CN111508941B - Optical sensing chip packaging structure - Google Patents
Optical sensing chip packaging structure Download PDFInfo
- Publication number
- CN111508941B CN111508941B CN201910097741.9A CN201910097741A CN111508941B CN 111508941 B CN111508941 B CN 111508941B CN 201910097741 A CN201910097741 A CN 201910097741A CN 111508941 B CN111508941 B CN 111508941B
- Authority
- CN
- China
- Prior art keywords
- light
- substrate
- emitting element
- light emitting
- sensing element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
Abstract
An optical sensing chip packaging structure comprises a substrate, a light sensing element, a light emitting element and a transparent cover plate. The substrate is provided with a concave part, and the light sensing element is arranged in the concave part and is electrically connected with the substrate. The light-emitting element is disposed in the recess and electrically connected to the substrate or the light-sensing element. The transparent cover plate is arranged on the substrate and covers the light sensing element and the light emitting element.
Description
Technical Field
The invention relates to a chip packaging structure; in particular to an optical sensing chip packaging structure.
Background
Fig. 1 is a schematic structural diagram of a conventional optical sensing chip package structure 100, which is composed of a substrate 120, a light sensing element 140, a light emitting element 160 and a transparent adhesive layer 180, wherein the light sensing element 140 is disposed in a recess 122 of the substrate 120, and the light emitting element 160 is disposed on the light sensing element 140; the transparent adhesive layer 180 is disposed in the recess 122 and covers the light sensing element 140 and the light emitting element 160.
However, the transparent adhesive layer 180 of the optical sensing chip package structure 100 is directly exposed, and thus is easily stained with dust or dirt, resulting in misalignment of the sensing result of the optical sensing element 140. For example, when the optical sensor chip package 100 passes through the SMT solder furnace, the solder dust adheres to the transparent adhesive layer 180 of the optical sensor chip package 100. In addition, when a person takes the optical sensing chip package structure 100, the person easily touches or presses the transparent adhesive layer 180 of the optical sensing chip package structure 100, such that the sensing result of the optical sensing element 140 is misaligned, or even the optical sensing chip package structure 100 fails as a whole.
In summary, the problems of the conventional optical sensing chip package structure are yet to be overcome.
Disclosure of Invention
In view of the above, the present invention provides an optical sensor chip package structure, which uses a transparent cover to cover the light sensing element and the light emitting element, so as to prevent dust or dirt from adhering to the light sensing element or the light emitting element, and prevent personnel from touching or pressing the light sensing element or the light emitting element, so as to protect the optical sensor chip package structure.
In order to achieve the above objective, the present invention provides an optical sensing chip package structure, which includes a substrate, a light sensing element, a light emitting element, and a transparent cover plate. The substrate is provided with a concave part, and the light sensing element is arranged in the concave part and is electrically connected with the substrate. The light-emitting element is disposed in the recess and electrically connected to the substrate or the light-sensing element. The transparent cover plate is arranged on the substrate and covers the light sensing element and the light emitting element.
The invention has the advantages that the light sensing element and the light emitting element are covered by the transparent cover plate, so that dust or dirt is prevented from adhering to the light sensing element or the light emitting element, personnel can be prevented from touching or pressing the light sensing element or the light emitting element, the optical sensing chip packaging structure is protected, and the sensing accuracy of the light sensing element and the overall reliability of the optical sensing chip packaging structure are further improved.
Drawings
FIG. 1 is a block diagram of a conventional optical sensing chip package structure;
FIG. 2 is a block diagram of an optical sensing chip package structure according to a first embodiment of the present invention;
FIG. 3 is a diagram illustrating a structure of an optical sensing chip package according to a second embodiment of the present invention;
FIG. 4 is a diagram illustrating a structure of an optical sensing chip package according to a third embodiment of the present invention;
FIG. 5 is a block diagram of an optical sensing chip package structure according to a fourth embodiment of the present invention;
fig. 6 is a block diagram of an optical sensing chip package structure according to a fifth embodiment of the present invention.
[ Prior Art ]
100 optical sensing chip packaging structure
120 substrate 122 recess 140 light sensing element
160 light-emitting element 180 transparent glue layer
[ invention ]
200a, 200b, 200c, 300a, 300b optical sensing chip packaging structure
220. 320 bottom wall 222 recess of substrate 221, 321
223. 323 sidewalls 224, 224a, 224b, 324a, 324b contacts
240. 340 photo sensor
241. 261, 341, 361 wires 242, 342 light sensing surfaces
260. 360 light emitting element 262, 362 light emitting surface
280. 380 transparent cover plate 281, 381 upper surface 282, 382 grating
283. 383 under surface 322a first accommodation space 322b second accommodation space
325 separator
d distance
Detailed Description
In order to more clearly illustrate the present invention, the following preferred embodiments are described in detail with reference to the accompanying drawings. Referring to fig. 2, an optical sensing chip package structure 200a according to a first embodiment of the invention includes a substrate 220, a light sensing element 240, a light emitting element 260, and a transparent cover 280. In an embodiment of the present invention, the substrate 220 has a recess 222. The substrate 220 has a plurality of circuit contacts 224; the photo sensor 240 is disposed in the recess 222 of the substrate 220 and electrically connected to the contact 224 of the substrate 220 through the conductive wire 241. In the embodiment of the invention, the substrate 220 includes a bottom wall 221 and a side wall 223, wherein the bottom wall 221 and the side wall 223 are connected to form a recess 222. In the embodiment of the invention, the contact 224 is disposed at the top of the sidewall 223, and one end of the conductive wire 241 is connected to the photo-sensing element 240, while the other end is connected to the contact 224.
The light emitting element 260 is disposed on the light sensing element 240 and electrically connected to the substrate 220 or the light sensing element 240. In the embodiment of the invention, the light emitting element 260 is disposed on the light sensing element 240 and is electrically connected to the light sensing element 240 through the conductive wire 261. In fig. 2, one end of the wire 261 is connected to the light emitting element 260, and the other end thereof is connected to the light sensing element 240.
In the embodiment of the invention, the light emitting element 260 has a light emitting surface 262, and the light sensing element 240 has a light sensing surface 242, and the light sensing surface 242 of the light sensing element 240 is used for sensing the light emitted by the light emitting element 260. In an application of the present embodiment, the optical sensor chip package structure 200a may be used to sense whether a target is located in front of the optical sensor chip package structure 200a, or the optical sensor chip package structure 200a may be used to detect whether a target moves relative to the optical sensor chip package structure 200a, which may be used as an optical ruler. In the embodiment of the invention, the light emitting element 260 is a point light source, such as a light emitting diode or a laser light source, but is not limited thereto. In the embodiment of the invention, the light emitting surface 262 of the light emitting element 260 and the light sensing surface 242 of the light sensing element 240 are substantially in the same direction, i.e. the light emitting surface 262 of the light emitting element 260 and the light sensing surface 242 of the light sensing element 240 face towards the transparent cover 280, so that when the light emitted from the light emitting surface 262 of the light emitting element 260 encounters the object to be reflected, the incident light and the reflected light have a smaller angle to obtain a more accurate measurement value.
The transparent cover 280 is disposed on the substrate 220 and covers the light sensing element 240 and the light emitting element 260. In the embodiment of the invention, the light sensing surface 242 has a distance d from a bottom surface of the transparent cover plate, and the distance d is less than or equal to 0.8 mm. If the distance d is larger, the diffusion area of the light emitted by the light emitting element 260 after being reflected is larger, so that the signal interference of the light sensing element 240 is increased; conversely, if the distance d is smaller, the diffusion area of the light emitted by the light emitting element 260 after being reflected is smaller, so that the optical sensing element 240 can obtain better signal resolution, and further, the measurement accuracy of the optical sensing chip package structure 200a is improved.
In the embodiment of the invention, the transparent cover 280 includes a grating 282, the photo-sensing element 240 and the light-emitting element 260 are located on the same side of the transparent cover 280, and the grating 282 covers the photo-sensing surface 242 of the photo-sensing element 240 and the light-emitting element 260, and the grating 282 is disposed on the upper surface 281 of the transparent cover 280. Since the grating 282 is fixed on the upper surface 281 of the transparent cover 280, the relative positions of the grating 282, the light sensing element 240 and the light emitting element 260 are fixed. In other words, the alignment of the grating 282 is completed, and the relative positions of the grating with the light sensing element 240 and the light emitting element 260 are not required to be adjusted. Therefore, compared to the conventional optical sensor chip package structure and the grating which are separately and independently disposed, the optical sensor chip package structure 200a provided by the embodiment of the invention has better measurement stability and reproducibility.
Referring to fig. 3, an optical sensing chip package structure 200b according to a second embodiment of the invention includes a substrate 220, a light sensing element 240, a light emitting element 260, and a transparent cover 280. The optical sensing chip package structure 200b of the second embodiment of the present invention is similar to the optical sensing chip package structure 200a of the first embodiment, and the difference between the two is that the positions of the contacts 224a, 224b and the grating 282 of the optical sensing chip package structure 200b are different from the optical sensing chip package structure 200a.
In an embodiment of the present invention, the substrate 220 has a plurality of circuit contacts 224a, 224b; the photo sensor 240 is disposed in the recess 222 of the substrate 220 and electrically connected to the contact 224a of the substrate 220 through the conductive wire 241. In the embodiment of the invention, the contact 224a is disposed on the bottom wall 221, and one end of the conductive wire 241 is connected to the photo-sensing element 240, while the other end is connected to the contact 224a.
The light emitting element 260 is disposed on the light sensing element 240 and electrically connected to the contact 224b of the substrate 220 through the conductive line 261. In fig. 3, the contact 224b is disposed on the bottom wall 221, and one end of the wire 261 is connected to the light emitting element 260, and the other end is electrically connected to the contact 224b of the substrate 220.
In the embodiment of the present invention, the transparent cover 280 includes a grating 282, and the grating 282 is disposed on a lower surface 283 of the transparent cover 280. Since the grating 282 is fixed on the lower surface 283 of the transparent cover 280, the relative positions of the grating 282, the light sensing element 240 and the light emitting element 260 are fixed. In other words, the alignment of the grating 282 is completed, and the relative positions of the grating with the light sensing element 240 and the light emitting element 260 are not required to be adjusted. Therefore, compared to the conventional optical sensor chip package structure and the grating which are separately and independently disposed, the optical sensor chip package structure 200b provided by the embodiment of the invention has better measurement stability and reproducibility.
Referring to fig. 4, an optical sensing chip package structure 200c according to a third embodiment of the invention includes a substrate 220, a light sensing element 240, a light emitting element 260, and a transparent cover 280. The optical sensing chip package structure 200c of the third embodiment of the present invention is similar to the optical sensing chip package structure 200b of the second embodiment, and the difference between the two is that the arrangement of the contacts 224a, 224b and the grating 282 of the optical sensing chip package structure 200c is different from the optical sensing chip package structure 200b.
In an embodiment of the present invention, the substrate 220 has a plurality of circuit contacts 224a, 224b; the photo sensor 240 is disposed in the recess 222 of the substrate 220 and electrically connected to the contact 224a of the substrate 220 through the conductive wire 241. In the embodiment of the invention, the contact 224a is disposed at the top of the sidewall 223, and one end of the conductive wire 241 is connected to the photo-sensing element 240, while the other end is connected to the contact 224a.
The light emitting element 260 is disposed on the light sensing element 240 and electrically connected to the contact 224b of the substrate 220 through the conductive line 261. In fig. 4, the contact 224b is disposed at the top end of the sidewall 223, and one end of the wire 261 is connected to the light emitting element 260, and the other end is electrically connected to the contact 224b of the substrate 220.
In the embodiment of the invention, the transparent cover 280 includes a grating 282, and the grating 282 is disposed on the upper surface 281 and the lower surface 283 of the transparent cover 280, respectively. Since the grating 282 is fixed on the upper surface 281 and the lower surface 283 of the transparent cover 280, the relative positions of the grating 282, the light sensing element 240 and the light emitting element 260 are fixed. In other words, the alignment of the grating 282 is completed, and the relative positions of the grating with the light sensing element 240 and the light emitting element 260 are not required to be adjusted. Therefore, compared to the conventional optical sensor chip package structure and the grating which are separately and independently disposed, the optical sensor chip package structure 200c provided by the embodiment of the invention has better measurement stability and reproducibility.
Referring to fig. 5, an optical sensor chip package 300a according to a fourth embodiment of the invention includes a substrate 320, a light sensing element 340, a light emitting element 360 and a transparent cover 380. In the embodiment of the invention, the substrate 320 has a recess and a partition 325, and the partition 325 is disposed in the recess to divide the recess into a first accommodating space 322a and a second accommodating space 322b; the light emitting element 360 is disposed in the first accommodating space 322a, and the light sensing element 340 is disposed in the second accommodating space 322 b. In an embodiment of the present invention, the barrier 325 is an opaque barrier. The substrate 220 has a plurality of circuit contacts 324a, 324b; the photo-sensing device 340 is electrically connected to the contact 324a of the substrate 320 through the conductive wire 341. In the embodiment of the invention, the substrate 320 includes a bottom wall 321 and a side wall 323, wherein the bottom wall 321 and the side wall 323 are connected to form a recess. In the embodiment of the invention, the contact 324a is disposed on the bottom wall 321, and one end of the conductive wire 341 is connected to the photo-sensing element 340, while the other end is connected to the contact 324a.
The light emitting element 360 is electrically connected to the substrate 320. In the embodiment of the invention, the light emitting element 360 is electrically connected to the contact 324b of the substrate 320 through the conductive line 361. In fig. 5, the contact 324b is disposed on the bottom wall 321, and one end of the conductive line 361 is connected to the light emitting device 360, and the other end is connected to the contact 324b of the substrate 320.
The transparent cover 380 is disposed on the substrate 320 and covers the light sensing element 340 and the light emitting element 360. In an embodiment of the present invention, transparent cover plate 380 includes a grating 382, and grating 382 is disposed on an upper surface 381 of transparent cover plate 380. Since the grating 382 is fixed on the upper surface 381 of the transparent cover 380, the relative positions of the grating 382, the light sensing element 340 and the light emitting element 360 are fixed. In other words, the alignment of the grating 382 is completed, and the relative positions of the grating with the light sensing element 340 and the light emitting element 360 are not required to be adjusted. Therefore, compared to the conventional optical sensor chip package structure and the grating which are separately and independently disposed, the optical sensor chip package structure 300a provided by the embodiment of the invention has better measurement stability and reproducibility.
Referring to fig. 6, an optical sensor chip package 300b according to a fifth embodiment of the invention includes a substrate 320, a light sensing element 340, a light emitting element 360 and a transparent cover 380. The optical sensing chip package structure 300b of the fifth embodiment of the present invention is similar to the optical sensing chip package structure 300a of the fourth embodiment, and the difference is that the positions of the contacts 324a, 324b of the optical sensing chip package structure 300b are different from the optical sensing chip package structure 300a; in addition, the transparent cover plate 380 of the optical sensing chip package structure 300b does not include a grating.
In the embodiment of the present invention, the substrate 220 has a plurality of circuit contacts 324a, 324b; the photo-sensing device 340 is electrically connected to the contact 324a of the substrate 320 through the conductive wire 341. In the embodiment of the invention, the substrate 320 includes a bottom wall 321 and a side wall 323, wherein the bottom wall 321 and the side wall 323 are connected to form a recess. In the embodiment of the invention, the contact 324a is disposed at the top of the sidewall 323, and one end of the conductive wire 341 is connected to the photo-sensing element 340, and the other end is connected to the contact 324a.
The light emitting element 360 is electrically connected to the substrate 320. In the embodiment of the invention, the light emitting element 360 is electrically connected to the contact 324b of the substrate 320 through the conductive line 361. In fig. 6, the contact 324b is disposed at the top of the sidewall 323, and one end of the conductive line 361 is connected to the light emitting device 360, and the other end is connected to the contact 324b of the substrate 320.
According to the embodiment of the invention, the optical sensing chip packaging structure provided by the embodiment of the invention is characterized in that the optical sensing element and the light emitting element are covered by the transparent cover plate, so that dust or dirt is prevented from being attached to the optical sensing element or the light emitting element, personnel can be prevented from touching or pressing the optical sensing element or the light emitting element, the optical sensing chip packaging structure is protected, and the sensing accuracy of the optical sensing element and the overall reliability of the optical sensing chip packaging structure are further improved.
The foregoing description is only illustrative of the preferred embodiments of the present invention, and all changes which come within the meaning and range of equivalency of the description and the claims are therefore intended to be embraced therein.
Claims (4)
1. An optical sensing chip package structure, comprising:
a substrate having a recess;
the light sensing element is arranged in the concave part and is electrically connected with the substrate; the light sensing element is provided with a light sensing surface;
the light-emitting element is arranged in the concave part and is electrically connected with the substrate or the light-sensing element, the light-emitting element is arranged on the light-sensing element, the light-emitting element is connected with a wire, and when the light-emitting element is electrically connected with the substrate, one end of the wire is connected with the substrate, so that the light-emitting element is electrically connected with the substrate; when the light-emitting element is electrically connected with the light-sensing element, one end of the wire is connected with the light-sensing element, so that the light-emitting element is electrically connected with the light-sensing element; and
a transparent cover plate disposed on the substrate and covering the light sensing element and the light emitting element,
the light sensing element and the light emitting element are positioned on the same side of the transparent cover plate, the transparent cover plate comprises a grating which is positioned on the upper surface, the lower surface or the combination of the upper surface and the lower surface of the transparent cover plate, and the grating covers the light sensing surface of the light sensing element and the light emitting element.
2. The package structure of claim 1, wherein the light emitting device has a light emitting surface facing the transparent cover.
3. The package structure of claim 1, wherein the light sensing surface faces the transparent cover.
4. The optical sensor chip package according to claim 3, wherein the light sensing surface has a distance from a bottom surface of the transparent cover plate, and the distance is less than or equal to 0.8 mm.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910097741.9A CN111508941B (en) | 2019-01-31 | 2019-01-31 | Optical sensing chip packaging structure |
| CN202310080753.7A CN115939121A (en) | 2019-01-31 | 2019-01-31 | Optical sensing chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910097741.9A CN111508941B (en) | 2019-01-31 | 2019-01-31 | Optical sensing chip packaging structure |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310080753.7A Division CN115939121A (en) | 2019-01-31 | 2019-01-31 | Optical sensing chip packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111508941A CN111508941A (en) | 2020-08-07 |
| CN111508941B true CN111508941B (en) | 2023-06-16 |
Family
ID=71875641
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310080753.7A Pending CN115939121A (en) | 2019-01-31 | 2019-01-31 | Optical sensing chip packaging structure |
| CN201910097741.9A Active CN111508941B (en) | 2019-01-31 | 2019-01-31 | Optical sensing chip packaging structure |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310080753.7A Pending CN115939121A (en) | 2019-01-31 | 2019-01-31 | Optical sensing chip packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN115939121A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101689748A (en) * | 2007-06-27 | 2010-03-31 | 皇家飞利浦电子股份有限公司 | Optical sensor module and its manufacture |
| CN106646684A (en) * | 2016-07-26 | 2017-05-10 | 友达光电股份有限公司 | Image sensing device and optical film thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103500786B (en) * | 2013-09-29 | 2016-06-08 | 杭州杭科光电股份有限公司 | The LED/light source of a kind of full angle luminescence and its preparation method |
| US9590129B2 (en) * | 2014-11-19 | 2017-03-07 | Analog Devices Global | Optical sensor module |
-
2019
- 2019-01-31 CN CN202310080753.7A patent/CN115939121A/en active Pending
- 2019-01-31 CN CN201910097741.9A patent/CN111508941B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101689748A (en) * | 2007-06-27 | 2010-03-31 | 皇家飞利浦电子股份有限公司 | Optical sensor module and its manufacture |
| CN106646684A (en) * | 2016-07-26 | 2017-05-10 | 友达光电股份有限公司 | Image sensing device and optical film thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115939121A (en) | 2023-04-07 |
| CN111508941A (en) | 2020-08-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102051238B1 (en) | Capacitive DOE Integrity Monitor | |
| US10903387B2 (en) | Optical sensing assembly and method for manufacturing the same, and optical sensing system | |
| US8558162B2 (en) | Optical pointing device having a transparent housing element | |
| US20190278104A1 (en) | Optical module for protecting human eyes | |
| TWI731296B (en) | Optical sensing chip packaging structure | |
| CN111508941B (en) | Optical sensing chip packaging structure | |
| JP2024012600A (en) | Optical module and reflection encoder | |
| CN106404013B (en) | Position measuring mechanism | |
| TWI504026B (en) | Optical orientation module and light source unit thereof | |
| US10811399B1 (en) | Optical sensing chip packaging structure | |
| JP4999595B2 (en) | Reflective photo sensor | |
| CN116068528A (en) | TOF sensor and electronic device | |
| JP4377072B2 (en) | 3D measurement module | |
| JP4999596B2 (en) | Reflective photo sensor | |
| KR102459822B1 (en) | semiconductor device | |
| JP4265928B2 (en) | Photoelectric encoder | |
| CN112053995A (en) | Optical sensing chip package structure | |
| JP4350419B2 (en) | Photoelectric encoder | |
| JP3228683B2 (en) | Optical coupling device for tilt detection | |
| US20200381574A1 (en) | Optical sensing chip packaging structure | |
| US9816842B2 (en) | Optoelectronic position measuring device including a code carrier, a radiation source, and a detection element | |
| JP2006078376A (en) | Optical displacement sensor | |
| JP3560866B2 (en) | Encoder package manufacturing method | |
| JP2000266542A (en) | Optical inclination sensor | |
| JPH0273112A (en) | Photoelectric device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |