CN111491465A - Low-cost low-resistance-value conductive paste grouting circuit board lamp strip and manufacturing method thereof - Google Patents
Low-cost low-resistance-value conductive paste grouting circuit board lamp strip and manufacturing method thereof Download PDFInfo
- Publication number
- CN111491465A CN111491465A CN201910047626.0A CN201910047626A CN111491465A CN 111491465 A CN111491465 A CN 111491465A CN 201910047626 A CN201910047626 A CN 201910047626A CN 111491465 A CN111491465 A CN 111491465A
- Authority
- CN
- China
- Prior art keywords
- conductive paste
- hole
- circuit board
- low
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to a low-cost low-resistance conductive paste hole-filling circuit board lamp strip and a manufacturing method thereof, and particularly relates to a circuit board lamp strip with low cost and low resistance value, wherein after a circuit is manufactured on a single-sided copper-clad plate, a thermosetting adhesive film is pasted on the back surface of the circuit, then holes are punched or drilled together to manufacture a front single-sided panel, a circuit is manufactured on the other single-sided copper-clad plate, then the copper surfaces of the circuit are aligned and pressed against the thermosetting adhesive surface of the front single-sided panel to be adhered together, cup-shaped holes are formed at hole positions, bottom copper is pushed towards the holes at the hole positions by a mold to enable the holes to be shallow, conductive paste is applied to the holes and the hole edges, the conductive paste is heated and cured, upper and lower layers of metal are conducted at the hole positions through the conductive paste, then front resistance welding is performed, and a L ED lamp bead is welded on a circuit board.
Description
Technical Field
The invention relates to the field of circuit boards and L ED (electronic device) application thereof, in particular to a low-cost low-resistance conductive paste grouting circuit board lamp strip and a manufacturing method thereof.
Background
The conventional conductive paste hole filling plate has the advantages that the insulating layer of the plate is thick, so that the hole is deep, the metal distance between two sides of the hole is long, the connection distance between the conductive paste filled into the hole and the metal on the two sides is long, the resistance value of the conductive paste filled into the hole and the metal on the two sides is large, the using amount of the conductive paste is large, and the cost is high.
In order to overcome the defects and the shortcomings, the cost can be reduced, and the resistance value can be reduced, the position of the circuit board needing to be conducted on two sides is designed to be a cup-shaped conducting hole, namely copper at the cup opening of the cup-shaped conducting hole is copper on a front circuit of the circuit board, metal copper at the cup bottom is copper on a back circuit, then the copper at the cup bottom is pushed to be flush or nearly flush from the back to the cup opening by utilizing the ductility of the copper, the distance between the copper at the cup bottom and the copper at the cup opening is shortened, the cup depth is reduced, then conductive paste is filled into the cup-shaped conducting hole, the using amount of the conductive paste is reduced, the resistance value of the conductive paste at the hole is reduced, the resistance value is reduced according to the resistance calculation formula R of the material rho L/S, the length L is the depth of the hole, and the shallower L value of the hole.
Disclosure of Invention
The invention relates to a low-cost low-resistance conductive paste hole-filling circuit board lamp strip and a manufacturing method thereof, and particularly relates to a circuit board lamp strip with low cost and low resistance value, wherein after a circuit is manufactured on a single-sided copper-clad plate, a thermosetting adhesive film is pasted on the back surface of the circuit, then holes are punched or drilled together to manufacture a front single-sided panel, a circuit is manufactured on the other single-sided copper-clad plate, then the copper surfaces of the circuit are aligned and pressed against the thermosetting adhesive surface of the front single-sided panel to be adhered together, cup-shaped holes are formed at hole positions, bottom copper is pushed towards the holes at the hole positions by a mold to enable the holes to be shallow, conductive paste is applied to the holes and the hole edges, the conductive paste is heated and cured, upper and lower layers of metal are conducted at the hole positions through the conductive paste, then front resistance welding is performed, and a L ED lamp bead is welded on a circuit board.
The invention provides a method for manufacturing a conductive paste hole-filling circuit board lamp strip with low cost and low resistance value, which comprises the following steps of manufacturing a circuit by a single-sided copper-clad plate, attaching a thermosetting adhesive film on the back surface of the circuit, punching or drilling the circuit together to manufacture a front single-sided single-panel, etching or die-cutting another single-sided flexible copper-clad plate to manufacture a circuit, aligning and adhering a circuit copper surface to a thermosetting adhesive surface of the front single-panel, forming a cup-shaped hole at a hole position, wherein the bottom copper is complete or etched with a small hole, jacking the bottom copper towards the hole by a die, making the hole shallow, enabling the bottom metal to be closer to the metal distance at the edge of the cup, then printing conductive paste from the front surface, or printing conductive paste from the front surface by the small hole at the bottom of the hole, sucking the conductive paste from the small hole at the back surface, aiming at enabling the conductive paste to enter the hole, heating and curing, conducting the upper and lower metal layers at the hole, then making a front solder resist, manufacturing the conductive paste hole circuit board, and welding L ED on the circuit board to reduce the resistance value and the lamp bead.
The invention also provides a low-cost low-resistance conductive paste hole-filling circuit board lamp strip which comprises a bottom circuit, a middle insulating layer, a top circuit, a cup-shaped via hole, conductive paste and solder masks on the surfaces of two sides, and L ED lamp beads, and is characterized in that the bottom of the cup-shaped via hole is made of metal copper of one circuit, the metal copper is complete or has a small hole smaller than a bosom-shaped hole, the hole side of the cup-shaped via hole is made of metal copper of the other circuit, the conductive paste is filled in the cup-shaped via hole and connected with the bottom metal of the cup-shaped via hole and the surface metal of the hole side to form conduction between the two circuits, the bottom metal copper of the cup-shaped via hole protrudes towards the cup opening direction, the connecting distance of the conductive paste for connecting the two layers of the metal is smaller than the thickness of the middle insulating layer, the using amount and the resistance of the conductive paste are compared with the case that the bottom metal of the cup is flat, the conductive paste is covered by the conductive paste, the conductive paste is exposed by the solder masks or the surface of the conductive paste, the conductive paste is formed into the conductive paste hole, L, the conductive paste hole is welded to the.
According to a preferred embodiment of the present invention, the conductive paste-filled circuit board strip with low cost and low resistance value is characterized in that the conductive substance in the conductive paste is metal silver powder, metal copper powder, graphite powder, or a mixed powder of any two or three of metal silver powder, metal copper powder and graphite powder, or metal alloy powder.
According to a preferred embodiment of the present invention, the conductive paste-filled via circuit board strip with low cost and low resistance value is characterized in that the conductive paste is formed by mixing a conductive substance, an adhesive polymer material and an auxiliary agent.
According to a preferred embodiment of the present invention, the conductive paste-filled via circuit board strip with low cost and low resistance value is characterized in that the double-sided circuit board is a flexible circuit board or a rigid circuit board.
According to a preferred embodiment of the present invention, the conductive paste-filled hole circuit board strip with low cost and low resistance value is characterized in that the hole is a circular hole or a special-shaped hole.
According to a preferred embodiment of the present invention, the conductive paste-filled circuit board strip with low cost and low resistance value is characterized in that the surface solder mask is a cover film solder mask or an ink solder mask.
According to a preferred embodiment of the invention, the low-cost and low-resistance hole-filled circuit board strip is characterized in that when the cover film is used as the surface solder mask, the cover film firmly covers the cured silver paste to prevent migration of silver particles.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
Fig. 1 is a schematic view of a circuit board strip with conductive paste filled holes, which has low cost and low resistance value, wherein the copper metal at the bottom of the holes is a complete cross section at the cup-shaped holes.
Fig. 2 is a schematic cross-sectional view of a low-cost, low-resistance, conductive paste-filled circuit board strip, where a hole is etched in a copper metal layer at the bottom of the hole.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
1. And (3) placing the single-sided copper-clad plate on a screen printing machine, baking and curing the screen printing line ink prepared according to design data in advance, etching and manufacturing a top layer circuit 2 on an etching and film-removing horizontal production line, pasting a thermosetting adhesive film on the back, placing the circuit on an FPC (flexible printed circuit) drilling machine, and drilling required holes according to the designed drilling data to complete the manufacture of the front single-sided plate.
2. The other one-sided copper-clad plate is put on a screen printing machine, the screen printing plate screen printing line printing ink which is manufactured in advance according to the design data is baked and solidified, then etching and manufacturing a bottom layer circuit 1 on an etching film-removing horizontal production line, aligning and sticking the copper surface of the circuit to the thermosetting adhesive surface of the front single panel, pressing the circuit on a quick press at 180 ℃ and 1200kg, firmly bonding the bottom layer circuit 1 and the top layer circuit 2 by the thermosetting adhesive film, separating a middle insulating layer 3 between the top layer circuit 2 and the bottom layer circuit 1, forming a cup-shaped hole at the hole position, enabling the bottom metal copper of the hole to be complete, ejecting the copper of the bottom circuit 1 towards the inside of the hole at the hole position by using a mould, enabling the bottom metal copper of the cup-shaped via hole to be convex towards the cup opening direction, enabling the hole to be shallow, enabling the bottom metal of the hole to be close to the metal distance of the edge of the cup opening, and manufacturing the double-layer circuit board with the via hole (as shown in figure 1).
Or a small hole 1.1 is etched in the bottom metal copper, the copper of the bottom circuit 1 is pushed towards the inside of the hole at the hole by using a mould, the bottom metal copper of the cup-shaped via hole is raised towards the cup mouth, so that the hole becomes shallow, the metal distance between the bottom metal of the hole and the edge of the cup mouth is close, and the double-layer circuit board with the via hole is manufactured (as shown in figure 2).
3. The manufactured silk screen printing is used on a silk screen printing machine, the bottom metal copper of the hole is complete at the position of the through hole, the conductive paste 4 is printed on the top layer circuit 2 on the front surface, the conductive paste 4 is printed and poured into the through hole, meanwhile, the conductive paste 4 is adhered to the surface of the bottom copper of the hole, namely, the bottom layer circuit 1 and the top layer circuit 2 on the periphery of the hole, baking and curing are carried out, and the bottom layer circuit 1 and the top layer circuit 2 are connected and conducted through the conductive paste 4 in the through hole (as shown in figure 1).
Or, at the via hole, the bottom metal copper is etched with a small hole 1.1, the conductive paste 4 is printed from the top layer circuit 2 on the front surface, and the conductive paste 4 is sucked from the small hole 1.1 on the back surface, so as to make the conductive paste 4 more easily enter the hole, so that the conductive paste 4 is printed and poured in the via hole, the conductive paste 4 is simultaneously stuck to the bottom copper surface, namely the bottom layer circuit 1, and the top layer circuit 2 on the periphery of the hole, and is baked and cured, and the bottom layer circuit 1 and the top layer circuit 2 are connected and conducted through the conductive paste 4 in the via hole (as shown in fig. 2).
4. The top surface covering film 5 with the opened pad window is attached to the top layer circuit 2 in an aligned mode, a part of conductive silver paste 4 is covered according to design, a part of conductive silver paste 4 is exposed, the bottom surface covering film 6 is attached to the bottom layer circuit 1 in an aligned mode, then the top surface covering film 5, the top layer circuit 2, the bottom layer circuit 1 and the bottom surface covering film 6 are firmly bonded together by pressing on a quick press at the temperature of 180 ℃ and the pressure of 1200kg, then the top surface covering film, the top layer circuit 2, the bottom layer circuit 1 and the bottom surface covering film 6 are placed in an oven and are baked and cured for 60 minutes at the temperature of 150 ℃, and then the conductive paste hole-filling circuit board with low cost and low resistance is manufactured through the traditional manufacturing procedures of circuit boards such as silk-printing characters, baking and curing, OSP.
5. The method comprises the steps of printing solder paste on a bonding pad of a conductive paste filling hole circuit board by using a steel mesh on a solder paste printing machine by adopting a traditional SMT (surface mount technology), then mounting L ED lamp beads 7 on the bonding pad printed with the solder paste, welding EED lamp beads 7 on the circuit board through reflow soldering, and manufacturing the conductive paste filling hole circuit board lamp strip with low cost and low resistance (as shown in figures 1 and 2).
The position of the circuit board needing to be conducted on two sides is designed into a cup-shaped via hole, copper at the bottom of the cup is pushed to be flush or nearly flush from the back to the cup opening by utilizing the ductility of the copper, the distance between the copper at the bottom of the cup and the copper at the cup opening is shortened, the cup depth is reduced, and then the conductive paste is filled into the cup-shaped via hole, so that the using amount of the conductive paste is reduced, the resistance value of the conductive paste at the hole is reduced, according to the resistance calculation formula R of the material, the length L is the depth of the hole, and the shallower L value of the hole is, the smaller the resistance value is, the using amount of the conductive paste is less, and the cost is low.
The present invention is described in detail with reference to the accompanying drawings by using a specific embodiment of a low-cost low-resistance conductive paste hole-filled circuit board strip and a manufacturing method thereof. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (8)
1. A method for manufacturing a circuit board lamp belt with conductive paste filling holes at low cost and low resistance value includes the steps of manufacturing a circuit by a single-sided copper-clad plate, attaching a thermosetting adhesive film to the back side of the circuit, punching or drilling the circuit together to manufacture a front single-sided single-panel, etching or die-cutting another single-sided flexible copper-clad plate to manufacture a circuit, aligning and pressing the copper surfaces of the circuit opposite to the thermosetting adhesive surface of the front single-sided single-panel to form a cup-shaped hole at the hole position, printing conductive paste from the front side or printing the conductive paste from the front side when the hole is formed at the bottom of the hole, sucking the conductive paste from the small hole at the back side by a die, heating and curing the upper and lower metal layers at the hole position, conducting the conductive paste through the conductive paste, performing front solder resistance welding to manufacture a conductive paste L ED welded on the circuit board, and manufacturing the circuit board lamp belt with conductive paste filling holes capable of reducing the resistance value and reducing the cost.
2. The utility model provides a conductive paste of low-cost low resistance value irritates hole circuit board lamp area, includes:
a bottom layer circuit;
an intermediate insulating layer;
a top layer circuit;
a cup-shaped via hole;
conducting paste;
solder resist on the surfaces of the two sides;
l ED lamp beads;
the conductive paste is poured into the cup-shaped via hole, the cup-shaped via hole is connected with the cup-shaped via hole bottom metal and the hole edge surface metal to form conduction of two-side circuits, the cup-shaped via hole bottom metal protrudes towards the cup opening direction, the connection distance of the conductive paste for connecting two layers of metals is smaller than the thickness of the middle insulating layer, the consumption and the resistance of the conductive paste are compared with those of the cup-shaped via hole bottom metal, the consumption of the conductive paste is reduced, the resistance value is reduced, the conductive paste is covered by a solder resist layer or the surface of the conductive paste is exposed to form a conductive paste pouring circuit board, L ED lamp beads are welded on the conductive paste pouring circuit board, and the conductive paste pouring circuit board lamp strip with low cost and low resistance value is formed.
3. The low-cost low-resistance conductive paste-filled circuit board lamp strip as claimed in claim 1 or 2, wherein the conductive substance in the conductive paste is silver powder, copper powder, graphite powder, or a mixture of any two or three of silver powder, copper powder and graphite powder, or metal alloy powder.
4. The low-cost low-resistance conductive paste-filled circuit board lamp strip as claimed in claim 1 or 2, wherein the conductive paste is formed by mixing conductive substances, adhesive high polymer materials and auxiliaries.
5. A low cost, low resistance, and conductive paste filled via strip as defined in claim 1 or 2 wherein said double sided circuit board is a flexible circuit board or a rigid circuit board.
6. A low cost, low resistance, hole-filled circuit board strip as defined in claim 1 or 2, wherein said hole is a circular hole or a shaped hole.
7. The low-cost low-resistance conductive paste filled circuit board light strip as claimed in claim 1 or 2, wherein the surface solder resist is cover film solder resist or ink solder resist.
8. The low-cost low-resistance hole-filled circuit board lamp strip as claimed in claim 7, wherein the cover film firmly covers the solidified silver paste to prevent migration of silver particles when the cover film is used as surface solder resist.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910047626.0A CN111491465A (en) | 2019-01-10 | 2019-01-10 | Low-cost low-resistance-value conductive paste grouting circuit board lamp strip and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910047626.0A CN111491465A (en) | 2019-01-10 | 2019-01-10 | Low-cost low-resistance-value conductive paste grouting circuit board lamp strip and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111491465A true CN111491465A (en) | 2020-08-04 |
Family
ID=71796134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910047626.0A Pending CN111491465A (en) | 2019-01-10 | 2019-01-10 | Low-cost low-resistance-value conductive paste grouting circuit board lamp strip and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111491465A (en) |
-
2019
- 2019-01-10 CN CN201910047626.0A patent/CN111491465A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20160095227A1 (en) | Filling method of conductive paste and manufacturing method of multi-layer printed circuit board | |
| CN102065645B (en) | Double-sided printed circuit board (PCB) with elements and mutual conductance method thereof | |
| CN103281864B (en) | A kind of static state is destroyed or force to yield the manufacture method of ladder wiring board | |
| WO2003083940A1 (en) | Method of manufacturing heat conductive substrate | |
| CN210725563U (en) | Double-sided circuit board lamp strip with two-sided circuit switched on in two modes | |
| US9332638B2 (en) | Wiring board and method for manufacturing wiring board | |
| CN207354726U (en) | A kind of one-sided metallic base circuit board for being used to weld pin member | |
| CN204377257U (en) | The circuit board of the metal forming making of die-cut band glue | |
| CN113692130A (en) | FPC structure and manufacturing method thereof | |
| CN110113877B (en) | Method for manufacturing metal-based circuit board by laser cutting method | |
| CN111491465A (en) | Low-cost low-resistance-value conductive paste grouting circuit board lamp strip and manufacturing method thereof | |
| CN210725561U (en) | Conductive paste grouting hole circuit board lamp strip with low cost and low resistance value | |
| CN210725560U (en) | Low-cost low-resistance conductive paste hole filling circuit board | |
| CN111436184A (en) | Low-cost low-resistance conductive paste hole filling circuit board and manufacturing method thereof | |
| CN210725506U (en) | Novel bowl hole of bowl hole double-sided circuit board | |
| CN107770953B (en) | A kind of single-sided flexible circuit board and its pad pasting preparation method based on separable copper foil | |
| CN1665376A (en) | Production process of high precision silver slurry perforated multilayer carbon membrane surface mounting board | |
| CN211063867U (en) | Double-sided circuit board with two modes for conducting circuits on two sides | |
| CN112055477A (en) | Novel bowl-hole double-sided circuit board and manufacturing method | |
| CN112911809B (en) | Method and device for processing blind slot structure of multilayer printed circuit board | |
| CN210725562U (en) | Double-sided circuit board lamp strip for conducting two sides of circuit board in two modes | |
| CN210725559U (en) | Double-sided circuit board with two sides of circuit board switched on in two modes | |
| CN211063888U (en) | Novel lamp area of bowl hole double-sided circuit board preparation | |
| CN113811077A (en) | Flexible circuit board and windowing method thereof | |
| WO2019080914A1 (en) | Method for fabricating single-sided metal-based circuit board used for soldering pin components |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |