adhering the mother board on the adhesive film layer; and S3, cutting the uncut edges of the daughter board in the step S1 by using a laser cutting mechanism to completely separate the daughter board from the mother board. According to the board splitting method provided by the invention, mechanical cutting with high cutting efficiency is firstly carried out, and because only part of edges of the daughter board are cut during mechanical cutting, a special jig is not needed for fixing the daughter board; and then, carrying out non-contact laser cutting on the residual edge, ensuring the relative position between the daughter board and the mother board and improving the cutting precision. Through the combination of mechanical cutting and laser cutting, the problems of the fixing difficulty and the cutting efficiency can be well balanced, the problem of the fixing difficulty is solved, the plate dividing quality is improved, and the plate dividing efficiency is guaranteed.

Description

Board splitting method

Technical Field

The invention relates to the technical field of PCB processing, in particular to a board splitting method.

Background

In the production process of PCB (Printed Circuit Board), Board separation is a crucial step in order to adapt the size of PCB to the size of electronic components. The so-called board splitting is that the PCBs used in the electronic components are all relatively small, but when manufacturing the PCBs, a plurality of small PCBs are generally integrated into one large PCB by adopting a sheet-connected assembly mode, and finally, the large PCB integrated by the sheets is divided into small PCB units, that is, the board splitting of the PCBs.

In the prior art, the plate separation is usually performed by mechanical cutting. However, when this method is adopted, a special jig must be used to reliably fix the small PCB, which is difficult to fix. If the small PCB is not reliably fixed, when the last connecting point of the small PCB and the large PCB is cut, the small PCB can move relative to the large PCB under the action of the cutting tool, so that the cutting path is deviated, even the small PCB is damaged, and the board dividing quality and the board dividing success rate are reduced. In addition, the jig has a complex structure, high design difficulty and high cost, and when a small PCB (such as a PCB for a cochlear implant) is too small, the jig cannot be used for fixing, so that the actual production requirement cannot be met.

Therefore, a new board dividing method is needed to solve the above technical problems.

Disclosure of Invention

The invention aims to provide a board splitting method, which can ensure the relative position between a daughter board and a mother board without using a special jig, ensure the cutting precision and improve the board splitting quality and the board splitting efficiency.

In order to achieve the purpose, the invention adopts the following technical scheme:

a method of splitting a panel, comprising:

s1, cutting partial edges of a daughter board by using a mechanical cutting tool, separating the cut edges of the daughter board from a mother board, and keeping the uncut edges connected with the mother board;

s2, adhering the mother board to an adhesive film layer;

and S3, cutting the uncut edge of the daughter board in the step S1 by using a laser cutting mechanism to completely separate the daughter board from the mother board.

As a preferable aspect of the board separation method, the daughter board is provided with a V-shaped groove at an edge which is not cut in step S1, and the laser cutting mechanism cuts along the V-shaped groove in step S3 to completely separate the daughter board from the mother board.

As a preferable scheme of the board dividing method, in step S3, a plurality of sets of cutting process parameters are preset in the laser cutting mechanism, and a cutting width of the cutting process parameters executed first is greater than a cutting width of the cutting process parameters executed later.

As a preferable aspect of the board dividing method, in step S3, the cutting trajectory of the laser cutting mechanism includes a front guide cutting part, a main body cutting part, and a rear guide cutting part in this order, wherein the length of the main body cutting part is equal to the length of the edge of the sub board that is not cut in step S1.

Preferably, the adhesive film layer is a transparent adhesive film layer.

As a preferable scheme of the plate dividing method, the laser cutting mechanism is an ultraviolet laser cutting mechanism.

In step S1, the dust generated by cutting is blown toward a dust suction mechanism by an antistatic air knife, and the dust generated by cutting is collected by the dust suction mechanism.

As a preferable embodiment of the board dividing method, before step S1, the method further includes:

s11, fixing the mother board on a mechanical cutting platform, detecting a difference value between the actual position and a preset position of the mother board by using a first visual positioning mechanism, if the difference value is larger than a preset value, compensating the difference value by using the mechanical cutting tool, and then executing the step S1, and if the difference value is smaller than or equal to the preset value, directly executing the step S1 by using the mechanical cutting tool.

As a preferable scheme of the board dividing method, between the steps S2 and S3, the method further comprises:

and S31, adsorbing and fixing the adhesive film layer by using a vacuum adsorption platform.

As a preferable scheme of the board dividing method, after the step S31 and before the step S3, the method further includes:

s32, detecting a difference value between the actual position and a preset position of the mother board by using a second visual positioning mechanism, if the difference value is larger than a preset value, compensating the difference value by using the laser cutting mechanism, and then executing the step S3, and if the difference value is smaller than or equal to the preset value, directly executing the step S3 by using the mechanical cutting tool.

The invention has the beneficial effects that:

according to the board splitting method provided by the invention, mechanical cutting is carried out by utilizing the mechanical cutting tool, the mechanical cutting efficiency is high, meanwhile, because only part of the edge of the daughter board is cut during mechanical cutting, the daughter board still keeps being connected with the mother board, and the daughter board can not move relative to the mother board, a special jig is not needed to be used for fixing the daughter board, and the cost of the jig is saved; and then, the residual edges are subjected to laser cutting by using a laser cutting mechanism, and because the laser cutting belongs to non-contact cutting, in the process of completely separating the daughter board from the mother board, the influence of cutting acting force on the relative position between the daughter board and the mother board does not need to be considered, and the daughter board and the mother board can be further prevented from relatively moving by the adhesion of the adhesive film layer, so that the cutting precision is improved. Although the fixed degree of difficulty of daughter board also need not to consider in whole utilizing laser cutting, because the junction of daughter board and mother board contains copper, difficult cutting, when the thickness of junction is thick moreover, divide board efficiency will greatly reduced when all utilizing laser cutting, and through the combination of mechanical cutting and laser cutting, can balance the problem of fixed degree of difficulty and cutting efficiency well, both solved the problem of fixed degree of difficulty, improved branch board quality and branch board success rate, guaranteed branch board efficiency again.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.

FIG. 1 is a flow chart of a board separation method according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a daughter board, a mother board, an adhesive film layer and a vacuum adsorption platform according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a daughter board according to an embodiment of the present invention;

fig. 4 is a cutting track of the laser cutting mechanism provided by the embodiment of the invention.

In the figure:

1-a daughter board; 11-a first edge; 12-a second edge; 13-a third edge; 14-a fourth edge;

2-a mother board; 21-V-shaped grooves; 22-a first locating hole; 23-a second positioning hole;

3-an adhesive film layer;

4-vacuum adsorption platform;

10-a front pilot cutting section; 20-a body cutting section; 30-rear guide cutting section.

Detailed Description

In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only or to distinguish between different structures or components and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.

In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1 and 2, the present embodiment provides a board dividing method for cutting a plurality of small PCB boards (daughter boards 1) from a large PCB board (mother board 2). Specifically, the plate dividing method comprises the following steps:

s1, cutting partial edges of a daughter board 1 by using a mechanical cutting tool, separating the cut edges of the daughter board 1 from a mother board 2, and keeping the uncut edges connected with the mother board 2;

s2, adhering the mother board 2 to the adhesive film layer 3;

s3. the edge of the daughter board 1, which is not cut in step S1, is cut using the laser cutting mechanism, so that the daughter board 1 is completely separated from the mother board 2.

According to the board splitting method provided by the embodiment, firstly, mechanical cutting is carried out by using a mechanical cutting tool, the mechanical cutting efficiency is high, meanwhile, because only part of the edge of the daughter board 1 is cut during the mechanical cutting, the daughter board 1 is still connected with the mother board 2, and the daughter board 1 cannot move relative to the mother board 2, a special jig is not needed to be used for fixing the daughter board 1, and the cost of the jig is saved; and then, the residual edge is subjected to laser cutting by using a laser cutting mechanism, and because the laser cutting belongs to non-contact cutting, in the process of completely separating the daughter board 1 from the mother board 2, the influence of cutting acting force on the relative position between the daughter board 1 and the mother board 2 does not need to be considered, and the daughter board 1 and the mother board 2 are adhered by the adhesive film layer 3, so that the daughter board 1 and the mother board 2 can be further prevented from relatively moving, and the cutting precision is improved. Although the fixed degree of difficulty of daughter board 1 also need not to be considered in whole utilizing laser cutting, because the junction of daughter board 1 and mother board 2 contains copper, difficult cutting, and when the thickness of junction was thick, divide board efficiency when all utilizing laser cutting will greatly reduced, and through the combination of mechanical cutting and laser cutting, can balance the problem of fixed degree of difficulty and cutting efficiency well, both solved the problem of fixed degree of difficulty, improved branch board quality and branch board success rate, guaranteed branch board efficiency again.

Optionally, the mechanical cutting tool is a milling cutter. Specifically, as shown in fig. 2 and 3, in the present embodiment, the daughter board 1 and the motherboard 2 each have a rectangular shape, and a plurality of daughter boards 1 are rectangular arrayed on the motherboard 2. Wherein the mechanical cutting tool cuts a first edge 11, a second edge 12 and a third edge 13 of the daughter board 1. The laser cutting mechanism cuts the fourth edge 14 of the daughter board 1. Of course, the edges cut by the mechanical cutting tool and the laser cutting mechanism can be adjusted as long as it is ensured that the mechanical cutting tool cuts the edges of a part of the daughter boards 1 first and the laser cutting mechanism cuts the edges of the remaining daughter boards 1 later.

Preferably, as shown in fig. 2, the daughter board 1 is provided with the V-shaped groove 21 at the edge which is not cut in step S1, and the laser cutting mechanism cuts along the V-shaped groove 21 in step S3 to completely separate the daughter board 1 from the mother board 2. By arranging the V-shaped groove 21, on one hand, the cutting depth of the laser cutting mechanism can be reduced, so that the daughter board 1 is quickly and completely separated from the mother board 2, and the board separating efficiency is improved; on the other hand, the area of the cutting fracture is reduced, and the quality of the cutting fracture is guaranteed. Specifically, in the present embodiment, the sub-board 1 is provided at the fourth edge 14 with the V-shaped groove 21. Further, in order to facilitate the processing of the V-shaped groove 21 and improve the processing efficiency, the V-shaped groove 21 penetrates through the fourth edge 14 of the row of daughter boards 1.

Preferably, in step S3, several sets of cutting process parameters are preset in the laser cutting mechanism, and the cutting width in the cutting process parameters executed first is greater than the cutting width in the cutting process parameters executed later. The cutting width of the laser cutting mechanism during initial cutting is large, the cutting width during later cutting is small, the upper portion of the cutting seam is wide, waste materials or residues cut off by the laser can be discharged from the cutting seam conveniently, the laser can continue to cut downwards, and the cutting efficiency and the cutting quality of the laser are guaranteed.

Specifically, in this embodiment, two sets of cutting process parameters are preset in the laser cutting mechanism. The first set of cutting process parameters includes: the number of the laser lines is 4, the distance between two adjacent laser lines is 0.02-0.05 mm, and the cutting times are 5-20. The second set of cutting process parameters included: the number of the laser lines is 2, the distance between two adjacent laser lines is 0.002-0.008 mm, and the cutting frequency is 20-50 times. Of course, in other embodiments, the number of sets of cutting process parameters and the specific value of the parameters in each set of cutting process parameters may also be adjusted according to the thickness of the edge to be cut of the daughter board 1, which is not limited herein.

Preferably, as shown in fig. 4, in step S3, the cutting trajectory of the laser cutting mechanism includes a front guide cutting part 10, a main body cutting part 20, and a rear guide cutting part 30 in this order, wherein the length of the main body cutting part 20 is equal to the length of the edge of the sub-board 1 that is not cut in step S1. The laser cutting mechanism is stable before and after the edge of the daughter board 1 is formally cut, that is, the front guide cutting part 10 and the rear guide cutting part 30 are cut before and after the main body cutting part 20 is cut, so as to avoid the situations that the energy of the laser cutting mechanism is too large or too small at the initial cutting stage and the cutting finishing stage, or the initial segment of the galvanometer deviates, and the like, and ensure the cutting quality when the edge of the daughter board 1 is cut. Specifically, in the present embodiment, the length of the main body cutting part 20 is equal to the length of the fourth edge 14 of the sub-board 1, and the cutting of the front guide cutting part 10 and the rear guide cutting part 30 is performed before and after the cutting of the fourth edge 14, thereby ensuring the cutting quality of the fourth edge 14.

Specifically, in the present embodiment, since the sub-board 1 is rectangular, the body cut part 20 is linear. Optionally, the leading cutting portion 10 and the trailing cutting portion 30 are curved. Of course, in other embodiments, the front guide cutting part 10 and the rear guide cutting part 30 may also be a straight line having an angle with the body cutting part 20, for example, a straight line having an angle of 135 ° with the body cutting part 20.

Preferably, adhesive film layer 3 is a transparent adhesive film layer. The transparent adhesive film layer 3 is selected, so that the damage of laser to the adhesive film layer 3 can be reduced, the adhesive film layer 3 can be recycled, and the service life of the adhesive film layer 3 is prolonged. Optionally, the adhesive film layer 3 is made of a transparent PET material.

Preferably, the laser cutting mechanism is an ultraviolet laser cutting mechanism. The ultraviolet laser has the advantages of short wavelength (355nm), large single photon energy and the like, can break chemical bonds of resin materials during cutting, quickly gasifies the materials, has small heat effect, and basically has no carbonization phenomenon on the section of the cut materials. Preferably, the laser cutting mechanism is equipped with a detection module capable of detecting the thickness of the daughter board 1 and the thickness of the adhesive film layer 3, and automatically focusing accordingly.

Specifically, in the embodiment, the power of the laser cutting mechanism is 10-30W, the cutting speed is 500mm/s, and the frequency is 250 KHz. Of course, in other embodiments, the laser cutting mechanism can also be a green laser cutting mechanism with a power of 20-40W.

Preferably, in step S1, the anti-static wind knife is used to blow air to the daughter board 1, and blow the dust generated by cutting to the dust collection mechanism, and the dust generated by cutting is collected by the dust collection mechanism, so as to prevent the daughter board 1 from being polluted by the dust and ensure the production quality. Of course, in step S3, dust removal may be performed by this method.

Preferably, before step S1, the method further includes: s11, fixing the mother board 2 on a mechanical cutting platform, detecting a difference value between the actual position and a preset position of the mother board 2 by using a first visual positioning mechanism, if the difference value is larger than the preset value, compensating the difference value by using a mechanical cutting tool, and then executing the step S1, and if the difference value is smaller than or equal to the preset value, directly executing the step S1 by using the mechanical cutting tool. Fix motherboard 2 on mechanical cutting platform, be favorable to preventing that motherboard 2 from taking place to remove in mechanical cutting process, guarantee the stability in motherboard 2 position to be favorable to improving cutting accuracy. The detection and the positioning of the position of the template 2 through the first visual positioning mechanism and the compensation of the difference value by the mechanical cutting tool are favorable for further improving the cutting precision.

Alternatively, in the present embodiment, the first visual alignment mechanism determines the difference between the actual position of the mother substrate 2 and the preset position by detecting the position of the second alignment hole 23 of the first alignment hole 22 on the mother substrate 2. Specifically, in the present embodiment, the first visual positioning mechanism includes a color CCD camera.

Preferably, between steps S2 and S3, further comprising: and S31, adsorbing and fixing the adhesive film layer 3 by using the vacuum adsorption platform 4. After the mother substrate 2 is adhered to the adhesive film layer 3, the mother substrate 2 and the adhesive film layer 3 may be put together on the vacuum adsorption stage 4 by a robot. When the vacuum adsorption platform 4 generates negative pressure adsorption, the adhesive film layer 3 can be smoothly and firmly fixed on the vacuum adsorption platform 4, and meanwhile, the mother board 2 can also be stably and firmly fixed on the vacuum adsorption platform 4. Alternatively, the effective suction area of the vacuum suction platform 4 is equal to the area of the adhesive film layer 3.

Preferably, after step S31 and before step S3, the method further comprises: and S32, detecting a difference value between the actual position and the preset position of the mother board 2 by using the second visual positioning mechanism, if the difference value is larger than the preset value, compensating the difference value by using the laser cutting mechanism, and then executing the step S3, and if the difference value is smaller than or equal to the preset value, directly executing the step S3 by using the mechanical cutting tool. The detection and the positioning of the position of the template 2 by the second visual positioning mechanism and the compensation of the difference value by the laser cutting mechanism are favorable for improving the precision of laser cutting.

Alternatively, in the present embodiment, the second visual alignment mechanism determines the difference between the actual position of the mother substrate 2 and the preset position by detecting the positions of the first alignment hole 22 and the second alignment hole 23 on the mother substrate 2. Specifically, in the present embodiment, the second visual positioning mechanism includes a color CCD camera.

Further, after step S3, the method further includes: s4, the mother board 2 is removed from the adhesive film layer 3. After step S3 is completed, that is, after the daughter board 1 is completely separated from the mother board 2, the vacuum suction platform 4 may be desorbed, and the mother board 2 and the adhesive film layer 3 may be placed on the next stage by using the robot, and then the mother board 2 is removed from the adhesive film layer 3, so that the plurality of daughter boards 1 may be independently and constantly adhered to the adhesive film layer 3. In order to easily remove the mother substrate 2 from the adhesive film layer 3, in the present embodiment, the peeling force of the adhesive film layer 3 is 20 to 40g/inch, and the thickness of the adhesive material on the adhesive film layer 3 is 60 to 100 μm.

It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A method of splitting a panel, comprising:

s1, cutting partial edges of a daughter board (1) by using a mechanical cutting tool, separating the cut edges of the daughter board (1) from a mother board (2), and keeping the uncut edges connected with the mother board (2);

s2, adhering the mother board (2) to an adhesive film layer (3);

s3, cutting the uncut edge of the daughter board (1) in the step S1 by using a laser cutting mechanism, so that the daughter board (1) is completely separated from the mother board (2).

2. The board splitting method according to claim 1, wherein the daughter board (1) is provided with a V-shaped groove (21) at an edge which is not cut in step S1, and the laser cutting mechanism cuts along the V-shaped groove (21) in step S3 to completely separate the daughter board (1) from the mother board (2).

3. The board splitting method according to claim 1, wherein in step S3, a plurality of sets of cutting process parameters are preset in the laser cutting mechanism, and a cutting width of the cutting process parameters executed first is greater than a cutting width of the cutting process parameters executed later.

4. The board splitting method according to claim 1, wherein in step S3, the cutting trajectory of the laser cutting mechanism comprises a front guide cutting part (10), a main body cutting part (20), and a rear guide cutting part (30) in this order, wherein the length of the main body cutting part (20) is equal to the length of the edge of the sub-board (1) that is not cut in step S1.

5. The method of claim 1, wherein the adhesive film layer (3) is a transparent adhesive film layer.

6. The plate splitting method according to claim 1, wherein the laser cutting mechanism is an ultraviolet laser cutting mechanism.

7. The board splitting method according to claim 1, wherein in step S1, the sub board (1) is blown by an antistatic air knife, and dust generated by cutting is blown to a dust suction mechanism, and the dust generated by cutting is collected by the dust suction mechanism.

8. The board splitting method according to claim 1, further comprising, before step S1:

s11, fixing the mother board (2) on a mechanical cutting platform, detecting a difference value between the actual position and a preset position of the mother board (2) by using a first visual positioning mechanism, if the difference value is larger than a preset value, performing S1 after compensating the difference value by using the mechanical cutting tool, and if the difference value is smaller than or equal to the preset value, directly performing S1 by using the mechanical cutting tool.

9. The board splitting method according to claim 1, further comprising, between steps S2 and S3:

and S31, adsorbing and fixing the adhesive film layer (3) by using a vacuum adsorption platform (4).

10. The board splitting method according to claim 9, further comprising, after the step S31 and before the step S3:

s32, detecting a difference value between the actual position and a preset position of the mother board (2) by using a second visual positioning mechanism, if the difference value is larger than the preset value, compensating the difference value by using the laser cutting mechanism, and then executing the step S3, and if the difference value is smaller than or equal to the preset value, directly executing the step S3 by using the mechanical cutting tool.