JP2000266542A - Optical inclination sensor - Google Patents
Optical inclination sensorInfo
- Publication number
- JP2000266542A JP2000266542A JP7388899A JP7388899A JP2000266542A JP 2000266542 A JP2000266542 A JP 2000266542A JP 7388899 A JP7388899 A JP 7388899A JP 7388899 A JP7388899 A JP 7388899A JP 2000266542 A JP2000266542 A JP 2000266542A
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting element
- light emitting
- light receiving
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は被検出物の傾斜を光
により測定する光学式傾斜センサに関するものであり、
詳細には、この光学式傾斜センサにおけるＳ／Ｎ比の向
上を可能とする構成に係るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical inclination sensor for measuring an inclination of an object to be detected by light,
More specifically, the present invention relates to a configuration that enables an improvement in the S / N ratio of the optical tilt sensor.
【０００２】[0002]
【従来の技術】従来のこの種の光学式傾斜センサ９０の
例を示すものが図４であり、基板９１上にはＬＥＤなど
による発光素子９２と、ホトダイオードなどによる受光
素子９３とがチップの状態で前記基板９１上の配線パタ
ーン９１ａの所定位置に一方の電極がマウントされ、他
方の電極をワイヤー９４により他の配線パターン９１ａ
に接続している。このとき、前記受光素子９３は感光面
９３ａと感光面９３ｂとを有する二分割のものが採用さ
れており、実質的に複数の受光素子を有する受光素子群
となっている。2. Description of the Related Art FIG. 4 shows an example of a conventional optical tilt sensor 90 of this type. A light emitting element 92 such as an LED and a light receiving element 93 such as a photodiode are provided on a substrate 91 in a chip state. One electrode is mounted on a predetermined position of the wiring pattern 91a on the substrate 91, and the other electrode is connected to another wiring pattern 91a by a wire 94.
Connected to At this time, the light receiving element 93 is a two-division element having a photosensitive surface 93a and a photosensitive surface 93b, and is substantially a light receiving element group having a plurality of light receiving elements.
【０００３】このように基板９１上にマウントが行なわ
れた発光素子９２と受光素子９３とは図５に示すように
不透明樹脂のトランスファーモールドなどにより前記発
光素子９２と前記受光素子９３の間に遮光壁９５ａを有
し、投光及び受光側方向に開口９５ｂを設けたケース９
５を形成し、前記開口９５ｂには前記発光素子９２と前
記受光素子９３の中心に光軸を有する１つの凸レンズ９
６が透明樹脂のトランスファーモールドなどにより形成
されている。As shown in FIG. 5, the light emitting element 92 and the light receiving element 93 mounted on the substrate 91 are shielded between the light emitting element 92 and the light receiving element 93 by transfer molding of an opaque resin or the like. Case 9 having a wall 95a and an opening 95b in the direction of the light emitting and receiving sides
5, and one convex lens 9 having an optical axis at the center of the light emitting element 92 and the light receiving element 93 is formed in the opening 95b.
6 is formed by a transparent resin transfer mold or the like.
【０００４】以上のように構成された光学式傾斜センサ
９０は、図６に示すように前方に存在する被検出物８０
に対して発光素子９２から放射された光は前記凸レンズ
９６により略平行光となり投射するものとなり、このと
きに前記被検出物８０に傾きを生じていなければ前記発
光素子９２からの反射光は前記凸レンズ９６を介して前
記受光素子９３の感光面９３ａと感光面９３ｂとに均等
に達するものとなる。[0006] The optical tilt sensor 90 configured as described above is provided with an object to be detected 80 existing in front as shown in FIG.
The light emitted from the light emitting element 92 becomes substantially parallel light and is projected by the convex lens 96. At this time, if the detected object 80 is not inclined, the reflected light from the light emitting element 92 is The light reaches the photosensitive surface 93a and the photosensitive surface 93b of the light receiving element 93 via the convex lens 96 evenly.
【０００５】また、もしも被検出物８０に傾きを生じて
いれば、反射光の方向が傾き、感光面９３ａと感光面９
３ｂとに異なる光量が達するものとなるので、前記受光
素子９３の出力から被検出物８０に生じている傾斜の方
向及び傾斜の程度が検出できるものとなる。If the detected object 80 is inclined, the direction of the reflected light is inclined, and the photosensitive surface 93a and the photosensitive surface 9a are tilted.
Since the amount of light that reaches 3b is different from that of FIG. 3b, it is possible to detect the direction and the degree of the inclination occurring on the object 80 from the output of the light receiving element 93.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、前記し
た従来の光学式傾斜センサ９０においては、１つの凸レ
ンズ９６により光の出射及び受光を行なっているので、
前記発光素子９２及び受光素子９３は前記凸レンズ９６
の光軸よりずれた位置に配置されるため、前記発光素子
９２から放射された光は前記凸レンズ９６により理想的
な平行光とはならず、前記被検出物８０の反射率や距離
が変化したときに前記受光素子９３上に形成される反射
光によるスポットにずれが生じ特性に影響を与えるもの
となる。However, in the above-described conventional optical tilt sensor 90, light is emitted and received by one convex lens 96.
The light emitting element 92 and the light receiving element 93 are
Since the light is emitted from the light emitting element 92, the light emitted from the light emitting element 92 does not become ideal parallel light due to the convex lens 96, and the reflectance and the distance of the object 80 change. Occasionally, a spot is shifted due to reflected light formed on the light receiving element 93, which affects characteristics.
【０００７】また、前記のように共用する凸レンズ９６
を使用しているため、前記ケース９５に形成される遮光
壁９５ａの高さは前記発光素子９２又は受光素子９３の
高さ程度にしかすることができず、このため前記凸レン
ズ９６により反射を生じ、この光が前記受光素子９３に
入ることにより出力に対するＳ／Ｎ比が低下し、傾斜に
対する検出感度が低下するものとなる問題点を生じてい
る。Further, the common convex lens 96 is used as described above.
Is used, the height of the light-shielding wall 95a formed in the case 95 can be only about the height of the light-emitting element 92 or the light-receiving element 93, so that the convex lens 96 causes reflection. However, when this light enters the light receiving element 93, the S / N ratio with respect to the output decreases, and there is a problem that the detection sensitivity with respect to the inclination decreases.
【０００８】さらに、前記発光素子９２は通常ＬＥＤが
用いられるが、このＬＥＤは光出射面の略中央に一方の
電極９２ａを有し、この電極９２ａの周囲より光が放出
されるものであるため、比較的大きな発光源となってし
まいレンズに対する集光度が悪く、又、前記電極９２ａ
への配線のためにワイヤー９４を用いているため、この
ワイヤー９４が影となり、理想的な発光が得らず、高い
精度が要求されるこの種の光学式傾斜センサ９０におい
ては重大な問題となっていた。Further, an LED is usually used as the light emitting element 92. This LED has one electrode 92a substantially at the center of the light emitting surface, and light is emitted from the periphery of the electrode 92a. , It becomes a relatively large light source and the degree of light condensing on the lens is poor.
Since the wire 94 is used for wiring to the optical tilt sensor, the wire 94 becomes a shadow, and an ideal light emission is not obtained. Had become.
【０００９】[0009]
【課題を解決するための手段】本発明は前記した従来の
課題を解決するための具体的手段として、発光素子と複
数の受光素子とが一体の基板内に配置され、これらを覆
うケースを有する光学式傾斜センサにおいて、前記ケー
スは前記発光素子及び複数の前記受光素子である受光素
子群に対応した投光部及び受光部を有し、前記投光部と
前記受光部にはそれぞれ独立したレンズを有することを
特徴とする光学式傾斜センサを提供することで課題を解
決するものである。According to the present invention, as a specific means for solving the above-mentioned conventional problems, there is provided a case in which a light emitting element and a plurality of light receiving elements are arranged in an integrated substrate and cover them. In the optical tilt sensor, the case has a light emitting unit and a light receiving unit corresponding to the light emitting element and a light receiving element group as the plurality of light receiving elements, and the light emitting unit and the light receiving unit have independent lenses. The problem is solved by providing an optical inclination sensor having the following.
【００１０】さらに良好な具体的手段としては、前記発
光素子が発光中心部に窓部が形成された電極を有するＬ
ＥＤとするものである。As a more preferable specific means, the light emitting element has an electrode in which a window is formed at a light emission center.
ED.
【００１１】[0011]
【発明の実施の形態】次に本発明を図に示す実施形態に
基づいて詳細に説明する。図１及び図２に符号１で示す
ものは本発明に係る光学式傾斜センサであり、基板２上
に形成した所定の配線パターン２ａ上に発光素子である
発光ダイオード３（以下、ＬＥＤ３とする）及び複数の
受光素子である受光素子群として２分割ホトダイオード
４（以下、２分割ＰＤ４とする）を所定位置にマウント
し、両素子をケース５により覆っている点は従来例のも
のと同様であり、又、被検出物（ここでの図示は省略す
る、図６を参照）の検出を行なうときの動作原理も従来
例のものと同様である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail based on an embodiment shown in the drawings. 1 and 2 is an optical tilt sensor according to the present invention, and a light emitting diode 3 (hereinafter, referred to as LED3) as a light emitting element is provided on a predetermined wiring pattern 2a formed on a substrate 2. Also, a two-division photodiode 4 (hereinafter, referred to as a two-division PD 4) is mounted at a predetermined position as a light receiving element group as a plurality of light receiving elements, and both elements are covered with a case 5 as in the conventional example. The principle of operation for detecting an object to be detected (not shown here, see FIG. 6) is the same as that of the conventional example.
【００１２】ここで、本発明においては前記光学式セン
サ１のケース５に投光部６及び受光部７を形成し、前記
投光部６及び受光部７にはそれぞれ独立した凸レンズ５
ａを形成している。また、前記ケース５の投光部６及び
受光部７の間には不透明材料により遮光壁８を形成して
いる。In the present invention, a light projecting portion 6 and a light receiving portion 7 are formed in the case 5 of the optical sensor 1, and the light projecting portion 6 and the light receiving portion 7 have independent convex lenses 5 respectively.
a. Further, a light-shielding wall 8 is formed of an opaque material between the light projecting portion 6 and the light receiving portion 7 of the case 5.
【００１３】さらに詳細に説明すると、本実施形態の場
合、前記ケース５は透光性の樹脂により前記投光部６及
び受光部７に設ける凸レンズ５ａと、さらに前記した遮
光壁８とをトランスファーモールドなどにより一体的に
形成するものである。More specifically, in the case of the present embodiment, the case 5 is formed by transfer molding a convex lens 5a provided in the light projecting portion 6 and the light receiving portion 7 with a translucent resin and the light shielding wall 8 described above. It is formed integrally by such as.
【００１４】このようにして形成された前記ケース５の
凸レンズ５ａは、投光部６の場合前記基板２上に配置さ
れたＬＥＤ３の中心に光軸が位置するように配置し、受
光部７の場合には前記２分割ＰＤ４の中心すなわち両感
光面４ａ、４ｂの間に光軸が位置するように配置する。The convex lens 5a of the case 5 thus formed is arranged so that the optical axis is located at the center of the LED 3 arranged on the substrate 2 in the case of the light projecting section 6, and the light receiving section 7 In such a case, the two divided PDs 4 are arranged such that the optical axis is located at the center of the divided PD 4, that is, between the photosensitive surfaces 4a and 4b.
【００１５】次に、発光素子として用いるＬＥＤ３は、
従来例においてはＬＥＤ３の略中心に円形状の電極を有
するものであったのに対し、本発明においては図３に示
すように、ＬＥＤ３の発光面となる側に形成する電極３
ａを、前記ＬＥＤ３の略中心に光が透過する窓部３ｂを
有するものとしている。Next, the LED 3 used as a light emitting element is:
In the conventional example, a circular electrode is provided substantially at the center of the LED 3, whereas in the present invention, as shown in FIG.
a has a window portion 3b through which light is transmitted substantially at the center of the LED3.
【００１６】ついで、以上の構成とした本発明の光学式
傾斜センサ１の作用及び効果について説明する。前記凸
レンズ５ａが投光部６及び受光部７のそれぞれに独立し
て設けられたことにより、投光部６側では、ＬＥＤ３の
発光中心と前記凸レンズ５ａの光軸を一致させることが
できるものとなり、前記ＬＥＤ３から外部に放射される
光は理想的な平行光となり、鋭いビーム形状が確保され
るものとなる。Next, the operation and effects of the optical tilt sensor 1 of the present invention having the above-described configuration will be described. Since the convex lens 5a is independently provided for each of the light projecting unit 6 and the light receiving unit 7, the light emitting center of the LED 3 and the optical axis of the convex lens 5a can be matched on the light projecting unit 6 side. The light emitted from the LED 3 to the outside becomes ideal parallel light, and a sharp beam shape is secured.
【００１７】また、受光部７側でも前記２分割ＰＤ４の
感光面４ａと４ｂの中間に前記凸レンズ５ａの光軸を配
置することができ、前記ＬＥＤ３からの反射光を正確に
前記感光面４ａ、４ｂ上に結像でき結像されるスポット
も鮮明な輪郭を有するものとなる。The optical axis of the convex lens 5a can be arranged between the photosensitive surfaces 4a and 4b of the two-divided PD 4 on the light receiving section 7 side, and the reflected light from the LED 3 can be accurately reflected on the photosensitive surfaces 4a and 4b. The spot that can be imaged on 4b also has a sharp outline.
【００１８】さらに、遮光壁８が前記凸レンズ５ａの近
傍まで形成できるものとなるので、前記凸レンズ５ａで
の反射などノイズ光が低減されるものとなりＳ／Ｎ比が
向上し、これらにより被検出物８０の傾斜に対する検出
感度が向上するものとなる。Further, since the light-shielding wall 8 can be formed up to the vicinity of the convex lens 5a, noise light such as reflection at the convex lens 5a is reduced, and the S / N ratio is improved. The detection sensitivity to the inclination of 80 is improved.
【００１９】そして、前記ＬＥＤ３の電極形状を上記の
ようにし発光源を小さなものとすることにより、前記凸
レンズ５ａに対する集光度を上げることができるものと
なり、前記凸レンズ５ａと前記ＬＥＤ３の焦点距離を短
くでき、製品の小型化が可能なものとなる。By making the electrode shape of the LED 3 as described above and making the light emitting source small, it becomes possible to increase the degree of light condensing on the convex lens 5a and shorten the focal length between the convex lens 5a and the LED 3. It is possible to reduce the size of the product.
【００２０】なお、本発明では、複数の受光素子とは１
つの受光素子内に複数の感光面が形成された上記実施形
態のような２分割ＰＤなども含むものであり、要は受光
部が複数設けられており、これらの出力により被検出物
の傾斜方向及び傾斜の程度が検出できるものであれば良
い。そしてこの複数の受光素子を受光素子群とし、この
受光素子群に対して、１つのレンズを設けるものであ
る。In the present invention, a plurality of light receiving elements is one.
It also includes a two-segment PD as in the above embodiment in which a plurality of photosensitive surfaces are formed in one light receiving element. In short, a plurality of light receiving portions are provided, and the tilt direction of the detected object is determined by these outputs. What is necessary is just to be able to detect the degree of inclination and the degree of inclination. The plurality of light receiving elements constitute a light receiving element group, and one lens is provided for the light receiving element group.
【００２１】また、上記実施形態では、ケース５を透明
樹脂により凸レンズ５ａと一体的に形成した例を示した
が、前記ケース５を不透明樹脂により形成し、前記投光
部６及び受光部７の位置に前記基板１まで貫通する孔を
形成し、表面に凸レンズ５ａを形成するか、前記貫通す
る孔を透明樹脂により充填し、表面を凸レンズ形状とす
ることも可能である。In the above embodiment, the case 5 is formed integrally with the convex lens 5a using a transparent resin. However, the case 5 is formed using an opaque resin, and the light projecting portion 6 and the light receiving portion 7 are formed. It is also possible to form a hole penetrating to the substrate 1 at the position and form a convex lens 5a on the surface, or fill the penetrating hole with a transparent resin to make the surface a convex lens shape.
【００２２】[0022]
【発明の効果】以上説明したように、本発明では光学式
傾斜センサのケースに発光素子及び複数の受光素子であ
る受光素子群に対応した投光部及び受光部を有し、前記
投光部と前記受光部にはそれぞれ独立したレンズを有す
ることにより、発光素子及び受光素子の中心と前記レン
ズの光軸を一致させることができるものとなり、投光部
においては理想的な平行光である鋭いビームを得ること
ができ、受光部においては結像されるスポットが鮮明な
輪郭を有するものとなり、さらに遮光壁が充分な高さ形
成することが可能であるため、ノイズ光が低減されるも
のとなる。As described above, according to the present invention, the case of the optical tilt sensor has a light emitting element and a light receiving section corresponding to a light receiving element group which is a plurality of light receiving elements in the case of the optical inclination sensor. And the light receiving unit have independent lenses, so that the center of the light emitting element and the light receiving element can be aligned with the optical axis of the lens. In the light projecting unit, a sharp parallel light is ideal. A beam can be obtained, and a spot to be imaged has a sharp outline in the light receiving section. Further, since the light shielding wall can be formed with a sufficient height, noise light is reduced. Become.
【００２３】また、前記発光素子を発光中心部に窓部が
形成された電極を有するＬＥＤとし発光源を小さなもの
とすることにより、レンズとの焦点距離を短くすること
ができ製品の小型化が可能になるとともに、この電極と
配線パターンの電気的な接続のためのワイヤーによる影
が生じないため理想的な放射光を得られるものとなり、
Ｓ／Ｎ比の向上による検出感度の向上あるいは検出精度
向上などが得られるものとなる。Further, by making the light emitting element an LED having an electrode having a window formed at the center of the light emission and making the light emission source small, the focal length with the lens can be shortened and the product can be miniaturized. It becomes possible to obtain ideal synchrotron radiation because there is no shadow due to wires for electrical connection between the electrode and the wiring pattern.
It is possible to improve the detection sensitivity or the detection accuracy by improving the S / N ratio.
【図１】 本発明に係る光学式傾斜センサの要部を示す
斜視図である。FIG. 1 is a perspective view showing a main part of an optical tilt sensor according to the present invention.
【図２】 同じく本発明に係る光学式傾斜センサを示す
斜視図である。FIG. 2 is a perspective view showing an optical tilt sensor according to the present invention.
【図３】 本発明に係る発光素子を示す斜視図である。FIG. 3 is a perspective view showing a light emitting device according to the present invention.
【図４】 従来の光学式傾斜センサの要部を示す斜視図
である。FIG. 4 is a perspective view showing a main part of a conventional optical tilt sensor.
【図５】 同じく従来の光学式傾斜センサを示す説明図
である。FIG. 5 is an explanatory view showing a conventional optical tilt sensor.
【図６】 同じく従来の光学式傾斜センサの動作原理を
示す説明図である。FIG. 6 is an explanatory view showing the operation principle of a conventional optical tilt sensor.
１……光学式傾斜センサ ２……基板 ２ａ……配線パターン ３……ＬＥＤ ３ａ……電極 ３ｂ……窓部 ４……２分割ＰＤ ４ａ……感光面 ４ｂ……感光面 ５……ケース ５ａ……凸レンズ ６……投光部 ７……受光部 ８……遮光壁 DESCRIPTION OF SYMBOLS 1 ... Optical inclination sensor 2 ... Substrate 2a ... Wiring pattern 3 ... LED 3a ... Electrode 3b ... Window part 4 ... 2 divided PD 4a ... Photosensitive surface 4b ... Photosensitive surface 5 ... Case 5a ... Convex lens 6... Projecting part 7... Light receiving part 8.
フロントページの続き (72)発明者 吉田 健一 神奈川県横浜市青葉区荏田西２−14−１ スタンレー電気株式会社横浜技術センター 内 Ｆターム(参考） 5F089 BA05 BB02 BC11 BC22 CA03Continuation of the front page (72) Inventor Kenichi Yoshida 2-14-1 Edanishi, Aoba-ku, Yokohama-shi, Kanagawa Prefecture Stanley Electric Co., Ltd. Yokohama Technical Center F term (reference) 5F089 BA05 BB02 BC11 BC22 BC03 CA03
Claims (2)
板内に配置され、これらを覆うケースを有する光学式傾
斜センサにおいて、前記ケースは前記発光素子及び複数
の前記受光素子である受光素子群に対応した投光部及び
受光部を有し、前記投光部と前記受光部にはそれぞれ独
立したレンズを有することを特徴とする光学式傾斜セン
サ。1. An optical tilt sensor having a case in which a light-emitting element and a plurality of light-receiving elements are disposed in an integrated substrate and covers the same, wherein the case is the light-emitting element and the plurality of light-receiving elements as the light-receiving elements An optical tilt sensor having a light projecting unit and a light receiving unit corresponding to a group, wherein the light projecting unit and the light receiving unit each have an independent lens.
された電極を有するＬＥＤであることを特徴とする請求
項１記載の光学式傾斜センサ。2. The optical tilt sensor according to claim 1, wherein the light emitting element is an LED having an electrode having a window at a light emission center.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7388899A JP2000266542A (en) | 1999-03-18 | 1999-03-18 | Optical inclination sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7388899A JP2000266542A (en) | 1999-03-18 | 1999-03-18 | Optical inclination sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000266542A true JP2000266542A (en) | 2000-09-29 |
Family
ID=13531213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7388899A Pending JP2000266542A (en) | 1999-03-18 | 1999-03-18 | Optical inclination sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000266542A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005033051A (en) * | 2003-07-08 | 2005-02-03 | Sharp Corp | Tilt angle detection optical coupling device and electronic appliance provided with it |
| KR200452496Y1 (en) | 2008-10-30 | 2011-03-03 | 주식회사 케이티 | Tilt apparatus of having sighting device |
| JP2019058451A (en) * | 2017-09-27 | 2019-04-18 | 京セラ株式会社 | Optical sensor device |
-
1999
- 1999-03-18 JP JP7388899A patent/JP2000266542A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005033051A (en) * | 2003-07-08 | 2005-02-03 | Sharp Corp | Tilt angle detection optical coupling device and electronic appliance provided with it |
| JP4549640B2 (en) * | 2003-07-08 | 2010-09-22 | シャープ株式会社 | Tilt angle detection optical coupling device and electronic apparatus including the same |
| KR200452496Y1 (en) | 2008-10-30 | 2011-03-03 | 주식회사 케이티 | Tilt apparatus of having sighting device |
| JP2019058451A (en) * | 2017-09-27 | 2019-04-18 | 京セラ株式会社 | Optical sensor device |
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