CN111562087A - Chip luminous performance test equipment, loading mechanism and chip fixing device thereof - Google Patents
Chip luminous performance test equipment, loading mechanism and chip fixing device thereof Download PDFInfo
- Publication number
- CN111562087A CN111562087A CN201910112859.4A CN201910112859A CN111562087A CN 111562087 A CN111562087 A CN 111562087A CN 201910112859 A CN201910112859 A CN 201910112859A CN 111562087 A CN111562087 A CN 111562087A
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- Prior art keywords
- chip
- carrier plate
- cooling structure
- cooling
- plate
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- 238000011056 performance test Methods 0.000 title claims description 9
- 238000001816 cooling Methods 0.000 claims abstract description 93
- 238000012360 testing method Methods 0.000 claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 31
- 238000004020 luminiscence type Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 abstract description 8
- 238000009434 installation Methods 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/82—Rotary or reciprocating members for direct action on articles or materials, e.g. pushers, rakes, shovels
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- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses a chip luminous performance testing device, a feeding mechanism and a chip fixing device, wherein the chip fixing device comprises: the chip testing device comprises a chip carrier plate, a plurality of chip placing positions and a plurality of testing chips, wherein the mounting surface of the chip carrier plate is provided with the chip placing positions; the cooling structure is fixedly arranged on one side of the chip carrier plate, which is far away from the mounting surface, and is used for cooling the chip carrier plate; the carrier plate connector is laterally arranged on the cooling structure and can push the cooling structure to linearly move in a preset direction; the chip carrier plate is fixedly arranged on one side, far away from the cooling structure, of the chip carrier plate, a plurality of through holes are formed in the chip carrier plate, and the through holes correspond to the chip placing positions in a one-to-one correspondence mode. Through the design of the chip fixing device, the chip can be reliably and stably clamped in the process of testing the luminous performance of the chip.
Description
Technical Field
The invention relates to the technical field of chip performance test equipment, in particular to a chip fixing device of a feeding mechanism of chip luminous performance test equipment. The invention also relates to a feeding mechanism comprising the chip fixing device and a chip luminous performance testing device comprising the feeding mechanism.
Background
At present, the application market of semiconductor laser chips is more and more extensive, but the use conditions of the semiconductor laser chips are more and more rigorous, and the reliability requirement is higher and higher. Among many parameters of the laser chip, the luminescence performance of the chip is undoubtedly important, and if the luminescence performance does not meet the optical requirement, the performance of the product is reduced and even the product is invalid, so that the chip needs to be accurately and effectively detected by using a test device for the luminescence performance of the chip. In the process of testing the luminescence property of the chip, how to reliably clamp the chip and meet the requirements for position adjustment and cooling in the test becomes a problem to be solved by those skilled in the art.
Disclosure of Invention
The present invention is directed to solving at least one of the problems set forth above, and the object is achieved by the following means.
The invention provides a chip fixing device, which is used for a feeding mechanism of a chip luminous performance testing device and comprises:
the chip testing device comprises a chip carrier plate, a plurality of chip placing positions and a plurality of testing chips, wherein the mounting surface of the chip carrier plate is provided with a plurality of chip placing positions, and the chips to be tested are placed in the chip placing positions in a one-to-one correspondence manner and are respectively and electrically connected with the chip carrier plate;
the cooling structure is fixedly arranged on one side, far away from the mounting surface, of the chip carrier plate and is used for cooling the chip carrier plate;
the loading plate connector is laterally arranged on the cooling structure and can push the cooling structure to linearly move in a preset direction;
the chip carrier plate is fixedly arranged on one side, far away from the cooling structure, of the chip carrier plate, a plurality of through holes are formed in the chip carrier plate, and the through holes correspond to the chip placement positions in a one-to-one correspondence mode.
In the working process, a chip to be tested is placed on a chip carrier plate, a cooling structure is arranged below the chip carrier plate, a carrier plate fixing plate is arranged above the chip carrier plate, and from top to bottom, the carrier plate fixing plate, the chip carrier plate and the cooling structure are arranged in a stacked mode and fixedly connected; the chip carrier plate connector is arranged on the lateral side of the cooling structure, and can push the cooling structure to move linearly along a preset direction, so that the chip carrier plate and the chips on the chip carrier plate are pushed to move synchronously, and the chips to be tested are driven to be in a proper testing position. Like this, through the design of this chip fixing device, can carry out reliable, stable clamping to the chip at the in-process of chip luminous performance test to through wherein cooling structure and carry the setting of board connector, can satisfy the chip in the test to position adjustment and refrigerated demand, provide guarantee and basis for chip luminous performance test.
Furthermore, a plurality of groove bodies are formed in the mounting surface of the chip carrier plate, the groove bodies form the chip placing positions, and the chips to be tested are placed in the groove bodies in a one-to-one correspondence mode.
Further, the cooling structure is a water cooling block, a cooling pipeline is arranged in the water cooling block, and a water inlet and a water outlet of the cooling pipeline are both arranged on the side wall of the water cooling block.
Furthermore, a fixing pile is arranged on the surface of the water cooling block facing the chip carrier plate, a mounting hole is formed in the surface of the chip carrier plate facing the water cooling block, and the fixing pile is inserted into the mounting hole.
Furthermore, the number of the fixing piles and the number of the mounting holes are multiple, and the fixing piles are fixedly connected in the mounting holes in a one-to-one correspondence manner.
Furthermore, the carrier plate connector comprises a driving piece, a guide rod and a push plate, and a through hole is formed in the side wall of the cooling structure;
the guide rod is slidably arranged in the through hole, and one end of the guide rod, which is positioned outside the through hole, is fixedly connected with the push plate;
the push plate moves towards the direction close to or away from the cooling structure under the driving of the driving piece so as to push the cooling structure to move along the guide rod.
Further, the guide rod comprises a first guide rod and a second guide rod, the first guide rod is located on one side of the push plate, and the second guide rod is located on the other side of the push plate.
Furthermore, the driving piece is mounted on the first guide rod and/or the second guide rod, the driving piece is an adjusting nut in threaded connection with the first guide rod and/or the second guide rod, and the guide rail without the driving piece is a linear bearing.
The invention also provides a feeding mechanism, which comprises a base and a chip fixing device arranged on the base, wherein the chip fixing device is the chip fixing device.
The invention also provides a chip luminescence property testing device which comprises the feeding mechanism or the chip fixing device.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
fig. 1 is a schematic structural diagram of a specific embodiment of a chip fixing device provided in the present invention.
Description of the reference numerals
1-chip carrier plate 2-water cooling block 3-carrier plate connector 4-carrier plate fixing plate
11-trough body
21-fixing pile
31-driving piece 32-first guide rod 33-second guide rod 34-push plate
41-through hole
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a specific embodiment of a chip fixing device provided in the present invention.
In a specific embodiment, the chip fixing device provided by the invention is used for a feeding mechanism of a chip luminescence performance testing device, and particularly can be used for a vcsel laser chip (chip in the 3D sensing field) luminescence performance testing device which is mainly used for testing optical performance of the vcsel laser chip such as light intensity, power, divergence angle and the like of laser.
The chip fixing device comprises a chip carrier plate 1, a cooling structure, a carrier plate connector 3 and a carrier plate fixing plate 4. The mounting surface of the chip carrier plate 1 is provided with a plurality of chip placing positions, and the chips to be tested are correspondingly placed in the chip placing positions one by one and are respectively and electrically connected with the chip carrier plate 1. Specifically, the chips are attached to the chip carrier plates 1 by silver paste, each chip carrier plate 1 is generally provided with about 40 chip placement positions, and then the conductive electrodes of the chips and the electrodes of the carrier plates are fixed by silver wires by a wire bonder so as to realize the electrical connection between the chips and the chip carrier plates 1. The number and arrangement of the chip placement positions can be determined according to actual requirements, and are not limited to 40 placement positions, nor the rectangular arrangement shown in fig. 1.
The cooling structure is fixedly installed on one side of the chip carrier plate 1 away from the installation surface, and is used for cooling the chip carrier plate 1, in this embodiment, the installation surface where the chip installation position of the chip carrier plate 1 is located is upward, and the cooling structure is located below the chip carrier plate 1.
The carrier plate connector 3 is laterally installed on the cooling structure and can push the cooling structure to linearly move in a preset direction, and the lateral direction of the cooling structure refers to the direction which is connected with the installation surface and is vertical to the installation surface.
A carrier plate fixing plate 4 is fixedly mounted on a side of the chip carrier plate 1 away from the cooling structure, that is, covers the mounting surface of the chip carrier plate 1, obviously, a plurality of through holes 41 should be formed in the carrier plate fixing plate 4, and these through holes 41 correspond to the chip placement positions on the chip carrier plate 1 in a one-to-one correspondence manner and are used for exposing the chip placement positions and the chips to be tested placed thereon.
In the working process, a chip to be tested is placed on the chip carrier plate 1, the cooling structure is arranged below the chip carrier plate 1, the carrier plate fixing plate 4 is arranged above the chip carrier plate 1, and from top to bottom, the carrier plate fixing plate 4, the chip carrier plate 1 and the cooling structure are stacked and fixedly connected; the carrier connector 3 is disposed laterally of the cooling structure and can push the cooling structure to move linearly along a predetermined direction, so as to push the chip carrier 1 and the chips on the chip carrier 1 to move synchronously, so as to drive the chips to be tested to be in a proper testing position. Like this, through the design of this chip fixing device, can carry out reliable, stable clamping to the chip at the in-process of chip luminous performance test to through wherein cooling structure and carry board connector 3's setting, can satisfy the chip in the test to position adjustment and refrigerated demand, provide guarantee and basis for chip luminous performance test.
When a chip to be tested is placed on a chip carrier, in order to ensure the position stability, a plurality of groove bodies 11 can be arranged on the installation surface of the chip carrier plate 1, the groove bodies 11 form the chip placing positions, and the chips to be tested are placed in the groove bodies 11 in a one-to-one correspondence manner so as to limit the chips to be tested through the groove bodies 11.
Theoretically, the slot 11 should be slightly larger than the chip size, and when the chip fixing board is disposed, the slot 11 can be enclosed by the through hole 41 of the chip fixing board and the mounting surface of the chip carrier board 1.
Specifically, the cooling structure is a water cooling block 2, a cooling pipeline is arranged in the water cooling block 2, a water inlet and a water outlet of the cooling pipeline are both arranged on the side wall of the water cooling block 2, in the working process, the water inlet of the cooling pipeline is communicated with a cooling water source, and the water outlet of the cooling pipeline is communicated with a heat exchanger or a recoverer, so that cooling circulation is realized.
The cooling pipeline can be in a coiled pipe form, so that the water cooling block 2 can be cooled within the plate surface range; the cooling pipeline can also be replaced by a cooling cavity, namely the inside of the whole water cooling block 2 is the cooling cavity, and the side wall of the water cooling block 2 is provided with a water inlet and a water outlet which are communicated with the cooling cavity.
In addition to the water cooling system, other air cooling systems such as medium cooling and compressor cooling may be employed, and the water cooling system and the corresponding water cooling block 2 are preferably employed in view of cost and installation space.
In order to ensure the installation reliability and the structural stability of the water cooling block 2 and the chip carrier plate 1, a fixing pile 21 may be disposed on the surface of the water cooling block 2 facing the chip carrier plate 1, a mounting hole is disposed on the surface of the chip carrier plate 1 facing the water cooling block 2, and the fixing pile 21 is inserted into the mounting hole. Specifically, the number of the fixing piles 21 and the number of the mounting holes are multiple, and the fixing piles 21 are fixedly connected in the mounting holes in a one-to-one correspondence manner.
Obviously, other structures for fixing and connecting the water-cooling block 2 and the chip carrier 1 may also be used, for example, a screw connection or a slide block connection.
Further, the board-loading connector 3 includes a driving member 31, a guide rod and a push plate 34, and a through hole 41 is formed in a side wall of the cooling structure; the guide rod is slidably mounted in the through hole 41, and one end of the guide rod, which is located outside the through hole 41, is fixedly connected with the push plate 34; the push plate 34 is driven by the driving member 31 to move towards or away from the cooling structure so as to push the cooling structure to move along the guide rod. In the working process, when the position of the chip needs to be adjusted, the driving member 31 applies a driving force to the pushing plate 34, and the pushing plate 34 moves in a direction close to the cooling structure and pushes the cooling structure, thereby driving the chip carrier 1 fixedly connected with the cooling structure and the chip on the chip carrier 1 to move synchronously.
The guide rods comprise a first guide rod 32 and a second guide rod 33, the first guide rod 32 is located on one side of the push plate 34, the second guide rod 33 is located on the other side of the push plate 34, the driving piece 31 is installed on the first guide rod 32 and/or the second guide rod 33, the driving piece 31 is an adjusting nut in threaded connection with the first guide rod 32 and/or the second guide rod 33, and a guide rail on which the driving piece 31 is not installed is a linear bearing.
In this embodiment, the first guide rod 32 slidably passes through the cooling structure, the second guide rod 33 is a linear bearing, which slidably passes through the cooling structure and has an end provided with an adjusting nut, and when position adjustment is required, the adjusting nut is rotated to move the position of the adjusting nut on the second guide rod 33, so as to push the push plate 34 to move, thereby driving the push plate 34.
Theoretically, the driving member 31 may be a telescopic cylinder or the like as long as it can provide a force for the push plate 34 to slide along the guide rail, and the preset direction of the movement of the push plate 34 is the extending direction of the guide rod.
In addition to the chip fixing device, the present invention further provides a feeding mechanism including the chip fixing device, and a chip light emitting performance testing apparatus including the feeding mechanism, and other structural parts of the feeding mechanism and other structural parts of the chip light emitting performance testing apparatus, which have no influence on the implementation of the technical effects of the present invention, and thus are not described in detail.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The utility model provides a chip fixing device for chip luminous performance test equipment's feed mechanism, its characterized in that includes:
the test device comprises a chip carrier plate (1), wherein a plurality of chip placing positions are formed in the mounting surface of the chip carrier plate (1), and chips to be tested are placed in the chip placing positions in a one-to-one correspondence manner and are respectively and electrically connected with the chip carrier plate (1);
the cooling structure is fixedly arranged on one side, away from the mounting surface, of the chip carrier plate (1) and is used for cooling the chip carrier plate (1);
the carrying plate connector (3), the carrying plate connector (3) is laterally installed on the cooling structure, and can push the cooling structure to move linearly in a preset direction;
the chip cooling structure comprises a carrier plate fixing plate (4), wherein the carrier plate fixing plate (4) is fixedly arranged on one side, away from the cooling structure, of the chip carrier plate (1), a plurality of through holes (41) are formed in the carrier plate fixing plate (4), and the through holes (41) correspond to chip placing positions in a one-to-one correspondence mode.
2. The chip fixing device according to claim 1, wherein a plurality of grooves (11) are formed in the mounting surface of the chip carrier plate (1), the grooves (11) form the chip placing positions, and the chips to be tested are placed in the grooves (11) in a one-to-one correspondence manner.
3. The chip fixing device according to claim 1, wherein the cooling structure is a water cooling block (2), a cooling pipeline is arranged in the water cooling block (2), and a water inlet and a water outlet of the cooling pipeline are both arranged on the side wall of the water cooling block (2).
4. The chip fixing device according to claim 3, wherein a fixing pile (21) is disposed on a surface of the water-cooling block (2) facing the chip carrier plate (1), a mounting hole is disposed on a surface of the chip carrier plate (1) facing the water-cooling block (2), and the fixing pile (21) is inserted into the mounting hole.
5. The chip fixing device according to claim 4, wherein the number of the fixing posts (21) and the mounting holes is plural, and each fixing post (21) is fixedly connected in each mounting hole in a one-to-one correspondence manner.
6. The die holding apparatus according to claim 1, wherein the carrier connector (3) comprises a driving member (31), a guide rod and a push plate (34), and a through hole (41) is formed in a side wall of the cooling structure;
the guide rod is slidably arranged in the through hole (41), and one end of the guide rod, which is positioned outside the through hole (41), is fixedly connected with the push plate (34);
the push plate (34) moves towards or away from the cooling structure under the driving of the driving piece (31) to push the cooling structure to move along the guide rod.
7. The die attach apparatus of claim 6, wherein the guide rods comprise a first guide rod (32) and a second guide rod (33), the first guide rod (32) being located on one side of the pusher (34), the second guide rod (33) being located on the other side of the pusher (34).
8. The die attach apparatus according to claim 7, wherein the driving member (31) is mounted on the first guide bar (32) and/or the second guide bar (33), the driving member (31) is an adjusting nut threadedly coupled to the first guide bar (32) and/or the second guide bar (33), and the guide rail on which the driving member (31) is not mounted is a linear bearing.
9. A loading mechanism comprising a base and a die attachment device mounted on the base, the die attachment device being as claimed in any one of claims 1 to 8.
10. A chip luminescence property testing apparatus, comprising the loading mechanism according to claim 9, or comprising the chip fixing device according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910112859.4A CN111562087A (en) | 2019-02-13 | 2019-02-13 | Chip luminous performance test equipment, loading mechanism and chip fixing device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910112859.4A CN111562087A (en) | 2019-02-13 | 2019-02-13 | Chip luminous performance test equipment, loading mechanism and chip fixing device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111562087A true CN111562087A (en) | 2020-08-21 |
Family
ID=72071339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910112859.4A Pending CN111562087A (en) | 2019-02-13 | 2019-02-13 | Chip luminous performance test equipment, loading mechanism and chip fixing device thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111562087A (en) |
-
2019
- 2019-02-13 CN CN201910112859.4A patent/CN111562087A/en active Pending
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Effective date of registration: 20231206 Address after: Room 717, building 3, 111 Xiangke Road, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai, 200120 Applicant after: Shanghai filai Testing Technology Co.,Ltd. Address before: Room 310-7, No. 1019 Donghai Road, Binhai Zhongguancun Science and Technology Park, Binhai New Area, Tianjin, 300381 Applicant before: TIANJIN FEILAI TECHNOLOGY Co.,Ltd. |