CN111503934A - Refrigeration control method - Google Patents
Refrigeration control method Download PDFInfo
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- CN111503934A CN111503934A CN202010344281.8A CN202010344281A CN111503934A CN 111503934 A CN111503934 A CN 111503934A CN 202010344281 A CN202010344281 A CN 202010344281A CN 111503934 A CN111503934 A CN 111503934A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
- F25B2321/0211—Control thereof of fans
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2500/00—Problems to be solved
- F25B2500/12—Sound
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cold Air Circulating Systems And Constructional Details In Refrigerators (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a refrigeration control method. In the invention: presetting a difference value T between a set temperature TS and an environment temperature TE as TE-TS; dividing the temperature difference into n temperature sections T1, T2 and T3.. Tn in sequence from high to low, and dividing the rotating speed parameter of the cooling fan into n rotating speed parameter gears F1, F2 and F3... Fn from low speed to high speed; setting a gear Fx of a rotating speed parameter corresponding to each temperature section Tx; the controller controls the running rotating speed of the cooling fan according to the signal transmitted by the temperature sensor. According to the invention, the control method of the cooling fan by the optimized controller is used for realizing the fine control of the cooling fan of the semiconductor refrigeration sheet, the average gear in the operation process of the cooling fan is obviously reduced, the rotating speed and the noise of the cooling fan can be slowly increased only after the refrigeration system reaches a certain value, the user experience is improved, and the energy utilization efficiency is higher.
Description
Technical Field
The invention belongs to the field of refrigeration control, particularly relates to a refrigeration control method, and particularly relates to a refrigeration control method for a cosmetic box based on semiconductor refrigeration.
Background
The semiconductor refrigerating plate, also called thermoelectric refrigerating plate, is a heat pump. By using the Peltier effect of the semiconductor materials, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, and the aim of refrigeration can be fulfilled. In principle, a semiconductor cooling plate is a means of heat transfer. When a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer can be generated between the two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end. But the semiconductor itself presents a resistance that generates heat when current passes through it, thereby affecting heat transfer. But the heat between the two plates is also transferred through the air and the semiconductor material itself in a reverse direction. When the cold end and the hot end reach a certain temperature difference and the heat transfer amounts are equal, a balance point is reached, the positive heat transfer and the reverse heat transfer are mutually offset, and the temperature of the cold end and the hot end cannot be changed continuously. The temperature difference of the cold end and the hot end of the semiconductor refrigerating sheet can reach 40-65 ℃, and in order to reach lower temperature, the temperature of the hot end can be reduced by adopting heat dissipation and other modes.
The traditional semiconductor refrigerating piece system consists of six modules, namely a metal aluminum inner container attached to a cold guide block, a square cold guide block connected with a cold guide surface of the metal aluminum inner container and a refrigerating surface of a semiconductor refrigerating piece and used for transferring heat, a semiconductor refrigerating piece, a toothed radiator connected with a radiating surface of the refrigerating piece and used for radiating, a fixed cold guide block, a metal fastening screw and a gasket of the semiconductor refrigerating piece and the radiator, and a foaming heat-insulating layer for blocking the metal aluminum inner container and the cold guide block from exchanging heat with the radiator. In order to better realize the heat transfer of the cooling surface of the refrigerating fin, various fans for forced convection heat transfer are generally arranged on the toothed radiator, and the heat on the radiator is continuously discharged into the ambient air, so that the temperature of the cooling surface of the refrigerating fin is reduced, and the refrigerating performance of the refrigerating fin is improved.
The semiconductor refrigerating sheet has no mechanical structure, no noise and no vibration during working. However, when the heat dissipation fan works, noise of different degrees can be generated according to different rotating speeds. In a small-sized ice making device based on a semiconductor refrigerating sheet, which is disclosed in the Chinese patent publication No. CN207922644U, a mini cosmetic box product adopting a semiconductor refrigerating system is disclosed, the design of the heat radiating system is designed by referring to the heat radiating requirement of the semiconductor refrigerating sheet under the maximum working condition, a fan is in a fixed rotating speed, the rotating speed is higher, and the generated noise is large. The product is from power-on work, no matter whether the user has set for maximum refrigeration temperature, all work according to the maximum operating mode of its whole refrigerating system, whole duty cycle, the noise index homogeneous of product is in the maximum value state directly. Considering the mini cosmetic box products, the used scenes are mostly small-area rooms such as dormitories, rental houses, dressing tables, living rooms, restaurants and the like, the high-noise work lasts for a long time, the use experience of users is poor,
in a low-noise semiconductor cooling system and a control method thereof of the chinese patent publication No. CN110018724A, it is disclosed that different cooling capacities are realized by controlling the current of a semiconductor cooling plate, the state of a cooling fan is only two states of shutdown and fixed rotation speed, the scheme frequently changes the current of the cooling plate, and the damage to the semiconductor cooling plate is large.
Disclosure of Invention
The invention aims to provide a refrigeration control method, which is characterized in that a temperature sensor is arranged to detect the environmental temperature of a cosmetic box, and the control method of a cooling fan is optimized by a controller, so that the cooling fan of a semiconductor refrigeration sheet is finely controlled, the semiconductor refrigeration system is always operated at the lowest working noise, the average gear in the operation process of the cooling fan is obviously reduced, the rotation speed and the noise of the cooling fan can be slowly increased only after the refrigeration system achieves a certain value of refrigeration and cooling, the user experience is improved, and the energy utilization efficiency is higher; the aim of controlling refrigeration is achieved by always maintaining fixed current for the refrigeration piece and changing the rotating speed of the cooling fan, and the refrigeration piece cannot be damaged.
In order to solve the technical problems, the invention is realized by the following technical scheme:
the invention relates to a refrigeration control method, which is carried out in a control system consisting of a temperature sensor, a controller and a cooling fan according to the following steps:
acquiring ambient temperature TE through a temperature sensor, and transmitting acquired temperature data to a controller; inputting a set temperature TS through a controller;
the difference T between the preset temperature TS and the environment temperature TE is TE-TS; dividing the temperature difference into n temperature sections T1, T2 and T3.. Tn in sequence from high to low, wherein T1+ T2+.. + Tn ═ T; dividing the rotating speed parameters of the cooling fan into n rotating speed parameter gears F1, F2 and F3. from low speed to high speed;
setting a gear Fx of a rotating speed parameter corresponding to each temperature section Tx;
secondly, the controller controls the running rotating speed of the cooling fan according to the signal transmitted by the temperature sensor; the method comprises the following substeps:
SS01, after the system starts to refrigerate, the difference value between the environmental temperature TE and the set temperature TS is in the range of the temperature T1; the controller controls the cooling fan to work at the lowest rotating speed F1 to cool the semiconductor refrigerating sheet until the environmental temperature TE reaches the lowest refrigerating temperature which can be reached by the current rotating speed F1;
SS02, when the environmental temperature TE reaches the lowest refrigeration temperature which can be reached by the current rotating speed F1, the difference value between the environmental temperature TE and the set temperature TS reaches the range of the temperature section T2, and the controller controls the rotating speed parameter of the cooling fan to increase one gear to reach the gear F2 to work so as to cool the semiconductor refrigeration piece;
SS03, circulating the SS02 steps until the environment temperature TE reaches the set temperature TS;
step three, the controller controls the running rotating speed of the cooling fan according to the change curve of the environmental temperature TE; when the slope of the temperature change curve is smaller than a set threshold value, the controller controls the cooling fan to increase a gear on the basis of the current speed parameter gear Fx.
Preferably, the cooling fan cools the hot side of the semiconductor refrigeration piece, and when the cooling fan cools the hot side of the semiconductor refrigeration piece, the heat balance of the semiconductor refrigeration piece is destroyed, so that the temperature of the cold side is indirectly reduced, and the cooling is realized.
Preferably, an analysis control program is installed in the controller; the controller is also electrically connected with an input module, and the input module comprises a keyboard or a touch panel; the input module is used for inputting data of set temperature TS to the control module.
Preferably, the lowest refrigeration temperature corresponding to the speed parameter gear Fx of the cooling fan is input through a control panel; the refrigeration system realizes refrigeration through cold and heat exchange between the cold end of the semiconductor refrigeration sheet and the interior of the system, and after the refrigeration system is determined, the lowest refrigeration temperature of the refrigeration system under each cooling fan gear can be determined through experiments.
Preferably, in the third step, the controller controls the temperature difference sensor to collect the ambient temperature of the cosmetic box every half hour; the temperature data collected by the temperature sensors every half hour are sequentially connected to form a temperature change curve; when the reduction value of the environmental temperature TE is less than 0.1 ℃, the slope of the temperature change curve is less than the set threshold value.
The invention has the following beneficial effects:
according to the cosmetic box, the temperature sensor is arranged to detect the environmental temperature of the cosmetic box, the control method of the cooling fan through the optimization controller is used for realizing the fine control of the cooling fan of the semiconductor refrigeration sheet, the semiconductor refrigeration system is always operated at the lowest working noise, the average gear in the operation process of the cooling fan is obviously reduced, the rotating speed and the noise of the cooling fan can be slowly increased only after the refrigeration system cools to reach a certain value, the user experience is improved, and the energy utilization efficiency is higher; the aim of controlling refrigeration is achieved by always maintaining fixed current for the refrigeration piece and changing the rotating speed of the cooling fan, and the refrigeration piece cannot be damaged.
Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a control flow chart of a refrigeration control method;
fig. 2 is a temperature-rotational speed map of a refrigeration control method.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the present invention relates to a refrigeration control method, which comprises a control system composed of a temperature sensor, a controller and a cooling fan, and is performed according to the following steps:
acquiring ambient temperature TE through a temperature sensor, and transmitting acquired temperature data to a controller; inputting a set temperature TS through a controller;
the difference T between the preset temperature TS and the environment temperature TE is TE-TS; dividing the temperature difference into n temperature sections T1, T2 and T3.. Tn in sequence from high to low, wherein T1+ T2+.. + Tn ═ T; dividing the rotating speed parameters of the cooling fan into n rotating speed parameter gears F1, F2 and F3. from low speed to high speed;
setting a gear Fx of a rotating speed parameter corresponding to each temperature section Tx;
secondly, the controller controls the running rotating speed of the cooling fan according to the signal transmitted by the temperature sensor; the method comprises the following substeps:
SS01, after the system starts to refrigerate, the difference value between the environmental temperature TE and the set temperature TS is in the range of the temperature T1; the controller controls the cooling fan to work at the lowest rotating speed F1 to cool the semiconductor refrigerating sheet until the environmental temperature TE reaches the lowest refrigerating temperature which can be reached by the current rotating speed F1;
SS02, when the environmental temperature TE reaches the lowest refrigeration temperature which can be reached by the current rotating speed F1, the difference value between the environmental temperature TE and the set temperature TS reaches the range of the temperature section T2, and the controller controls the rotating speed parameter of the cooling fan to increase one gear to reach the gear F2 to work so as to cool the semiconductor refrigeration piece;
SS03, circulating the SS02 steps until the environment temperature TE reaches the set temperature TS;
step three, the controller controls the running rotating speed of the cooling fan according to the change curve of the environmental temperature TE; when the slope of the temperature change curve is smaller than a set threshold value, the controller controls the cooling fan to increase a gear on the basis of the current speed parameter gear Fx.
Preferably, the cooling fan cools the hot side of the semiconductor refrigeration piece, and when the cooling fan cools the hot side of the semiconductor refrigeration piece, the heat balance of the semiconductor refrigeration piece is destroyed, so that the temperature of the cold side is indirectly reduced, and the cooling is realized.
Preferably, an analysis control program is installed in the controller; the controller is also electrically connected with an input module, and the input module comprises a keyboard or a touch panel; the input module is used for inputting data of set temperature TS to the control module.
Preferably, the lowest refrigeration temperature corresponding to the speed parameter gear Fx of the cooling fan is input through a control panel; the refrigeration system realizes refrigeration through cold and heat exchange between the cold end of the semiconductor refrigeration sheet and the interior of the system, and after the refrigeration system is determined, the lowest refrigeration temperature of the refrigeration system under each cooling fan gear can be determined through experiments.
Preferably, in the third step, the controller controls the temperature difference sensor to collect the ambient temperature of the cosmetic box every half hour; the temperature data collected by the temperature sensors every half hour are sequentially connected to form a temperature change curve; when the reduction value of the environmental temperature TE is less than 0.1 ℃, the slope of the temperature change curve is less than the set threshold value.
The first embodiment is as follows: the implementation is a refrigeration control method applied to a cosmetic box, and in a control system consisting of a temperature sensor, a controller and a cooling fan, the refrigeration control method comprises the following steps:
step one, a temperature sensor detects the environmental temperature TE in a cosmetic box and transmits detected data information to a controller; an analysis control program is installed in the controller; the controller is also electrically connected with a control panel, and the control panel inputs the set temperature TS to the controller;
the difference T between the preset temperature TS and the environment temperature TE is TE-TS; dividing the temperature difference into n temperature sections T1, T2 and T3.. Tn in sequence from high to low, wherein T1+ T2+.. + Tn ═ T; dividing the rotating speed parameters of the cooling fan into n rotating speed parameter gears F1, F2 and F3. from low speed to high speed;
setting a gear Fx of a rotating speed parameter corresponding to each temperature section Tx;
secondly, the controller controls the running rotating speed of the cooling fan according to the signal transmitted by the temperature sensor; the method comprises the following substeps:
SS01, after the system starts to refrigerate, the difference value between the environmental temperature TE of the cosmetic box and the set temperature TS is in the range of the temperature T1; the controller controls the cooling fan to work at the lowest rotating speed F1 to cool the semiconductor refrigeration sheet until the environmental temperature TE of the cosmetic box reaches the lowest refrigeration temperature which can be reached by the current rotating speed F1;
SS02, when the environmental temperature TE of the cosmetic box reaches the lowest refrigeration temperature which can be reached by the current rotating speed F1, the difference value between the environmental temperature TE of the cosmetic box and the set temperature TS reaches the range of the T2 temperature section, and the controller controls the rotating speed parameter of the cooling fan to increase one gear to reach the F2 gear to work so as to cool the semiconductor refrigeration piece;
SS03, circulating the SS02 steps until the environmental temperature TE of the cosmetic box reaches the set temperature TS;
step three, the controller controls the running rotating speed of the cooling fan according to the change curve of the environmental temperature TE of the cosmetic box; when the slope of the temperature change curve is smaller than a set threshold value, the controller controls the cooling fan to increase a gear on the basis of the current speed parameter gear Fx.
Preferably, the cooling fan cools the hot side of the semiconductor refrigeration piece, and when the cooling fan cools the hot side of the semiconductor refrigeration piece, the heat balance of the semiconductor refrigeration piece is destroyed, so that the temperature of the cold side is indirectly reduced, and the cooling is realized.
Preferably, the lowest refrigeration temperature corresponding to the speed parameter gear Fx of the cooling fan is input through a control panel; the refrigeration system realizes refrigeration through cold and heat exchange between the cold end of the semiconductor refrigeration sheet and the interior of the system, and after the refrigeration system is determined, the lowest refrigeration temperature of the refrigeration system under each cooling fan gear can be determined through experiments.
Preferably, the controller controls the temperature difference sensor to collect the ambient temperature of the cosmetic box every half hour in the third step; sequentially connecting temperature data acquired by the temperature sensors every half hour to obtain a temperature change curve; when the reduction value of the environmental temperature TE is less than 0.1 ℃, the slope of the temperature change curve is less than the set threshold value.
One specific application of this embodiment is: after the refrigeration system starts working, the cooling fan firstly keeps working at a gear 1, when refrigeration reaches 11 ℃ lower than the ambient temperature, the rotating speed of the cooling fan is increased to a gear 2, when the difference reaches 12 ℃, the rotating speed of the cooling fan is increased to a gear 3, when the difference reaches 13 ℃, the rotating speed of the cooling fan is increased to a gear 4, and when the difference reaches 14 ℃, the rotating speed of the cooling fan is increased to a gear 5. By applying the technical scheme of the invention, the running time of the cooling fan in the state of low rotating speed and low noise is very large in proportion through test determination, compared with the existing technical scheme that the gear 5 is always adopted.
When the rotating speed of the cooling fan is changed due to operations such as temperature setting by a user, door opening and the like, the set temperature of the cosmetic box is 10 ℃, the ambient temperature is 22 ℃, the temperature difference is 10 ℃, the rotating speed of the cooling fan is gear 3, the ambient temperature is still 22 ℃ after half an hour, the temperature in the cosmetic box is reduced by less than 0.1 ℃, the rotating speed of the cooling fan is increased to gear 4, the set temperature is modified to 11 ℃, the temperature difference is calculated to be 11 ℃, and therefore the rotating speed of the cooling fan is gear 2.
It should be noted that, in the above system embodiment, each included unit is only divided according to functional logic, but is not limited to the above division as long as the corresponding function can be implemented; in addition, specific names of the functional units are only for convenience of distinguishing from each other, and are not used for limiting the protection scope of the present invention.
In addition, it can be understood by those skilled in the art that all or part of the steps in the method for implementing the embodiments described above can be implemented by instructing the relevant hardware through a program, and the corresponding program can be stored in a computer-readable storage medium, such as a ROM/RAM, a magnetic disk, an optical disk, or the like.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (5)
1. A refrigeration control method is characterized in that in a control system composed of a temperature sensor, a controller and a cooling fan, the method comprises the following steps:
acquiring ambient temperature TE through the temperature sensor, and transmitting acquired temperature data to a controller; inputting a set temperature TS through a controller;
the difference T between the preset temperature TS and the environment temperature TE is TE-TS; dividing the temperature difference into n temperature sections T1, T2 and T3.. Tn in sequence from high to low, wherein T1+ T2+.. + Tn ═ T; dividing the rotating speed parameters of the cooling fan into n rotating speed parameter gears F1, F2 and F3. from low speed to high speed;
setting a gear Fx of a rotating speed parameter corresponding to each temperature section Tx;
secondly, the controller controls the running rotating speed of the cooling fan according to the signal transmitted by the temperature sensor; the method comprises the following substeps:
SS01, after the system starts to refrigerate, the difference value between the environmental temperature TE and the set temperature TS is in the range of the temperature T1; the controller controls the cooling fan to work at the lowest rotating speed F1 to cool the semiconductor refrigerating sheet until the environmental temperature TE reaches the lowest refrigerating temperature which can be reached by the current rotating speed F1;
SS02, when the environmental temperature TE reaches the lowest refrigeration temperature which can be reached by the current rotating speed F1, the difference value between the environmental temperature TE and the set temperature TS reaches the range of the temperature section T2, and the controller controls the rotating speed parameter of the cooling fan to increase one gear to reach the gear F2 to work so as to cool the semiconductor refrigeration piece;
SS03, circulating the SS02 steps until the environment temperature TE reaches the set temperature TS;
step three, the controller controls the running rotating speed of the cooling fan according to the change curve of the environmental temperature TE; when the slope of the temperature change curve is smaller than a set threshold value, the controller controls the cooling fan to increase a gear on the basis of the current speed parameter gear Fx.
2. A refrigeration control method as recited in claim 1, wherein said heat dissipation fan cools a hot surface of the semiconductor refrigeration sheet.
3. A refrigeration control method according to claim 1, wherein an analysis control program is installed in said controller; the controller is also electrically connected with an input module, and the input module comprises a keyboard or a touch panel; the input module is used for inputting data of set temperature TS to the control module.
4. A refrigeration control method as recited in claim 1, wherein the lowest refrigeration temperature corresponding to the speed parameter gear Fx of the heat dissipation fan is inputted through the control panel.
5. A refrigeration control method as recited in claim 1, wherein said controller controls the temperature difference sensor to collect the ambient temperature of the cosmetic case every half hour in the third step; the temperature data collected by the temperature sensors every half hour are sequentially connected to form a temperature change curve; when the reduction value of the environmental temperature TE is less than 0.1 ℃, the slope of the temperature change curve is less than the set threshold value.
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| CN113782814A (en) * | 2021-08-02 | 2021-12-10 | 珠海泰坦新动力电子有限公司 | Control method and system for high-temperature chemical cabinet |
| CN114234475A (en) * | 2020-09-09 | 2022-03-25 | 青岛海尔特种电冰柜有限公司 | Control method of semiconductor refrigeration device |
| CN115435546A (en) * | 2022-10-10 | 2022-12-06 | 长虹美菱股份有限公司 | Temperature control method of semiconductor refrigerator |
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