CN111533544A - 一种低温快烧的瓷质砖胚体及该瓷质砖的制备方法 - Google Patents
一种低温快烧的瓷质砖胚体及该瓷质砖的制备方法 Download PDFInfo
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Abstract
本发明公开了一种低温快烧的瓷质砖胚体及其制备方法,配方包括以下重量比的原材料:新月钠石粉17‑20%;镁质土2‑3%;黄坭膏10‑13%;黑泥2‑4%;龙门砂12‑15%;12号砂10‑15%;混合砂13‑16%;肇庆钾砂8‑10%;铝矾土1‑2%;以及膨润土12‑15%。本发明的低温快烧的瓷质砖胚体,通过优化调整配方结构,调整配方成份,进一步配以相应的工艺方法,使得本发明的配方能够适用于低温快烧工艺,大大缩短烧成周期,进而增加产量,降低制造成本。
Description
技术领域
本发明涉及一种建材领域,具体涉及一种低温快烧的瓷质砖胚体及该瓷质砖的制备方法。
背景技术
从目前世界范围建筑陶瓷制品生产成本比率看,燃料费用在生产成本中所占比率为最大,已经在各国陶瓷行业的总能耗中达到40%以上。目前,全世界的建筑陶瓷工业的发展一直受到高能耗的制约。由于近20年来油、电、燃气及煤炭的价格持续上涨,也遏制着陶瓷业的发展速度。国内许多陶瓷企业由于能耗成本居高不下,导致产品价格上扬,降低了市场竞争力。还有一些企业由于无法承担较高的产品成本而濒临破产;在国外一些发达国家,一些企业由于无法消化能源价格高涨的成本问题,而逐渐缩小陶瓷生产规模,或者尽量到发展中国家去建厂。
现有技术的陶瓷产品能耗高居不下的核心原因在于:现有工艺的烧成周期过长,普遍在45-60分钟左右。从而导致产量偏低,间接导致能耗偏高及生产成本偏高。如果强行拉大产量,就会导致坯体氧化不充分有黑心,半成品吸水率偏大,成品后期返变超标等一系列问题。
发明内容
针对上述技术问题,本发明的一种低温快烧的瓷质砖胚体,适用于低温快烧工艺,大大缩短烧成周期,进而增加产量,降低制造成本。
本发明解决该技术问题所采用的技术方案是:一种低温快烧的瓷质砖胚体,包括以下重量比的原材料:
优选地,本发明的低温快烧的瓷质砖胚体,包括以下重量比的原材料:
具体地,所述原材料的组分包括以下重量比的化合物:
本发明解决该技术问题所采用的另一技术方案是:一种低温快烧的瓷质砖的制备方法,其步骤依次如下:
1)球磨:按照以上配方罗列顺序进行配料,依次加入所述重量比例的原材料,然后利用球磨机进行球磨13-14小时,球磨后,浆料细度控制在250目的筛余量为0.4-0.6%;
2)泥浆除铁、过筛:采用70目筛网进行过滤、除铁,得到泥浆,并重复一次;
3)泥浆陈腐:将除铁过筛后的泥浆在室温条件下陈腐24小时以上;
4)制成粉料:将陈腐后的泥浆利用喷雾干燥塔制成含水率6-7%的粉料;
5)粉料陈腐:将粉料置于室温条件下陈腐24小时以上;
6)粉料除铁、过筛:将陈腐后的粉料采用12目筛网进行过滤、除铁,得到胚料;
7)压制成型:将胚料置于压机内模具中进行压制,然后输送至干燥窑干燥;
8)干燥;
9)装饰:依次为施面釉、喷墨打印及施抛釉;
10)烧成:窑炉内进行烧制成型。
具体地,步骤7)的压制条件为,采用29000-32000KN的压力进行压制。
具体地,步骤10)的烧制条件为,在1150℃-1160℃条件下,烧成周期30-35min。
进一步,步骤4)所得的粉料粒子级配为:
粉料目数 | 占比/% |
30目以上 | 18-23 |
30—40目 | 30-38 |
40—60目 | 32-41 |
60—100目 | ≤10 |
100目以下 | ≤1.5 |
以上占比为重量百分比。
进一步,所述面釉包括的各组分的重量百分比为:钾长石15-18%,钠长石14-16%,石英粉40-42%,煅烧铝4-5%,高岭土5-7%,硅灰石4-5%,球土2-4%,以及硅酸锆10-13%;所述抛釉包括的各组分的重量百分比为:钾长石10-12%,钠长石27-30%,氧化锌3-6%,煅烧高岭土10-12%,高岭土4-6%,硅灰石8-10%,碳酸钡8-10%,熔块10-12%,以及白云石10-12%。
进一步,步骤8)是将胚体送至干燥窑,在130℃-210℃的温度曲线条件下干燥45-60分钟。
与现有技术相比,具有如下积极效果:
1、本发明的低温快烧的瓷质砖胚体,通过优化调整配方结构,调整配方成份,进一步配以相应的工艺方法,使得本发明的配方能够适用于低温快烧工艺,大大降低烧成周期,增加产量,降低制造成本。相对调整前的配方,本发明对比现有技术的常规配方,MgO增加0.3%,K2O增加0.3%,Na2O增加0.3%,而烧失量L.O.I减少0.4%,而坭类粘土减少5%,使用膨润土代替.MgO、K2O、Na2O等熔剂成分增加可降低配方的烧成温度;而烧失量L.O.I减少可缩短烧成时间;坭类黏土使用膨润土代替,可缩短烧成时间,提升粉料的成型性能、缩短干燥时间。
2、本发明的低温快烧的瓷质砖胚体的制备方法,通过制定一套合理的生产步骤,大大降低烧成周期,增加产量,降低制造成本。行业的细度基本都在0.8以上,本发明浆料细度250目控制为筛余量0.4-0.6%,有利于胚体成型性能的改善,胚体的烧结程度更好、更致密,有利于减少烧成时间;而粉料级配的调整,有利于胚体在成型过程中更好地排气,为增加压制频率提供前提条件。
下面结合实施例对本发明作进一步说明。
具体实施方式
本发明公开了一种低温快烧的瓷质砖胚体,包括以下重量比的原材料:
以上原材料通过检验,得到化学成分配比为:
以上为重量百分比,且L.O.I为4.0-4.5。
以下表1为实施例1-5的原材料重量配比。
表1
其中,新月钠石粉为麦月华供应的石粉类原材料。镁质土为麦月华供应的滑石类原材料。黄坭膏为区绍供应的坭膏类原材料。黑坭为张景供应的坭类原材料。龙门砂为伟业远朋公司供应的混合砂类原材料。12号砂为凯得利公司供应的混合砂类原材料。混合砂为伟业远朋公司供应的混合砂类原材料。肇庆钾砂为伟业远朋公司供应的原矿砂类原材料。铝矾土为麦月华供应的石粉类原材料。膨润土为伟业远朋公司供应的黏土类原材料。
实施例1-2的低温快烧的瓷质砖的制备方法,其步骤依次如下:
1)球磨:按照以上配方罗列顺序进行配料,依次加入所述重量的新月钠石粉、镁质土、黄坭膏、黑泥、龙门砂、12号砂、混合砂、肇庆钾砂、铝矾土以及膨润土,然后利用球磨机进行球磨13小时,球磨后,浆料细度控制在250目的筛余量为0.4-0.6%;
2)泥浆除铁、过筛:采用70目筛网进行过滤、除铁,得到泥浆,并重复一次;
3)泥浆陈腐:将除铁过筛后的泥浆在室温条件下陈腐24小时;
4)制成粉料:将陈腐后的泥浆利用喷雾干燥塔制成含水率6-7%的粉料,且所得的粉料粒子级配为,
以上占比为重量百分比;
5)粉料陈腐:将粉料置于室温条件下陈腐28小时;
6)粉料除铁、过筛:将陈腐后的粉料采用12目筛网进行过滤、除铁,得到胚料;
7)压制成型:将胚料置于压机内模具中采用29000KN的压力进行压制,然后输送至干燥窑干燥;
8)干燥,将胚体送至干燥窑,在130℃-210℃的温度曲线条件下干燥45分钟。;
9)装饰:依次为施面釉、喷墨打印及施抛釉,其中,面釉包括的各组分的重量百分比为:钾长石15%,钠长石16%,石英粉40%,煅烧铝4%,高岭土7%,硅灰石5%,球土3%,以及硅酸锆10%;所述抛釉包括的各组分的重量百分比为:钾长石12%,钠长石30%,氧化锌6%,煅烧高岭土10%,高岭土4%,硅灰石8%,碳酸钡8%,熔块12%,以及白云石10%;
10)烧成:窑炉内进行烧制成型,实施例1和实施例2分别在1150℃-1160℃条件下,烧成周期分别为35min和34min。
实施例3的低温快烧的瓷质砖的制备方法,其步骤依次如下:
1)球磨:按照以上配方罗列顺序进行配料,依次加入所述重量的新月钠石粉、镁质土、黄坭膏、黑泥、龙门砂、12号砂、混合砂、肇庆钾砂、铝矾土以及膨润土,然后利用球磨机进行球磨13小时,球磨后,浆料细度控制在250目的筛余量为0.4-0.6%;
2)泥浆除铁、过筛:采用70目筛网进行过滤、除铁,得到泥浆,并重复一次;
3)泥浆陈腐:将除铁过筛后的泥浆在室温条件下陈腐28小时;
4)制成粉料:将陈腐后的泥浆利用喷雾干燥塔制成含水率6-7%的粉料;
5)粉料陈腐:将粉料置于室温条件下陈腐26小时,且所得的粉料粒子级配为,
粉料目数 | 占比/% |
30目以上 | 20 |
30—40目 | 33.5 |
40—60目 | 39 |
60—100目 | 7 |
100目以下 | 0.5 |
以上占比为重量百分比;
6)粉料除铁、过筛:将陈腐后的粉料采用12目筛网进行过滤、除铁,得到胚料;
7)压制成型:将胚料置于压机内模具中采用31000KN的压力进行压制,然后输送至干燥窑干燥;
8)干燥,将胚体送至干燥窑,在130℃-210℃的温度曲线条件下干燥60分钟。;
9)装饰:依次为施面釉、喷墨打印及施抛釉,其中,所述面釉包括的各组分的重量百分比为:钾长石18%,钠长石14%,石英粉42%,煅烧铝5%,高岭土5%,硅灰石4%,球土2%,以及硅酸锆10%;所述抛釉包括的各组分的重量百分比为:钾长石10%,钠长石27%,氧化锌3%,煅烧高岭土12%,高岭土6%,硅灰石10%,碳酸钡10%,熔块10%,以及白云石12%;
10)烧成:窑炉内进行烧制成型,实施例3分别在1150℃-1160℃条件下,烧成周期为33min。
实施例4-5的低温快烧的瓷质砖的制备方法,其步骤依次如下:
1)球磨:按照以上配方罗列顺序进行配料,依次加入所述重量的新月钠石粉、镁质土、黄坭膏、黑泥、龙门砂、12号砂、混合砂、肇庆钾砂、铝矾土以及膨润土,然后利用球磨机进行球磨14小时,球磨后,浆料细度控制在250目的筛余量为0.4-0.6%;
2)泥浆除铁、过筛:采用70目筛网进行过滤、除铁,得到泥浆,并重复一次;
3)泥浆陈腐:将除铁过筛后的泥浆在室温条件下陈腐26小时;
4)制成粉料:将陈腐后的泥浆利用喷雾干燥塔制成含水率6-7%的粉料,且所得的粉料粒子级配为,
粉料目数 | 占比/% |
30目以上 | 18 |
30—40目 | 30 |
40—60目 | 41 |
60—100目 | 10 |
100目以下 | 1 |
以上占比为重量百分比;
5)粉料陈腐:将粉料置于室温条件下陈腐24小时;
6)粉料除铁、过筛:将陈腐后的粉料采用12目筛网进行过滤、除铁,得到胚料;
7)压制成型:将胚料置于压机内模具中采用32000KN的压力进行压制,然后输送至干燥窑干燥;
8)干燥,将胚体送至干燥窑,在130℃-210℃的温度曲线条件下干燥50分钟。;
9)装饰:依次为施面釉、喷墨打印及施抛釉,其中,所述面釉包括的各组分的重量百分比为:钾长石16%,钠长石14%,石英粉40%,煅烧铝4%,高岭土5%,硅灰石4%,球土4%,以及硅酸锆13%;所述抛釉包括的各组分的重量百分比为:钾长石11%,钠长石28%,氧化锌5%,煅烧高岭土11%,高岭土5%,硅灰石9%,碳酸钡9%,熔块11%,以及白云石11%;
10)烧成:窑炉内进行烧制成型,实施例4和实施例5在1150℃-1160℃条件下,烧成周期分别为31min和32min。
对比例1的瓷质砖胚体,包括以下重量比的原材料:
对比例1的瓷质砖的制备方法,其步骤依次如下:
1)球磨:按照以上配方罗列顺序进行配料,依次加入所述重量的新月钠石粉、镁质土、黄坭膏、黑泥、龙门砂、12号砂、混合砂、华兴坭、铝矾土以及膨润土,然后利用球磨机进行球磨10小时,球磨后,浆料细度控制在250目的筛余量为0.9-1.1%;
2)泥浆除铁、过筛:采用70目筛网进行过滤、除铁,得到泥浆,并重复一次;
3)泥浆陈腐:将除铁过筛后的泥浆在室温条件下陈腐24小时;
4)制成粉料:将陈腐后的泥浆利用喷雾干燥塔制成含水率6-7%的粉料,且所得的粉料粒子级配为,
粉料目数 | 占比/% |
30目以上 | 15 |
30—40目 | 32 |
40—60目 | 38.5 |
60—100目 | 12 |
100目以下 | 2.5 |
以上占比为重量百分比;
5)粉料陈腐:将粉料置于室温条件下陈腐28小时;
6)粉料除铁、过筛:将陈腐后的粉料采用12目筛网进行过滤、除铁,得到胚料;
7)压制成型:将胚料置于压机内模具中采用31000KN的压力进行压制,然后输送至干燥窑干燥;
8)干燥;将胚体送至干燥窑,在130℃-210℃的温度曲线条件下干燥78分钟
9)装饰:依次为施面釉、喷墨打印及施抛釉,其中,面釉包括的各组分的重量百分比为:钾长石15%,钠长石16%,石英粉40%,煅烧铝4%,高岭土7%,硅灰石5%,球土3%,以及硅酸锆10%;所述抛釉包括的各组分的重量百分比为:钾长石12%,钠长石30%,氧化锌6%,煅烧高岭土10%,高岭土4%,硅灰石8%,碳酸钡8%,熔块12%,以及白云石10%;
10)烧成:窑炉内进行烧制成型,在1165℃-1175℃条件下,烧成周期为45min。
本发明对实施例1的低温快烧的瓷质砖与对比例1的瓷质砖分别进行了物理性能检测,并进行了分析对比。具体数据见下表2。
表2
从表2可见,本发明的制得的低温快烧的瓷质砖力学性能优异,与现有技术采用常规配方与烧结工艺所得的瓷质砖各方面性能无异,而且本发明能实现低温快烧,在1150℃-1160℃条件下,烧成周期30-35min,而现有技术的瓷质砖烧成周期过长,普遍在45-60分钟左右,且烧成温度相对较高。本发明完全能替代现有技术的的瓷质砖。
与现有技术相比,本发明的低温快烧的瓷质砖胚体,通过优化调整配方结构,调整配方成份,进一步配以相应的工艺方法,使得本发明能够适用于低温快烧工艺,大大缩短烧成周期,进而增加产量,降低制造成本。
本发明并不局限于上述实施方式,如果对本发明的各种改动或变型不脱离本发明的精神和范围,倘若这些改动和变型属于本发明的权利要求和等同技术范围之内,则本发明也意图包含这些改动和变型。
Claims (9)
4.一种低温快烧的瓷质砖的制备方法,其特征在于,其步骤依次如下:
1)球磨:按照权利要求1或2配方罗列顺序进行配料,依次加入所述重量比例的原材料,然后利用球磨机进行球磨13-14小时,球磨后,浆料细度控制在250目的筛余量为0.4-0.6%;
2)泥浆除铁、过筛:采用70目筛网进行过滤、除铁,得到泥浆,并重复一次;
3)泥浆陈腐:将除铁过筛后的泥浆在室温条件下陈腐24小时以上;
4)制成粉料:将陈腐后的泥浆利用喷雾干燥塔制成含水率6-7%的粉料;
5)粉料陈腐:将粉料置于室温条件下陈腐24小时以上;
6)粉料除铁、过筛:将陈腐后的粉料采用12目筛网进行过滤、除铁,得到胚料;
7)压制成型:将胚料置于压机内模具中进行压制,然后输送至干燥窑干燥;
8)干燥;
9)装饰:依次为施面釉、喷墨打印及施抛釉;
10)烧成:窑炉内进行烧制成型。
5.如权利要求4所述低温快烧的瓷质砖的制备方法,其特征在于:步骤7)的压制条件为,采用29000-32000KN的压力进行压制。
6.如权利要求4所述低温快烧的瓷质砖的制备方法,其特征在于:步骤10)的烧制条件为,在1150℃-1160℃条件下,烧成周期30-35min。
8.如权利要求4所述低温快烧的瓷质砖的制备方法,其特征在于:所述面釉包括的各组分的重量百分比为:钾长石15-18%,钠长石14-16%,石英粉40-42%,煅烧铝4-5%,高岭土5-7%,硅灰石4-5%,球土2-4%,以及硅酸锆10-13%;所述抛釉包括的各组分的重量百分比为:钾长石10-12%,钠长石27-30%,氧化锌3-6%,煅烧高岭土10-12%,高岭土4-6%,硅灰石8-10%,碳酸钡8-10%,熔块10-12%,以及白云石10-12%。
9.如权利要求4所述低温快烧的瓷质砖的制备方法,其特征在于:步骤8)是将胚体送至干燥窑,在130℃-210℃的温度曲线条件下干燥45-60分钟。
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