CN111540693A - Expansion device - Google Patents

Expansion device Download PDF

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Publication number
CN111540693A
CN111540693A CN202010079512.7A CN202010079512A CN111540693A CN 111540693 A CN111540693 A CN 111540693A CN 202010079512 A CN202010079512 A CN 202010079512A CN 111540693 A CN111540693 A CN 111540693A
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CN
China
Prior art keywords
frame
workpiece
unit
expanding
cooling
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Pending
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CN202010079512.7A
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Chinese (zh)
Inventor
松田智人
川口吉洋
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Disco Corp
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Disco Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67132Apparatus for placing on an insulating substrate, e.g. tape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67109Apparatus for thermal treatment mainly by convection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Provided is an expansion device which cools an expansion sheet with a simpler configuration. An expanding device expands an expanding piece of a workpiece unit, the workpiece unit including a workpiece, the expanding piece, and an annular frame to which an outer peripheral side of the expanding piece is bonded, the expanding device including: a frame fixing unit having a frame supporting portion capable of supporting the annular frame of the workpiece unit and a frame pressing portion capable of clamping the annular frame together with the frame supporting portion; and an expanding unit capable of expanding the expanding piece, wherein the frame fixing unit has an ejection port and a cooling air supply path, one end of the cooling air supply path is communicated with the ejection port, the other end of the cooling air supply path is communicated with a cooling air supply source, and the ejection port can eject the cooling air supplied from the cooling air supply source towards a region between the processed object of the expanding piece contained in the processed object unit and the inner periphery of the annular frame.

Description

Expansion device
Technical Field
The present invention relates to an expanding device for expanding an expanding sheet attached to an annular frame on an outer peripheral side radially outward.
Background
After a plurality of intersecting planned dividing lines (also referred to as streets) are set on the front surface of a disk-shaped wafer and devices are formed in each region partitioned by the planned dividing lines, each device chip can be formed when the wafer is divided along the planned dividing lines. The formed device chip is mounted on an electronic device or the like and used.
The wafer is divided, for example, by using a laser processing apparatus. For example, a laser beam having a wavelength that is transparent to the wafer is condensed inside the wafer along the lines to be divided, and a modified layer that serves as a division start point is formed along the lines to be divided.
A sheet called an extension sheet is previously attached to the back surface side of the wafer. An annular frame made of metal or the like is attached to the outer peripheral side of the expansion sheet. When the wafer is bonded to the extension sheet, a workpiece unit is formed in which the wafer, the extension sheet, and the ring frame are integrated.
When the expanding sheet is expanded radially outward in a state where the modified layer is formed inside the wafer along the planned dividing lines, the wafer is broken using the modified layer as a starting point to form device chips, and the pitch between the device chips is further increased. When the distance between the device chips is increased, the device chips are less likely to contact each other when the workpiece unit or the like is transported later, and damage to the device chips is suppressed.
However, if the extension sheet is extended in a room temperature environment, the extension sheet may extend only in a region between the inner peripheral edge of the ring frame and the wafer, and the extension sheet in a region bonded to the wafer may not be appropriately extended. Therefore, the following extension means are used: the expanding device includes a cooling chamber that houses various components such as an expanding mechanism for expanding a sheet (for example, patent documents 1 to 3).
In this apparatus and the like, the frame unit is carried into the cooling chamber, the atmosphere inside the chamber is cooled to cool the extension piece, and the extension piece is extended in a state where the extension piece is not easily extended, so that the wafer is easily broken.
Patent document 1: japanese patent laid-open publication No. 2018-113350
Patent document 2: japanese patent laid-open publication No. 2016-181659
Patent document 3: japanese patent laid-open publication No. 2007-189057
If the cooling chamber is incorporated in the expansion device, the expansion device becomes large. Further, it is not easy to cool the internal space of the cooling chamber having a large capacity in order to reliably cool the extension piece, and the cooling cost of the extension piece cannot be ignored.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object thereof is to provide a spreader capable of cooling a spreader with a simpler structure.
According to one aspect of the present invention, there is provided an expanding device for expanding an expanding piece of a workpiece unit, the workpiece unit including: a workpiece; the expansion sheet is stuck to the processed object; and an annular frame to which an outer peripheral side of the expansion piece is attached, wherein the expansion device includes: a frame fixing unit having a frame supporting portion capable of supporting the annular frame of the workpiece unit and a frame pressing portion capable of clamping the annular frame together with the frame supporting portion; and an expanding unit that can expand an expanding blade included in a workpiece unit having an annular frame fixed by the frame fixing unit, the frame fixing unit having an ejection port and a cooling air supply path, one end of the cooling air supply path communicating with the ejection port and the other end communicating with a cooling air supply source, the ejection port being capable of ejecting cooling air supplied from the cooling air supply source toward the following region of the expanding blade included in the workpiece unit having the annular frame fixed by the frame fixing unit: the region is a region between the workpiece and the inner periphery of the annular frame.
Preferably, the frame fixing means has a plurality of the ejection ports arranged in a ring shape, and the cooling air supply path includes: an annular cooling circuit; a plurality of branch paths extending from the annular cooling path to the plurality of discharge ports, respectively; and a supply passage having one end communicating with the cooling air supply source and the other end reaching the annular cooling passage, wherein the cooling air supply source cools the frame fixing unit by supplying cooling air to the annular cooling passage, so that a cooling space can be formed around the workpiece of the workpiece unit having the annular frame fixed by the frame fixing unit.
More preferably, the expanding device further includes a cooling plate that can be brought into contact with the workpiece included in the workpiece unit via an expanding piece included in the workpiece unit having the annular frame fixed by the frame fixing unit.
In the expanding device according to one aspect of the present invention, the annular frame can be fixed by the frame fixing means. The workpiece and the extension piece included in the workpiece unit including the annular frame can be cooled. In particular, the expansion device can cool a region between the workpiece and the inner peripheral edge of the annular frame by ejecting cooling air from an ejection port formed in the frame fixing unit to the region.
Therefore, the expanding device according to one embodiment of the present invention can sufficiently cool the region of the expanding sheet to be expanded in the expanding device. Therefore, the expansion device does not require a large cooling chamber capable of accommodating the workpiece unit, the frame fixing unit, the expansion unit, and the like.
Therefore, according to the present invention, there is provided an expansion device capable of cooling an expansion sheet with a simpler configuration.
Drawings
Fig. 1 is a perspective view schematically showing an example of the expanding device.
Fig. 2 is a sectional view schematically showing the expanding device into which the workpiece unit is carried.
Fig. 3 is a cross-sectional view schematically showing a spreading device that performs cooling of the spread sheet.
FIG. 4 is a cross-sectional view schematically showing an expanding device for performing expansion of an expanding sheet.
FIG. 5 is a cross-sectional view schematically illustrating a stent device implementing this slack removal of the slack-producing stent sheet.
Fig. 6 is a cross-sectional view schematically showing another example of the expanding device into which the workpiece unit is carried.
Fig. 7 is a sectional view schematically showing a spreading device that performs cooling of the spread sheet.
FIG. 8 is a cross-sectional view schematically showing an expanding device for performing expansion of an expanding sheet.
FIG. 9 is a cross-sectional view schematically illustrating a stent device implementing this slack removal of the slack-producing stent sheet.
Description of the reference symbols
1: a workpiece; 3: a modified layer; 5: a device; 7: expanding the sheet; 7 a: DAF (adhesive sheet film); 9: a frame; 11: a workpiece unit; 13: dividing the groove; 15: a device chip; 2. 80: an expansion device; 4. 84: a frame fixing unit; 6. 86: a frame support portion; 6a, 8a, 86a, 88 a: an opening; 8. 88: a frame pressing portion; 10. 46, 90: a cylinder; 12. 48, 92: a rod; 14. 94: an annular cooling circuit; 16. 96: a branch circuit; 18. 98: providing a path; 20. 100, 136: a cooling air supply path; 22. 102: an ejection port; 24. 104: a vortex tube; 26. 40, 62, 106, 134, 140, 156: an opening and closing valve; 28. 108: a compressed air supply source; 30. 110: a cooling air supply source; 32. 112, 112: an extension unit; 34. 124: a holding table (cooling plate); 36. 128: an aspiration path; 38. 130, 130: a suction port; 42. 132: an attraction source; 44. 120: a cooling unit; 50. 142: a sheet contracting unit; 52: a rod; 54. 148: a support plate; 56. 150: a heating unit; 58. 152: an air supply path; 58a, 160: an opening; 60. 138, 154: an air supply source; 64. 158: a coil heater; 66. 168: a switch; 68. 144, 162: a rotary motor; 70. 146, 164: a rotating shaft; 72. 166: a shutter plate; 72a, 166 a: an opening; 82: a housing; 82 a: a carry-out/carry-in port; 82 b: opening and closing the door; 88 b: a through hole; 88 c: a frame pressing portion support bolt; 88 d: a sealing part; 114: an expanding roller support portion; 116: an expanding roller; 118: a workpiece cooling unit; 122: a table lifting unit; 126: a workbench cover.
Detailed Description
Embodiments of the present invention will be described with reference to the accompanying drawings. The expanding device of the present embodiment expands the expanding piece of the workpiece unit in which the workpiece, the expanding piece, and the annular frame are integrated. Fig. 2 and the like show a cross section of the workpiece unit 11.
The extension sheet 7 of the workpiece unit 11 includes, for example, a base layer made of vinyl chloride or the like and a paste layer supported by the base layer. The central region of one surface of the expansion sheet 7 is bonded to the workpiece 1. Further, the outer peripheral portion of the expanding sheet 7 is bonded to the inner peripheral portion of the annular frame 9 having the opening so as to seal the opening.
The workpiece 1 is, for example, a wafer made of a material such as silicon, SiC (silicon carbide), or other semiconductors, or a substantially disk-shaped substrate made of a material such as sapphire, glass, or quartz. The front surface of the workpiece 1 is divided into a plurality of regions by a plurality of planned dividing lines (streets) intersecting each other, and devices 5 such as ICs (integrated circuits) are formed in each of the divided regions. When the workpiece 1 is divided along the lines to be divided, the device chips can be formed.
The modified layer 3 is formed inside the workpiece 1 along the planned dividing line as a division start point. The modified layer 3 can be formed by, for example, condensing a laser beam having a wavelength that is transparent to the object 1 (a wavelength that can transmit the object 1) inside the object 1 along the lines to divide.
When a force directed radially outward is applied to the object 1 having the modified layer 3 formed therein along the line to divide, cracks are generated from the modified layer 3 to the upper and lower surfaces of the object 1, and the object 1 is divided into the device chips 15 (see fig. 4 and the like). Thereafter, the expansion sheet 7 is further expanded to easily pick up the respective device chips 15 from the expansion sheet 7, and the intervals between the device chips 15 are expanded. The expanding device of the present embodiment expands the expanding sheet 7.
In addition, DAF (die attach film) may be provided in advance on the workpiece 1. The DAF is a film that functions as an adhesive when the device chip 15 is mounted on a predetermined mounting object. The expanding apparatus can divide the workpiece 1 provided with the DAF for each DAF. In this case, the device chip 15 provided with the DAF is formed.
An example of the expanding apparatus according to the present embodiment will be described with reference to fig. 1 to 5. Fig. 1 schematically shows a perspective view of the expanding device 2, and fig. 2 schematically shows a cross-sectional view of the expanding device 2 loaded with the workpiece unit 11. The expansion device 2 includes: a frame fixing unit 4 for fixing the annular frame 9 of the workpiece unit 11; and an expanding unit 32 capable of expanding the expanding sheet 7 of the workpiece unit 11.
The expanding device 2 further includes a holding table (cooling plate) 34, and the holding table (cooling plate) 34 is in contact with the workpiece 1 included in the workpiece unit 11 via the expanding sheet 7 included in the workpiece unit 11, and can cool the expanding sheet 7 and the workpiece 1. The expanding device 2 further includes a sheet contracting unit 50, and the sheet contracting unit 50 heats and contracts the expanded sheet 7, which is expanded to have slack, to remove the slack. Hereinafter, each component of the expansion device 2 will be described in detail.
The frame fixing unit 4 has a frame supporting portion 6, and the frame supporting portion 6 can support the annular frame 9 of the workpiece unit 11. The frame support portion 6 is a ring-shaped member having a flat upper surface, and has an opening 6a having a diameter corresponding to the diameter of the opening of the ring frame 9 at the center. The upper ends of a plurality of rods 12 are connected to the lower surface of the frame support portion 6, and the lower ends of the rods 12 are respectively housed in an elevating mechanism such as an air cylinder 10. The frame support portion 6 can be raised and lowered by moving the rod 12 up and down by operating the cylinder 10.
The frame fixing unit 4 further includes an annular frame pressing portion 8, and the frame pressing portion 8 can sandwich the annular frame 9 together with the frame support portion 6. The frame pressing portion 8 is an annular member having an opening 8a in the center, the diameter of which is the same as that of the opening 6a of the frame supporting portion 6, and the lower surface of the frame pressing portion 8 is flat.
When the frame support portion 6 on which the ring frame 9 is placed is raised and the ring frame 9 is brought into contact with the lower surface of the frame pressing portion 8, the ring frame 9 is sandwiched and held between the frame support portion 6 and the frame pressing portion 8. The frame pressing portion 8 can grip the ring frame 9 with a strong force so that the fixed ring frame 9 does not shift in position.
Further, the frame pressing portion 8 may be movable upward by an external force. For example, the frame pressing part 8 may be configured to be raised by further raising the frame supporting part 6 after the frame supporting part 6 on which the ring frame 9 is placed is raised to bring the ring frame 9 into contact with the frame pressing part 8.
The frame pressing portion 8 of the frame fixing unit 4 has an ejection port 22 formed in the inner peripheral wall of the opening 8 a. For example, as shown in fig. 1 and 2, a plurality of discharge ports 22 are formed in an inner peripheral wall of the frame pressing portion 8 so as to be arranged at equal intervals in a ring shape.
A cooling air supply passage 20 is formed inside the frame pressing portion 8 of the frame fixing unit 4, and one end of the cooling air supply passage 20 communicates with the ejection port 22 and the other end communicates with a cooling air supply source 30. The cooling air supply path 20 includes, for example: an annular cooling passage 14 disposed so as to surround the inner peripheral wall of the frame pressing portion 8; and a plurality of branch lines 16 extending from the annular cooling line 14 to the plurality of discharge ports 22. The cooling air supply passage 20 includes a supply passage 18, and one end of the supply passage 18 communicates with a cooling air supply source 30 and the other end thereof reaches the annular cooling passage 14.
The cooling air supply source 30 can supply the cooling air to the ejection port 22 through the cooling air supply path 20. The cooling air supply source 30 includes a compressed air supply source 28 and a cooling mechanism such as a vortex tube 24, and the cooling mechanism such as the vortex tube 24 cools the compressed air supplied from the compressed air supply source 28 to change the cooled air into cooling air. Further, an open-close valve 26 is provided in the air passage between the compressed air supply source 28 and the vortex tube 24. When the on-off valve 26 is opened, the cooling air is supplied from the cooling air supply source 30 to the cooling air supply passage 20.
When the cooling air is supplied to the cooling air supply passage 20 in a state where the annular frame 9 is fixed by the frame fixing unit 4, the cooling air is supplied from the plurality of discharge ports 22 to the extension piece 7 of the workpiece unit 11. At this time, the frame pressing portion 8 itself is cooled, and the ring frame 9 is cooled. That is, the cooling air contributes to cooling of the entire workpiece unit 11. In order to efficiently cool the annular frame 9, the frame pressing portion 8 is preferably formed of a metal having high thermal conductivity, such as aluminum.
The expanding means 32 can expand the expanding sheet 7 included in the workpiece unit 11 having the annular frame 9 fixed by the frame fixing means 4. The extension unit 32 has a holding table 34, and the holding table 34 is accommodated in the opening 6a of the frame support portion 6 of the frame fixing unit 4. The workpiece 1 is placed on the upper surface of the holding table 34 via the extension sheet 7 included in the workpiece unit 11 having the annular frame 9 fixed by the frame fixing unit 4.
The holding table 34 can suck and hold the workpiece 1 through the expanding sheet 7. A plurality of suction ports 38 are formed in the upper surface of the holding table 34, and suction paths 36 connected to the respective suction ports 38 are formed inside the holding table 34. The suction path 36 is connected to a suction source 42 disposed outside the holding table 34.
An on-off valve 40 is provided between the suction passage 36 and the suction source 42. When the opening/closing valve 40 is opened, the negative pressure generated by the suction source 42 can be applied to the object placed on the upper surface of the holding table 34 via the suction passage 36 and the suction port 38. That is, the suction path 36, the suction port 38, the opening/closing valve 40, the suction source 42, and the like function as holding means for sucking and holding the workpiece 1 through the expanding sheet 7.
Further, a cooling unit 44 such as a piston cooler is provided on the lower surface of the holding table 34. When the cooling unit 44 is operated, the holding table 34 can be cooled. The holding table 34 can function as a cooling plate that can be brought into contact with the workpiece 1 included in the workpiece unit 11 via the extension piece 7 included in the workpiece unit 11 having the annular frame 9 fixed by the frame fixing unit 4. Further, the holding table 34 is preferably made of aluminum or the like having high thermal conductivity so as to efficiently perform cooling.
The upper ends of a plurality of rods 48 are connected to the lower surface of the holding table 34, and the lower ends of the rods 48 are respectively housed in an elevating mechanism such as an air cylinder 46. The holding table (cooling plate) 34 can be moved up and down by moving the rod 48 up and down by operating the air cylinder 46. When the holding table 34 is raised in a state where the ring frame 9 is fixed to the frame fixing unit 4, the extension piece 7 attached to the ring frame 9 is extended radially outward.
The sheet shrinking unit 50 removes the slack by heating and shrinking a region between the inner peripheral edge of the annular frame 9 of the expanded sheet 7, which is expanded to have slack, and the workpiece 1. The sheet contracting unit 50 has: a rod 52 that supports the components of the sheet contracting unit 50 from above; a disc-shaped support plate 54 connected to a lower end of the rod 52; and a plurality of heating units 56 provided on the lower surface of the outer peripheral portion of the support plate 54.
The heating unit 56 has a function of ejecting heated air downward. Fig. 2 shows a cross section of the heating unit 56. The heating unit 56 has an air supply passage 58, and the air supply passage 58 has a cylindrical casing extending in the vertical direction. An upper end of the air supply path 58 is connected to an air supply source 60 via an on-off valve 62. When the on-off valve 62 is opened, air can be supplied from the air supply source 60 to the air supply passage 58. The air supply source 60 may supply air to the air supply path 58 through the rod 52, the support plate 54, and the like.
A coil heater 64 is provided inside the air supply path 58 as a heating mechanism for heating the air supplied from the air supply source 60. The coil heater 64 is connected to a power supply and switch 66, and when the switch 66 is turned on and current flows through the coil heater 64, heat is generated from the coil heater 64 to heat the air supplied from the air supply source 60. An opening 58a is provided in the lower surface of the air supply passage 58, and when the opening/closing valve 62 is opened and the heating unit 56 is operated, heated air is discharged downward from the opening 58 a.
The sheet contracting unit 50 includes a rotary motor 68 on the central lower surface of the support plate 54, and the upper end of a rotary shaft 70 extending in the vertical direction is attached to the rotary motor 68. A disc-shaped shutter 72 is connected to a lower end of the rotary shaft 70. The diameter of the disc-shaped shutter 72 is slightly smaller than the diameter of the opening 8a of the frame pressing portion 8 of the frame fixing unit 4. The frame pressing portion 8 can be relatively lifted and lowered with respect to the shutter plate 72 in a state where the shutter plate 72 is accommodated in the opening 8 a.
The shutter 72 has a plurality of openings 72a (see fig. 1 and 5) in an arrangement corresponding to the arrangement of the plurality of heating units 56 on the support plate 54. For example, the support plate 54 has the heating units 56 at a plurality of fixed positions arranged at equal intervals, each of which has a predetermined diameter from the center of the lower surface of the support plate 54. The shutter 72 has the same number of openings 72a as the number of heating units 56 at a plurality of formation positions arranged at equal intervals, the diameter of which from the center of the shutter 72 is the predetermined diameter.
The shutter 72 has a function of preventing heat from the heating unit 56 from being unnecessarily transmitted to the workpiece unit 11. When it is desired to block the heat transfer from the heating unit 56 to the workpiece unit 11, the shutter 72 is rotated by rotating the rotary shaft 70 by operating the rotary motor 68, and the position of each heating unit 56 is shifted from the position of each opening 72 a.
When the sheet shrinking unit 50 shrinks the expanded sheet 7 of the workpiece unit 11 that has been loosened, the shutter 72 is rotated to align the position of each heating unit 56 with the position of each opening 72 a. Then, the heated air is supplied to the expansion sheet 7 through the opening 58a of the air supply path 58 of the heating unit 56 and the opening 72a of the shutter 72.
A rotary motor, not shown, is connected to an upper end of the rod 52 of the sheet contracting unit 50. When the rotary motor is operated while heated air is supplied to the expansion sheet 7 by the heating means 56, the region between the object 1 to be processed of the expansion sheet 7, which is expanded and loosened, and the inner peripheral edge of the ring frame 9 is heated over the entire circumferential range. Then, the spread sheet 7 contracts, and the interval between the formed device chips 15 (see fig. 4 and 5) is kept wide, so that the pickup of the device chips 15 becomes easy.
The extension device 2 of the present embodiment can supply the cooling air from the ejection port 22 formed on the inner peripheral wall of the frame pressing portion 8 of the frame fixing unit 4 to the extension piece 7 of the object unit 11 fixed by the frame fixing unit 4. When the cooling unit 44 attached to the holding table 34 is operated, the extension piece 7 and the workpiece 1 can be cooled. That is, the extension piece 7 can be cooled from above and below.
The expanding device 2 of the present embodiment can cool the region between the workpiece 1 of the expanding sheet 7 and the inner peripheral edge of the annular frame 9 when expanding the expanding sheet 7. When the extension piece 7, which has been cooled in this region and has been inhibited from extending, is extended, the extension piece 7 is appropriately extended, and the workpiece 1 can be reliably divided.
When the DAF (adhesive film) is provided in advance on the workpiece 1, the DAF is cooled by the cooling unit 44 via the holding table (cooling plate) 34. Therefore, when the object 1 is divided by expanding the expanding piece 7, the extension of the DAF is suppressed, and the DAF is also divided more reliably.
Conventionally, in order to cool the extension sheet 7 and the like when extending the extension sheet 7, it is necessary to prepare a cooling chamber having a size capable of accommodating each component of the extension apparatus. In contrast, in the expanding apparatus 2 of the present embodiment, the region between the workpiece 1 and the inner peripheral edge of the annular frame 9 of the expanding sheet 7 having the cooling necessity is cooled. In this way, a cooling space can be formed around the extension sheet 7, and therefore, a cooling chamber is not required. The expansion device 2 cools only a limited area, and therefore the expansion sheet 7 can be cooled efficiently.
Next, as a method of using the expanding device 2 of the present embodiment, a method of expanding the expanding sheet 7 by the expanding device 2 will be described. First, the workpiece unit 11 is carried into the expanding device 2. Fig. 2 schematically shows a cross-sectional view of the workpiece unit 11 and the expanding device 2 in a state of being carried into the expanding device 2. For convenience of explanation, the drawings shown below in fig. 2 are cross-sectional views of a part of the expansion device 2 and the like.
When the workpiece unit 11 is carried in, as shown in fig. 2, the annular frame 9 of the workpiece unit 11 is placed on the frame support portion 6 of the frame fixing unit 4, and the workpiece 1 is placed on the holding table 34 via the expanding sheet 7.
Next, the extension sheet 7 and the like are cooled. Fig. 3 shows a cross-sectional view of the extension device 2 cooling the extension piece 7 and the cooled extension piece 7. When the extension piece 7 is cooled, first, the cylinder 10 is operated to raise the rod 12, and the frame support portion 6 is raised until the annular frame 9 abuts against the upper frame pressing portion 8.
In this case, the annular frame 9 of the workpiece unit 11 is sandwiched between the frame support portion 6 and the frame pressing portion 8. At this time, the frame supporting portion 6 may be further raised, and the frame pressing portion 8 may be further raised via the ring frame 9.
Next, the open-close valve 26 of the cooling air supply source 30 is opened, and the compressed air is supplied from the compressed air supply source 28 to the vortex tube 24, so that the vortex tube 24 cools the compressed air. The generated cooling air passes through supply passage 18 of cooling air supply passage 20 formed in frame pressing portion 8, annular cooling passage 14, and branch passage 16, and reaches discharge ports 22. The cooling air is ejected from the ejection ports 22 toward a region between the workpiece 1 of the expansion piece 7 and the inner peripheral edge of the annular frame 9, thereby cooling the expansion piece 7.
The cooling air supply source 30 supplies cooling air to the annular cooling passage 14 to cool the frame fixing unit 4, and forms a cooling space around the workpiece 1 of the workpiece unit 11 having the annular frame 9 fixed by the frame fixing unit 4.
Further, the opening/closing valve 26 may be opened to start cooling the extension piece 7 with the cooling air after the annular frame 9 is placed on the frame support portion 6 and before the annular frame 9 is fixed by the frame fixing unit 4. As will be described later, the on-off valve 26 may be closed only when the expansion piece 7 is heated and contracted, and the on-off valve 26 may be opened all the time. The longer the opening/closing valve 26 is opened, the more the inside of the expansion device 2 can be sufficiently cooled.
In the case where DAF is disposed on the workpiece 1, the cooling unit 44 attached to the holding table (cooling plate) 34 may be operated as necessary to cool the workpiece 1 through the extending piece 7. In this case, a command for cooling the cooling unit 44 is input to the expansion device 2 in advance. The cooling unit 44 may start operating immediately when the command is input to the expansion device 2.
Next, the expanding piece 7 is expanded radially outward. Fig. 4 shows a cross-sectional view of the expansion device 2 expanding the expansion flap 7 and the expanded expansion flap 7. When the expanding piece 7 is expanded radially outward, the air cylinder 46 of the expanding unit 32 is operated to raise the rod 48, and the holding table 34 is raised.
In this case, the extension piece 7 is extended to apply a force directed radially outward to the workpiece 1, thereby generating cracks in the vertical direction from the modified layer 3, and dividing the workpiece 1 with the modified layer 3 as a starting point. When the object 1 is divided, the device chips 15 each having the device 5 are formed. The device chip 15 continues to be held on the expansion sheet 7.
After the expansion sheet 7 is expanded, the opening and closing valve 26 is closed and the operation of the cooling unit 44 is stopped, thereby stopping the cooling of the expansion sheet 7. However, the timing at which cooling of the extension piece 7 is stopped is not limited to this. For example, as described later, the cooling of the spread sheet 7 may be stopped after the spread of the spread sheet 7 is released, or the cooling of the spread sheet 7 may be stopped immediately before the spread sheet 7 is heated.
Then, the expansion of the expansion sheet 7 is released, and the expansion sheet 7 is heated and contracted. The process of shrinking the expansion sheet 7 by heating is also referred to as heat shrinkage. Fig. 5 shows a cross-sectional view of the expanding device 2 and the expanding sheet 7, in which heating is performed by removing the expansion of the expanding sheet 7.
When the expansion of the expansion piece 7 is released, the cylinder 46 is operated to lower the rod 48, and the holding table 34 is lowered. Here, the opening/closing valve 40 is opened in advance after the expansion of the expansion piece 7 and before the expansion of the expansion piece 7 is released. Then, the negative pressure generated by the suction source 42 is applied to the extension piece 7 of the workpiece unit 11 and the workpiece 1 via the suction path 36 and the suction port 38, and the extension piece 7 and the like are held on the holding table 34.
When the expansion of the expansion sheet 7 is released, the expansion sheet 7 is relaxed. At this time, since the region of the expansion piece 7 overlapping the workpiece 1 is fixed by the holding mechanism of the holding table 34, as shown in fig. 5, slack is concentrated in the region of the expansion piece 7 between the workpiece 1 and the inner peripheral edge of the annular frame 9.
Thereafter, the rotary motor 68 is operated to rotate the shutter 72 and move the opening 72a downward of the heating unit 56. Then, the on-off valve 62 is opened, air is supplied from the air supply source 60 to the air supply path 58, and the switch 66 is turned on to energize the coil heater 64, thereby heating the air. In this case, the air heated inside the air supply path 58 is supplied to the area of the expansion sheet 7 where the slack is generated through the opening 58a of the air supply path 58 and the opening 72a of the shutter.
Further, while the expansion device 2 is being operated, the switch 66 may be always on, and the supply and stop of the heated air may be switched by controlling the opening and closing of the on-off valve 62. A certain time is required from turning on the switch 66 until the coil heater 64 reaches a predetermined temperature, but if the switch 66 is always turned on, there is no need to wait for the temperature of the coil heater 64 to increase.
When the region of the expansion sheet 7 is heated and contracted by the heated air, the expansion sheet 7 is held in the expanded state in the region overlapping the workpiece 1 when the operation of the holding mechanism of the holding table 34 is stopped and the suction of the expansion sheet 7 is released. In this case, since the intervals between the device chips 15 are kept wide, the adjacent device chips 15 are less likely to contact each other when the workpiece unit 11 is transported later, and damage to the device chips 15 is suppressed.
Next, a modified example of the expanding apparatus of the present embodiment will be described. Fig. 6 to 9 schematically show cross-sectional views of the expanding device 80 of this modification. The expanding device 80 cools the expanding blade 7 of the workpiece unit 11 and expands the expanding blade 7, as in the expanding device 2 described above. The expansion device 80 will be explained below.
The expansion device 80 has basically the same components as the expansion device 2 and performs the same functions, but is different from the expansion device 2 in many respects. For example, in the expanding apparatus 80, the holding table (cooling plate) 124 is located above the height at which the workpiece unit 11 is carried in, and the sheet contracting unit 142 is located below the height.
Hereinafter, among the structures and functions of the respective components of the expansion device 80, the same structures and functions as those of the expansion device 2 may be omitted from the description. In this case, the description about the expansion device 2 can be appropriately referred to in the description of the expansion device 80.
The expansion device 80 has a housing 82, and the housing 82 houses the respective components of the expansion device 80. However, the housing 82 is not a cooling chamber, and the expansion device 80 does not have a mechanism for cooling the entire interior of the housing 82. An opening is formed in a side surface of the housing 82 as a carrying-in/out port 82a of the workpiece unit 11, and the opening can be opened and closed by an opening/closing door 82 b.
The expansion device 80 has a frame fixing unit 84, an expansion unit 112, a holding table (cooling plate) 124, and a sheet contracting unit 142 inside the housing 82. Unlike the expanding apparatus 2 shown in fig. 2 to 5, the expanding apparatus 80 carries the workpiece unit 11 in a state where the workpiece 1 is directed downward.
The frame fixing unit 84 has an annular frame support portion 86, and the frame support portion 86 can support the annular frame 9 of the workpiece unit 11. The frame support portion 86 has an opening 86a at the center. The upper ends of a plurality of rods 92 are connected to the lower surface of the frame support portion 86, and the lower ends of the rods 92 are respectively housed in the lifting mechanism such as the air cylinder 90. The frame fixing unit 84 further has a frame pressing portion 88 above the frame supporting portion 86. The frame pressing portion 88 is an annular member having an opening 88a at the center.
A sealing portion 88d made of a flexible member such as rubber or silicone resin is formed on the lower surface of the frame pressing portion 88. When the frame supporting portion 86 on which the ring frame 9 is placed is raised and the ring frame 9 is brought into contact with the lower surface of the frame pressing portion 88, the ring frame 9 is sandwiched and held between the frame supporting portion 86 and the frame pressing portion 88. At this time, even if the workpiece unit 11 warps or flexes, the sealing portion 88d abuts against the workpiece unit 11, and the frame pressing portion 88 and the workpiece unit 11 are sealed without a gap therebetween.
Further, a through hole 88b penetrating vertically is formed in the frame pressing portion 88. The frame pressing portion support bolt 88c is inserted through the through hole 88b so that the head is positioned below the through hole 88 b. The upper end of the frame pressing portion supporting bolt 88c on the opposite side to the head is fixed to, for example, an expanding roller supporting portion 114 described later, and the expanding roller supporting portion 114 is fixed to the housing 82. The frame pressing portion 88 can move upward by an external force.
For example, when the frame supporting portion 86 on which the ring frame 9 is placed is raised to bring the ring frame 9 into contact with the frame pressing portion 88, and then the frame supporting portion 86 is further raised, the frame pressing portion 88 is raised. The frame pressing portion 88 is preferably formed with a weight capable of firmly fixing the ring frame 9 so that the clamped ring frame 9 does not shift in position. In addition, when the expanding roller 116 described later is disposed to be movable up and down, the frame pressing portion 88 may be fixed.
A plurality of discharge ports 102 are formed in the frame pressing portion 88. A cooling air supply passage 100 is formed inside the frame pressing portion 88, and one end of the cooling air supply passage 100 communicates with the ejection port 102 and the other end communicates with a cooling air supply source 110. In the expanding device 80 shown in fig. 6 and the like, the plurality of ejection ports 102 are formed in the bottom surface of the frame pressing portion 88, but the formation position of the ejection ports 102 is not limited thereto. For example, the ejection port 102 may be formed in the inner peripheral wall surface of the frame pressing portion 88.
The cooling air supply passage 100 includes, for example, the annular cooling passage 94 and the plurality of branch passages 96. The cooling air supply passage 100 includes a supply passage 98, and one end of the supply passage 98 communicates with a cooling air supply source 110 and the other end reaches the annular cooling passage 94. The cooling air supply source 110 has a cooling mechanism such as a compressed air supply source 108 and a vortex tube 104. An opening/closing valve 106 is provided in a gas passage between the compressed air supply source 108 and the vortex tube 104.
The expansion unit 112 has an expansion roller support portion 114 that supports an expansion roller 116 from above. The extension roller support portion 114 has, for example, an arm portion having one end fixed to the housing 82. The arm portion extends toward the center of the housing 82 to above the inside of the opening 88a of the frame pressing portion 88. The extension roller support portion 114 has a hanging portion hanging downward from the other end of the arm portion, and an extension roller 116 is attached to a lower end of the hanging portion. The extension roller 116 may be vertically movable.
The frame support portion 86 of the frame fixing unit 84 is raised, the workpiece unit 11 having the annular frame 9 fixed to the frame fixing unit 84 is raised, and the extension sheet 7 included in the workpiece unit 11 is brought into contact with the extension roller 116. Then, when the frame support portion 86 is further raised to raise the workpiece unit 11, the expansion piece 7 expands radially outward.
In this case, the expanding roller support portion 114, the expanding roller 116, the frame support portion 86, the air cylinder 90, and the rod 92 function as an expanding unit 112 that expands the expanding sheet 7.
The holding table 124 can suck and hold the workpiece 1 through the expanding sheet 7. A plurality of suction ports 130 are formed in the lower surface of the holding table 124, and a suction passage 128 connected to each suction port 130 is formed inside the holding table 124. The suction path 128 is connected to a suction source 132 disposed outside the holding table 124. An on-off valve 134 is provided between the suction passage 128 and the suction source 132.
Further, a cooling unit 120 such as a piston cooler is provided on the holding table 124. The cooling unit 120 is supported by a table lifting unit 122. The table lifting unit 122 is provided outside the casing 82 of the expansion device 80, for example. When the table lifting/lowering unit 122 is operated, the holding table 124 can be lifted and lowered.
The portion other than the lower surface of the holding table 124 is covered with a table cover 126. The table cover 126 covers a part of the lower portion of the cooling unit 120. The table cover 126 suppresses cooling of the holding table 124 and the like. A gap is left between the table cover 126, the holding table 124, and the cooling unit 120, and this gap serves as a cooling air supply passage 136, and this cooling air supply passage 136 serves as a flow passage of air.
A vent hole is formed in an upper portion of the table cover 126, and one end of the cooling air supply passage 136 communicates with an external air supply source 138 through the vent hole. An on-off valve 140 is provided between the air supply source 138 and the cooling air supply passage 136. The other end of the cooling air supply path 136 that does not reach the air supply source 138 reaches between the lower surface of the holding table 124 and the table cover 126. The air passing through the cooling air supply passage 136 is finally ejected downward from the outer periphery of the holding table 124.
When the on-off valve 140 is opened in a state where the cooling unit 120 is operated, the air supplied from the air supply source 138 to the cooling air supply passage 136 is cooled by being brought into contact with the cooling unit 120 and the cooled holding table 124, and becomes cooling air.
For example, when the contact surface between the cooling unit 120 and the holding table 124 is cooled to about-40 ℃ by the piston cooler used in the cooling unit 120, the holding table 124 is cooled to about-30 ℃ by the cooling unit 120. Then, the cooling air cooled to about-5 ℃ to-10 ℃ in the cooling air supply path 136 is blown downward from the outer periphery of the holding table 124. The temperature of the cooling air blown out from the blow port 102 of the frame fixing unit 84 is, for example, about-5 ℃ to-10 ℃.
When the DAF 7a is disposed on the workpiece 1, if the workpiece 1 and the DAF 7a are cooled to about-5 ℃ to-10 ℃, the DAF 7a can be favorably divided together with the workpiece 1.
The sheet contracting unit 142 has: a rotary motor 144 provided on the bottom surface of the housing 82; a rotary shaft 146, the lower part of which is housed in the rotary motor 144; and a disc-shaped support plate 148 attached to an upper end of the rotary shaft 146. A plurality of heating units 150 are arranged on the upper surface of the support plate 148 at equal intervals along the outer peripheral edge of the support plate 148.
The heating unit 150 has an air supply path 152. The lower end of the air supply passage 152 is connected to an air supply source 154 via an on-off valve 156. A coil heater 158 is provided inside the air supply path 152. The coil heater 158 is connected to a power supply and switch 168. An opening 160 is provided in the upper surface of the air supply passage 152, and when the heating unit 150 is operated by opening the on-off valve 156, heated air is ejected upward from the opening 160.
The sheet contracting unit 142 includes a rotary motor 162 on the central upper surface of the support plate 148, and the rotary motor 162 houses a lower end of a rotary shaft 164 extending in the vertical direction and is rotatable about the rotary shaft 164. A shutter 166 is connected to an upper end of the rotary shaft 164. The shutter 166 has a plurality of openings 166a at positions corresponding to the arrangement of the heating unit 150 (see fig. 9).
When the expanding sheet 7 of the workpiece unit 11 that has been loosened is contracted by the sheet contraction unit 142, the rotary motor 162 is operated to align the position of each opening 166a with the position of each heating unit 150. Then, the heating unit 150 is operated to supply heated air to the extension sheet 7 through the opening 160 of the air supply passage 152 and the opening 166a of the shutter 166.
When the rotary motor 144 is operated while supplying the air heated by the heating unit 150 to the extension piece 7, the region between the object 1 to be processed of the extension piece 7, which is extended and loosened, and the inner peripheral edge of the annular frame 9 is heated over the entire circumferential range. Then, the expansion sheet 7 contracts.
Next, as a method of using the expanding device 80 of the present embodiment, a method of expanding the expanding sheet 7 by the expanding device 80 will be described. First, the workpiece unit 11 is loaded into the housing 82 of the expanding device 80 from the loading/unloading port 82 a.
Fig. 6 schematically shows a cross-sectional view of the workpiece unit 11 and the expanding device 80 in a state of being carried into the expanding device 80. When the workpiece unit 11 is carried in, the ring frame 9 is placed on the frame support portion 86 as shown in fig. 6. After the workpiece unit 11 is housed in the housing 82, the open/close door 82b is moved to close the carry-out/carry-in port 82 a.
Next, the workpiece 1, the expansion sheet 7, and the like are cooled. As shown in fig. 7, the table elevation unit 122 is operated to lower the holding table 124 (cooling plate), and the holding table 124 is brought close to the extension sheet 7. Then, the cooling unit 120 is operated, and the on-off valve 140 is opened, so that the air is supplied from the air supply source 138 to the cooling air supply passage 136, and the air is cooled in the cooling air supply passage 136. Further, since it takes time to cool the cooling unit 120 to a predetermined temperature after the cooling unit is operated again once it is stopped, the cooling unit may be operated at all times.
The cooled air is supplied from the outer periphery of the holding table 124 to the extending piece 7, so that the extending piece 7, the DAF 7a, and the workpiece 1 are cooled. In this case, the holding table (cooling plate) 124 may be brought into contact with the extension sheet 7 to cool the DAF 7a and the workpiece 1 via the extension sheet 7.
Next, the expanding piece 7 is expanded radially outward. Fig. 8 shows a cross-sectional view of the expanding device 80 for expanding the expanding blade 7 and the expanded expanding blade 7. When the extension sheet 7 is extended, the table lifting and lowering unit 122 is operated in advance to lift the holding table 124. However, if the lower surface of the holding table 124 does not reach a position below the lower end of the expanding roller 116, it is not necessary to raise the holding table 124.
However, like the extension sheet 7, the DAF 7a becomes hard when cooled, and is less likely to elongate when an external force is applied, and is likely to break. Therefore, when the DAF 7a is cooled to appropriately divide the DAF 7a, only the region of the extension piece 7 overlapping the workpiece 1 is cooled. In this case, a large temperature difference occurs between the region and the peripheral region of the region in the expansion sheet 7.
When the expansion sheet 7 is expanded in a state where the peripheral region of the expansion sheet 7 has a temperature higher than that of the region overlapping with the workpiece 1, the peripheral region is greatly expanded. In the region overlapping the workpiece 1, the extension of the extension piece 7 is reduced, and the workpiece 1 cannot be divided appropriately.
Therefore, the opening/closing valve 106 is opened, and the cooling air is supplied from the discharge port 102 to the extension piece 7 through the cooling air supply passage 100, thereby cooling the extension piece 7 in advance. If the temperature difference is small in each region of the expansion sheet 7, the expansion sheet 7 is uniformly stretched as a whole when the expansion sheet 7 is expanded, and the workpiece 1 is appropriately divided.
When the extension piece 7 is extended radially outward, the cylinder 90 is operated to raise the rod 92, thereby raising the frame support portion 86 and bringing the extension piece 7 of the workpiece unit 11 into contact with the extension roller 116. Thereafter, when the frame support portion 86 is further raised, the spread sheet 7 spreads radially outward, and the object 1 and the DAF 7a are divided into the device chips 15 each having the DAF 7 a.
In the expanding device 80, since the workpiece 1 is divided in a state where the workpiece 1 is disposed below the expanding piece 7, chips and the like generated along with the division of the workpiece 1 and the like fall downward. Therefore, even if the chips and the like scatter, the chips and the like are not easily attached to the devices 5 and the like formed on the front surface of the workpiece 1.
In the expanding apparatus 80, since the DAF 7a is cooled in addition to the expanding sheet 7, the extension of the expanding sheet 7 and the DAF 7a is suppressed, and the DAF 7a can be appropriately divided together with the workpiece 1. After the extension piece 7 is extended, the opening/closing valve 140 and the opening/closing valve 106 are closed and the operation of the cooling unit 120 is stopped, thereby stopping the cooling of the extension piece 7 and the like. Further, if the operation of the cooling unit 120 is stopped, it takes time to reach a predetermined temperature when the operation is resumed, and therefore the operation may not be stopped.
Next, the expansion of the expansion sheet 7 is released and the expansion sheet 7 is heated to be contracted. Fig. 9 shows a cross-sectional view of the expanding device 80 that releases the expansion of the expanding sheet 7 and heats the expanding sheet 7.
Before the extension of the extension piece 7 is released, the table elevation unit 122 is operated to lower the holding table 124, and the lower surface of the holding table 124 is brought into contact with the extension piece 7 of the workpiece unit 11. Then, the opening/closing valve 134 is opened, and the negative pressure generated by the suction source 42 is applied to the extension piece 7 of the workpiece unit 11 and the workpiece 1 via the suction passage 128 and the suction port 130, whereby the workpiece 1 is held on the holding table 124 via the extension piece 7.
When the expansion of the expansion sheet 7 is released, the expansion sheet 7 is loosened. To remove the slack, first, the rotary motor 162 is operated to move the opening 166a of the shutter 166 upward of the heating unit 150. Then, the on-off valve 156 is opened, air is supplied from the air supply source 154 to the air supply passage 152, and the switch 168 is turned on to energize the coil heater 158, thereby heating the air.
In addition, as in the above-described expansion apparatus 2, the switch 168 may be always turned on in the expansion apparatus 80. In this case, the start and stop of heating of the extension piece 7 are switched by opening and closing the opening and closing valve 156.
The air heated in the air supply passage 152 is supplied to the expansion sheet 7, and when the region between the workpiece 1 of the expansion sheet 7 and the inner peripheral edge of the ring frame 9 is heated, the expansion sheet 7 contracts. When the suction of the extension piece 7 by the holding mechanism of the holding table 124 is released, the extension piece 7 is held in an extended state in a region overlapping the workpiece 1.
Even in the expansion device 80, the cooling space can be formed only in a limited region around the expansion sheet 7 inside the housing 82. Therefore, the housing 82 does not need to be a cooling chamber, and the extension device 80 can cool the extension sheet 7 very efficiently.
The present invention is not limited to the above-described embodiments, and can be implemented by being variously modified. For example, in the above-described embodiment, the case where the extension piece 7 is cooled in the region between the workpiece 1 of the extension piece 7 and the inner peripheral edge of the annular frame 9 and the portion overlapping the workpiece 1 has been described, but one embodiment of the present invention is not limited to this.
For example, the cooling air may be supplied to a region between the workpiece 1 of the extension piece 7 and the inner peripheral edge of the annular frame 9 to cool only the region. In this case, since the expansion piece 7 is not easily stretched in this region, when the expansion piece 7 is expanded, the portion of the expansion piece 7 overlapping the workpiece 1 is easily stretched, and the workpiece 1 can be more reliably divided. However, if the DAF 7a is provided on the workpiece 1, the DAF 7a is difficult to divide.
In the above embodiment, the case where the ejection ports 22 and 102 of the cooling air for cooling the extending piece 7 are formed in the frame pressing portions 8 and 88, and the frame pressing portions 8 and 88 have the cooling air supply passages 20 and 100 has been described. In one embodiment of the present invention, the frame support portion 6, 86 may have the cooling air discharge port 22, 102 and the cooling air supply passage 20, 100. The cooling air discharge ports 22 and 102 and the cooling air supply passages 20 and 100 may be formed in other components.
The structure, method, and the like of the above-described embodiments can be implemented by making appropriate changes within a range not departing from the object of the present invention.

Claims (3)

1. An expanding device for expanding an expanding piece of a workpiece unit, the workpiece unit comprising: a workpiece; the expansion sheet is stuck to the processed object; and a ring frame to which the outer peripheral side of the extension piece is adhered,
the expansion device has:
a frame fixing unit having a frame supporting portion capable of supporting the annular frame of the workpiece unit and a frame pressing portion capable of clamping the annular frame together with the frame supporting portion; and
an expanding means capable of expanding an expanding sheet included in a workpiece unit having an annular frame fixed by the frame fixing means,
the frame fixing unit has an ejection port and a cooling air supply path having one end communicating with the ejection port and the other end communicating with a cooling air supply source,
the ejection port is capable of ejecting the cooling air supplied from the cooling air supply source toward the following region of the expansion sheet included in the workpiece unit having the annular frame fixed by the frame fixing unit: the region is a region between the workpiece and the inner periphery of the annular frame.
2. Expansion device according to claim 1,
a plurality of the ejection ports are formed on the frame fixing unit in a ring-like arrangement,
the cooling air supply path includes: an annular cooling circuit; a plurality of branch paths extending from the annular cooling path to the plurality of discharge ports, respectively; and a supply passage having one end communicating with the cooling air supply source and the other end reaching the annular cooling passage,
the cooling air supply source is configured to supply cooling air to the annular cooling passage to cool the frame fixing unit, thereby forming a cooling space around the workpiece having the workpiece unit of the annular frame fixed by the frame fixing unit.
3. Expansion device according to claim 1 or 2,
the expansion device further includes a cooling plate capable of contacting the workpiece included in the workpiece unit via an expansion sheet included in the workpiece unit having the annular frame fixed by the frame fixing unit.
CN202010079512.7A 2019-02-06 2020-02-04 Expansion device Pending CN111540693A (en)

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