CN111540510A - Intermediate frequency signal transmission structure and electronic equipment - Google Patents

Abstract

The present disclosure relates to an intermediate frequency signal transmission structure and an electronic device. The intermediate frequency signal transmission structure includes at least two connection areas and a wiring area arranged between the two connection areas; the connection area and the wiring area Each region includes a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer, and a third metal layer that are stacked; the first metal layer and the third metal layer are grounded, and the second metal layer is grounded. The metal layer includes a signal transmission part, and the signal transmission part includes at least one signal line for transmitting an intermediate frequency signal. The intermediate frequency signal transmission structure provided by the embodiments of the present disclosure has low signal transmission loss, greatly increases the transmission distance of the intermediate frequency signal, and greatly improves the flexibility of use. The intermediate frequency signal transmission structure provided by the embodiment of the present disclosure occupies a small area and volume of the whole machine, and has a wide application prospect.

Description

Intermediate frequency signal transmission structure and electronic equipment

technical field

The present disclosure relates to the field of communication technologies, and in particular, to an intermediate frequency signal transmission structure and an electronic device.

Background technique

For the 5G NR era, communication systems will face challenges in the following aspects: rapidly increasing data traffic, extremely high data transmission rates, extremely low time delays, extreme user mobility, ultra-high density, deep coverage, and high reliability sex, high security. The millimeter wave communication of 5G NR is the future development trend. Intelligent terminal equipment using 5G millimeter wave band communication, due to the large bandwidth of millimeter wave (up to 400MHz), in order to achieve efficient transmission and reception of ultra-high bandwidth and maintain system stability, it is inevitable to use intermediate frequency (super-heterodyne system) , in order to achieve the purpose of transmitting and receiving the baseband signal to the millimeter-wave frequency band after multiple modulations.

The modules of millimeter wave communication mainly include 5G millimeter wave antenna array modules and millimeter wave intermediate frequency chips. Usually the antenna array module is installed separately on the terminal structure (the number is more than one, and the position is variable), and the IF chip is soldered on the motherboard according to the design method of the conventional chip. Then, an additional connection structure needs to be designed between the millimeter wave antenna array module and the intermediate frequency chip to complete the communication between the antenna array and the intermediate frequency chip. The connection structure needs to include 2 or 3 signal lines for transmitting intermediate frequency signals with a frequency of 7.5GHZ-12GHZ.

In the prior art, the connection structure is usually designed as an FPC (Flexible Printed Circuit, flexible circuit board) or a coaxial cable. The structural characteristics of the FPC make it still have a large signal loss in signal transmission, so the FPC can only achieve intermediate frequency communication within a short distance (such as 20-30mm). This makes FPC less flexible to use. The coaxial cable has a thick shape, occupies a large area, and uses more snap-fit seats, increasing the cost. Therefore, there is still a lack of a better transmission structure for intermediate frequency signal transmission.

SUMMARY OF THE INVENTION

In order to solve the above technical problems or at least partially solve the above technical problems, the present disclosure provides an intermediate frequency signal transmission structure and an electronic device.

In a first aspect, an embodiment of the present disclosure provides an intermediate frequency signal transmission structure, including at least two connection areas and a wiring area disposed between the two connection areas;

The connection area and the wiring area both include a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer and a third metal layer that are stacked and arranged;

The first metal layer and the third metal layer are grounded, the second metal layer includes a signal transmission part, and the signal transmission part includes at least one signal line for transmitting an intermediate frequency signal.

In some embodiments, the second metal layer further includes a shield;

the shielding portion is electrically insulated from the signal transmission portion, and the shielding portion is grounded;

The shielding portion surrounds the signal line.

In some embodiments, the signal transmission section includes at least two signal lines;

The shielding portion is provided with a plurality of hollow signal line layout areas, and only one of the signal lines is arranged in each of the signal line layout areas.

In some embodiments, the intermediate frequency signal transmission structure further includes a plurality of first through holes;

The first through hole simultaneously penetrates the first metal layer, the first dielectric layer, the shielding portion of the second metal layer, the second dielectric layer and the third metal layer; the first The through hole is filled with conductive material, so that the first metal layer, the shielding portion of the second metal layer, and the third metal layer are all electrically connected;

The plurality of first through holes are located at at least one of the following positions:

Between any two adjacent signal lines in the wiring area, between the signal line closest to the edge of the intermediate frequency signal transmission structure in the wiring area and its closest edge, and the connection area.

In some embodiments, at least part of the plurality of first vias are located between any two adjacent signal lines in the routing area;

All the first through holes located between two adjacent signal lines in the routing area are arranged along the extending direction of the signal lines to form two rows; any two adjacent first through holes in the same row are arranged in two rows. The distance between the holes is equal, which is the first distance;

The two rows of the first through holes are mutually displaced by 1/2 of the first distance.

In some embodiments, at least a part of the plurality of first through holes are located between the signal line closest to the edge of the intermediate frequency signal transmission structure in the trace area and the closest edge thereof;

All the first through holes located between the signal line closest to the edge of the intermediate frequency signal transmission structure and its closest edge in the trace area are arranged along the extension direction of the signal line to form a row, and any phase in the same row is arranged. The distance between two adjacent first through holes is equal.

In some embodiments, the dielectric constants of the first dielectric layer and the second dielectric layer are both less than or equal to 3.3, and the loss factor is less than or equal to 0.0018.

In some embodiments, the materials of the first dielectric layer and the second dielectric layer are liquid crystal polymers, and the materials of the first metal layer, the second metal layer and the third metal layer are All are copper.

In some embodiments, the impedance of any one of the signal lines is greater than or equal to 47.5Ω and less than or equal to 52.5Ω.

In a second aspect, an embodiment of the present disclosure further provides an electronic device, including any of the intermediate frequency signal transmission structures provided by the embodiments of the present disclosure.

Compared with the prior art, the technical solutions provided by the embodiments of the present disclosure have the following advantages:

The intermediate frequency signal transmission structure provided by the embodiments of the present disclosure has low signal transmission loss, greatly increases the transmission distance of the intermediate frequency signal, and greatly improves the flexibility of use.

The intermediate frequency signal transmission structure provided by the embodiment of the present disclosure occupies a small area and volume of the whole machine, and has a wide application prospect.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description serve to explain the principles of the disclosure.

In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the accompanying drawings that are required to be used in the description of the embodiments or the prior art will be briefly introduced below. In other words, on the premise of no creative labor, other drawings can also be obtained from these drawings.

FIG. 1 is a schematic structural diagram of an intermediate frequency signal transmission structure according to an embodiment of the present disclosure;

Fig. 2 is a schematic diagram of a cross-sectional structure along C1-C2 in Fig. 1;

3 is a schematic structural diagram of the first metal layer in FIG. 1;

FIG. 4 is a schematic structural diagram of the second metal layer in FIG. 1;

FIG. 5 is a schematic diagram of a partial structure of the second metal layer in FIG. 4;

FIG. 6 is a schematic structural diagram of another intermediate frequency signal transmission structure provided by an embodiment of the present disclosure;

7-9 provide schematic diagrams of three practical application scenarios of the intermediate frequency signal transmission structure provided by the present disclosure;

10 is a schematic partial cross-sectional structural diagram of another intermediate frequency signal transmission structure provided by an embodiment of the present disclosure;

FIG. 11 is a schematic partial structure diagram of another second metal layer according to an embodiment of the present disclosure;

FIG. 12 is a schematic partial structure diagram of a third metal layer according to an embodiment of the present disclosure;

13 is a schematic cross-sectional structural diagram of a connection area of an intermediate frequency signal transmission structure provided by an embodiment of the present disclosure;

FIG. 14 is a schematic partial structure diagram of another second metal layer according to an embodiment of the present disclosure;

FIG. 15 is an equivalent circuit of the structure where the signal connection holes are provided in the present disclosure;

FIG. 16 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure.

Detailed ways

In order to more clearly understand the above objects, features and advantages of the present disclosure, the solutions of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features in the embodiments may be combined with each other under the condition of no conflict.

Many specific details are set forth in the following description to facilitate a full understanding of the present disclosure, but the present disclosure can also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only a part of the embodiments of the present disclosure, and Not all examples.

FIG. 1 is a schematic structural diagram of an intermediate frequency signal transmission structure according to an embodiment of the present disclosure. FIG. 2 is a schematic diagram of a cross-sectional structure along C1-C2 in FIG. 1 . FIG. 3 is a schematic structural diagram of the first metal layer in FIG. 1 . FIG. 4 is a schematic structural diagram of the second metal layer in FIG. 1 . FIG. 5 is a schematic diagram of a partial structure of the second metal layer in FIG. 4 . 1-5, the intermediate frequency signal transmission structure includes at least two connection areas A (exemplarily, the intermediate frequency signal transmission structure in FIG. 1 includes two connection areas A) and a The wiring area B; the connection area A and the wiring area B both include a first metal layer 11, a first dielectric layer 12, a second metal layer 13, a second dielectric layer 14 and a third metal layer 15 that are stacked and arranged; the first The metal layer 11 and the third metal layer 15 are grounded, the second metal layer 13 includes a signal transmission part 131, and the signal transmission part 131 includes at least one signal line 1310 (exemplarily, the signal transmission part 131 in FIG. 4 and FIG. 5 includes two Signal line 1310) for transmitting intermediate frequency signals.

The essence of the above technical solution is to make the first metal layer 11 , the second metal layer 13 and the third metal layer 15 form a stacked structure, and use the second metal layer 13 to make the signal line 1310 , and the first metal layer 11 and the third metal layer 13 . The metal layer 15 is used as a shielding layer to shield the intermediate frequency electrical signal transmitted on the signal line 1310, suppress the interference of various electromagnetic waves propagating through space to the intermediate frequency signal, and at the same time reduce the radiation of the intermediate frequency signal and reduce the transmitted intermediate frequency signal. transmission loss. Therefore, compared with the existing flexible circuit board, the above technical solution can greatly increase the transmission distance of the intermediate frequency signal, and greatly improve the flexibility of use.

On the basis of the above technical solution, optionally, in the intermediate frequency signal transmission structure, the second metal layer 13 further includes a shielding portion 132; the shielding portion 132 is electrically insulated from the signal transmission portion 131, and the shielding portion 132 is grounded; The portion 132 surrounds the signal line 1310 . This setting can further suppress the interference of various electromagnetic waves propagating through space to the intermediate frequency signal, at the same time reduce the radiation of the intermediate frequency signal, reduce the transmission loss of the transmitted intermediate frequency signal, increase the transmission distance of the intermediate frequency signal, and improve the flexibility of use. .

Continuing to refer to FIG. 5 , optionally, the signal transmission part 131 includes at least two signal lines 1310 ; the shielding part 132 is provided with a plurality of hollow signal line layout areas 1320 (exemplarily, the shielding part 132 in FIG. 5 is provided with There are two hollow signal line layout areas 1320 ), and only one signal line 1310 is arranged in each signal line layout area 1320 . The essence of this arrangement is that at least part of the shielding portion 132 is located between two adjacent signal lines 1310 . In this way, the signals transmitted by the two adjacent signal lines 1310 can be prevented from interfering with each other, the transmission loss of the transmitted intermediate frequency signal can be reduced, and the transmission distance of the intermediate frequency signal can be further increased.

Studies have shown that the dielectric constant and loss factor of the dielectric layers (including the first dielectric layer 12 and the second dielectric layer 14 ) will affect the transmission loss rate of the intermediate frequency signal it transmits. Therefore, in practice, it is necessary to make the dielectric layer material maintain a constant dielectric constant and loss tangent (loss factor Df) in the radio frequency range between 8GHZ and 15GHZ. Therefore, optionally, on the basis of the above technical solutions, the dielectric constants of the first dielectric layer 12 and the second dielectric layer 14 are both set to be less than or equal to 3.3 and the loss factor to be less than or equal to 0.0018 to further reduce the signal transmission process. The transmission loss of the intermediate frequency signal increases the transmission distance of the intermediate frequency signal.

On this basis, optionally, the materials of the first dielectric layer 12 and the second dielectric layer 14 can be set to be liquid crystal polymer, and the materials of the first metal layer 11 , the second metal layer 13 and the third metal layer 14 All are copper. On the one hand, the materials of the first dielectric layer 12 and the second dielectric layer 14 meet the requirements that the dielectric constant is less than or equal to 3.3 and the loss factor is less than or equal to 0.0018, which is beneficial to reduce the transmission loss of the intermediate frequency signal during the signal transmission process. , to increase the transmission distance of the intermediate frequency signal; on the other hand, by selecting the above materials, the final product of the signal transmission structure can be a flexible board, which is very light and thin. Compared with the coaxial cable, the intermediate frequency signal transmission structure provided by the present disclosure occupies a small area and volume of the whole machine, which can expand its usage scenarios.

Continuing to refer to FIG. 2, the intermediate frequency signal transmission structure may further include a first protective layer 16 and a second protective layer 17; the first protective layer 16 is located on the side of the first metal layer 11 away from the first dielectric layer 12; the second protective layer 17 is located on the side of the third metal layer 15 away from the second dielectric layer 14 . By arranging the first protective layer 16 and the second protective layer 17, the first metal layer 11 and the third metal layer 15 can be protected, so as to prolong the service life of the intermediate frequency signal transmission structure.

In practice, it is necessary to set connection pins in the connection area of the intermediate frequency signal transmission structure, so as to realize the purpose of connecting with the antenna array module (or the intermediate frequency chip). The intermediate frequency signal transmission structure may further include a reinforcement layer, the reinforcement layer is located in the connection area, and the reinforcement layer and the connection pins are respectively located on two opposite surfaces. Providing the reinforcement layer can increase the strength of the connection area, so as to facilitate the subsequent connection of the connection pins in the connection area to the antenna array module (or the intermediate frequency chip).

Exemplarily, Table 1 shows the parameters of the material and thickness of each film layer of an intermediate frequency signal transmission structure provided by the embodiments of the present disclosure.

The research shows that using the intermediate frequency signal transmission structure shown in Table 1, when the length of the routing area of the intermediate frequency signal transmission structure is 95mm, the transmitted signal loss is less than or equal to 3.5dB, which can meet the requirements of the actual intelligent terminal transmission intermediate frequency signal requirements.

Further, the impedance of any signal line can be set to be greater than or equal to 47.5Ω and less than or equal to 52.5Ω. In practice, by controlling the line width of the signal line, the thickness of the signal line, the distance between the signal line and the shielding part next to it, the thickness of the two dielectric layers, the material (dielectric constant) of the dielectric layer, etc. The impedance of the signal line meets the above requirements.

Optionally, the roughness of the first metal layer 11 , the second metal layer 13 and the third metal layer 15 may be set to be less than or equal to 1.8 μm to further reduce the signal loss of the intermediate frequency signal transmission structure.

It should be noted that, it can be found from Table 1 that in the intermediate frequency signal transmission structure, the surface of the first protective layer away from the second protective layer is taken as the first surface, and the surface of the second protective layer away from the first protective layer is taken as the first surface. Two surfaces, the first surface and the second surface are opposite. One of the reinforcing layers of the two connecting regions is located on the first surface and the other is located on the second surface. This is only a specific example provided by the present disclosure, rather than a limitation of the present disclosure. In practice, the reinforcing layers of the two connecting regions can be arranged on the first surface, or the reinforcing layers of the two connecting regions can be arranged on the second surface.

At least part of the area in the routing area B in the intermediate frequency signal transmission structure can be set as a bendable structure to meet the requirements of different application scenarios. FIG. 6 is a schematic structural diagram of another intermediate frequency signal transmission structure provided by an embodiment of the present disclosure. Exemplarily, in FIG. 6 only the region E is provided as a bendable structure.

7-9 provide schematic diagrams of three practical application scenarios of the intermediate frequency signal transmission structure provided by the present disclosure. Referring to Figures 7-9, when in use, connect the connection area A1 to the IF chip soldered on the motherboard, and connect the connection area A2 to the antenna array module located on the side wall of the battery slot.

FIG. 10 is a schematic partial cross-sectional structural diagram of another intermediate frequency signal transmission structure provided by an embodiment of the present disclosure. FIG. 11 is a schematic partial structure diagram of another second metal layer according to an embodiment of the present disclosure. Referring to FIGS. 10 and 11 , on the basis of the above technical solutions, optionally, the intermediate frequency signal transmission structure further includes a plurality of first through holes 20 ; the first through holes 20 simultaneously penetrate the first metal layer 11 and the first medium. layer 12 , the shielding portion 132 of the second metal layer 13 , the second dielectric layer 14 and the third metal layer 15 . The first through hole 20 is filled with conductive material, so that the first metal layer 11 , the shielding portion 132 of the second metal layer 13 , and the third metal layer 15 are all electrically connected. The plurality of first through holes 20 are located at at least one of the following positions: between any two adjacent signal lines 1310 in the routing area B, and the signal line 1310 in the routing area B that is closest to the edge of the intermediate frequency signal transmission structure and its Between the nearest edges, and the connection area A. The first through hole 20 has two functions: first, since the first metal layer 11 , the shielding portion 132 of the second metal layer 13 and the third metal layer 15 are all grounded, the first through hole 20 can make the first metal layer 11 , the shielding part 132 of the second metal layer 13 and the third metal layer 15 are connected to increase the return area of the signal; second, an electrical wall can be formed around the transmitted intermediate frequency signal to control the isolation between the signal lines 1310 and prevent the intermediate frequency The signal is radiated outward, which increases the shielding effect and reduces the probability of crosstalk between signals.

Optionally, the conductive material in the first through hole 20 is the same as the material of the third metal layer 15 . In this way, during fabrication, the first through hole 20 can be fabricated after the first dielectric layer 12 is fabricated, and the subsequent fabrication of the third metal layer 15 and filling of the first through hole 20 can be completed in the same fabrication process, which can simplify fabrication. process to improve production efficiency.

Optionally, in the actual setting, the distance between two adjacent through holes 20 can be set to be less than or equal to 1/4 of the wavelength of the intermediate frequency signal transmitted by the intermediate frequency signal transmission structure, so as to further ensure that the transmitted signal cannot go out. radiation.

On the basis of the above technical solutions, optionally, the distance between the first through hole 20 in the routing area B and the signal line 1310 and the distance between the signal line 1310 and the shielding portion 132 beside it are slightly larger than that of the dielectric layer (eg thickness of the first dielectric layer 12 and the second dielectric layer 14). This not only ensures that the impedance control of the signal line 1310 is accurate enough, but also prevents signal radiation.

Since the signal crosstalk between any two adjacent signal lines 1310 in the routing area is the most serious, optionally, referring to FIG. 11 , at least some of the plurality of first through holes 20 are arranged at any two adjacent signal lines 1310 in the routing area. between. Further, referring to FIG. 11 , all the first through holes 20 located between two adjacent signal lines 1310 in the routing area can be arranged to form two rows along the extending direction of the signal lines 1310 ; any two adjacent first through holes 20 in the same row The distances between the through holes 20 are the same, which is the first distance; the first through holes 20 in the two rows are displaced from each other by 1/2 of the first distance. Compared with the solution in which all the first through holes 20 located between two adjacent signal lines 1310 in the routing area B are arranged along the extending direction of the signal lines 1310 to form a row, two adjacent signal lines 1310 located in the routing area B are arranged. All the first through holes 20 between them are arranged along the extension direction of the signal line 1310 to form two rows; the distance between any two adjacent first through holes 20 in the same row is equal, which is the first distance; two rows of first through holes 20 are mutually displaced by 1/2 of the first distance, which can reduce the number of the first through holes 20 to be fabricated and reduce the fabrication difficulty.

Optionally, on the basis of the above technical solution, continue to refer to FIG. 11 , at least part of the plurality of first through holes 20 may be arranged between the signal line 1310 closest to the edge of the intermediate frequency signal transmission structure in the routing area and the closest edge thereof. All the first through holes 20 located between the signal line 1310 closest to the edge of the intermediate frequency signal transmission structure in the routing area B and its closest edge are arranged along the extension direction of the signal line 1310 to form a row, and any two adjacent ones in the same row are arranged in a row. The distances between the first through holes 20 are equal. Since the signal line 1310 closest to the edge of the IF signal transmission structure has no signal line 1310 on its adjacent edge side, the probability of crosstalk between signals at this position is low, and a row of the first through holes 20 can achieve a better shielding effect. And only arranging one row of the first through holes 20 can reduce the size between the signal line 1310 closest to the edge of the IF signal transmission structure and its closest edge, making the IF signal transmission structure more compact.

If the first through holes 20 are located in the connection area, the first through holes 20 may be randomly distributed in the connection area.

As mentioned above, in practice, connection pins need to be set in the connection area of the intermediate frequency signal transmission structure to achieve the purpose of connecting with the antenna array module (or the intermediate frequency chip). There are two main types of connection pins: one is a ground pin, and the other is a signal transmission pin. The first metal layer 11, the shielding portion 132 of the second metal layer 13, and the third metal layer 15 in the intermediate frequency signal transmission structure all need to be electrically connected to the ground pin; and the signal line 1310 needs to be electrically connected to the signal transmission pin .

FIG. 12 is a schematic partial structure diagram of a third metal layer according to an embodiment of the present disclosure. FIG. 13 is a schematic cross-sectional structural diagram of a connection area of an intermediate frequency signal transmission structure according to an embodiment of the present disclosure. Continuing to refer to FIG. 12 and FIG. 13 , optionally, part of the first through holes 20 in the connection area may be multiplexed as grounding holes 21 (exemplarily, a total of four first through holes 20 in FIG. 12 are multiplexed as grounding holes 21 ) hole 21). Specifically, referring to FIG. 13 , it is assumed that the ground pins of the intermediate frequency signal transmission structure need to be fabricated on the side of the second protective layer 17 away from the third metal layer 15 . The ground holes 21 penetrate through the first metal layer 11 and the first dielectric The layer 12 , the shielding portion 132 of the second metal layer 13 , the second dielectric layer 14 and the third metal layer 15 also penetrate the second protective layer 17 , and the conductive material fills the ground hole 21 to form a first conductive structure. On the side of the second protective layer 17 facing away from the third metal layer 15 , the second protective layer 17 is flush with the first conductive structure in the grounding hole 21 . The part of the first conductive structure exposed outside the second protective layer 17 is used as a ground pin of the intermediate frequency signal transmission structure. It should be noted that, in practice, the ground pin of the intermediate frequency signal transmission structure can also be formed on the side of the first protective layer away from the first metal layer, and its specific structure is similar to that in FIG.

FIG. 14 is a schematic partial structure diagram of another second metal layer according to an embodiment of the present disclosure. Referring to FIGS. 13 and 14 , further, the signal transmission part 131 of the second metal layer 13 that can be arranged in the connection area of the intermediate frequency signal transmission structure further includes an auxiliary connection piece 1311 , and the auxiliary connection piece 1311 and the signal line 1310 are located in the same layer and electrically connected. A signal connection hole 22 is also provided in the connection area of the intermediate frequency signal transmission structure, and the signal connection hole penetrates through the second dielectric layer 14 , the third metal layer 15 and the second protective layer 17 . And the signal connection hole 22 exposes the auxiliary connection member 1311 , and the conductive material fills the signal connection hole 22 to form a second conductive structure. On the side of the second protective layer 17 facing away from the third metal layer 15 , the second protective layer 17 is flush with the second conductive structure in the signal connection hole 22 . The part of the second conductive structure exposed outside the second protective layer 17 is used as a signal transmission pin of the intermediate frequency signal transmission structure.

The present disclosure does not limit the size of the signal connection hole 22, the size of the auxiliary connection member 1311, etc., as long as the signal lines have good isolation. FIG. 15 is an equivalent circuit of the structure where the signal connection holes are provided in the present disclosure. Referring to FIG. 15 , the structure where the signal connection hole 22 is set can be equivalent to a PI circuit, which is composed of two capacitors and one inductor. Based on the PI circuit, the optimal solution of each parameter of the signal connection hole 22 can be obtained after the simulation calculation, so that the impedance of the second conductive structure at the signal connection hole 22 can be controlled in the range of 50Ω, which is consistent with the impedance of the signal line 1310 and decreases The impedance of the signal line 1310 is abruptly changed. For example, the diameter of the signal connection hole 22 can be set to be 3.5433 mil, the diameter of the auxiliary connector 1311 can be set to be 7.874 mil, and the distance between the signal connection hole 22 and the surrounding ground metal layer is 14.34 mil.

Optionally, in the connection area, the auxiliary connector 1311 is not in the extending direction of the signal line 1310, and the auxiliary connector 1311 and the signal line 1310 are connected by an arc (see area F in FIG. 12 and area M in FIG. 14). Such setting can reduce the sudden change of impedance of the signal line 1310 .

Continuing to refer to FIG. 14 , optionally, the auxiliary connector 1311 can be set to be in the shape of a teardrop, which can also reduce the sudden change of impedance of the signal line 1310 .

FIG. 16 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. Referring to FIG. 16 , the electronic device includes any one of the intermediate frequency signal transmission structures 100 provided by the embodiments of the present disclosure.

Since the electronic device provided by the embodiment of the present disclosure includes any intermediate frequency signal transmission structure provided in the embodiment of the present disclosure, it has the same or corresponding beneficial effects as the intermediate frequency signal transmission structure included in the electronic device, which is not repeated here.

It should be noted that, in this document, relational terms such as "first" and "second" etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply these There is no such actual relationship or sequence between entities or operations. Moreover, the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method, article or device that includes a list of elements includes not only those elements, but also includes not explicitly listed or other elements inherent to such a process, method, article or apparatus. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in a process, method, article or apparatus that includes the element.

The above descriptions are only specific embodiments of the present disclosure, so that those skilled in the art can understand or implement the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure is not intended to be limited to the embodiments described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. an intermediate frequency signal transmission structure, is characterized in that, comprises at least two connection areas and the wiring area that is arranged between two described connection areas; The connection area and the wiring area both include a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer and a third metal layer that are stacked and arranged; The first metal layer and the third metal layer are grounded, the second metal layer includes a signal transmission part, and the signal transmission part includes at least one signal line for transmitting an intermediate frequency signal. 2. The intermediate frequency signal transmission structure according to claim 1, wherein the second metal layer further comprises a shielding part; the shielding portion is electrically insulated from the signal transmission portion, and the shielding portion is grounded; The shielding portion surrounds the signal line. 3. The intermediate frequency signal transmission structure according to claim 2, wherein the signal transmission part comprises at least two signal lines; The shielding portion is provided with a plurality of hollow signal line layout areas, and only one of the signal lines is arranged in each of the signal line layout areas. 4. The intermediate frequency signal transmission structure according to claim 3, wherein the intermediate frequency signal transmission structure further comprises a plurality of first through holes; The first through hole simultaneously penetrates the first metal layer, the first dielectric layer, the shielding portion of the second metal layer, the second dielectric layer and the third metal layer; the first The through hole is filled with conductive material, so that the first metal layer, the shielding portion of the second metal layer, and the third metal layer are all electrically connected; The plurality of first through holes are located at at least one of the following positions: Between any two adjacent signal lines in the wiring area, between the signal line closest to the edge of the intermediate frequency signal transmission structure in the wiring area and its closest edge, and the connection area. 5. IF signal transmission structure according to claim 4, is characterized in that, At least part of the plurality of first through holes are located between any two adjacent signal lines in the routing area; All the first through holes located between two adjacent signal lines in the routing area are arranged along the extending direction of the signal lines to form two rows; any two adjacent first through holes in the same row are arranged in two rows. The distance between the holes is equal, which is the first distance; The two rows of the first through holes are mutually displaced by 1/2 of the first distance. 6 . The intermediate frequency signal transmission structure according to claim 4 , wherein at least a part of the plurality of first through holes are located in the routing area and the signal line closest to the edge of the intermediate frequency signal transmission structure is closest to the signal line. 7 . between the edges; All the first through holes located between the signal line closest to the edge of the intermediate frequency signal transmission structure and its closest edge in the trace area are arranged along the extension direction of the signal line to form a row, and any phase in the same row is arranged. The distance between two adjacent first through holes is equal. 7. IF signal transmission structure according to claim 1, is characterized in that, The dielectric constants of the first dielectric layer and the second dielectric layer are both less than or equal to 3.3, and the loss factor is less than or equal to 0.0018. 8 . The intermediate frequency signal transmission structure according to claim 7 , wherein the materials of the first dielectric layer and the second dielectric layer are liquid crystal polymer, the first metal layer, the first The materials of the second metal layer and the third metal layer are both copper. 9 . The intermediate frequency signal transmission structure according to claim 1 , wherein the impedance of any one of the signal lines is greater than or equal to 47.5Ω and less than or equal to 52.5Ω. 10 . 10. An electronic device, characterized in that it comprises the intermediate frequency signal transmission structure according to any one of claims 1-9.

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