CN111511569A

CN111511569A - Transfer carrier

Info

Publication number: CN111511569A
Application number: CN201980006860.7A
Authority: CN
Inventors: C.弗塞; B.托伊费尔
Original assignee: Giesecke and Devrient GmbH
Current assignee: Giesecke and Devrient GmbH
Priority date: 2018-02-21
Filing date: 2019-02-14
Publication date: 2020-08-07
Anticipated expiration: 2039-02-14
Also published as: CN111511569B; DE102018001379A1; EP3755544B1; EP3755544A1; WO2019161966A1

Abstract

The invention relates to a transfer carrier (10) comprising: a carrier layer (11) and a transfer layer (12). The transfer layer (12) is arranged above the carrier layer (11) and can be detached from the carrier layer (11). The transfer carrier (10) comprises a transfer boundary (15, 18). The transfer boundary (15, 18) comprises a transfer layer interruption (15) which serves as a boundary between a transfer section (1) of the transfer layer (12) to be transferred and a carrier section (2) of the transfer layer (12) remaining on the carrier layer (11). The transfer border (15, 18) further comprises an anti-adhesion structure (18) arranged above the transfer layer (12). The anti-adhesion structure (18) is arranged next to the transfer layer interruption (15) and only locally on at least one of the two sections (1, 2).

Description

Transfer carrier

The invention relates to a transfer printing carrier and to the use and production of said transfer printing carrier.

The transfer carrier generally comprises a carrier layer on which a transfer layer is arranged first and on which an adhesive layer is arranged. In the transfer device, the transfer element, the section of the transfer layer is transferred to the substrate or the base by means of heat and/or pressure and adheres to the adhesive layer on the base. The transfer layer typically includes a plurality of sub-layers.

In particular for very thin transfer layers or softened transfer layers, the transfer element is well defined in its contour by the transfer die. The transfer layer is broken exactly at the edges of the transfer die.

It is also known that the adhesive layer is only optionally provided in the region corresponding to the transfer member. The transfer layer is broken exactly at the edge of the adhesive layer.

However, the transfer layer typically comprises a plurality of sub-layers. In this case, in particular stable partial layers in the transfer layer, for example uv-cured lacquer layers, have proven to be problematic. The sub-layers are not usually broken exactly at the boundary of the transfer die. Instead, during the transfer, undesired fragments of the transfer layer may be produced which detach from the support but do not adhere to the substrate and which, as undesired particles, for example interfere with the subsequent pressing process. Three fundamentally different measures are known to avoid said debris.

According to a first measure, the areas of the transfer layer located between the transfer elements are removed before transfer. After the overall production of the transfer layer and suitable scoring, the unwanted regions between the transfer elements to be transferred are removed, which regions are arranged around the transfer elements like a grid.

The removal of the grid area is usually premised on the transfer layer comprising the film as a sub-layer. Patent document DE102016009318 a1 describes the removal of a grid region for a transfer element without a thin-film sublayer. In a further variant of the first measure, the grid-like regions are removed by means of a laser.

According to a second measure, the transfer layer is simply produced only at the location where the transfer layer is needed afterwards. One particular form of such a solution is described in patent document EP 2848425 a 2. Since the transfer layer to be transferred is usually a composite of a plurality of layers, all these layers must be printed or produced in a Register structure (Register), which represents an additional expenditure compared to other measures, for example, which make it possible to simply print a primer layer or an adhesive layer on all sides without Register.

According to a third measure, the transfer element is separated from the sections that do not require transfer on the carrier, so that the transfer layer is already severed and no more debris is produced during transfer. The transfer layer is cut by means of blanking or laser, for example. Patent document WO 2010/031543 a1 suggests an improved carrier layer for the cutting process.

The exact positioning of the transfer element in the transfer device relative to the transfer tool (or transfer die) is common today, but is nevertheless associated with costs or even with wear of the incorrectly positioned transfer element until the first transfer element reaches the nominal position.

The object of the present invention is to provide a cost-effective transfer method or a correspondingly suitable component, such as a transfer element, a transfer carrier or a transfer device, which in particular also avoids the formation of fragments of the transfer layer.

The object is achieved by the features of the independent claims. The invention is characterized in that it is provided with a plurality of design elements.

The transfer carrier includes a carrier layer and a transfer layer. The transfer layer is arranged above the carrier layer and can be detached or peeled off from the carrier layer. The transfer carrier includes a transfer boundary including a transfer layer interruption. The transfer layer interruption serves as a boundary between a transfer section of the transfer layer to be transferred and a carrier section of the transfer layer remaining on the carrier layer. The transfer border currently also comprises an anti-adhesion or anti-blocking structure. The anti-adhesion structure is disposed over the transfer layer. The anti-adhesive structure is located next to the transfer layer interruption and is only present locally on at least one of the two sections.

The transfer carrier without the anti-adhesive structure firstly provides the transfer tool of the transfer device with only (precisely) transfer layer interruptions as transfer locations. The transfer border, which is formed by the combination of the transfer layer interruption and the anti-adhesive structure, reduces the positioning requirements. The anti-adhesion structure provides a longitudinally oriented positioning region for a transfer tool of a transfer device. Regardless of the specific positioning of the transfer tool within the positioning region, no debris is generated.

The anti-adhesive structure is preferably present only locally on the transfer section.

This arrangement already achieves a plurality of advantageous embodiments. This makes it possible to use (larger transfer sections or) shorter transfer tools intentionally or as a function of tolerances. The transfer section can in particular even be longer than the transfer tool. The transfer section adheres to the substrate after transfer, except for the areas of the anti-adhesion structure.

In a particularly preferred variant, the anti-adhesive structure is present only partially on the transfer section and only partially or completely on the carrier section. Thereby enabling a larger positioning area to be provided. Larger transfer tools (or smaller transfer sections) may also be used. The transfer section may be shorter (or longer) than the transfer tool. The anti-adhesive structure present over the entire carrier section is in particular only partially arranged on the (first) transfer section adjoining the carrier section and only partially arranged on the following (second) transfer section adjoining the carrier section.

In other variants, the anti-adhesive structure may be present only on the transfer section and only locally there.

The provision of the anti-adhesive structure next to the transfer layer interruption comprises a plurality of embodiments which are also provided at least in the area next to the transfer layer interruption. The anti-adhesive structure can in particular be arranged immediately adjacent to the transfer layer interruption (or immediately next to the transfer layer interruption) and can here extend over the transfer layer interruption, optionally from one side of the transfer layer interruption, from both sides of the transfer layer interruption or continuously (across the interruption). As an alternative to the arrangement which directly adjoins or extends over the transfer layer interruption in the longitudinal direction, the release structure can be arranged next to the transfer layer interruption at a longitudinal distance which is small compared to the length of the release structure.

The transfer support typically comprises an adhesive layer. The anti-adhesive structure is preferably arranged on the adhesive layer. In one variant, the anti-adhesive structure is a deactivated section of the adhesive layer. Only the adhesion layer is alternatively provided on the substrate.

The anti-adhesion structure can be adapted to the parameters of the transfer device, in particular, by suitably selecting its length. The anti-adhesion structure can be adapted to the positioning tolerance of the transfer device. If there are a plurality of transfer devices and/or different transfer device types, for example different companies or manufacturing years, the anti-adhesive structure can be adapted to the maximum positioning tolerances. The anti-adhesive structure can be adapted to the length of the transfer tool of the transfer device as already described. The adaptation or adjustment can be carried out in particular on the basis of a minimum or maximum length of a plurality of transfer devices and/or transfer tools of the transfer device type. The positioning tolerance of the transfer device may take into account one or more of the following tolerance parameters:

-positioning of the transfer carrier in the longitudinal direction in the transfer device; and/or

-the position of the transfer tool in the longitudinal direction in the transfer device; and/or

-length tolerance of the transfer die.

The transfer layer interruption portion interrupts the transfer layer by 50% or more, particularly by 75% to 100%, and particularly preferably by 100%. The transfer layer is already divided in portions in its cross section. Preferably completely separated. The transfer layer interruption can likewise pass through the adhesive layer and/or the anti-adhesive structure as an interruption. The interruptions can be made before or after the application of the adhesive layer and/or the anti-adhesive structure.

The anti-adhesion structures are preferably only 0.5 to 5 μm, in particular 1 to 3 μm, thick. The length of the anti-adhesion structure is greater than 0.5mm, in particular greater than 2 mm. The length is in particular between 0.5 and 20mm, preferably between 1 and 10 mm. The length of the part of the anti-adhesive structure lying above the transfer section is preferably less than 2mm, in particular in the range from 0.2 to 2mm, particularly preferably from 0.2 to 0.5mm or from 0.5 to 1.5 mm.

The anti-adhesion structure is typically transparent. In an advantageous embodiment, however, the anti-adhesive structure has a visually or machine-recognizable color (for example black or red).

The start and end of the transfer section are preferably defined by transfer layer interruptions, respectively. The anti-adhesion structures may be provided at the beginning and the end of the transfer section, respectively. The anti-adhesive structure particularly preferably extends over (exactly) one transfer layer interruption. In some embodiments, the anti-adhesive structure extends over exactly two transfer layer interruptions of adjacent (or successive transfer layers on the transfer carrier) transfer sections.

The anti-adhesive structure can be present next to or adjacent to the transfer layer interruption or alongside the transfer layer interruption with an adhesive edge. The length of the adhesive (longitudinal) edges is only small compared to the length of the anti-adhesive structures on the segments (length ratio in particular < 1/10 or preferably < 1/20). Even if such a narrow edge is initially disadvantageous, it can be provided in order to facilitate the subsequent adhesion or attachment of the transfer section to the substrate. The anti-adhesive structure also typically extends over the entire width of the transfer layer. However, the adhesive edge can be present transversely to the anti-adhesive structure (or laterally next to the anti-adhesive structure). The width of the transverse edges of the adhesive is only small compared to the width of the anti-adhesive structure (width ratio in particular < 1/10 or preferably < 1/20). It is conceivable to provide anti-adhesion structures with a width which is smaller and/or larger in the longitudinal direction. In particular, the anti-adhesion structure can be applied less and less or more over the beginning of the transfer section and correspondingly (mirror-symmetrically) more and more or less over the end of the transfer section.

In a preferred embodiment, the anti-adhesive structure is arranged only partially in the longitudinal direction, but over the entire width of the segments (or over the entire width of both segments) in the transverse direction. The anti-adhesive structure is particularly preferably arranged in the longitudinal direction locally above the transfer section and/or the carrier section locally only in the immediate vicinity of the transfer layer interruption; and optionally across a transfer layer interruption. Alternatively, the release structure is arranged continuously (over the entire surface or with transverse edges) in the longitudinal direction over the carrier section, optionally over the transfer layer interruption, and only immediately adjacent to the transfer layer interruption over the carrier section.

The anti-adhesive structure is adapted to the adhesive layer and in particular to the activatable properties of the adhesive layer in such a way that it is effective when the adhesive layer is activated. The anti-adhesion structure preferably consists of:

-a (UV) -curable lacquer,

a lacquer which is in an inactive state when the adhesion layer is activated (e.g. softening temperature > activation temperature), which lacquer may be solvent-based or water-based,

crosslinkable lacquers or dispersions which can be crosslinked to one another, in particular by reactive groups (e.g. polyols with isocyanates, carboxylic acids with aziridine rings), or

Activated sections of the adhesive layer, which can be activated only once, for example uv-activated areas of uv-activated lacquers.

The transfer carrier can also be referred to as an elongated transfer carrier because of its length (or longitudinal dimension) which is significantly greater than the width (or transverse dimension). The transfer carrier is usually a continuous belt (length > 10m, usually not more than 10000m) and is provided, in particular, wound on a roller. The carrier layer of the transfer support is a film, which is preferably transparent. The transfer layer is arranged on the carrier layer of the transfer carrier. The carrier layer is accordingly arranged on the upper side of the upper/carrier layer or the transfer layer is arranged with its lower side on the carrier layer. The terms "upper", "above" and "above" are currently used synonymously in the context of this orientation.

A plurality of transfer sections are preferably arranged one behind the other in the longitudinal direction on the transfer carrier. The transfer section may additionally or alternatively comprise a plurality of security elements, which are contained in the transfer section one behind the other in the longitudinal direction.

The length of the transfer section is greater than 25cm, in particular simultaneously less than 120 cm. The length of the transfer section is in particular greater than the total length of the plurality of security elements. The security element corresponds in its length to the outer dimensions (length or width) of the document of value. The base may be a base page or a base web having page sections. The substrate is in particular a value document substrate.

The width of the carrier layer preferably corresponds to the width of the transfer section. It is conceivable, however, that more complicated production is achieved in that the transfer section is alternatively narrower than the carrier layer, which may in particular comprise a strip without a transfer section on the exact side or on both sides.

The transfer carrier is provided for use in a transfer device, in particular one of a plurality of transfer devices. The plurality of transfer devices may be the same transfer device type and/or different transfer device types. The present solution simplifies the application of the transfer carrier independently of the specific transfer device.

In particular, in the embodiment of the transfer carrier, the transfer carrier can be produced by the following steps. A transfer carrier is provided having a carrier layer and a transfer layer. The transfer layer is disposed above and detachable from the carrier layer. The transfer boundary is produced at least locally in the transfer carrier. The transfer boundary comprises a transfer layer interruption serving as a boundary between a transfer section of the transfer layer to be transferred and a carrier section of the transfer layer remaining on the carrier. In a step of producing the transfer border, a release structure is applied, wherein the release structure is applied on top of the transfer layer, is arranged next to the transfer layer interruption and is applied only locally on at least one of the two sections. Alternatively, the transfer layer interruption of the transfer boundary may already exist in advance.

Further embodiments and advantages of the invention are explained below with reference to the drawings, in which the representation in real size and in real scale is omitted from the views in order to improve the intuitiveness.

In the drawings:

FIG. 1 shows a transfer carrier with a transfer layer in a transfer device when transferring a transfer section of the transfer layer;

FIG. 2 shows a longitudinal section through a transfer carrier having an anti-adhesion structure as part of a transfer boundary;

FIG. 3 shows a longitudinal section through a transfer carrier with a modified anti-adhesion structure as part of a transfer boundary;

FIG. 4A shows a top view of a special embodiment of the anti-adhesion structure of the transfer carrier; and is

Fig. 4B shows a plan view of a further embodiment of an anti-adhesive structure of a transfer carrier.

Fig. 1 first shows a conventional transfer device 30 with a transfer tool 31, which is usually designed as a transfer die or transfer roller. The substrate 20 is sequentially fed into the transfer device 30 from the right side in the drawing. The substrate 20 may be a value document page from which a plurality of, for example four by six, value documents are then produced, wherein a plurality, in this example six, value document substrates are present in succession in the longitudinal direction in the page. The transfer tools can accordingly comprise a plurality, in this example four, not shown, of transfer tools 31 operating in parallel.

The transfer carrier 10 comprises a carrier layer 11 on which a transfer layer 12 is detachably arranged. The transfer layer 12 comprises a transfer section 1, which is transferred to the substrate 20 by means of a transfer tool 31, and a carrier section 2, which remains on the transfer carrier 10 or on the carrier layer 11 of the transfer carrier. On the transfer carrier 10, which is a continuous strip, for example, unwound from a roll, a plurality of transfer sections 1 are arranged one behind the other in the longitudinal direction.

In the drawing, a first substrate 20 with a transfer section 1 that has already been transferred, a second substrate 20 in a transfer device that does not yet have a transfer section, and a third substrate 20 are shown from left to right. In the left-hand half of the drawing, the transfer section 1 is correspondingly missing between the two carrier sections 2 of the transfer layer 12.

The transfer layer 12 also comprises at least a layer which is easily chipped (or which is too stable for transfer), for example a hardened lacquer layer. The transfer layer 12 is typically multi-layered. The transfer layer 12 may, for example, comprise a plurality of the following sublayers: embossed layers, effect layers (reflective or translucent, thin-layer structures with or without color gradient effects), effect pigment layers, reflective layers, primer layer(s), stabilizing layers (if desired in the form of thin films). If necessary, a release layer can be arranged between the carrier film and the transfer layer. The release layer may be completely (or partially) left on the carrier layer or completely (or partially) constitute part of the transfer layer. The thickness of the transfer layer 12 is typically between 8 and 50 μm.

The carrier layer 11 is typically a plastic film, for example, having a thickness of 10 to 150 μm. The support layer can be constructed in a single layer or in multiple layers. The carrier layer preferably comprises two plastic films bonded to one another.

Fig. 2 shows a longitudinal section through the transfer carrier 10. The transfer layer 12 is located on the carrier layer 11. Over transfer layer 12 is disposed an (optional) adhesive layer 16 and a release structure 18.

Layers

12, 16 and 18 comprise extended transfer layer 14.

The transfer boundary of the transfer section 1 is formed by the transfer layer interruption 15 together with the anti-adhesive structure 18. The transfer layer interruption 15 is arranged as a first sub-element of the

transfer boundary

15, 18 between the transfer sections 1 of the transfer layer 12. The transfer layer interruption portion 15 may be provided in the transfer layer 12 by punching or laser irradiation, for example. Two transfer layer interruptions 15 define the transfer section 1. Transfer layer interruptions 15 are provided at the beginning and the end of the transfer section 1, respectively. Carrier sections 2 are located between the transfer sections 1.

The transfer tool 31 is also designated in fig. 2 for the purpose of illustrating the current solution by the length L31 of the transfer tool 31 the transfer section 1 has a length L1, the length L1 (and length L31) is greater than 25cm and in the range of 25 to 120cm, both lengths are shown intentionally shortened to a greater extent in the drawing.

If the length L31 of the transfer tool is exactly equal to the length L1 of the transfer section, the transfer tool 31 must be positioned precisely relative to the transfer section 1, as is conventional, i.e., without the anti-adhesive structure 18, any positional deviation would risk causing the adhesive layer 16 in the region of the carrier section 2 to also adhere to the substrate, possibly resulting in fragments of the transfer layer 12.

In the solution shown, the positional tolerances are increased by the anti-adhesion structure 18. The anti-adhesive structure 18 provides a longitudinal positioning region, in particular an enlarged positioning region, for the transfer tool 31 in the transfer carrier 10. This problem is avoided as long as the position of the transfer tool 31 remains in the boundary of the anti-adhesion structure 18. Adhesion is prevented by improved positional tolerances between the carrier section 2 (or the adhesive layer 16 located thereon) and the substrate.

As shown in the figures, length L31 of transfer tool 31 may thus be greater than length L1 of transfer section 1, but it is also contemplated by the illustrated anti-adhesion structure to select length L31 equal to length L1 or to select length L31 less than length L1.

The anti-adhesive structure 18 is provided (respectively) with a length L18, the anti-adhesive structure 18 is applied before the formation of the adhesive layer interruption 15, alternatively a subsequent application is also possible, the anti-adhesive structure 18 is provided only locally both above the transfer section 1 and above the carrier section, the transfer layer interruption 15 interrupts the transfer layer 12 and the anti-adhesive structure 18, the anti-adhesive structure 18 in particular directly adjoins the transfer layer interruption 15 on both sides, the length L18 of the anti-adhesive structure is greater than 2mm, the length L18 is in particular between 2 and 20mm, preferably between 4 and 10mm, the length of the part of the anti-adhesive structure located above the transfer section 1 is preferably less than 2mm, in particular in the range from 0.2 to 2mm, particularly preferably from 0.2 to 1 mm.

In a further variant, it can also be provided that, in contrast to fig. 1, the anti-adhesive structure 18 does not only partially but completely cover the carrier section of the transfer layer remaining on the carrier layer. The anti-adhesive structure then extends over the first transfer layer interruption (at one of the two ends of the transfer section), the carrier section and the second transfer layer interruption (at the respective other end of the adjacent transfer section). The anti-adhesion structure thus forms a common anti-adhesion structure for two adjacent transfer sections. In this case too, in particular, a greater length of the anti-adhesion structure is generally produced, which may also be greater than 20 mm.

The transfer section 1 of the transfer layer 12 is adhered to the substrate 20 after transfer, together with the adhesive layer 16 and the portions of the release structure 18 located above said transfer section 1, in that regard, the respective sections of the expanded transfer layer 14 are transferred to the substrate 20 in the example according to fig. 2, the transfer section 1 is adhered to the substrate 20 over almost the entire length L31 of said transfer section, the respective portions of the release structure 18 only prevent adhesion at locations immediately adjacent to the beginning and the end of the transfer section 1.

In fig. 2, a continuous adhesive layer 16 is arranged on the transfer layer 12, however, it is likewise possible to provide a continuous adhesive layer on a substrate, whereby an anti-adhesive structure 18 arranged directly on the transfer layer 12 functions in the same way, in particular, an adhesive layer that can be activated (by means of temperature, radiation or pressure), preferably a thermally pressed adhesive lacquer layer (Hei β siegeckschicht), is used as the adhesive layer 16, the adhesive layer 16 preferably having a plurality of sub-layers, in particular a primer layer and an adhesive lacquer layer that can be activated.

The anti-adhesive structure 18 is preferably applied, in particular printed, as a separate structure. In an alternative embodiment, the anti-adhesive structure 18 is formed by deactivated sections of the adhesive layer 16. The deactivation may be effected physically or chemically, for example by local irradiation or local application of deactivating chemicals.

Fig. 3 likewise shows a longitudinal section through the transfer carrier 10. The anti-adhesion structure 18 is arranged differently in this example. Furthermore, the figures show two differently designed anti-adhesion structures 18.

The anti-adhesive structure 18 is arranged only above the transfer section 1 and is only locally present there again. The transfer section 1 does not have an anti-adhesive structure 18 over the largest part of its length. The transfer section is accordingly adhered to the substrate over almost its entire length after transfer.

For this embodiment, the length L31 of the transfer tool is selected to be smaller than the length L1 of the transfer section 1. the anti-adhesive structure 18 in turn allows for variable positioning (of the transfer carrier relative to the transfer device or relative to the transfer tool) and correspondingly also for variation of the length of the individual transfer tools in the transfer device(s).

The anti-adhesive structure 18 shown in the right half of fig. 3 is applied afterwards to the adhesive layer 16. The anti-adhesive structure 18 (optionally) overlaps the transfer layer interruption 15. The anti-adhesive structures 18 shown in the left-hand half are not arranged directly adjacent to the transfer layer interruptions 15. It has been shown that the anti-adhesion structure does not necessarily have to extend exactly to the interruption. The longitudinal, yet adhered, minimum edge as shown here may be provided without losing the desired effect of the transfer characteristics of greater positional tolerance.

In all the embodiments discussed so far, it is assumed that the anti-adhesive structures are arranged over the entire width of the transfer carrier.

Fig. 4A and 4B, in turn, show examples of conceivable anti-adhesive structures 18 with adhesive edges in a plan view of the transfer carrier. In the region of the edges, the adhesive layer 16 in the drawing remains visible in top view, since it is not covered by the anti-adhesive layer 18. The variant without the adhesive layer 16, in which the transfer layer 12 can be seen in the region of the edges, is not shown separately.

The release structure 18 of fig. 4A with its length L is arranged in such a way that between the release structure 18 and the transfer layer interruption 15 there is an adhesive longitudinal edge (formed by the adhesive layer 16) of length L, the release structure 18 is arranged with the adhesive edge next to the transfer layer interruption 15, in the example of fig. 4A the release structure 18 is arranged with longitudinal edges next to the transfer layer interruption 15 on both sides, respectively, the length ratio of the length L of the longitudinal edge to the length of the release structure 18 (L to L) is less than 0.05, as a compensation or alternative to the adhesive longitudinal edge, it is also possible to arrange in such a way that on at least one side there is an adhesive transverse edge, in the drawing, the two release structures 18 are arranged in such a way that on both sides there is an adhesive transverse edge transverse to the release structure, the width of the release structure 18 is thus less than the width of the transfer carrier, the width of the transverse edge to the width of the release structure (B16 to 591) is less than 0.1.

Fig. 4B shows the anti-adhesion structure 18 overlying the transfer layer interruption 15. The anti-adhesive structure 18 has a width which increases in the longitudinal direction in the direction of the transfer section 1 on the right in the drawing. The width B18 of the release structure can optionally be increased to the width B10 of the transfer carrier 10 or, as shown, remain smaller than the width B10 of the transfer carrier 10. It is particularly preferred to use increasingly larger widths B18 of the anti-adhesion structures at the beginning of the transfer section 1 and correspondingly increasingly smaller widths of the anti-adhesion structures at the end of said transfer section (mirror-symmetrical arrangement).

List of reference numerals

1 transfer section

2 vector segment

10 transfer carrier

11 support layer

12 transfer layer

14 expanded transfer layer

15 transfer layer interruption

16 adhesive layer

18 anti-adhesion structure

20 base

30 transfer device

31 transfer tool

Claims

1. A transfer carrier (10) comprising:

-a carrier layer (11); and

-a transfer layer (12);

wherein the transfer layer (12) is arranged above the carrier layer (11) and can be detached from the carrier layer (11);

wherein the transfer carrier (10) comprises a transfer boundary (15, 18), and

wherein the transfer boundary (15, 18) comprises a transfer layer interruption (15) which serves as a boundary between a transfer section (1) of the transfer layer (12) to be transferred and a carrier section (2) of the transfer layer (12) remaining on the carrier layer (11),

it is characterized in that the preparation method is characterized in that,

the transfer border (15, 18) further comprising an anti-adhesion structure (18) arranged above the transfer layer (12),

the anti-adhesion structure (18) is arranged beside the transfer layer interruption (15) and

the anti-adhesion structure (18) is arranged only partially on at least one of the two sections (1, 2).

2. The transfer carrier (10) according to claim 1, characterized in that the anti-adhesive structure (18) is arranged only locally above the transfer section (1).

3. The transfer carrier (10) according to claim 1 or 2, characterized in that the anti-adhesive structure (18) is arranged only partially above the transfer section (1) and only partially above the carrier section (2).

4. The transfer carrier (10) according to claim 1 or 2, characterized in that the anti-adhesive structure (18) is arranged only partially above the transfer section (1) and fully above the carrier section (2).

5. Transfer carrier (10) according to one of claims 1 to 4, characterized in that the anti-adhesive structure (18) is arranged next to the transfer layer interruption (15) and extends over the transfer layer interruption (15).

6. Transfer carrier (10) according to one of claims 1 to 5, characterized in that the transfer carrier (10) further comprises an adhesive layer (16).

7. Transfer carrier (10) according to claim 6,

-the anti-adhesion structure (18) is arranged on the adhesive layer (16), or

-said anti-adhesion structure (18) is constituted by deactivated sections of the adhesive layer (16).

8. Transfer carrier (10) according to one of claims 1 to 7, characterized in that the anti-adhesive structure (18) provides a longitudinal positioning region for a transfer tool (31) of a transfer device (30).

9. Transfer carrier (10) according to one of claims 1 to 8, characterized in that it is based on

-a positioning tolerance of the transfer device (30), in particular a maximum positioning tolerance and/or based on a plurality of transfer devices and/or transfer device types

-the length of a transfer tool of a transfer device (30), in particular the minimum or maximum length of a transfer tool based on a plurality of transfer devices and/or transfer device types

The anti-adhesion structure (18), in particular the length (L18) or the location area of the anti-adhesion structure, is selected.

10. The transfer carrier (10) according to claim 9, characterized in that the positioning tolerance takes into account one or more of the following tolerance parameters:

-the position of the transfer die in the longitudinal direction in the transfer device; and/or

-length tolerance of the transfer die.

11. Transfer carrier (10) according to one of the preceding claims, characterized in that the transfer layer interruption (15) interrupts the transfer layer (12) by more than 50%, in particular by between 75% and 100%, particularly preferably by 100%.

12. Transfer carrier (10) according to one of the preceding claims,

-the start and end of the transfer section (1) are respectively defined by a transfer layer interruption (15); and/or

-said anti-adhesion structures (18) are provided only at the beginning and at the end of the transfer section (1), respectively; and/or

-the anti-adhesive structure (18) extends over exactly one transfer layer interruption (15) of a transfer section or over exactly two transfer layer interruptions of an adjacent transfer section.

13. Transfer carrier (10) according to one of the preceding claims, characterized in that the anti-adhesive structure (18) is arranged only partially in the longitudinal direction, however in the transverse direction over the entire width of the segments (1, 2).

14. Transfer carrier (10) according to one of the preceding claims,

-a plurality of transfer sections (1) are arranged one behind the other in the longitudinal direction on a transfer carrier (10); and/or

-the transfer section (1) comprises a plurality of security elements, which are contained in the transfer section one behind the other in the longitudinal direction; and/or

-the width of the carrier layer (11) corresponds to the width of the transfer section (1).

15. Transfer carrier (10) according to claim 14, characterized in that the length of the transfer section (1) is more than 25cm and in particular less than 120 cm.

16. Use of a transfer carrier (10) according to one of the preceding claims in a transfer device (30), in particular in one of a plurality of transfer devices (30).

17. Method for manufacturing a transfer carrier (10), in particular according to one of claims 2 to 15, having the steps of:

-providing a transfer carrier (10) with a carrier layer (11) and a transfer layer (12),

wherein the transfer layer (12) is arranged above a carrier layer (11) and can be detached from the carrier layer (11),

-producing a transfer boundary (15, 18) at least locally in the transfer carrier (10),

wherein the transfer boundary (15, 18) comprises a transfer layer interruption (15) which serves as a boundary between a transfer section (1) of the transfer layer (12) to be transferred and a carrier section (2) of the transfer layer (12) remaining on the carrier,

it is characterized in that the preparation method is characterized in that,

applying an anti-adhesion structure (18) during the step of manufacturing the transfer border (15, 18),

wherein the anti-adhesive structure (18) is applied on top of the transfer layer (12),

wherein the anti-adhesion structure (18) is arranged next to the transfer layer interruption (15) and

wherein the anti-adhesive structure (18) is applied only locally on at least one of the two sections (1, 2).