CN111540704B - Wafer deflection device and wafer processing equipment - Google Patents

Wafer deflection device and wafer processing equipment Download PDF

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Publication number
CN111540704B
CN111540704B CN202010660034.9A CN202010660034A CN111540704B CN 111540704 B CN111540704 B CN 111540704B CN 202010660034 A CN202010660034 A CN 202010660034A CN 111540704 B CN111540704 B CN 111540704B
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wafer
acceleration
time
angular velocity
deceleration
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CN111540704A (en
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李长坤
赵德文
路新春
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Tsinghua University
Huahaiqingke Co Ltd
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Tsinghua University
Huahaiqingke Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A wafer deflection apparatus includes a wafer carrier and a drive wafer carrier between a first orientation and a second orientationAn oscillating drive mechanism for controlling the wafer carrier to oscillate from a first orientation to a second orientation in a manner conforming to a predetermined angular velocity-time curve, the angular velocity-time curve including at least one acceleration segment and at least one deceleration segment, the drive mechanism including an oscillating shaft and a motor assembly for driving the oscillating shaft to rotate, the wafer carrier being coupled to the oscillating shaft for oscillation therewith, the wafer carrier including an arcuate trailing arm having a profile of 90o‑180oThe arc-shaped supporting arm is symmetrically provided with a plurality of convex supporting parts for supporting and supporting the wafer, the supporting parts are provided with V-shaped grooves with the depth of 3mm-4mm for loading the wafer, the distance between the supporting parts along the contour direction of the arc-shaped supporting arm exceeds 10mm, and the sum of the lengths of the supporting parts does not exceed 118 mm. The application also discloses a wafer processing device with the wafer deflection device.

Description

Wafer deflection device and wafer processing equipment
Technical Field
The invention relates to the field of semiconductor manufacturing equipment, in particular to a wafer deflection device and wafer processing equipment.
Background
Chemical Mechanical Polishing (CMP) is an ultra-precise surface processing technique for obtaining global Planarization in Integrated Circuit (IC) manufacturing. Since a large amount of chemicals and abrasives are used in chemical mechanical polishing to contaminate the surface of a wafer, the contamination on the surface of the wafer needs to be removed by cleaning and drying processes after polishing to provide a smooth and clean surface of the wafer.
Marangoni drying is a promising drying technique that achieves surface drying of wafers by injecting a surface-active organic vapor, such as IPA vapor, at a meniscus of a gas-liquid-solid three-phase interface during the lifting of the wafer from the surface of the liquid, inducing the marangoni effect.
In some wafer processing equipment using marangoni drying technology, wafers are first introduced into a liquid through one port of a container, deflected at an angle in the liquid, and then removed through another port of the container while undergoing marangoni drying. However, such wafer processing equipment is not without drawbacks. For example, as shown in fig. 1, in which the device for realizing the wafer submerged deflection is not mature, the wafer angular velocity changes drastically around two time points of the rotation start and the rotation stop, a large instantaneous moment of resistance is generated, and the wafer is easily damaged. It is easy to understand that the larger the length (area) of the wafer submerged deflection device in contact with the wafer, the less likely the wafer will be broken due to the excessive moment of resistance, but the more likely other problems will occur, such as jamming (wafer being stuck), so on the one hand, it is desirable to avoid the risk of chipping, and on the other hand, it is desirable to reduce the contact area and contact length of the wafer submerged deflection device in contact with the wafer as much as possible.
Therefore, there is a need for a wafer under-liquid deflection technique and a wafer processing technique that improve wafer stress and operation efficiency.
Disclosure of Invention
The invention aims to provide a wafer deflection device and wafer processing equipment, which improve the stress condition of a wafer during submerged deflection, avoid the damage of the wafer and improve the operation efficiency.
According to one aspect of the present invention, there is provided a wafer deflection apparatus comprising a wafer carrier and a drive mechanism for driving the wafer carrier to oscillate between a first orientation and a second orientation, wherein the drive mechanism controls the wafer carrier to oscillate from the first orientation to the second orientation in a manner that conforms to a predetermined angular velocity-time profile, the angular velocity-time profile comprising at least one acceleration segment and at least one deceleration segment; wherein, the driving mechanism comprises a swing shaft and a motor component for driving the swing shaft to rotate, the wafer bracket is connected with the swing shaft to swing along with the swing shaft, the wafer bracket comprises an arched bracket arm, and the outline of the arched bracket arm is 90o- 180oThe arc-shaped supporting arm is symmetrically provided with a plurality of convex supporting parts for supporting and supporting the wafer, the supporting parts are provided with V-shaped grooves with the depth of 3mm-4mm for loading the wafer, the distance between the plurality of supporting parts along the contour direction of the arc-shaped supporting arm exceeds 10mm, and the sum of the lengths of the plurality of supporting parts does not exceed 118 mm.
In some embodiments, the absolute value of the instantaneous acceleration in each acceleration and deceleration segment is less than or equal to 200rad/s2Further 10 rad/s or less2And the sum of the time lengths of the acceleration section and the deceleration section is an angleMore than 50% of the sum of the time lengths of the speed-time curves.
In some embodiments, the angular velocity-time curve is composed of one acceleration segment and one deceleration segment.
In some embodiments, the ratio of the sum of the time lengths of the acceleration segments to the sum of the time lengths of the deceleration segments of the angular velocity-time curve is r,
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further, further
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。
In some embodiments, the absolute value of acceleration of the acceleration and/or deceleration segments of the angular velocity-time curve is decreasing over time.
In some embodiments, the curve of the deceleration segment has substantially the same shape as the curve of the natural deceleration of the wafer under liquid resistance in the absence of the driving force of the drive mechanism.
In some embodiments, the surface of the V-shaped groove is provided with a cushion.
In some embodiments, the cushion is formed of a rubber material and has a thickness of no more than 1 mm.
In some embodiments, the surface of the bumper pad is coated with a teflon or parylene coating.
Further, according to another aspect of the present invention, there is provided a wafer processing apparatus comprising:
a cleaning tank for containing a liquid therein and having a first port and a second port; and
a wafer deflection apparatus, wherein a wafer carrier of the wafer deflection apparatus is mounted in the cleaning tank such that a first orientation is aligned with a first port of the cleaning tank and a second orientation is aligned with a second port, and the drive mechanism is mounted at least partially outside the cleaning tank.
According to the wafer deflection device and the wafer processing equipment provided by the embodiment of the invention, the resistance moment generated by the change of the reference angular velocity and the contact mode of the wafer bracket and the wafer are comprehensively considered, so that the problems of wafer fragmentation and other problems influencing the production efficiency are avoided.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic diagram of the resistance moment experienced by a wafer during submerged deflection in a conventional wafer processing apparatus over time;
FIG. 2 shows a schematic view of a wafer processing apparatus according to an embodiment of the invention;
FIG. 3 shows a schematic flow diagram of a related wafer drying method according to an embodiment of the invention;
FIG. 4 illustrates a preferred embodiment of a wafer deflection apparatus and wafer processing equipment employing the same, in accordance with embodiments of the present invention, wherein a wafer is shown loaded onto a wafer carrier in a first orientation;
FIG. 5 is another schematic view of the wafer deflection apparatus of FIG. 4 and wafer processing equipment employing the same, illustrating deflection of the wafer carrier to a second orientation;
FIG. 6 is a further schematic view of the wafer deflection apparatus of FIG. 4 and wafer processing equipment employing the same, illustrating a wafer lifted from a wafer carrier by a lifting mechanism, not shown, and exiting through a second port and drying;
FIG. 7 illustrates one example of an angular velocity versus time curve that may be applied in embodiments of the present invention;
FIG. 8 schematically illustrates a plurality of angular velocity-time curves for different acceleration and deceleration segment time durations with a fixed total wafer submerged deflection time duration;
FIG. 9 shows an advantageous example of an angular velocity versus time curve that may be applied in embodiments of the present invention;
portions (a) and (b) of fig. 10 are schematic diagrams illustrating the variation of the liquid drag torque experienced by the wafer with time when the wafer carrier is controlled to control the submerged deflection of the wafer using the angular velocity-time curves of fig. 7 and 9, respectively;
FIG. 11 is a schematic view of the wafer under a force during submerged deflection;
figures 12 and 13 show two advantageous examples of angular velocity-time curves, respectively, that can be applied in embodiments of the present invention; and
parts (a) and (b) in fig. 14 show two other advantageous examples of angular velocity-time curves, respectively, which can be applied in the embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
First, a wafer processing apparatus 100 according to an embodiment of the present invention and a wafer deflection apparatus 200 according to an embodiment of the present invention applicable to the wafer processing apparatus will be described with reference to fig. 2.
As shown in fig. 2, the wafer processing apparatus 100 includes a cleaning tank 101. The cleaning tank 101 is for containing liquid therein, and has a first port 101a and a second port 101 b. A wafer deflection apparatus 200 according to an embodiment of the present invention includes a wafer carrier 110 and a drive mechanism 120 for driving the wafer carrier to oscillate between a first orientation and a second orientation. In the example shown in fig. 2, at least the wafer carrier 110 is mounted in the cleaning tank 101 of the wafer processing apparatus 100. Preferably, the drive mechanism 120 of the wafer deflection apparatus 200 is at least partially mounted outside the cleaning tank 101.
The wafer carrier 110 of the wafer deflection apparatus 200 may have at least two orientations (alignments), namely a first orientation a1 and a second orientation a2, wherein the first orientation a1 is aligned with the first port 101a of the cleaning tank 101 and the second orientation a2 is aligned with the second port 101 b.
According to an embodiment of the present invention, the driving mechanism 120 controls the wafer carrier 110 to conform toSwinging a fixed angular velocity-time curve from a first orientation A1 to a second orientation A2, the angular velocity-time curve comprising at least one acceleration segment and at least one deceleration segment, the absolute value of the instantaneous acceleration in each acceleration segment and deceleration segment being less than or equal to 200rad/s2Further 10 rad/s or less2. According to a preferred embodiment of the invention, the sum of the lengths of time of the acceleration and deceleration sections is more than 50%, preferably more than 60%, of the sum of the lengths of time of the angular velocity-time curves. Angular velocity-time curves applicable to embodiments of the present invention will be described in more detail below with reference to fig. 7-14.
In the example shown in fig. 2, the wafer processing apparatus 100 may include at least one pair of shower pipes 102, with a first port 101a defined between the pair of shower pipes 102. The wafer processing apparatus 100 may further include a pair of dry gas pipes 103, and the second port 101b is defined between the pair of dry gas pipes 103.
Next, a wafer drying method 1 will be described with reference to fig. 3. Fig. 3 is a schematic flow chart of the wafer drying method 1. The method may be implemented based on the wafer processing equipment 100 according to the embodiment of the invention, and is described below with reference to fig. 3 and 2 for ease of understanding.
As shown in fig. 3, the wafer drying method 1 includes the following operations:
step S10: loading a wafer onto a wafer carrier in the cleaning tank through a first port of the cleaning tank;
step S20: driving the wafer carrier to swing from a first orientation aligned with the first port to a second orientation aligned with the second port of the cleaning tank at a predetermined angular velocity-time profile; and
step S30: the wafer is moved out of the cleaning tank from the wafer carrier through the second port and dried.
It should be appreciated that in step S10, the wafer carrier 110 is in the first orientation a1, the first orientation a1 of the wafer carrier 110 is aligned with the first port 101a of the cleaning tank 101; at this time, the wafer W (see fig. 4 to 6) is loaded into the cleaning tank 101, for example, via the first port 101a by a not-shown robot arm, so as to be immersed in the liquid within the cleaning tank 101.
Advantageously, when the wafer W passes between the pair of shower pipes 102 at the first port 101a, the shower pipes 102 spray liquid toward the surface of the wafer W, rinsing the surface of the wafer W. However, it should be understood that the invention is not limited in this respect.
In step S20, the wafer W is driven and controlled to deflect under liquid, wherein the angular velocity-time curve includes at least one acceleration segment and at least one deceleration segment, and the absolute value of the instantaneous acceleration in each acceleration segment and deceleration segment is less than or equal to 200rad/S2Further 10 rad/s or less2. According to a preferred embodiment of the invention, the sum of the time lengths of the acceleration and deceleration sections is more than 50% of the sum of the time lengths of the angular velocity-time curves.
In step S30, the wafer W is moved out of the cleaning tank 101 from the wafer carrier 110 through the second port 101b, and when the wafer W passes between the pair of drying air pipes 103 at the second port 101b, the drying air pipes 103 can blow organic vapors with surface activity such as IPA vapor toward the wafer surface to dry the wafer surface by utilizing Marangoni effect.
Fig. 4-6 further illustrate a preferred implementation of the wafer deflection apparatus 200 according to an embodiment of the present invention, and illustrate a wafer processing tool 100 employing the wafer deflection apparatus 200. FIG. 4 shows the wafer W loaded onto the wafer carrier 110 in a first orientation A1; FIG. 5 shows the wafer carrier 110 deflected to a second orientation A2; fig. 6 shows that the wafer W is lifted from the wafer tray 110 by a not-shown lifting mechanism, moved out through the second port 101b of the cleaning tank 101, and dried.
In the preferred embodiment shown in fig. 4 to 6, the driving mechanism 120 of the wafer deflecting apparatus 200 is selectively driven by the motor assembly 122, and the driving mechanism 120 includes a swing shaft 121, the swing shaft 121 is driven by the motor assembly 122 to rotate, and the wafer carrier 110 is connected to the swing shaft 121 to swing with the swing shaft 121. As shown, the motor assembly 122 is preferably mounted outside the cleaning tank 101. The motor assembly 122 may include a motor, a control circuit for controlling the motor, and the like.
As has been described above, in the apparatus provided according to an embodiment of the present invention, it is intended to control the submerged deflection movement of the wafer carrier 110 from the first orientation a1 to the second orientation a2 by means of the above-mentioned predetermined angular velocity-time profile. A drive mechanism in the form of a motor drive offers advantageous conditions for achieving such control of the angular velocity over time in a predetermined manner: on one hand, the swing angular speed output to the wafer bracket can be simply and accurately controlled by controlling the rotating speed of the motor, and the specific adopted angular speed-time curve is convenient to correct and adjust; on the other hand, the driving mechanism can have a simple structure, so that the structure of the wafer deflection device and even the whole wafer processing equipment is simplified, the installation space is saved, and the miniaturization of the equipment is facilitated. Existing wafer deflection devices and wafer processing equipment, such as those employing pneumatic cylinder actuation, do not provide such technical advantages.
As shown in fig. 4-6, in the preferred embodiment shown, the wafer carrier 110 may include an arcuate bracket 111, and the arcuate bracket 111 is preferably contoured 90o-180oIs used for the arc of (1). The arcuate cradle 111 thus facilitates providing support and drive for the wafer W at discrete support locations, particularly locations that are as far away from the center of oscillation (at the axis of oscillation 121 in the illustrated example) as possible while not interfering with the movement of loading the wafer W onto the wafer carrier 110 and unloading the wafer W off of the wafer carrier 110. Such an arcuate bracket 111 is advantageous for improving the stress on the wafer W and protecting the wafer W from damage, especially when the same driving torque is provided.
Further preferably, as more clearly shown in fig. 6, a plurality of convex-shaped holding portions 111a for holding and supporting the wafer may be formed on the arcuate holding arm 111, and the holding portions 111a have V-shaped grooves with a depth of 3mm to 4mm for placing the wafer thereon, and the surfaces of the V-shaped grooves have cushions or buffer layers (not shown) formed of an elastic material for contacting and holding the wafer. In order not to affect the chip (die) in the functional region in the wafer, it is desirable that the V-shaped groove only carries the nonfunctional edge region of the wafer, and therefore the depth of the V-shaped groove is set to 3mm to 4mm, thereby not damaging the chip (die) while ensuring that the wafer can be stably and reliably carried. Although it is easier to stably place the V-groove as long as it is arranged in the circumferential direction of the wafer and it is possible to make the influence on the unit area of the edge of the wafer smaller and less likely to be broken by dispersing the influence of the moment, excessive contact with the edge of the wafer is likely to catch the wafer and to scratch the edge of the wafer or accumulate contaminants, etc., resulting in other unnecessary risks. Therefore, when the problem of the above-mentioned debris and the like can be overcome by the torque relief, the contact between the V-shaped groove and the edge of the wafer should be properly reduced, considering that the size of the wafer is generally not more than 300mm to 305mm (12 inches), the sum of the lengths of the plurality of supporting parts is not more than 236mm, preferably not more than 118mm, so as to minimize the contact with the edge of the wafer under the premise of ensuring stability and not damaging the wafer, and the length of each V-shaped groove is not more than 50 mm.
In fact, the arrangement of the support portions 111a having the V-shaped grooves at discrete intervals has another significant advantage in that the relatively long and narrow grooves formed on the entire carrier in the prior art are easily affected by the deformation of the carrier made of plastic, and since the grooves are long and narrow, the wafer is easily chucked once the carrier immersed in the liquid for a long time is deformed or distorted in the thickness direction, so that the prior art often needs to periodically replace the carrier during the application process to prevent the wafer from being chucked after the carrier is deformed.
Meanwhile, since the cushion pad or the cushion layer is made of elastic material such as rubber, which may cause the wafer (card) to be stuck or the wafer (scribe) to be scratched by adsorbing impurities (debris), it is preferable to coat a hydrophobic material with low surface resistance, such as Parylene-C (Parylene-C) coating or Teflon (Teflon) coating, on the surface of the cushion pad or the cushion layer to prevent V-groove card or scribe.
Here, the elastic material forming cushion pad is preferably fixedly formed or bonded on the surface of the lug part 111a, and may be formed as an integral layer structure, for example. Preferably, the cushions contact the front and rear major surfaces of the wafer W, so that when the wafer W is under-liquid deflected, the driving force generated by the wafer deflecting device 200 can be applied to the wafer W via the cushions, and the cushions can automatically perform fine adjustment on the angular velocity of the wafer W in a time-varying manner according to the resistance of the wafer W to reaction, so as to reduce the transient impact of the driving. Further, the motor element 122 and the swing shaft 121 may be connected by a reduction transmission mechanism having a transmission ratio (a ratio of the input rotation speed to the output rotation speed) of 10 or more. In this way, the rotational motion of several revolutions output by the motor can be output as a swinging motion of the wafer carrier 110 between the first orientation a1 and the second orientation a2 with a smaller angle, which is beneficial to realizing more precise wafer deflection control.
An angular velocity-time curve for controlling the oscillation of the wafer carrier from the first orientation to the second orientation, which can be applied to the wafer deflection apparatus and the wafer processing equipment according to the embodiments of the present invention, will be described in detail below.
First, as described above, the angular velocity-time curve applicable to the embodiment of the present invention includes at least one acceleration segment and at least one deceleration segment, and the absolute value of the instantaneous acceleration in each of the acceleration segment and the deceleration segment is 200rad/s or less2Further 10 rad/s or less2And the sum of the time lengths of the acceleration section and the deceleration section is 50% or more of the total time length of the angular velocity-time curve.
According to the embodiment of the invention, on one hand, the resistance torque borne by the wafer can be kept at a stable and lower level by limiting the absolute value of the instantaneous acceleration in the angular velocity-time curve, and the instantaneous high resistance torque with destructive power is eliminated; on the other hand, by performing the acceleration and deceleration movements at a larger fraction of the time during which the wafer is deflected, it is possible to allow a more rapid deflection without increasing the instantaneous acceleration of the wafer, or from another point of view, to use a smaller acceleration of the wafer without increasing the time required for the deflection, thereby reducing the wafer stress.
It should be understood that, in the present invention, the curve of the acceleration segment may take any increasing function within its time interval, and the form includes, but is not limited to, a polynomial function, an exponential function, a sinusoidal function; the curve of the deceleration segment may take any decreasing function over its time interval, and the form includes, but is not limited to, a polynomial function, an exponential function, a sinusoidal function.
It should also be understood that, in the present invention, the number of the acceleration segment and the deceleration segment is not limited to one, and the constant speed segment may not be present, and may include one or more constant speed segments. When a plurality of acceleration segments or a plurality of deceleration segments are included in the angular velocity-time curve, the order of occurrence of these acceleration segments and/or deceleration segments is not limited to a specific manner, and for example, the acceleration segments and the deceleration segments may alternately occur, or a plurality of acceleration segments may be followed by a plurality of deceleration segments. In general, the invention is not limited in this respect.
Different specific examples of angular velocity-time curves applicable in embodiments of the present invention are described next with reference to fig. 7-9, fig. 11-12, and fig. 14. It should be understood that although the magnitude of the instantaneous acceleration on the angular velocity-time curves shown are not indicated or indicated by the magnitudes of the vertical and horizontal axes in the figures, these curves are intended to have a magnitude of 200rad/s or less2Further 10 rad/s or less2The instantaneous absolute value of acceleration.
Referring to fig. 7, fig. 7 shows an example of an angular velocity-time curve that can be applied in an embodiment of the present invention. In this example, the angular velocity-time curve includes an acceleration segment that rises straight, a constant velocity segment, and a deceleration segment that falls straight. The slopes of the straight lines of the acceleration section and the deceleration section correspond to the respective accelerations of the acceleration section and the deceleration section. It can be seen that in this example, the acceleration and deceleration sections each have a fixed acceleration. In addition, the time lengths of the acceleration section, the uniform velocity section and the deceleration section are respectively tAdding、tUniform mixing、tReducingIn the example shown in FIG. 7, the intention is to satisfy
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Fig. 8 comparatively shows a plurality of angular velocity-time curves of different time ratios of the acceleration section and the deceleration section in the case that the total time length of the wafer submerged deflection is fixed. Here, the "acceleration and deceleration section duration ratio" refers to a ratio of a sum of the acceleration and deceleration section durations to a total time length of a deflection process of the wafer carrier from the first orientation to the second orientation (i.e., a total time length of an angular velocity-time curve). Fig. 8 shows an angular velocity-time curve shown by a solid line as an intermediate reference object, an angular velocity-time curve shown by a broken line in which the time length of the uniform velocity segment is zero (including only the acceleration segment and the deceleration segment), and an angular velocity-time curve shown by a center line in which the uniform velocity segment increases. Comparing the three, it can be seen that, under the same total deflection time, the larger the time length ratio of the acceleration section to the deceleration section is, the smaller the absolute value of the acceleration section and the deceleration section can be, which means the smaller wafer resistance moment; conversely, the smaller the ratio of the time length of the acceleration section to the time length of the deceleration section, the larger the absolute value of the acceleration that needs to be adopted by the acceleration section and the deceleration section, which means the larger the wafer resistance torque.
Based at least in part on the results of the comparative analysis shown in fig. 8, the inventors of the present invention propose a preferred example of an angular velocity-time curve that can be applied to embodiments of the present invention. As shown in fig. 9, in this preferred example, the angular velocity-time curve applicable to the embodiment of the present invention is composed of only one acceleration section and one deceleration section. According to the preferred example, the resistance moment applied to the wafer can be further reduced under the same wafer deflection operation efficiency (or the same total deflection time), and the wafer can be protected from being damaged.
Parts (a) and (b) of fig. 10 schematically show the variation with time of the liquid resistance torque to which the wafer is subjected when the wafer carrier is controlled using the angular velocity-time curves of fig. 7 and 9, respectively, to control the deflection of the wafer under liquid. It can be seen that by controlling the angular velocity-time curve of the wafer carrier swing as shown in fig. 7 and 9, the resisting moment applied to the wafer during the submerged deflection can be maintained at a relatively stable and low level, which is beneficial to avoiding the wafer damage.
FIG. 11 is a diagram illustrating the force applied to the wafer during the submerged deflection. As shown in FIG. 11, when the wafer W is submerged, it is at an angular velocity as indicated by the upward arrow
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During rotation, the wafer is subjected to the resistance F of the liquidLiquid for treating urinary tract infectionAnd receives a driving force F of the wafer carrierDriving device. When it is desired that the acceleration of the wafer in the angular velocity direction be a positive value (acceleration), FDriving deviceAnd fluid resistance FLiquid for treating urinary tract infectionA force in the opposite direction; when it is desired that the acceleration of the wafer in the angular velocity direction be a negative value (deceleration), FDriving deviceAnd fluid resistance FLiquid for treating urinary tract infectionForces that may be in opposite or the same direction. It can be understood that under the condition that the force exerted on the wafer by the wafer bracket is unchanged, the absolute value of the acceleration of the wafer in the deceleration section is larger than that of the acceleration of the wafer in the acceleration section when the wafer deflects under the liquid under the influence of the liquid resistance. This means that the deceleration section can be completed in a shorter time than the acceleration section.
Based at least in part on the results of the comparative analysis shown in fig. 11, the inventors of the present invention propose a preferred example as shown in fig. 12 and 13, in which the time length of the acceleration section of the angular velocity-time curve is greater than the time length of the deceleration section, tAdding
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tReducing. Although the angular velocity-time curves include only one acceleration section and one deceleration section in the examples shown in fig. 12 and 13, as described above, the angular velocity-time curves may include at least one acceleration section and at least one deceleration section according to an embodiment of the present invention. In this case, the ratio r of the sum of the time lengths of the acceleration segments to the sum of the time lengths of the deceleration segments of the angular velocity-time curve may satisfy
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As schematically shown in fig. 12, in case the angular velocity-time curve comprises a uniform velocity segment, according to an embodiment of the present invention, it is still preferred
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Parts (a) and (b) in fig. 14 show two other advantageous examples of angular velocity-time curves, respectively, which can be applied in the embodiment of the present invention. As shown in fig. 14, in these examples, the absolute value of the acceleration segment and/or the deceleration segment of the angular velocity-time curve is decreased with time, the constant velocity segment is included in the angular velocity-time curve shown in part (a) of fig. 14, and the constant velocity segment is not included in the angular velocity-time curve shown in part (b) of fig. 14.
This is mainly considered that, in the acceleration stage, as the angular velocity of the wafer increases, the liquid resistance to the wafer also increases correspondingly, and in this case, under the condition that the magnitude of the driving force applied to the wafer by the wafer carrier is not changed, the absolute value of the acceleration of the wafer gradually decreases due to the increase of the liquid resistance; in the deceleration stage, as the angular velocity of the wafer decreases, the liquid resistance to the wafer also decreases accordingly, and in this case, the absolute value of the acceleration of the wafer gradually decreases due to the decrease of the liquid resistance without changing the magnitude of the driving force applied to the wafer by the wafer carrier. Therefore, the angular velocity-time curve of the acceleration absolute value of the acceleration section and/or the deceleration section decreasing with time is more beneficial to applying stable driving force on the wafer through the wafer bracket, so that the angular velocity acceleration as large as possible can be realized under the condition of not damaging the wafer, and the operation efficiency of wafer submerged deflection is improved.
Although not shown, in another advantageous example, the curve of the deceleration section may have substantially the same shape as the curve of the natural deceleration of the wafer under the liquid resistance in the absence of the driving force of the driving mechanism.
It should be noted that the "curve" in the above embodiments is not a strictly curved line, but should be interpreted broadly as representing the relationship between different quantities in the form of a line, and the "acceleration" can also be understood or interpreted as "angular acceleration", in other words, the terms therein should not be interpreted strictly restrictively, and should be interpreted and interpreted expansively according to the content of the embodiments.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims (9)

1. A wafer deflection apparatus comprising a wafer carrier and a drive mechanism for driving the wafer carrier to oscillate between a first orientation and a second orientation, wherein the drive mechanism controls the wafer carrier to oscillate from the first orientation to the second orientation in conformance with a predetermined angular velocity-time curve, the angular velocity-time curve comprising at least one acceleration segment and at least one deceleration segment;
the wafer carrier comprises an arched supporting arm, and the outline of the arched supporting arm is 90o-180oIs a circular arc of, and
a plurality of convex supporting parts for supporting and supporting the wafer are symmetrically arranged on the arched supporting arm, the supporting parts are provided with V-shaped grooves with the depth of 3mm-4mm for loading the wafer,
the plurality of supporting parts are spaced from each other by more than 10mm along the contour direction of the arched supporting arm, and the sum of the lengths of the plurality of supporting parts is not more than 118 mm;
wherein the instantaneous acceleration absolute value in each acceleration section and deceleration section is less than or equal to 200rad/s2And the sum of the time lengths of the acceleration section and the deceleration section is the angleMore than 50% of the sum of the time lengths of the speed-time curves.
2. Wafer deflection apparatus according to claim 1, wherein the angular velocity-time profile is comprised of an acceleration segment and a deceleration segment.
3. Wafer deflection device according to claim 1, wherein the ratio of the sum of the time lengths of the acceleration sections to the sum of the time lengths of the deceleration sections of the angular velocity-time curve is r,
Figure 815884DEST_PATH_IMAGE002
。
4. wafer deflection device according to claim 3, wherein the absolute value of the acceleration and/or deceleration segment of the angular velocity-time curve decreases with time.
5. Wafer deflection apparatus according to claim 4, wherein the curve of the deceleration section has substantially the same shape as the curve of the natural deceleration of the wafer under liquid resistance in the absence of the driving force of the drive mechanism.
6. Wafer deflection apparatus according to claim 1, wherein the surface of the V-shaped groove is provided with a cushion.
7. The wafer deflection apparatus of claim 6, wherein the cushion pad is formed of a rubber material and has a thickness of no more than 1 mm.
8. Wafer deflection apparatus according to claim 7, wherein the surface of the cushion pad is coated with a teflon or parylene coating.
9. A wafer processing apparatus, comprising:
a cleaning tank for containing a liquid therein and having a first port and a second port; and
the wafer deflection device as set forth in any one of claims 1-8, wherein the wafer carrier of the wafer deflection device is mounted in the cleaning tank such that the first orientation is aligned with a first port of the cleaning tank and the second orientation is aligned with the second port, the drive mechanism being mounted at least partially outside the cleaning tank.
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