CN111562024A - Transient high-temperature field heat flux measuring device and method based on memory alloy - Google Patents
Transient high-temperature field heat flux measuring device and method based on memory alloy Download PDFInfo
- Publication number
- CN111562024A CN111562024A CN202010437287.XA CN202010437287A CN111562024A CN 111562024 A CN111562024 A CN 111562024A CN 202010437287 A CN202010437287 A CN 202010437287A CN 111562024 A CN111562024 A CN 111562024A
- Authority
- CN
- China
- Prior art keywords
- memory alloy
- temperature field
- transient high
- sliding block
- thermosensitive element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K5/00—Measuring temperature based on the expansion or contraction of a material
- G01K5/48—Measuring temperature based on the expansion or contraction of a material the material being a solid
- G01K5/483—Measuring temperature based on the expansion or contraction of a material the material being a solid using materials with a configuration memory, e.g. Ni-Ti alloys
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K17/00—Measuring quantity of heat
Abstract
The invention discloses a transient high-temperature field heat flux measuring device and method based on memory alloy, and aims to overcome the defects that the existing measuring method is greatly influenced by the emissivity of a measured object, has insufficient response speed and the like. The measuring device comprises a packaging shell, a thermosensitive element, a memory alloy component, a sliding block, a fixed base, a movable bolt and a screw, wherein the packaging shell, the thermosensitive element, the memory alloy component, the sliding block and the fixed base are coaxially arranged. The temperature of the thermosensitive element rises under the action of heat carried by the transient temperature high-temperature field, the heat is transferred to the memory alloy component, and the memory alloy component is heated and contracted to drive the sliding block to move. After the transient high-temperature field is loaded, the axial shortening of the memory alloy component is obtained according to the displacement of the sliding block, and the passive quantitative measurement of the heat flux of the transient high-temperature field can be realized by combining the loading time. The invention has the advantages of simple structure, no need of power supply, convenient layout, low cost, repeated use and high response sensitivity to transient high-temperature fields with different strengths.
Description
Technical Field
The invention belongs to the field of measurement and detection, and particularly relates to a method and a device for measuring heat flux of a transient high-temperature field, in particular to a method and a device for measuring heat flux of a transient high-temperature field by utilizing the plastic deformation characteristic generated by heating a memory alloy.
Background
At present, with the development of scientific technology, a transient high temperature field (the transient high temperature field means that the existing time of the high temperature field is in the order of seconds or even milliseconds) is often formed in some application scenes, such as explosive explosion, gas explosion and mine blasting, and under these circumstances, measuring the heat flux of the transient high temperature field formed thereby has important significance for practical application, so that the related research aiming at the measurement of the heat flux of the transient high temperature field is becoming a research hotspot.
According to the relation between the temperature detecting element and the target high temperature field during measurement, the temperature is measured in a contact mode and a non-contact mode. The non-contact temperature measurement mainly comprises: infrared radiation thermometry, fluorescence thermometry, dual-spectral thermometry, and the like. The infrared radiation thermometry method can be divided into a full radiation thermometry method, a monochromatic method, a dual-band thermometry method, a multi-band thermometry method and the like. The full radiation thermometry and the monochromatic method are used for determining the temperature of an object by a blackbody calibration instrument according to the total radiation power of the object with the measurement wavelength ranging from zero to infinity in the whole spectral range; however, the method is greatly influenced by the emissivity of the measured object, and an ideal result is difficult to obtain in the actual temperature measurement, so that the method is less applied to the actual temperature measurement. Dual and multi-band temperature sensing is based on measuring two (or more) given wavelengths lambda1And λ2The temperature of the object is determined by a blackbody calibration instrument, and the method is suitable for measuring emissivity change or unknown objects, but only suitable for measuring radiationHigh temperature objects with high energy density are shot. Fluorescence temperature measurement is realized by adopting the intensity ratio or the fluorescence lifetime of fluorescence emitted by excited fluorescent substances. The sensor used for fluorescence temperature measurement has small volume, no metal material, complete electrical insulation, no influence of high voltage and strong electromagnetic field, chemical corrosion resistance and no pollution; however, the temperature measurement method cannot adapt to transient measurement of a transient high-temperature field, and the sensor has a narrow measurement view range and is easily affected by various factors (for example, the high-temperature field carries fire). According to the double-spectral-line temperature measurement method, according to the atomic emission spectrum theory, when excited atoms transit from a high energy level to a low energy level, a specific atomic spectrum is generated, and energy is radiated in the form of light.
The contact type temperature measurement method mainly comprises a pressure type temperature measurement method, an optical fiber temperature measurement method, a thermoelectric type temperature measurement method and the like. When the temperature is measured in a contact mode, the temperature detection element is required to be in direct contact with a target, the sensor can generate heat conduction, and according to the thermodynamic equilibrium law, the detection element can output an electric signal when the cold end and the hot end are balanced; the contact temperature measurement mainly uses heat conduction and heat exchange, and is obtained by a first thermodynamic law, and the temperature of a detection element can be regarded as the temperature of a measured medium when the temperature reaches thermal equilibrium; the greatest advantage of the contact temperature measurement method is that the operation is simple, intuitive and visible. However, the temperature measurement principle of the contact temperature measurement method is based on the thermal equilibrium phenomenon, that is, the temperature sensor needs to be in full contact with the measured object to achieve thermal equilibrium. The response speed of the temperature measuring method is limited due to the existence of the heat transfer process with the measured object in the temperature measuring process of the contact temperature measuring method; meanwhile, the high-temperature field to be measured is interfered due to the contact with the object to be measured.
In summary, the existing measurement method at least has the following technical problems:
1. the existing non-contact temperature measurement method has the problems that the influence of the emissivity of a measured object is large, the influence of other factors is easy to cause, the measured temperature is the surface temperature of an object, the measurement error is easy to cause by surrounding media, and the like, and the heat flux of a transient high-temperature field cannot be accurately measured.
2. The existing contact temperature measurement method has the problems of insufficient response speed, interference of a measured high-temperature field caused by contact with a measured object and the like, and the measurement result has errors.
In fact, the measurement of the heat flux of the transient high temperature field can be obtained by deformation measurement of some materials with better heat deformation performance, for example, some memory alloy materials are ideal heat deformation materials. The one-way memory alloy is heated to generate unrecoverable plastic deformation and generate corresponding shrinkage, and the method converts the heat of the transient high-temperature field into self quantitative plastic deformation. The existing research shows that through reasonable design, the thermal deformation of the memory alloy is stable and controllable, and the memory alloy is a thermal deformation element with excellent performance. In addition, on the technical index, the heat absorbed by the memory alloy in a certain range and the plastic deformation of the memory alloy in the thermal deformation process form a determined functional relationship, and the heat-deformation quantity corresponds to the characteristic, so that the memory alloy can be used for quantitative measurement of heat. The shape of the memory alloy is generally in a spring shape, and memory alloy structures with different diameters and lengths can form measuring structures with different specifications and different heat-deformation quantity accurate correspondence, so that the transient high-temperature fields with different strengths can be accurately measured. Meanwhile, the transient high-temperature field heat flux measuring sensor device which is stable in structure, reliable in performance and capable of being stored and used for a long time can be manufactured by selecting materials with stable performance and corrosion resistance to manufacture the memory alloy structure.
Although the prior art patent publication CN1323981, "temperature sensor using shape memory alloy and manufacturing method thereof", reports a method of measuring temperature using deformation characteristics of memory alloy, the document only describes a temperature measuring method of a constant temperature field, and does not describe a measuring method of a heat flux of a transient high temperature field.
At present, no device and method for measuring the heat flux of the transient high-temperature field by adopting the deformation characteristic of the memory alloy are reported.
Disclosure of Invention
The invention provides a passive measuring device and a passive measuring method for transient high-temperature field heat flux based on one-way memory alloy plastic deformation, which solve the problems that the existing non-contact temperature measuring method is greatly influenced by the emissivity of a measured object and is easily influenced by other factors, the measured temperature is the surface temperature of an object, and the surrounding medium easily causes measuring errors and the like; the defects that the response speed is insufficient and the contact with a measured object generates the interference of a measured high-temperature field in the existing contact temperature measurement method are overcome. The sensor has the characteristics of simple structure, low cost, strong anti-interference capability, quick layout, convenient post-result processing, high measurement precision and the like, can be used for measuring the heat flux of the transient high-temperature field with different strength grades, and provides a new reference selection for measuring the heat flux of the transient high-temperature field. The provided measuring method is not influenced by the emissivity of the measured object, has small measuring error and high response speed, and is not interfered by the measured high-temperature field.
The invention utilizes the plastic deformation of the memory alloy to quantitatively convert the heat flux into the quantitative plastic deformation of the memory alloy, thereby realizing the rapid quantitative passive measurement of the heat flux in the transient high-temperature field.
The invention relates to a transient high-temperature field heat flux measuring device based on memory alloy, which consists of a packaging shell, a thermosensitive element, a memory alloy component, a sliding block, a fixed base, a movable bolt and a screw. The end of the invention close to the thermosensitive element is defined as the right end, and the end of the invention far away from the thermosensitive element is defined as the left end. The memory alloy component and the sliding block are positioned in the packaging shell, the thermosensitive element is fixed at the right end of the packaging shell through screws to package the right end face of the packaging shell, and the fixed base is fixed at the left end of the packaging shell through a movable bolt. The thermosensitive element, the memory alloy member and the slider are coaxially mounted. The right end and the left end of the memory alloy component are respectively connected with the thermosensitive element and the sliding block through cementing agents.
The packaging shell is cylindrical and has an outer diameter D1Satisfies 0.01m<D1<0.5m, wall thickness t1Satisfies 0.001m<t1<0.2m, inner diameter d1Satisfy d1＝D1-2t1Length L of1Satisfies 0.01m<L1<2 m; 4 screw holes are processed on the right end face of the packaging shell, and the distance r between the center of each screw hole and the center of the circle of the end face of the packaging shell1Satisfy r1＝(D1+d1) /4, screw hole diameter phi1Satisfies 0.005m<φ1<t1Depth of screw hole l1Satisfies 0.002m<l1<0.1 m. The packaging shell fixes the thermosensitive element on the right end face through a screw and a screw hole. The inner wall and the outer wall of the packaging shell are both stuck with heat insulation layers (the surface of the heat insulation layer is required to be smooth, and the heat conductivity coefficient is lower than 0.018W/(K.m)), so that the inside and the outside of the packaging shell do not have heat exchange, and the purpose of heat insulation is achieved. The package housing carries a slider and ensures that the slider can slide freely and frictionlessly within the package housing (coefficient of friction μ between slider and package housing)<0.05). The packaging shell is made of metal materials or organic glass and the like, and the required materials meet the following requirements: yield strength sigma1>100MPa, density rho1>1g/cm3The basic principle is that the package housing does not deform plastically when subjected to external impact.
The thermosensitive element is a circular thin sheet and is used for bearing external impact load and transferring heat of the transient high-temperature field. Diameter of heat-sensitive element D1Thickness t2Satisfies 0.001m<t2<0.1m, thickness t2Can be adjusted according to actual measurement requirements, namely t is t when the impact carried in a transient high-temperature place is larger2The larger. For example, when the impact carried by a transient high-temperature place is explosion impact, the thickness can be adjusted, and the thermosensitive element is prevented from generating plastic deformation under the impact; the left end face of the thermosensitive element is processed with 4 screw through holes, the positions of the 4 screw through holes correspond to the positions of 4 screw holes processed on the right end face of the packaging shell, and the diameter of the screw through hole is equal to phi1. Two end faces of the thermosensitive element are parallel and vertical to the central axis of the packaging shell, so that the thermosensitive element can uniformly transfer heat. The thermosensitive element is fixed at the right end of the packaging shell through a screw and a screw through hole; the thermosensitive element is made of hard alloy materials, the materials meet the principle that the thermosensitive element does not generate plastic deformation under the action of external impact, and the materials meet the following requirements: yield strength sigma2>200MPa, density rho2>2.0g/cm3. The thermosensitive element is fixed and disassembled by screws, so that a new memory alloy component can be reloaded to realize the sensorIs reused.
The memory alloy member is spring-shaped, the spring diameter D3Satisfies 0.01m<D3<d1Length L of memory alloy member3Satisfies 0.005m<L3<1 m; thickness of the spring (i.e. the diameter of the wire from which the spring is made) d3Satisfies 0.01m<d3<0.001m, number of turns n of spring3Satisfies 5<n3<50. The memory alloy component is made of one-way memory alloy (the one-way memory alloy means that the memory alloy generates shortened unrecoverable plastic deformation when being heated and does not generate extension after being cooled again, the concept is corresponding to the two-way memory alloy, namely, the memory alloy can be cooled after being heated and the length is firstly shortened and then extended), the memory alloy component generates unrecoverable plastic deformation when being heated and is obviously shortened in the axial direction; in actual use, two ends of the memory alloy component are respectively connected with the thermosensitive element and the sliding block by adopting cementing agent. The material of the memory alloy component is required to meet the following requirements: yield strength sigma3<1000MPa, density rho3<10.0g/cm3。
The slide block is a circular thin plate with a diameter d1Satisfy d1＝D1-2t1Thickness t4Satisfies 0.001m<t4<0.1 m. The left end face and the right end face of the sliding block are adhered with heat insulation layers (the surfaces of the heat insulation layers are required to be smooth, and the heat conductivity coefficient is lower than 0.018W/(K.m)) so as to reduce heat exchange at two sides of the sliding block; the two end surfaces of the sliding block are parallel and vertical to the central axis of the packaging shell, the outer side surface of the sliding block is smooth and can freely slide without friction (the friction coefficient is mu) in the packaging shell<0.05). The sliding block is made of alloy materials, and the required materials meet the following requirements: yield strength sigma4<1000MPa, density rho4<10.0g/cm3. Dig on the terminal surface of slider and had first disappointing hole, first disappointing hole is the through-hole, evenly distributed, and quantity is 2 ~ 20, and the diameter phi of single first disappointing hole4Satisfies 0.05d1<φ4<0.1d1The total area of the air leakage holes reaches 2% -50% of the area of one end face of the sliding block, so that air on the right side of the sliding block can be smoothly discharged from right to left, and the sliding of the sliding block in the packaging shell is not influenced.
The fixed base is roundSheet, diameter D5Satisfies D1<D5<1.2D1Thickness t5Satisfies 0.001m<t5<0.1 m. The fixed base is made of hard alloy, and the required materials meet the following requirements: yield strength sigma5>200MPa, density rho5>2.0g/cm3The fixed base is required not to be plastically deformed under the action of external impact. The fixed base is fixed on the left end face of the packaging shell through a movable bolt and used for fixing the packaging shell. The fixed base is dug with second air release holes which are through holes and are uniformly distributed, the number of the second air release holes is 5-50, and the diameter phi of each second air release hole is5Satisfies 0.01D5<φ5<0.1D5The total area of the second air release holes is 10% -50% of the area of one end face of the fixed base, so that air in the packaging shell can be smoothly discharged from right to left, and the sliding of the sliding block in the packaging shell is not influenced.
The method for measuring the heat flux of the transient high-temperature field by adopting the transient high-temperature field heat flux measuring device based on the memory alloy comprises the following steps:
the first step, heat flux measurement preparation, the method is:
1.1, stably connecting the thermosensitive element 2 and the sliding block 4 with the memory alloy member 3, namely, the thermosensitive element 2, the memory alloy member 3 and the sliding block 4 are ensured to be coaxial without shaking;
1.2 ensuring that the thermosensitive element 2 and the fixed base 5 are both in close contact with the packaging shell 1;
1.3 checking that the first air leakage hole and the second air leakage hole are smooth and have no blockage.
1.4, the whole transient high-temperature field heat flux measuring device based on the memory alloy is fixed on a support through a movable bolt 6, the right end face of the thermosensitive element 2 is ensured to be opposite to the transient high-temperature field as far as possible, the fixed support can be a slender rod, a screw hole is drilled in the slender rod, and the transient high-temperature field heat flux measuring device based on the memory alloy is fixed through connection with the movable bolt 6; the slender rod is made of alloy steel with high strength, the diameter and the length of the support are determined according to specific experimental conditions, and the lower end of the support is fixed on the ground.
1.5 measuring slide 4Distance x between left end face and right end face of fixed base 51The length of the left end face of the slider 4 from the right end face of the fixed base 5 is recorded (for example, x in FIG. 2)1Shown).
1.6 calibrating the heat sensitivity coefficient S (unit is J/m) of the transient high-temperature field heat flux measuring device based on the memory alloy by adopting a heat-displacement calibration experiment.
And step two, measuring the heat flux by the following method:
2.1 the transient high temperature field arrives, the generated heat is spread in the space, when the heat reaches the right surface of the thermosensitive element 2, the thermosensitive element 2 is heated, and the thermosensitive element 2 bears the external impact load.
2.2 the heat sensitive element 2 transfers the heat of the high temperature field to the memory alloy member 3, and the memory alloy member 3 is plastically deformed in the axial direction.
2.3 the slider 4 moves rightwards under the drive of the axial plastic shortening deformation of the memory alloy component 3, and the gas on the right side of the slider 4 is discharged from right to left through the first air release hole on the slider 4 without influencing the movement of the slider 4.
2.4 measuring the length of the left end face of the slide block 4 from the right end face of the fixed base 5, which is changed to x2(see FIG. 3), x is obtained by scale interpretation2The close contact between the thermosensitive element 3 and the package case 1 should be ensured without looseness during the judgment.
2.5 calculating the amount of plastic deformation Δ x, Δ x ═ x of the memory alloy member 3 in the axial direction2-x1(x1、x2And Δ x are both m).
2.6 the heat quantity Q transferred to the memory alloy member 3 by the heat sensitive element 2 is calculated according to the displacement quantity Δ x and the heat sensitivity coefficient S, and the heat quantity transferred to the heat sensitive element 2 by the transient high temperature field is obtained. Since the thermosensitive element 2 does not undergo plastic deformation, the heat of the memory alloy member 3 is the heat transferred to the present invention by the transient high temperature field.
2.7, calculating the heat flux of the transient high-temperature field
(unit is W/m)-2)，T(The unit is s) is the loading time of the transient high-temperature field to the transient high-temperature field heat flux measuring device based on the memory alloy, so that the rapid passive quantitative measurement of the transient high-temperature field heat flux is realized. After the measurement is completed, the screw 7 of the thermistor 2 is removed and replaced with a new memory alloy member 3, thereby reusing the sensor.
The invention can achieve the following technical effects:
1. the method can know the displacement delta x of the memory alloy component in the axial plastic deformation by measuring the displacement of the sliding block, can conveniently obtain the heat transferred to the sensor by the transient high-temperature field according to the heat sensitivity coefficient, and further completes the quantitative measurement of the heat flux of the transient high-temperature field by combining the loading time of the transient high-temperature field.
2. The memory alloy component can be formed by various forms of different materials, different diameters, different lengths and the like, so that the memory alloy component can form richer specifications, can realize higher response sensitivity to the measurement of the heat fluxes of the transient high-temperature fields with different strengths, and can be suitable for the measurement of the heat fluxes of the transient high-temperature fields with different types.
3. The device has the characteristics of simple structure, no need of power supply, convenient arrangement and use, simple and visual result, low use cost, reusability and the like.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a transient high temperature field heat flux measuring device based on memory alloy.
FIG. 2 is an axial sectional view of the transient high temperature field heat flux measuring device based on the memory alloy before being loaded by the transient high temperature field.
FIG. 3 is an axial sectional view of the transient high temperature field heat flux measuring device based on memory alloy after being loaded by the transient high temperature field.
Fig. 4 is a three-dimensional schematic view of the package housing 1 in fig. 1.
Fig. 5 is a three-dimensional schematic view of the thermosensitive element 2 in fig. 1.
Fig. 6 is a three-dimensional schematic view of the slider 4 in fig. 1.
Fig. 7 is a three-dimensional schematic view of the stationary base 5 of fig. 1.
Description of reference numerals:
1. the packaging structure comprises a packaging shell, 2 parts of a thermosensitive element, 3 parts of a memory alloy component, 4 parts of a sliding block, 5 parts of a fixed base, 6 parts of a movable bolt and 7 parts of a screw.
Detailed Description
The invention is described in further detail below with reference to the accompanying drawings and detailed description, in order to facilitate the understanding and implementation of the invention by those skilled in the art.
FIG. 1 is a schematic diagram of the overall structure of a transient high temperature field heat flux measuring device based on memory alloy according to the present invention. As shown in figure 1, the transient high temperature field heat flux measuring device based on memory alloy of the invention is composed of a packaging shell 1, a thermosensitive element 2, a memory alloy component 3, a sliding block 4, a fixed base 5, a movable bolt 6 and a screw 7. The end of the invention close to the thermosensitive element 2 is defined as the right end, and the end of the invention far from the thermosensitive element 2 is defined as the left end. The memory alloy component 3 and the sliding block 4 are positioned in the packaging shell 1, the thermosensitive element 2 is fixed at the right end of the packaging shell 1 through a screw 7 to package the right end face of the packaging shell 1, and the fixed base 5 is fixed at the left end of the packaging shell 1 through a movable bolt 6. The thermistor 2, the memory alloy member 3, and the slider 4 are coaxially mounted. The right end and the left end of the memory alloy component 3 are respectively connected with the thermosensitive element 2 and the sliding block 4 through cementing agents.
Fig. 2 is an axial sectional view of the transient high temperature field heat flux measuring device based on memory alloy before being loaded by the transient high temperature field, and fig. 4 is a three-dimensional schematic diagram of the packaging shell 1. As shown in FIG. 4, the package case 1 is cylindrical and has an outer diameter D1Satisfies 0.01m<D1<0.5m, wall thickness t1Satisfies 0.001m<t1<0.2m, inner diameter d1Satisfy d1＝D1-2t1Length L of1Satisfies 0.01m<L1<2 m; 4 screw holes are processed on the right end face of the packaging shell 1, and the distance r between the center of each screw hole and the center of the circle of the end face of the packaging shell 11Satisfy r1＝(D1+d1) /4, screw hole diameter phi1Satisfies 0.005m<φ1<t1Depth of screw hole l1Satisfies 0.002m<l1<0.1 m. As shown in fig. 2, a screw hole is used for inserting a screw 7, and the package case 1 fixes the thermosensitive element 2 on the right end face through the screw 7 and the screw hole. The inner wall and the outer wall of the packaging shell 1 are both stuck with heat insulation layers (the surface of the heat insulation layer is required to be smooth, and the heat conductivity coefficient is lower than 0.018W/(K.m)), so that the packaging shell 1 does not have heat exchange inside and outside, thereby achieving the purpose of heat insulation. The package body 1 is loaded with a slider 4 and it is ensured that the slider 4 can slide freely and frictionlessly within the package body 1 (coefficient of friction μ between the slider 4 and the package body 1)<0.05). The packaging shell 1 is made of metal materials or organic glass and the like, and the required materials meet the following requirements: yield strength sigma1>100MPa, density rho1>1g/cm3The basic principle is that the package body 1 does not deform plastically when subjected to external impact.
Fig. 5 is a three-dimensional schematic view of the thermosensitive element 2. As shown in fig. 5, the heat-sensitive element 2 is a circular thin plate for receiving an external impact load and transferring heat of a transient high-temperature field. Diameter D of the thermistor 21Thickness t2Satisfies 0.001m<t2<0.1m, thickness t2Can be adjusted according to actual measurement requirements, namely t is t when the impact carried in a transient high-temperature place is larger2The larger. For example, when the impact carried by a transient high-temperature place is explosion impact, the thickness can be adjusted, and the principle is to ensure that the thermosensitive element does not generate plastic deformation under the impact; the left end face of the thermosensitive element 2 is processed with 4 screw through holes, the positions of the 4 screw through holes correspond to the positions of 4 screw holes processed on the right end face of the packaging shell 1, and the diameter of the screw through hole is equal to phi1. Two end faces of the thermosensitive element 2 are parallel and perpendicular to the central axis of the packaging shell 1, so that the thermosensitive element 2 can uniformly transfer heat. The thermosensitive element 2 is fixed at the right end of the packaging shell 1 through a screw 7 and a screw through hole; the thermosensitive element 2 is made of hard alloy materials, the materials meet the requirement that the thermosensitive element 2 does not generate plastic deformation under the action of external impact, and the materials meet the following requirements: yield strength sigma2>200MPa, density rho2>2.0g/cm3. The heat-sensitive element 2 is fixed and removed by a screw 7, so that a new memory alloy member can be reloadedAnd 3, realizing the reutilization of the sensor.
As shown in FIG. 2, the memory alloy member 3 is spring-shaped with a spring diameter D3Satisfies 0.01m<D3<d1Length L of memory alloy member 33Satisfies 0.005m<L3<1 m; thickness of the spring (i.e. the diameter of the wire from which the spring is made) d3Satisfies 0.01m<d3<0.001m, number of turns n of spring3Satisfies 5<n3<50. The memory alloy component 3 is made of one-way memory alloy, generates unrecoverable plastic deformation when being heated, and obviously shortens in the axial direction; in actual use, two ends of the memory alloy member 3 are respectively connected with the thermosensitive element 2 and the slider 4 by using a cementing agent. The material of the memory alloy component 3 is required to meet the following requirements: yield strength sigma3<1000MPa, density rho3<10.0g/cm3。
Fig. 6 is a three-dimensional schematic view of the slider 4. As shown in FIG. 6, the slider 4 is a circular thin plate with a diameter d1Satisfy d1＝D1-2t1Thickness t4Satisfies 0.001m<t4<0.1 m. The left end face and the right end face of the sliding block 4 are adhered with heat insulation layers (the surfaces of the heat insulation layers are required to be smooth, and the heat conductivity coefficient is lower than 0.018W/(K.m)) so as to reduce heat exchange at two sides of the sliding block 4; as shown in FIG. 2, the two end faces of the slider 4 are parallel and perpendicular to the central axis of the package body 1, and the outer side face of the slider 4 is smooth and can slide freely without friction (coefficient of friction μ) in the package body 1<0.05). The sliding block 4 is made of alloy materials, and the required materials meet the following requirements: yield strength sigma4<1000MPa, density rho4<10.0g/cm3. Dig on the terminal surface of slider 4 and have first disappointing hole, first disappointing hole is the through-hole, evenly distributed, and quantity is 2 ~ 20, the diameter phi of single first disappointing hole4Satisfies 0.05d1<φ4<0.1d1The total area of the air release holes reaches 2% -50% of the area of one end face of the sliding block 4, so that air on the right side of the sliding block 4 can be smoothly discharged from right to left, and the sliding of the sliding block 4 in the packaging shell 1 is not influenced.
Fig. 7 is a three-dimensional schematic view of the stationary base 5. As shown in FIG. 7, the fixing base 5 is a circular thin plate with a diameter D5Satisfies D1<D5<1.2D1Thickness t5Satisfies 0.001m<t5<0.1 m. The fixed base 5 is made of hard alloy, and the required materials meet the following requirements: yield strength sigma5>200MPa, density rho5>2.0g/cm3The fixing base 5 is required not to be plastically deformed by an external impact. As shown in fig. 2, a fixing base 5 is fixed to the left end face of the package case 1 by a movable bolt 6, for fixing the package case 1. As shown in figure 7, a second air release hole is dug on the fixed base 5, the second air release holes are through holes and are uniformly distributed, the number of the second air release holes is 5-50, and the diameter phi of each second air release hole is5Satisfies 0.01D5<φ5<0.1D5The total area of the second air release hole is 10% -50% of the area of one end face of the fixed base 5, so that air in the packaging shell 1 can be smoothly discharged from right to left, and the sliding of the sliding block 4 in the packaging shell 1 is not affected.
FIG. 3 is an axial cross-sectional view of the invention after being subjected to a transient high temperature field. As shown in fig. 3, after the transient high temperature field is loaded, the position of the slider 4 moves to the right, that is, the distance between the left end surface of the slider 4 and the left end surface of the package housing 1 increases, and the distance x between the left end surface of the slider 4 and the left end surface of the package housing 1 is obtained by vernier caliper interpretation2I.e. the displacement of the slider is Δ x ═ x2-x1The plastic deformation amount of the memory alloy member 3 in the axial direction is Δ x ═ x2-x1。
The above embodiment is only one embodiment of the present invention. The specific structure and the size of the device can be adjusted correspondingly according to actual needs. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present patent.
Claims (14)
1. A transient high temperature field heat flux measuring device based on memory alloy is characterized in that the transient high temperature field heat flux measuring device based on memory alloy is composed of a packaging shell (1), a thermosensitive element (2), a memory alloy component (3), a sliding block (4), a fixed base (5), a movable bolt (6) and a screw (7); defining one end close to the thermosensitive element (2) as a right end and defining one end far away from the thermosensitive element (2) as a left end; the memory alloy component (3) and the sliding block (4) are positioned in the packaging shell (1), the thermosensitive element (2) is fixed at the right end of the packaging shell (1) through a screw (7) to package the right end face of the packaging shell (1), and the fixed base (5) is fixed at the left end of the packaging shell (1) through a movable bolt (6); the thermosensitive element (2), the memory alloy component (3) and the sliding block (4) are coaxially arranged; the right end and the left end of the memory alloy component (3) are respectively connected with the thermosensitive element (2) and the sliding block (4) through cementing agents;
the packaging shell (1) is cylindrical and has an outer diameter D1Wall thickness t1Inner diameter d1Satisfy d1＝D1-2t1Length of L1(ii) a 4 screw holes with diameter phi are processed on the right end face of the packaging shell (1)1For inserting a screw (7); the inner wall and the outer wall of the packaging shell (1) are both stuck with heat insulation layers; the packaging shell (1) is loaded with a sliding block (4), and the sliding block (4) slides freely without friction in the packaging shell (1); the packaging shell (1) is made of metal materials or organic glass, and the packaging shell (1) is required not to generate plastic deformation under the action of external impact;
the thermosensitive element (2) is a circular thin sheet and is used for bearing external impact load and transferring heat of a transient high-temperature field; the diameter of the thermosensitive element (2) is D1Thickness t2Thickness t2The requirement is satisfied that the thermosensitive element (2) does not generate plastic deformation under impact; 4 screw through holes are processed on the left end face of the thermosensitive element (2), and the positions of the 4 screw through holes correspond to the positions of 4 screw holes processed on the right end face of the packaging shell (1); two end surfaces of the thermosensitive element (2) are parallel and vertical to the central axis of the packaging shell (1); the thermosensitive element (2) is made of hard alloy materials, and the materials meet the requirement that the thermosensitive element (2) does not generate plastic deformation under the action of external impact; the thermosensitive element (2) is fixed and detached through a screw (7);
the memory alloy member (3) is spring-shaped and has a spring diameter D3The length of the memory alloy component (3) is L3(ii) a The memory alloy component (3) is made of one-way memory alloy, generates unrecoverable plastic deformation when heated and is axially clearShortening obviously; adopting cementing agent to connect two ends of the memory alloy component (3) with the thermosensitive element (2) and the sliding block (4) respectively;
the sliding block (4) is a circular thin plate with the diameter d1Thickness t4(ii) a The left end face and the right end face of the sliding block (4) are adhered with heat insulation layers to reduce heat exchange at two sides of the sliding block (4); the two end surfaces of the sliding block (4) are parallel and vertical to the central axis of the packaging shell (1), and the outer side surface of the sliding block (4) is smooth; the sliding block (4) is made of alloy materials; a first air release hole is dug in the end face of the sliding block (4), and the first air release holes are through holes and are uniformly distributed;
the fixed base (5) is a circular thin plate with the diameter of D5Thickness t5(ii) a The fixed base (5) is made of hard alloy, and the fixed base (5) is required not to generate plastic deformation under the action of external impact; the fixed base (5) is fixed on the left end face of the packaging shell (1) through a movable bolt (6); a second air release hole is dug on the fixed base (5), and the second air release holes are through holes and are uniformly distributed.
2. Memory alloy based transient high temperature field heat flux measurement device according to claim 1, characterized in that the outer diameter D of the package housing (1)1Satisfies 0.01m<D1<0.5m, wall thickness t1Satisfies 0.001m<t1<0.2m, length L1Satisfies 0.01m<L1<2 m; the center of 4 screw holes processed on the right end face of the packaging shell (1) is far from the center of the circle of the end face of the packaging shell (1)1Satisfy r1＝(D1+d1) /4, screw hole diameter phi1Satisfies 0.005m<φ1<t1Depth of screw hole l1Satisfies 0.002m<l1<0.1m。
3. A transient high temperature field heat flux measuring device based on memory alloy as claimed in claim 1, characterized in that the thickness t of said thermo-sensitive element (2)2The adjustment is carried out according to actual measurement requirements, namely t is t when the impact carried by a transient high-temperature place is larger2The larger; the diameter of 4 screw through holes processed on the left end face of the thermosensitive element (2) is phi1。
4. A transient high temperature field heat flux measuring device based on memory alloy as claimed in claim 3 characterized in that the thickness t of said thermo-sensitive element (2)2Satisfies 0.001m<t2<0.1m。
5. Memory alloy based transient high temperature field heat flux measuring device according to claim 1, characterized in that the spring diameter D of the memory alloy member (3)3Satisfies 0.01m<D3<d1Length L of3Satisfies 0.005m<L3<1 m; thickness of the spring, i.e. the diameter d of the wire from which the spring is made3Satisfies 0.01m<d3<0.001m, number of turns n of spring3Satisfies 5<n3<50。
6. A transient high temperature field heat flux measuring device based on memory alloy as claimed in claim 1, characterized in that the diameter d of the slide (4) is such that1Satisfy d1＝D1-2t1Thickness t4Satisfies 0.001m<t4<0.1 m; the friction coefficient mu between the sliding block (4) and the packaging shell (1)<0.05; the total area of the first air release holes dug on the end surface of the sliding block (4) reaches 2% -50% of the area of one end surface of the sliding block (4).
7. The transient high temperature field heat flux measuring device based on memory alloy as claimed in claim 6, characterized in that the number of the first air release holes dug on the end surface of the sliding block (4) is 2-20, and the diameter phi of the single first air release hole4Satisfies 0.05d1<φ4<0.1d1。
8. A transient high temperature field heat flux measuring device based on memory alloy as claimed in claim 1, characterized in that the diameter D of the fixing base (5)5Satisfies D1<D5<1.2D1Thickness t5Satisfies 0.001m<t5<0.1 m; the total area of the second air release holes dug on the fixed base (5) is the area of one end surface of the fixed base (5)10 to 50 percent of the total weight of the composition.
9. The transient high temperature field heat flux measuring device based on memory alloy as claimed in claim 8, wherein the number of second air release holes dug on the fixing base (5) is 5-50, and the diameter of a single second air release hole is phi5Satisfies 0.01D5<φ5<0.1D5。
10. The transient high temperature field heat flux measuring device based on memory alloy as claimed in claim 1, characterized in that the heat insulating layers of the left and right end faces of the packaging shell (1) and the slider (4) are required to have smooth surfaces and thermal conductivity less than 0.018W/(K-m).
11. The transient high temperature field heat flux measuring device based on memory alloy as claimed in claim 1, characterized in that the material adopted by the packaging shell (1) meets the following requirements: yield strength sigma1>100MPa, density rho1>1g/cm3(ii) a The material adopted by the thermosensitive element (2) meets the following requirements: yield strength sigma2>200MPa, density rho2>2.0g/cm3(ii) a The material requirement of the memory alloy component (3) meets the following requirements: yield strength sigma3<1000MPa, density rho3<10.0g/cm3(ii) a The material requirement that slider (4) adopted satisfies: yield strength sigma4<1000MPa, density rho4<10.0g/cm3(ii) a The fixed base (5) is made of materials which meet the following requirements: yield strength sigma5>200MPa, density rho5>2.0g/cm3。
12. A method for measuring the heat flux of a transient high-temperature field by using the device for measuring the heat flux of a transient high-temperature field based on a memory alloy according to claim 1 is characterized by comprising the following steps:
the first step, heat flux measurement preparation, the method is:
1.1, stably connecting the thermosensitive element (2) and the sliding block (4) with the memory alloy member (3), namely, the thermosensitive element (2), the memory alloy member (3) and the sliding block (4) are ensured to be coaxial without shaking;
1.2 ensuring that the thermosensitive element (2) and the fixed base (5) are both in close contact with the packaging shell (1);
1.3, checking that the first air leakage hole and the second air leakage hole are smooth without blockage;
1.4 fixing the transient high-temperature field heat flux measuring device based on the memory alloy on a bracket through a movable bolt (6), and ensuring that the right end face of the thermosensitive element (2) is opposite to the transient high-temperature field;
1.5 measuring and recording the distance x between the left end surface of the slide block (4) and the right end surface of the fixed base (5)1；
1.6 calibrating the heat sensitivity coefficient S of the transient high-temperature field heat flux measuring device based on the memory alloy by adopting a heat-displacement calibration experiment, wherein the unit is J/m;
and step two, measuring the heat flux by the following method:
2.1, the transient high-temperature field arrives, the generated heat is spread in the space, when the heat arrives at the right side surface of the thermosensitive element (2), the thermosensitive element (2) is heated, and the thermosensitive element (2) bears external impact load;
2.2 the thermosensitive element (2) transfers the heat of the high-temperature field to the memory alloy component (3), and the memory alloy component (3) generates axial plastic shortening deformation;
2.3 the sliding block (4) moves rightwards under the drive of the axial plastic shortening deformation of the memory alloy component (3), and the gas on the right side of the sliding block (4) is discharged from right to left through a first gas release hole on the sliding block (4), so that the movement of the sliding block (4) is not influenced;
2.4 measuring the length of the left end face of the sliding block (4) from the right end face of the fixed base (5), and then changing the length into x2X is obtained by reading with a graduated scale2；
2.5 calculating the plastic deformation quantity Deltax generated in the axial direction of the memory alloy component (3), the Deltax is x2-x1，x1、x2And Δ x is in units of m;
2.6, calculating the heat Q transferred to the memory alloy component (3) by the thermosensitive element (2) according to the displacement delta x and the heat sensitivity coefficient S, wherein Q is S.delta x, namely obtaining the heat transferred to the thermosensitive element (2) by the transient high-temperature field;
2.7, calculating the heat flux of the transient high-temperature field
The unit is W/m-2(ii) a T is the loading time of the transient high-temperature field to the transient high-temperature field heat flux measuring device based on the memory alloy, and the unit is s; after the measurement is finished, the screw 7 on the thermosensitive element (2) is detached and replaced by a new memory alloy component (3), so that the sensor is reused.
13. The transient high temperature field heat flux measuring device based on memory alloy according to claim 12, wherein 1.4 steps of the bracket is a slender rod, a screw hole is drilled on the slender rod, and the transient high temperature field heat flux measuring device based on memory alloy is fixed through connection with a movable bolt (6); the support is made of alloy steel, and the lower end of the support is fixed on the ground.
14. The method for measuring transient high temperature field heat flux of a transient high temperature field heat flux measuring device based on memory alloy as claimed in claim 12, wherein 2.4 steps of interpretation x2The close contact between the thermosensitive element 3 and the packaging shell (1) is ensured without looseness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010437287.XA CN111562024B (en) | 2020-05-21 | 2020-05-21 | Transient high-temperature field heat flux measuring device and method based on memory alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010437287.XA CN111562024B (en) | 2020-05-21 | 2020-05-21 | Transient high-temperature field heat flux measuring device and method based on memory alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111562024A true CN111562024A (en) | 2020-08-21 |
| CN111562024B CN111562024B (en) | 2021-04-13 |
Family
ID=72072160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010437287.XA Active CN111562024B (en) | 2020-05-21 | 2020-05-21 | Transient high-temperature field heat flux measuring device and method based on memory alloy |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111562024B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112326223A (en) * | 2020-10-29 | 2021-02-05 | 清华大学 | Contact characteristic analysis system for high-pressure gas sealing |
| CN113029395A (en) * | 2021-03-05 | 2021-06-25 | 中国人民解放军国防科技大学 | Transient high-temperature field heat flux passive sensor based on thermosensitive coating color change characteristic |
| CN113202870A (en) * | 2021-05-06 | 2021-08-03 | 吉林大学 | Solid lubricating material supply device for oil shortage protection of sliding bearing |
| CN113281377A (en) * | 2021-05-20 | 2021-08-20 | 中国人民解放军国防科技大学 | Device and method for measuring thermal dose of target object in explosion transient temperature field |
| CN114166400A (en) * | 2021-11-17 | 2022-03-11 | 中国人民解放军国防科技大学 | Fragment and shock wave comprehensive power measuring device and measuring method |
| CN116008349A (en) * | 2023-03-17 | 2023-04-25 | 天津仁爱学院 | Diesel engine cylinder liner structure damage detection mechanism |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3905228A (en) * | 1974-06-20 | 1975-09-16 | Us Navy | Mechanical heat flux recorder |
| CN104111125A (en) * | 2014-08-05 | 2014-10-22 | 苏州路之遥科技股份有限公司 | Temperature sensor and temperature regulator |
| CN104897306A (en) * | 2015-05-22 | 2015-09-09 | 清华大学 | Transient radiation heat flow measurement method based on circular foil heat flow meter |
| CN205079874U (en) * | 2015-09-27 | 2016-03-09 | 杭州捷尚智能电网技术有限公司 | Last cartridge formula junction temperature alarm of transmission line |
| CN207850559U (en) * | 2018-03-14 | 2018-09-11 | 中国空气动力研究与发展中心超高速空气动力研究所 | A kind of transient heat flow sensor |
| CN110836737A (en) * | 2019-12-11 | 2020-02-25 | 大连交通大学 | Film heat flowmeter based on high-temperature transient heat flow measurement and manufacturing method |
-
2020
- 2020-05-21 CN CN202010437287.XA patent/CN111562024B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3905228A (en) * | 1974-06-20 | 1975-09-16 | Us Navy | Mechanical heat flux recorder |
| CN104111125A (en) * | 2014-08-05 | 2014-10-22 | 苏州路之遥科技股份有限公司 | Temperature sensor and temperature regulator |
| CN104897306A (en) * | 2015-05-22 | 2015-09-09 | 清华大学 | Transient radiation heat flow measurement method based on circular foil heat flow meter |
| CN205079874U (en) * | 2015-09-27 | 2016-03-09 | 杭州捷尚智能电网技术有限公司 | Last cartridge formula junction temperature alarm of transmission line |
| CN207850559U (en) * | 2018-03-14 | 2018-09-11 | 中国空气动力研究与发展中心超高速空气动力研究所 | A kind of transient heat flow sensor |
| CN110836737A (en) * | 2019-12-11 | 2020-02-25 | 大连交通大学 | Film heat flowmeter based on high-temperature transient heat flow measurement and manufacturing method |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112326223A (en) * | 2020-10-29 | 2021-02-05 | 清华大学 | Contact characteristic analysis system for high-pressure gas sealing |
| CN113029395A (en) * | 2021-03-05 | 2021-06-25 | 中国人民解放军国防科技大学 | Transient high-temperature field heat flux passive sensor based on thermosensitive coating color change characteristic |
| CN113029395B (en) * | 2021-03-05 | 2021-10-29 | 中国人民解放军国防科技大学 | Transient high-temperature field heat flux passive sensor based on thermosensitive coating color change characteristic |
| CN113202870A (en) * | 2021-05-06 | 2021-08-03 | 吉林大学 | Solid lubricating material supply device for oil shortage protection of sliding bearing |
| CN113281377A (en) * | 2021-05-20 | 2021-08-20 | 中国人民解放军国防科技大学 | Device and method for measuring thermal dose of target object in explosion transient temperature field |
| CN113281377B (en) * | 2021-05-20 | 2021-12-10 | 中国人民解放军国防科技大学 | Device and method for measuring thermal dose of target object in explosion transient temperature field |
| CN114166400A (en) * | 2021-11-17 | 2022-03-11 | 中国人民解放军国防科技大学 | Fragment and shock wave comprehensive power measuring device and measuring method |
| CN114166400B (en) * | 2021-11-17 | 2024-02-02 | 中国人民解放军国防科技大学 | Fragment and shock wave comprehensive power measuring device and measuring method |
| CN116008349A (en) * | 2023-03-17 | 2023-04-25 | 天津仁爱学院 | Diesel engine cylinder liner structure damage detection mechanism |
| CN116008349B (en) * | 2023-03-17 | 2023-06-13 | 天津仁爱学院 | Diesel engine cylinder liner structure damage detection mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111562024B (en) | 2021-04-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111562024B (en) | Transient high-temperature field heat flux measuring device and method based on memory alloy | |
| EP2793006A2 (en) | Improved blackbody function | |
| RU2472120C2 (en) | Method of measuring tube inner surface temperature and device to this end | |
| Li et al. | Development of integrated high temperature sensor for simultaneous measurement of wall heat flux and temperature | |
| CN113281377B (en) | Device and method for measuring thermal dose of target object in explosion transient temperature field | |
| CN114279597A (en) | High-precision low-power radiant heat flow meter capable of being used for radiant heat flow tracing calibration | |
| CN116297658A (en) | Device and method for testing heat flux of transient temperature field based on heat shrinkage sheet | |
| Diller | Heat flux | |
| US10359318B2 (en) | Radio frequency stimulated blackbody with vacuum and cryogenic capability | |
| CN113029395B (en) | Transient high-temperature field heat flux passive sensor based on thermosensitive coating color change characteristic | |
| Kendall | Primary absolute cavity radiometer | |
| Diller et al. | Heat flux measurement | |
| Smetana et al. | A new measuring method to determine material spectral emissivity | |
| Gembarovic et al. | A method for thermal diffusivity determination of thermal insulators | |
| US20100238970A1 (en) | Low temperature radiometer | |
| RU66055U1 (en) | DEVICE FOR NON-CONTACT DETERMINATION OF THE TEMPERATURE DEPENDENCE OF THE HEAT CONDUCTIVITY COEFFICIENT OF SOLID ELECTRIC WIRING MATERIALS | |
| Murthy et al. | Experimental In-Cavity Radiative Calibration of High Heat-Flux Meters | |
| Vader et al. | Design and testing of a high‐temperature emissometer for porous and particulate dielectrics | |
| Quinn et al. | Total radiation measurements of thermodynamic temperature | |
| Foukal et al. | A Helium-Cooled Absolute Cavity Radiometer for Solar and Laboratory Irradiance Measurement | |
| Doronin | Sensors for metering heat flux area density and metrological equipment for the heat flux density measurement | |
| Reddy et al. | Design and calibration of a new compact radiative heat-flux gauge (RHFG) for combustion applications | |
| Schulte et al. | A Transducer for Measuring High Heat Transfer Rates | |
| Qu et al. | Errors associated with light-pipe radiation thermometer temperature measurements | |
| DiPirro et al. | A low-cost, low-temperature radiometer for thermal measurements |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |