CN111531175A - Powder slurry ultrasonic field assisted embossing forming microstructure device - Google Patents
Powder slurry ultrasonic field assisted embossing forming microstructure device Download PDFInfo
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- CN111531175A CN111531175A CN202010385624.5A CN202010385624A CN111531175A CN 111531175 A CN111531175 A CN 111531175A CN 202010385624 A CN202010385624 A CN 202010385624A CN 111531175 A CN111531175 A CN 111531175A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/22—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2202/00—Treatment under specific physical conditions
- B22F2202/01—Use of vibrations
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Abstract
The application relates to a powder thick liquids ultrasonic field helps impression shaping micro-structure device, includes: a base; the powder forming assembly is arranged on the base and is used for stamping and forming powder; the forming force application assembly is connected with the powder forming assembly; the powder molding assembly comprises a heating guide piece arranged on the base and an ultrasonic pressure head connected with the molding force application assembly and sliding along the heating guide piece, the heating guide piece is provided with a containing groove used for containing powder slurry, and a molding template is placed at the bottom of the containing groove; the ultrasonic pressure head moves along the heating guide piece under the driving of the forming force application assembly and imprints the powder slurry so that the powder slurry is tightly matched with the forming template, and the flowing performance, the transmission performance and the compactness of the powder slurry can be improved.
Description
Technical Field
The invention relates to a powder slurry ultrasonic field assisted embossing forming microstructure device, and belongs to the technical field of powder forming microstructure manufacturing.
Background
With the increasing requirements of important equipment in extreme working environments, higher requirements are also put forward on materials of workpieces, such as ceramics, diamonds, hard, brittle and hard-to-deform metal materials and the like, and the materials have higher performances in the aspects of high temperature resistance, mechanical strength, heat transfer and the like. However, these materials with special properties such as hardness and brittleness have poor plasticity, high strength, high hardness and strong wear resistance, and it is difficult to manufacture complex structural members by using the conventional processes such as plastic deformation and machining. For this purpose, parts of the above materials are generally manufactured by a process such as powder metallurgy, for example, powder hot press sintering. However, due to the limitation of the process, gaps exist among the powders, which are very difficult to eliminate, and the compactness of the manufactured part is not high, thereby affecting the performance of the part. In the powder metallurgy process, special process conditions such as high pressure, high temperature and the like are required to be adopted, so that gaps among powder particles are reduced, and the compactness of the powder part is improved. The powder particles have poor force transfer performance, poor flow performance and the like, organic adhesives such as paraffin and the like are required to be adopted to improve the flow performance of the powder particles, and the powder particles are still difficult to compactly fill cavities with complicated shapes or small sizes. Therefore, the traditional powder metallurgy process is mainly used for manufacturing a part blank with a simple shape, and the final part is manufactured by subsequent machining processes such as grinding and the like, so that the period is long, the cost is high, and the shape, the size and the like of the part are greatly restricted. In addition, only a blank is formed by powder molding, and the bonding strength between the powder needs to be improved by adopting processes such as sintering and the like, so that the performance requirements such as mechanical strength and the like can be met. However, the vaporization of organic binders such as paraffin wax during sintering leaves a large number of pores in the powder-prepared microstructure, which is also an important factor that limits the improvement of compactness.
Disclosure of Invention
The invention aims to provide a powder slurry ultrasonic field assisted imprinting forming microstructure device which can improve the flowing property, the transmission property and the compactness of powder slurry.
In order to achieve the purpose, the invention provides the following technical scheme: a powder slurry ultrasonic field assisted embossing forming microstructure device comprises:
a base;
the powder forming assembly is arranged on the base and is used for stamping and forming powder;
the forming force application assembly is connected with the powder forming assembly;
the powder molding assembly comprises a heating guide piece arranged on the base and an ultrasonic pressure head connected with the molding force application assembly and sliding along the heating guide piece, the heating guide piece is provided with a containing groove used for containing powder slurry, and a molding template is placed at the bottom of the containing groove; the ultrasonic pressure head moves along the heating guide piece under the driving of the forming force application assembly and imprints the powder slurry so that the powder slurry is tightly matched with the forming template.
Further, the ultrasonic pressure head is in clearance fit with the inner wall of the accommodating groove.
Furthermore, the forming force application assembly is connected with the base through a guide post, one end of the guide post is fixedly arranged on the base, and the forming force application assembly can move relative to the guide post to change the distance between the forming force application assembly and the base.
Further, the forming force application assembly comprises:
the sliding plate is in sliding fit with the guide pillar;
the ultrasonic vibrator is fixedly arranged on the sliding plate;
the sliding plate is provided with a through hole, the forming force application assembly further comprises an amplitude transformer, one end of the amplitude transformer penetrates through the through hole to be connected with the ultrasonic vibrator, and the other end of the amplitude transformer is connected with the ultrasonic pressure head.
Further, the forming force application assembly further comprises a fixed plate connected with the sliding plate through a stand column and excitation ceramics used for connecting the ultrasonic vibrator and the fixed plate.
Furthermore, the sliding plate is also provided with a guide sleeve in sliding fit with the guide post.
Further, a backing plate is arranged between the base and the heating guide piece.
Furthermore, a bulge is arranged on one surface, facing the ultrasonic pressure head, of the forming template.
Further, the shape of the cross section of the protrusion is any one of a wave shape, an arc shape, a slope shape, a wedge shape and a rectangular shape.
Furthermore, the vibration frequency of the ultrasonic vibrator is 10-40kHz, and the longitudinal amplitude is 0.1-10 μm.
The invention has the beneficial effects that: the ultrasonic pressure head slides along the heating guide piece under the action of the forming force application assembly to improve the flowing property and the force transmission property of the powder slurry, soften the adhesive, reduce the viscosity of the adhesive and improve the flowability of the adhesive;
the forming force application assembly comprises an ultrasonic vibrator connected with the ultrasonic pressure head, and the ultrasonic vibrator transmits vibration to the ultrasonic pressure head so that the small-size solid in the powder slurry fills the gap of the large-size solid, and the compactness of the formed part is improved.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Drawings
Fig. 1 is a schematic structural diagram of a powder slurry ultrasonic field assisted imprint forming microstructure device of the present invention.
Fig. 2 is a partial structural schematic diagram of fig. 1.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
Referring to fig. 1 and 2, in a preferred embodiment of the present invention, a powder slurry ultrasonic field assisted imprint molding microstructure apparatus is connected to external devices such as a precision material testing machine and a press machine, so as to achieve the purposes of load application, real-time displacement display and precise control, and operate under the driving of the external devices. Wherein, powder thick liquids ultrasonic field helps impression shaping micro-structure device includes base 1, sets up on the base 1 and be used for powder impression shaping powder forming assembly 2 and with shaping application of force subassembly 3 that powder forming assembly 2 is connected, shaping application of force subassembly 3 is connected with external equipment, shaping application of force subassembly 3 will do all can with power transmission under the drive of external equipment extremely powder forming assembly 2 is in order to carry out the impression shaping with the powder, and is convenient fast.
The powder forming assembly comprises a heating guide part 21 arranged on the base 1 and an ultrasonic pressure head 22 connected with the forming force application assembly 3 and sliding along the heating guide part 21, wherein a heating resistor is arranged in the heating guide part 21, and powder slurry can be heated to a required temperature as required to reduce the age of the adhesive and improve the flow property of the powder slurry so as to facilitate a better forming microstructure. The heating guide 21 also has a built-in sensor or a contact sensor for measuring the temperature of the powder slurry, and the heating resistor stops heating when the temperature reaches a temperature suitable for the binder. The heating guide 21 is provided with a containing groove 211 for containing powder, and a molding template 23 is placed at the bottom of the containing groove 211; the ultrasonic ram 22 moves along the heating guide 21 under the driving of the forming force application assembly 3 and imprints the powder so that the powder is tightly fitted with the forming template. The powder can be ceramic, diamond, metal material, etc., and the adhesive can be low-melting organic material such as paraffin, etc., and is not limited in particular, according to the actual situation.
The ultrasonic pressure head 22 is in clearance fit with the inner wall of the accommodating groove 211, and the inner wall provides a guiding function for the ultrasonic pressure head 22. The purpose of this is to: the smooth movement of the ultrasonic pressure head 22 is ensured, and meanwhile, the powder slurry is ensured not to overflow from the gap. A bulge is arranged on one surface of the forming template 23 facing the ultrasonic pressure head 22, and the shape of the cross section of the bulge is any one of wave shape, arc shape, slope shape, wedge shape, groove shape and rectangle. Indeed, in other embodiments, the side of the forming template 23 facing the ultrasonic head 22 may be provided with a groove, and the shape of the cross section of the groove may be any one of wave shape, arc shape, slope shape, wedge shape, groove shape and rectangle, which is not particularly limited herein, but the size of the protrusion or the groove is 2 μm or more.
The forming force application component 3 is connected with the base 1 through a guide post 4, one end of the guide post 4 is fixedly arranged on the base 1, and the forming force application component 3 can move relative to the guide post 4 to change the distance between the forming force application component and the base 1. Specifically, the forming force application assembly 3 includes a sliding plate 31 in sliding fit with the guide post 4, and an ultrasonic vibrator 32 fixedly arranged on the sliding plate 31, a through hole 311 is formed in the sliding plate 31, the forming force application assembly 3 further includes an amplitude transformer 33, one end of the amplitude transformer 33 passes through the through hole 311 to be connected with the ultrasonic vibrator 32, and the other end of the amplitude transformer 33 is connected with the ultrasonic pressure head 22. Specifically, the ultrasonic ram 22 and the horn 33 are tightly fixed by a screw thread, and the horn 33 is also tightly fixed by a screw thread to the ultrasonic vibrator 32. The amplitude transformer 33 is used for amplifying the amplitude of the high-frequency ultrasonic vibration generated by the ultrasonic vibrator 32, and then acts on the powder slurry through the ultrasonic pressure head 22, so that the operation is fast and convenient.
In the present embodiment, the through hole 311 is opened in the middle of the sliding plate 31, and it is needless to say that in other mode examples, the through hole 311 may be opened in other positions of the sliding plate 31, and is not particularly limited herein, depending on the actual situation. The vibration frequency of the ultrasonic vibrator 32 is 10-40kHz, and the longitudinal amplitude is 0.1-10 μm. Indeed, in other embodiments, the vibration frequency and the longitudinal amplitude of the ultrasonic vibrator 32 may be other, and are not limited herein, depending on the actual situation. The sliding plate 31 is further provided with a guide sleeve 5 in sliding fit with the guide post 4, and the guide sleeve 5 is matched with the guide post 4 to guide the forming force application component 3, so that the compactness of a finally formed part is improved.
The forming force application assembly 3 further comprises a fixed plate 34 connected with the sliding plate 31 through a column 36, and an excitation ceramic 35 used for connecting the ultrasonic vibrator 32 and the fixed plate 34, wherein the excitation ceramic 35 generates high-frequency stretching deformation under the action of an external high-frequency power supply, so that the ultrasonic vibrator 32 with the same frequency is driven to generate high-frequency ultrasonic vibration. Under the vibration condition, the small-size solid particles in the powder are more favorably filled in gaps of the large-size particles, so that the compactness of the micro structural member is improved. In order to make the high-frequency ultrasonic vibration generated by the excitation ceramic 35 act on the powder slurry better, the shapes and the sizes of the ultrasonic vibrator 32, the amplitude transformer 33 and the ultrasonic pressure head 22 need to be designed, and the design principle refers to the resonance principle so as to ensure the transmission efficiency of the ultrasonic vibration and reduce the energy loss. Ultrasonic vibration, as an energy, can be absorbed by the adhesive, thereby raising the temperature, lowering the viscosity, and improving the flow properties.
A backing plate 6 is further disposed between the base 1 and the heating guide 21. After the molding is finished, the ultrasonic vibration is stopped and the molded article is cooled to room temperature. In order to accelerate the cooling speed of the formed part, in the embodiment, a notch is arranged in the backing plate 6 to introduce circulating water to cool the formed part, and the cooling speed is determined according to the specific requirement of the formed part. It should be noted that the cooling rate should not be too fast, because the formed part will have internal stress and crack and other defects when the temperature gradient is too large.
The specific implementation process of the powder slurry ultrasonic field assisted imprinting forming microstructure device comprises the following steps: depending on the size of the shaped part, different proportions of powder and binder were chosen for compounding to produce a powder slurry. The prepared powder slurry is placed in the accommodating groove 211, and the external equipment is started, so that the external equipment drives the forming force application assembly 3 to move towards the powder forming assembly 2 through the guide pillar 4. When the ultrasonic head 22 contacts the powder slurry and generates a certain pressure (a pressure testing device is arranged on external equipment), the movement is stopped. The heating resistor in the heating guide 21 is turned on to preheat the powder slurry, the temperature is measured by the sensor, and when the temperature reaches a temperature suitable for the binder, the heating resistor stops heating. And starting the ultrasonic vibrator 32 and external equipment to enable the excitation ceramic 35 and the ultrasonic vibrator 32 to work to carry out molding treatment on the powder slurry. After the molding is completed, the ultrasonic vibration is stopped, and circulating water is introduced into the backing plate 6 to cool the powder slurry to room temperature, and a final molded article is obtained.
In summary, the following steps: by arranging the heating guide member 21 and the ultrasonic pressure head 22, the heating guide member 21 is provided with a containing groove 211 for containing the powder slurry, the bottom of the containing groove 211 is provided with the molding template 23, and the ultrasonic pressure head 22 slides along the heating guide member 21 under the action of the molding force application component 3 so as to improve the flowing property and the force transmission property of the powder slurry, soften the adhesive, reduce the viscosity of the adhesive and improve the fluidity of the adhesive;
the forming force application assembly 3 comprises an ultrasonic vibrator 32 connected with the ultrasonic pressure head 22, and the ultrasonic vibrator 32 transmits vibration to the ultrasonic pressure head 22 so that the small-size solid in the powder slurry is filled in the gap of the large-size solid, and the compactness of the formed part is improved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The utility model provides a powder thick liquids ultrasonic field helps impression forming microstructure device which characterized in that includes:
a base;
the powder forming assembly is arranged on the base and is used for stamping and forming powder;
the forming force application assembly is connected with the powder forming assembly;
the powder molding assembly comprises a heating guide piece arranged on the base and an ultrasonic pressure head connected with the molding force application assembly and sliding along the heating guide piece, the heating guide piece is provided with a containing groove used for containing powder slurry, and a molding template is placed at the bottom of the containing groove; the ultrasonic pressure head moves along the heating guide piece under the driving of the forming force application assembly and imprints the powder slurry so that the powder slurry is tightly matched with the forming template.
2. The powder slurry ultrasonic field assisted imprint-molded microstructure apparatus of claim 1, wherein the ultrasonic indenter is clearance-fitted to an inner wall of the receiving groove.
3. The powder slurry ultrasonic field assisted imprint forming microstructure apparatus of claim 1, wherein the forming force application assembly is connected to the base via a guide pillar, one end of the guide pillar is fixedly disposed on the base, and the forming force application assembly is movable relative to the guide pillar to change a distance between the forming force application assembly and the base.
4. The powder slurry ultrasonic field assisted imprint lithography microstructure apparatus of claim 3, wherein said formation forcing assembly comprises:
the sliding plate is in sliding fit with the guide pillar;
the ultrasonic vibrator is fixedly arranged on the sliding plate;
the sliding plate is provided with a through hole, the forming force application assembly further comprises an amplitude transformer, one end of the amplitude transformer penetrates through the through hole to be connected with the ultrasonic vibrator, and the other end of the amplitude transformer is connected with the ultrasonic pressure head.
5. The powder slurry ultrasonic field assisted imprint lithography microstructure apparatus of claim 4, wherein said formation forcing assembly further comprises a fixed plate connected to said sliding plate by a post, and an excitation ceramic connecting said ultrasonic vibrator and said fixed plate.
6. The powder slurry ultrasonic field assisted imprint lithography microstructure apparatus of claim 4, wherein said slide plate is further provided with a guide sleeve slidably engaged with said guide post.
7. The powder slurry ultrasonic field assisted imprint lithography microstructure apparatus of claim 1, wherein a backing plate is further disposed between said base and said heating guide.
8. The powder slurry ultrasonic field assisted imprint lithography microstructure apparatus of claim 1, wherein a face of said forming template facing said ultrasonic indenter is provided with protrusions.
9. The powder slurry ultrasonic-field-assisted imprint-molded microstructure apparatus according to claim 8, wherein a cross-sectional shape of the protrusion is any one of a wave shape, an arc shape, a slope shape, a wedge shape, and a rectangular shape.
10. The powder slurry ultrasonic field-assisted imprint-molded microstructure apparatus of claim 1, wherein a vibration frequency of the ultrasonic vibrator is 10 to 40kHz, and a longitudinal amplitude is 0.1 to 10 μm.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010385624.5A CN111531175A (en) | 2020-05-09 | 2020-05-09 | Powder slurry ultrasonic field assisted embossing forming microstructure device |
| PCT/CN2021/090431 WO2021227872A1 (en) | 2020-05-09 | 2021-04-28 | Powder slurry ultrasonic field-assisted imprinting forming microstructure device |
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| CN202010385624.5A CN111531175A (en) | 2020-05-09 | 2020-05-09 | Powder slurry ultrasonic field assisted embossing forming microstructure device |
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| CN111531175A true CN111531175A (en) | 2020-08-14 |
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| CN202010385624.5A Pending CN111531175A (en) | 2020-05-09 | 2020-05-09 | Powder slurry ultrasonic field assisted embossing forming microstructure device |
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| WO (1) | WO2021227872A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112176340A (en) * | 2020-10-23 | 2021-01-05 | 汕头华兴冶金设备股份有限公司 | Preparation method of high-temperature-resistant erosion-resistant slag-dredging ceramic coating |
| WO2021227872A1 (en) * | 2020-05-09 | 2021-11-18 | 苏州大学 | Powder slurry ultrasonic field-assisted imprinting forming microstructure device |
| CN114851429A (en) * | 2022-04-02 | 2022-08-05 | 东北林业大学 | Induction heating and ultrasonic vibration combined wood-plastic powder extrusion forming method |
| CN115740441A (en) * | 2022-11-10 | 2023-03-07 | 苏州大学 | Ultrasonic auxiliary forming device for preparing diamond/copper heat sink and application thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114107887A (en) * | 2021-11-22 | 2022-03-01 | 湖南科技大学 | Ultrasonic-assisted powder metal infiltration device and method |
| CN115416282A (en) * | 2022-07-18 | 2022-12-02 | 广东工业大学 | Ultrasonic microstructure three-dimensional forming method |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6126703A (en) * | 1984-07-13 | 1986-02-06 | Riken Corp | Production of amorphous metallic compact |
| US4957668A (en) * | 1988-12-07 | 1990-09-18 | General Motors Corporation | Ultrasonic compacting and bonding particles |
| US5888645A (en) * | 1990-09-14 | 1999-03-30 | Obtec A/S | Method and apparatus for manufacturing an article of a composite material |
| CN102490301A (en) * | 2011-12-16 | 2012-06-13 | 深圳大学 | Micropart powder compression molding method |
| CN204342641U (en) * | 2014-12-26 | 2015-05-20 | 湖南大学 | A kind of ultrasonic vibration precision compression molding device of complex micro structure optical element |
| CN204430266U (en) * | 2015-02-06 | 2015-07-01 | 江汉大学 | A kind of ultrasonic wave powder metallurgy compression molding device |
| CN104875393A (en) * | 2015-06-01 | 2015-09-02 | 天津大学 | Ultrasonic microimprint forming method of polymer powder material |
| CN108698125A (en) * | 2017-04-10 | 2018-10-23 | 深圳大学 | The system and method for manufacturing bulk nanocrystalline alloy |
| CN109226770A (en) * | 2018-11-12 | 2019-01-18 | 深圳艾利佳材料科技有限公司 | A kind of tungsten-copper alloy ultrasound plasticizing injection moulding forming method and device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007034893A1 (en) * | 2005-09-22 | 2007-03-29 | Nihon Handa Co., Ltd. | Pasty metal particle composition, method of hardening pasty metal particle composition, method of bonding metal member, process for producing printed wiring board |
| CN101406925B (en) * | 2008-11-18 | 2011-08-24 | 浙江大学 | Method for device for forming metal micro-thixotropy in semi-solid state assistant by supersonic vibration |
| CN204639128U (en) * | 2015-04-20 | 2015-09-16 | 沈阳俊吉科技有限公司 | A kind of high-duty electromagnetism compaction apparatus of metal dust |
| CN108085632B (en) * | 2017-12-11 | 2019-07-23 | 华中科技大学 | A kind of Plastic Forming and toughening process and its device based on ultrasonic vibration |
| CN208437483U (en) * | 2018-05-18 | 2019-01-29 | 沈阳航空航天大学 | The device of ultrasonic vibration assistant metal sheet material forming under a kind of thermal environment |
| CN111531175A (en) * | 2020-05-09 | 2020-08-14 | 苏州大学 | Powder slurry ultrasonic field assisted embossing forming microstructure device |
-
2020
- 2020-05-09 CN CN202010385624.5A patent/CN111531175A/en active Pending
-
2021
- 2021-04-28 WO PCT/CN2021/090431 patent/WO2021227872A1/en active Application Filing
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6126703A (en) * | 1984-07-13 | 1986-02-06 | Riken Corp | Production of amorphous metallic compact |
| US4957668A (en) * | 1988-12-07 | 1990-09-18 | General Motors Corporation | Ultrasonic compacting and bonding particles |
| US5888645A (en) * | 1990-09-14 | 1999-03-30 | Obtec A/S | Method and apparatus for manufacturing an article of a composite material |
| CN102490301A (en) * | 2011-12-16 | 2012-06-13 | 深圳大学 | Micropart powder compression molding method |
| CN204342641U (en) * | 2014-12-26 | 2015-05-20 | 湖南大学 | A kind of ultrasonic vibration precision compression molding device of complex micro structure optical element |
| CN204430266U (en) * | 2015-02-06 | 2015-07-01 | 江汉大学 | A kind of ultrasonic wave powder metallurgy compression molding device |
| CN104875393A (en) * | 2015-06-01 | 2015-09-02 | 天津大学 | Ultrasonic microimprint forming method of polymer powder material |
| CN108698125A (en) * | 2017-04-10 | 2018-10-23 | 深圳大学 | The system and method for manufacturing bulk nanocrystalline alloy |
| CN109226770A (en) * | 2018-11-12 | 2019-01-18 | 深圳艾利佳材料科技有限公司 | A kind of tungsten-copper alloy ultrasound plasticizing injection moulding forming method and device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021227872A1 (en) * | 2020-05-09 | 2021-11-18 | 苏州大学 | Powder slurry ultrasonic field-assisted imprinting forming microstructure device |
| CN112176340A (en) * | 2020-10-23 | 2021-01-05 | 汕头华兴冶金设备股份有限公司 | Preparation method of high-temperature-resistant erosion-resistant slag-dredging ceramic coating |
| CN114851429A (en) * | 2022-04-02 | 2022-08-05 | 东北林业大学 | Induction heating and ultrasonic vibration combined wood-plastic powder extrusion forming method |
| CN115740441A (en) * | 2022-11-10 | 2023-03-07 | 苏州大学 | Ultrasonic auxiliary forming device for preparing diamond/copper heat sink and application thereof |
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| WO2021227872A1 (en) | 2021-11-18 |
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Application publication date: 20200814 |