CN111508889A - 一种利用离心力夹持晶圆的晶圆承片台 - Google Patents

一种利用离心力夹持晶圆的晶圆承片台 Download PDF

Info

Publication number
CN111508889A
CN111508889A CN202010177742.7A CN202010177742A CN111508889A CN 111508889 A CN111508889 A CN 111508889A CN 202010177742 A CN202010177742 A CN 202010177742A CN 111508889 A CN111508889 A CN 111508889A
Authority
CN
China
Prior art keywords
wafer
base
clamping
bearing table
centrifugal force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010177742.7A
Other languages
English (en)
Inventor
沈云清
王冲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo All Semi Micro Electronics Equipment Co ltd
Original Assignee
Ningbo All Semi Micro Electronics Equipment Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo All Semi Micro Electronics Equipment Co ltd filed Critical Ningbo All Semi Micro Electronics Equipment Co ltd
Priority to CN202010177742.7A priority Critical patent/CN111508889A/zh
Publication of CN111508889A publication Critical patent/CN111508889A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本发明公开了一种利用离心力夹持晶圆的晶圆承片台，半导体加工领域；利用离心力夹持晶圆的晶圆承片台包括：底座、支柱、承片台底座、若干晶圆支撑柱、若干夹持块、若干配重块、若干支撑帽和驱动电机；承片台底座通过支柱与底座固定；若干晶圆支撑柱安装于承片台底座上，并且晶圆支撑柱在承片台底座上围成一晶片安装圆环；晶片安装圆环内用于放置晶片；单个晶圆支撑柱上均固定一个支撑帽和活动安装有一个夹持块；单个夹持块上均固定有一个配重块；底座安装于驱动电机，驱动电机用于驱动底座旋转；当驱动电机驱动底座旋转时，承片台底座同步转动，使配重块形成离心力，从而向内推动夹持块，使夹持块夹紧晶圆。

Description

一种利用离心力夹持晶圆的晶圆承片台
技术领域
本发明半导体加工领域，尤其涉及一种利用离心力夹持晶圆的晶圆承片台。
背景技术
在半导体生产工艺过程中，承片台带动晶圆高速旋转，高压喷嘴喷射高压溶剂，在晶圆表面往复扫描，在此过程中，由于喷射压力较高，如果承片台不稳定，晶圆就会飞出破碎，所以在此工艺中，承片台的稳定性至关重要。故开发此重力摆锤夹持晶圆承片台来使用。
如中国实用新型专利CN 206370410U所公开的一种晶圆承载盘，用以承载黏贴于胶膜上的晶圆与框架，且框架环绕于晶圆外围。晶圆承载盘包括承载平台以及多个第一滚动件。承载平台具有顶面、台阶以及凹槽，其中台阶位于顶面与凹槽之间，台阶环绕于凹槽外围，台阶距顶面具有第一深度，且凹槽的底部距顶面具有大于第一深度的第二深度。所述多个第一滚动件设置于台阶上，配置用以承载黏贴于胶膜上的晶圆与框架，且黏贴于胶膜上的晶圆与框架通过所述多个第一滚动件相对于承载平台转动。胶膜与晶圆相黏合处在承载平台上的正投影落在凹槽内，且胶膜与晶圆相黏合处与凹槽的底部保持距离。
上述现有技术的利用离心力夹持晶圆的晶圆承片台无法根据需求调节填充物的数量。
发明内容
一、要解决的技术问题
本发明的目的是针对现有技术所存在的上述问题，特提供一种利用离心力夹持晶圆的晶圆承片台，解决现有无法根据需求调节填充物的数量的问题。
二、技术方案
为解决上述技术问题，本发明提供一种利用离心力夹持晶圆的晶圆承片台，包括：底座、支柱、承片台底座、若干晶圆支撑柱、若干夹持块、若干配重块、若干支撑帽和驱动电机；
承片台底座通过支柱与底座固定；
若干晶圆支撑柱安装于承片台底座上，并且晶圆支撑柱在承片台底座上围成一晶片安装圆环；晶片安装圆环内用于放置晶片；
单个晶圆支撑柱上均固定一个支撑帽和活动安装有一个夹持块；
单个夹持块上均固定有一个配重块；
底座安装于驱动电机，驱动电机用于驱动底座旋转；
当驱动电机驱动底座旋转时，承片台底座同步转动，使配重块形成离心力，从而向内推动夹持块，使夹持块夹紧晶圆。
其中，底座和承片台底座同轴设置。
其中，承片台底座的圆心与晶片安装圆环的圆心之间具有0.2.mm的偏心距离。
其中，配重块上设有螺纹孔，螺纹孔用于调节配重。
其中，夹持块通过销轴与晶圆支撑柱活动连接。
其中，销轴上卡设有卡簧。
其中，晶圆支撑柱的设有6个。
三、本发明的有益效果
与现有技术相比，本发明的利用离心力夹持晶圆的晶圆承片台具有如下有益效果；
通过离心力驱动夹持块夹紧晶圆的设计，平台的转速越高离心力越大，同时对晶圆的夹持力也越大，有效的避免了传统夹具因为运行速度过高而产生的松弛问题，并且离心力驱动夹持块的设计也减少了传统夹具需要通过控制才能实现夹持的工序，简化了设备结构，同时还提高了生产效率。
通过可调节配重块的设计，使承片台在工作中可以根据实际需求调整配重块的重量，进一步的方便的生产加工。
通过承片台底座的圆心与晶片安装圆环的圆心之间具有0.2.mm的偏心距离的设计，使承片台底座在旋转时，对晶片产生更大的离心力。
附图说明
图1为本发明的利用离心力夹持晶圆的晶圆承片台的整体图；
图2为本发明的利用离心力夹持晶圆的晶圆承片台的爆炸图；
图3为本发明的利用离心力夹持晶圆的晶圆承片台的局部示意图；
图4为本发明的利用离心力夹持晶圆的晶圆承片台的局部放大图；
图5为本发明的利用离心力夹持晶圆的晶圆承片台的夹持块和配重块结合示意图；
图中：1为底座；2为支柱；3为承片台底座；4为晶圆支撑柱；5为夹持块；6为配重块；7为支撑帽；8为驱动电机；51为销轴；52为卡簧；61螺纹孔。
具体实施方式
下面结合附图和实施例，对本发明的具体实施方式作进一步详细描述。以下实施例用于说明本发明，但不能用来限制本发明的范围。
实施例一、
本实施例的利用离心力夹持晶圆的晶圆承片台的结构如图1至5所示包括：底座1、支柱2、承片台底座3、六个晶圆支撑柱4、六个夹持块5、六个配重块6、六个支撑帽7和驱动电机8。
承片台底座3通过支柱2与底座1同轴固定；六个晶圆支撑柱4安装于承片台底座3上，并且六个晶圆支撑柱4在承片台底座3上围成一晶片安装圆环；晶片安装圆环内用于放置晶片；承片台底座3的圆心与晶片安装圆环的圆心之间具有0.2mm的偏心距离。
每个晶圆支撑柱4上均安装有一个支撑帽7和一个夹持块5，支撑帽7与晶圆支撑柱4直接固定，夹持块5通过销轴51与晶圆支撑柱4活动连接，销轴51卡设有卡簧52防止销轴51滑落。
每个夹持块5上均固定有一个配重块6；底座1安装于驱动电机8，驱动电机8用于驱动底座1旋转。
当驱动电机8驱动底座1旋转时，承片台底座3同步转动，使配重块6形成离心力，从而向内推动夹持块5，使夹持块5夹紧晶圆，承片台底座3的转速越高，配重块6的离心力也就越大，那么对夹持块5的推力也就越大，使夹持块5可以更紧的夹住晶圆。
实施例二、
在实际生产过程中，不同规格的晶圆需要不同的夹持力，这样也就需要不同重量的配重块6，为了调节配配重块6的重量，在配重块6上加工有螺纹孔61，当需要增加重量时，可以通过螺丝在螺纹孔61上拧上重物，方便了配重块6总重量的调节。
以上仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明技术原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (7)

1.一种利用离心力夹持晶圆的晶圆承片台，其特征在于，所述利用离心力夹持晶圆的晶圆承片台包括：底座(1)、支柱(2)、承片台底座(3)、若干晶圆支撑柱(4)、若干夹持块(5)、若干配重块(6)、若干支撑帽(7)和驱动电机(8)；
所述承片台底座(3)通过所述支柱(2)与所述底座(1)固定；
若干所述晶圆支撑柱(4)安装于所述承片台底座(3)上，并且所述晶圆支撑柱(4)在所述承片台底座(3)上围成一晶片安装圆环；所述晶片安装圆环内用于放置晶片；
单个所述晶圆支撑柱(4)上均固定一个所述支撑帽(7)和活动安装有一个所述夹持块(5)；
单个所述夹持块(5)上均固定有一个配重块(6)；
所述底座(1)安装于所述驱动电机(8)，所述驱动电机(8)用于驱动所述底座(1)旋转；
当所述驱动电机(8)驱动所述底座(1)旋转时，所述承片台底座(3)同步转动，使所述配重块(6)形成离心力，从而向内推动所述夹持块(5)，使所述夹持块(5)夹紧所述晶圆。
2.如权利要求1所述的利用离心力夹持晶圆的晶圆承片台，其特征在于，所述底座(1)和所述承片台底座(3)同轴设置。
3.如权利要求2所述的利用离心力夹持晶圆的晶圆承片台，其特征在于，所述承片台底座(3)的圆心与所述晶片安装圆环的圆心之间具有0.2mm的偏心距离。
4.如权利要求1所述的利用离心力夹持晶圆的晶圆承片台，其特征在于，所述配重块(6)上设有螺纹孔(61)，所述螺纹孔(61)用于调节配重。
5.如权利要求4所述的利用离心力夹持晶圆的晶圆承片台，其特征在于，所述夹持块(5)通过销轴(51)与所述晶圆支撑柱(4)活动连接。
6.如权利要求1所述的利用离心力夹持晶圆的晶圆承片台，其特征在于，所述销轴(51)上卡设有卡簧(52)。
7.如权利要求6所述的利用离心力夹持晶圆的晶圆承片台，其特征在于，所述晶圆支撑柱(4)的设有6个。
CN202010177742.7A 2020-03-13 2020-03-13 一种利用离心力夹持晶圆的晶圆承片台 Pending CN111508889A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010177742.7A CN111508889A (zh) 2020-03-13 2020-03-13 一种利用离心力夹持晶圆的晶圆承片台

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010177742.7A CN111508889A (zh) 2020-03-13 2020-03-13 一种利用离心力夹持晶圆的晶圆承片台

Publications (1)

Publication Number Publication Date
CN111508889A true CN111508889A (zh) 2020-08-07

Family

ID=71875765

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010177742.7A Pending CN111508889A (zh) 2020-03-13 2020-03-13 一种利用离心力夹持晶圆的晶圆承片台

Country Status (1)

Country Link
CN (1) CN111508889A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112233995A (zh) * 2020-12-15 2021-01-15 西安奕斯伟硅片技术有限公司 硅片目检辅助装置和硅片目检方法
CN113001572A (zh) * 2021-02-26 2021-06-22 杭州临润贸易有限公司 一种防止物体旋转时掉落的工业机器人夹持装置
CN116716572A (zh) * 2023-06-09 2023-09-08 四川珂玛材料技术有限公司 一种半导体产品等离子喷涂治具结构

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6363623B1 (en) * 2000-06-02 2002-04-02 Speedfam-Ipec Corporation Apparatus and method for spinning a work piece
CN201307587Y (zh) * 2008-09-10 2009-09-09 联华电子股份有限公司 洗边机及洗边机的固定装置
CN208954967U (zh) * 2018-12-11 2019-06-07 云谷（固安）科技有限公司 一种夹持机构及半导体加工设备
CN109967480A (zh) * 2018-12-03 2019-07-05 杭州众硅电子科技有限公司 一种用于干燥晶圆的紧固结构
CN209868385U (zh) * 2019-04-18 2019-12-31 珠海市运泰利自动化设备有限公司 晶圆精确定位夹紧装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6363623B1 (en) * 2000-06-02 2002-04-02 Speedfam-Ipec Corporation Apparatus and method for spinning a work piece
CN201307587Y (zh) * 2008-09-10 2009-09-09 联华电子股份有限公司 洗边机及洗边机的固定装置
CN109967480A (zh) * 2018-12-03 2019-07-05 杭州众硅电子科技有限公司 一种用于干燥晶圆的紧固结构
CN208954967U (zh) * 2018-12-11 2019-06-07 云谷（固安）科技有限公司 一种夹持机构及半导体加工设备
CN209868385U (zh) * 2019-04-18 2019-12-31 珠海市运泰利自动化设备有限公司 晶圆精确定位夹紧装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112233995A (zh) * 2020-12-15 2021-01-15 西安奕斯伟硅片技术有限公司 硅片目检辅助装置和硅片目检方法
CN113001572A (zh) * 2021-02-26 2021-06-22 杭州临润贸易有限公司 一种防止物体旋转时掉落的工业机器人夹持装置
CN113001572B (zh) * 2021-02-26 2022-06-07 广东银谷科技股份有限公司 一种防止物体旋转时掉落的工业机器人夹持装置
CN116716572A (zh) * 2023-06-09 2023-09-08 四川珂玛材料技术有限公司 一种半导体产品等离子喷涂治具结构

Similar Documents

Publication Publication Date Title
CN111508889A (zh) 一种利用离心力夹持晶圆的晶圆承片台
CN109128923A (zh) 一种新型球阀端盖锻件的加工夹具
CN211210072U (zh) 一种led主板用smt贴片机点胶装置
CN107662057A (zh) 一种机械手及激光加工设备
CN104786031B (zh) 一种双转盘机构
CN111029279A (zh) 一种固晶机的连续取晶机构及其工作方法
CN219187524U (zh) 一种手动点胶贴片工装
CN116759370A (zh) 一种固晶装置及固晶设备
CN111230673A (zh) 一种y轴导轨水平布置的双轴双龙门结构划片机
CN210878696U (zh) 一种电机盖加工用夹具
CN217411276U (zh) 一种荧光体涂布机
CN209965881U (zh) 一种轨道侧部摩擦驱动旋转转台
CN219534497U (zh) 一种芯片封装用定位装置
CN209190607U (zh) 一种多尺寸晶片旋转夹持机构
CN206936593U (zh) 一种铝合金车身点焊夹具支座
CN218396506U (zh) 一种激光切割用工件的支撑平台
CN221088586U (zh) 一种晶体研磨机用配重装置
CN221696380U (zh) 一种零部件加工用打磨装置
CN208977601U (zh) 一种磨床用固定装置
CN216265493U (zh) 一种旋转座加工夹具
CN105834854B (zh) 一种紧固型玻璃柱圆头研磨装置
CN221313876U (zh) 一种固定治具
CN217912441U (zh) 一种钣金用夹托架
CN220406012U (zh) 一种用于电视支架喷塑的夹具
CN211858592U (zh) 一种用于芯片镀膜工艺的砝码模组

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20200807