CN111479408A - Transparent conductive circuit board manufacturing method, circuit board and transparent display device - Google Patents
Transparent conductive circuit board manufacturing method, circuit board and transparent display device Download PDFInfo
- Publication number
- CN111479408A CN111479408A CN202010266281.0A CN202010266281A CN111479408A CN 111479408 A CN111479408 A CN 111479408A CN 202010266281 A CN202010266281 A CN 202010266281A CN 111479408 A CN111479408 A CN 111479408A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- carrier
- board carrier
- plating
- metal film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 239000002184 metal Substances 0.000 claims abstract description 41
- 230000000694 effects Effects 0.000 claims abstract description 31
- 238000007747 plating Methods 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 28
- 238000001035 drying Methods 0.000 claims abstract description 18
- 230000005855 radiation Effects 0.000 claims abstract description 18
- 230000004048 modification Effects 0.000 claims abstract description 14
- 238000012986 modification Methods 0.000 claims abstract description 14
- 238000004140 cleaning Methods 0.000 claims abstract description 12
- 238000004506 ultrasonic cleaning Methods 0.000 claims abstract description 11
- 238000010586 diagram Methods 0.000 claims abstract description 10
- 238000001514 detection method Methods 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 42
- 230000008569 process Effects 0.000 claims description 16
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 12
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 10
- 238000005406 washing Methods 0.000 claims description 10
- 230000004913 activation Effects 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 8
- 238000007788 roughening Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000005728 strengthening Methods 0.000 claims description 5
- 239000011149 active material Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 238000011049 filling Methods 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 20
- 239000011521 glass Substances 0.000 description 33
- 239000010410 layer Substances 0.000 description 23
- 238000000576 coating method Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 239000000428 dust Substances 0.000 description 5
- 238000007772 electroless plating Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000001755 magnetron sputter deposition Methods 0.000 description 3
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000005341 toughened glass Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003075 superhydrophobic effect Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
Abstract
The invention discloses a transparent conductive circuit board manufacturing method, a circuit board and a transparent display device. The invention uses the insulated transparent carrier as the circuit board carrier, and cuts materials according to the preset sample board; performing laser positioning hole opening according to a preset sample plate; carrying out ultrasonic cleaning on the circuit board carrier after the laser positioning hole is opened; carrying out ultraviolet drying on the cleaned circuit board carrier; carrying out laser radiation selective coarsening modification treatment on the circuit board carrier according to a preset circuit diagram pattern; cleaning and drying the coarsened circuit board bearing plate again; plating a layer of high-activity material film on the circuit board carrier; plating a first metal film on the high-activity material film; plating a second metal film on the first metal film; and carrying out line detection. The manufacturing method of the transparent conductive circuit board can realize high-strength combination between the transparent substrate and the circuit layer and has low cost.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a transparent conductive circuit board manufacturing method, a circuit board and a transparent display device.
Background
In the microelectronics and device manufacturing industry, glass stands out in new substrate materials by virtue of excellent electrical insulation, high chemical stability, high optical transparency in the visible band, high hardness and dimensional stability. Due to the special properties of the glass, such as high brittleness, transparency and the like, the patterned arrangement of metal lines and micro-channels with excellent performance on the surface or inside of the glass has certain difficulty. Most of the existing glass surface technical technologies are to singly perform chemical liquid coating or magnetron sputtering coating on glass. There are still many disadvantages in the coating technique using such ion coating method or cathode sputtering method. On one hand, the process is complicated, the equipment investment is large and the production cost is extremely high; on the other hand, the bonding viscosity of the glass substrate and the coating layer is poor, only large-area wide coating can be performed, selective regional coating cannot be performed, complicated photoetching steps are required, the limitation is large, and the cost is increased. Therefore, the problem of how to reduce the production cost while improving the adhesion between the glass substrate and the coating layer has become an urgent problem to be solved by those skilled in the art.
Disclosure of Invention
In order to overcome the above defects, embodiments of the present invention provide a method for manufacturing a transparent conductive circuit board, a circuit board, and a transparent display device, so as to solve the problems in the prior art.
In a first aspect, an embodiment of the present invention provides a method for manufacturing a transparent conductive circuit board, where the method includes:
cutting materials according to a preset sample board by taking an insulating transparent carrier as a circuit board carrier;
performing laser positioning hole opening according to a preset sample plate;
carrying out ultrasonic cleaning on the circuit board carrier after the laser positioning hole is opened;
carrying out ultraviolet drying on the cleaned circuit board carrier;
carrying out laser radiation selective coarsening modification treatment on the circuit board carrier according to a preset circuit diagram pattern;
cleaning and drying the coarsened circuit board bearing plate again;
plating a layer of high-activity material film on the circuit board carrier;
plating a first metal film on the high-activity material film;
plating a second metal film on the first metal film;
and carrying out circuit detection on the circuit board carrier.
Preferably, the ultrasonic cleaning on the circuit board carrier comprises: washing with anhydrous ethanol for 10min, and washing with deionized water for 20 min.
Preferably, the process conditions for performing laser radiation selective roughening modification treatment on the circuit board carrier are as follows:
the laser wavelength is 355nm, and the laser energy density is 27.64J/CM2The laser pulse frequency was 100kHZ and the laser scanning speed was 200 mm/s.
Preferably, the step of cleaning and drying the roughened circuit board bearing plate again includes: ultrasonically cleaning with dilute hydrofluoric acid for 5min, washing with sodium hydroxide for 1min, and drying.
Preferably, plating a high-activity material film on the circuit board carrier comprises: and plating a layer of high-activity material film on the circuit board carrier in a direct soaking mode.
Preferably, plating a layer of high-activity material film on the circuit board carrier further comprises: and strengthening the high-activity substance film covered on the circuit board carrier by laser radiation activation.
Preferably, the process conditions for the activation plating of the high-activity material film on the circuit board carrier by laser radiation are as follows: the laser scanning speed is 50-100mm/s, and the laser energy density is 9.04-10.44J/CM2And the activation scanning filling interval is 7.5-10 um.
Preferably, the first layer of metal film is one of copper, chromium and titanium; the second layer of metal film is copper or tin; the thickness of the first layer of metal film is greater than the thickness of the second layer of metal film.
In a second aspect, an embodiment of the present invention provides a circuit board, where the circuit board includes the manufacturing method of the transparent conductive circuit board according to the first aspect.
In a third aspect, an embodiment of the present invention provides a display device, which includes the circuit board according to the second aspect.
In summary, the embodiments of the present invention provide a method for manufacturing a transparent conductive circuit board, a circuit board and a transparent display device, in which an insulating transparent carrier is used as a circuit board carrier, and cutting is performed according to a preset sample board; and carrying out ultrasonic cleaning on the circuit board bearing body, and carrying out ultraviolet drying on the cleaned circuit board bearing body, so that oil contamination impurities on the surface of the glass bearing body are removed, and the circuit board bearing body is ensured to be dry and clean. And carrying out laser radiation selective roughening modification treatment on the circuit board carrier according to a preset circuit diagram pattern, so that the roughness of the surface of the circuit board carrier is changed, and the effective combination of the glass substrate and the metal layer is facilitated. And cleaning and drying the coarsened circuit board bearing plate again to remove dust particles left during the selective coarsening modification treatment of the laser radiation. And plating a layer of high-activity substance film on the circuit board carrier, wherein the high-activity substance film increases the adhesiveness of the electroless plating metal film. Plating a first metal film on the high-activity material film; and plating a second metal film on the first metal film. The thickness of the first layer of metal film is larger than that of the second layer of metal film, so that the conductivity of the circuit bearing plate is ensured. And carrying out circuit detection on the circuit board carrier. The manufacturing method of the transparent conductive circuit board can realize high-strength combination between the glass substrate and the circuit layer, and the circuit layer has high conductivity. In addition, the invention omits a series of complicated steps such as photoetching, exposure, development and the like in the traditional magnetron sputtering method or vacuum evaporation method, and reduces the production cost.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described below, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a flow chart of a method for manufacturing a transparent conductive circuit board according to an embodiment of the invention.
Fig. 2 is a schematic view of the working principle of performing laser radiation selective roughening modification treatment on the circuit board carrier according to a preset circuit diagram pattern according to the method for manufacturing a transparent conductive circuit board of the embodiment of the invention;
fig. 3 is a schematic structural diagram of a transparent display device of the method for manufacturing a transparent conductive circuit board according to the embodiment of the invention.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Example one
The embodiment of the invention provides a method for manufacturing a transparent conductive circuit board, which comprises the following steps:
s1, cutting the material according to a preset sample board by taking the insulating transparent carrier as a circuit board carrier;
the glass or other transparent plastic substrates are good in electrical insulation property, high in chemical stability, high in optical transparency in a visible light band, excellent in thermal conductivity and strong in dimensional stability, meanwhile, the circuit board taking the glass or other transparent plastic materials as the substrate is strong in concealment, L ED high-efficiency light emission can be achieved in display application, transparent aesthetic feeling is achieved, low carbon and energy are achieved, and in the embodiment, cutting is conducted according to a preset sample board, namely, cutting is conducted according to the requirements of the required specification, size, shape and the like of the circuit board.
S2, performing laser positioning and hole opening according to a preset sample plate;
in the embodiment, since glass or other transparent plastic substrates have high brittleness and high hardness, the laser drilling can be used for effectively and accurately drilling holes, and the drilling precision is high.
S3, performing ultrasonic cleaning on the circuit board carrier after the laser positioning hole is opened;
specifically, the glass leaves dust and dust during the processes of cutting and positioning the hole, and a certain amount of oil stains and impurities exist on the surface of the glass, so that the absorption and wetting performance of the glass to light is influenced. The process precision is improved by carrying out ultrasonic cleaning on the circuit board carrier.
Preferably, the ultrasonic cleaning on the circuit board carrier comprises: washing with anhydrous ethanol for 10min, and washing with deionized water for 20 min.
S4, drying the cleaned circuit board carrier by ultraviolet rays;
s5, carrying out laser radiation selective coarsening modification treatment on the circuit board carrier according to a preset circuit diagram pattern;
preferably, referring to fig. 2, in this embodiment, the glass substrate is placed on a processing platform, a predetermined circuit pattern is introduced into an upper computer, the upper computer is connected to a laser device, and a laser beam with a certain energy is used to scan according to the predetermined circuit pattern, so that the surface of the glass substrate is selectively roughened. It is understood that the physical etching by the laser causes the micro-topography and roughness of the processing region (i.e., the predetermined circuit pattern) to change during the processing. In addition, the thermal effect of the laser causes the melting and vaporization effect to occur in the processing area (i.e. the preset circuit diagram pattern), and the surface structure of the processing area changes, presenting a rough preset circuit diagram pattern.
In this embodiment, the process conditions for performing the laser radiation selective roughening modification treatment on the circuit board carrier are as follows:
the laser wavelength is 355nm, and the laser energy density is 27.64J/CM2The laser pulse frequency was 100kHZ and the laser scanning speed was 200 mm/s.
S6, cleaning and drying the coarsened circuit board bearing plate again;
preferably, the step of cleaning and drying the roughened circuit board bearing plate again includes: ultrasonically cleaning with dilute hydrofluoric acid for 5min, washing with sodium hydroxide for 1min, and drying. It is understood that the ultrasonic cleaning with dilute hydrofluoric acid can remove dust debris left by roughening the surface of the glass substrate on the one hand, and the acid etching with dilute hydrofluoric acid increases the roughness and uniformity of the surface of the roughened region of the glass substrate on the other hand, while causing less damage to the non-roughened region. The sodium hydroxide washing ensures the alkaline environment of the surface of the roughening processing area of the glass substrate.
S7, plating a layer of high-activity material film on the circuit board carrier;
preferably, plating a high-activity material film on the circuit board carrier comprises: and plating a layer of high-activity material film on the circuit board carrier in a direct soaking mode. In this embodiment, the high active substance membrane is a palladium chloride solution. The circuit board bearing plate is directly soaked in a palladium chloride solution, and the roughened area of the glass substrate is covered with more high-activity substance films than the unprocessed area due to the large surface roughness and strong hydrophilicity of the roughened area of the glass substrate.
Preferably, plating a layer of high-activity material film on the circuit board carrier further comprises: and strengthening the high-activity substance film covered on the circuit board carrier by laser radiation activation. In this embodiment, the CCD coupling technique is used to precisely couple and align the surface of the processed circuit pattern, and the energy output of the laser beam causes the highly active material film attached to the roughened area of the glass substrate to perform a photochemical reaction, thereby causing a reduction reaction of the active ions on the highly active material film, and enhancing the adhesion of the highly active palladium chloride to the glass substrate.
In this embodiment, the process conditions for performing the strengthening treatment on the high active material film covering the circuit board carrier by laser radiation activation are as follows: the laser scanning speed is 50-100mm/s, and the laser energy density is 9.04-10.44J/CM2And the activation scanning filling interval is 7.5-10 um.
S8, plating a first metal film on the high-activity substance film;
s9, plating a second metal film on the first metal film;
and S10, carrying out circuit detection on the circuit board carrier.
In the embodiment, a first metal film and a second metal film are plated on the high-activity material film by an electroless plating method, wherein the first metal film is one of copper, chromium and titanium; the second layer of metal film is copper or tin; the thickness of the first layer of metal film is greater than the thickness of the second layer of metal film. In this embodiment, the electroless plating is performed under the following process conditions: the temperature was 55 ℃ and the pH was 12.5. Wherein the thicknesses of the first metal film and the second metal film are controlled by controlling the plating time.
Example two
The invention provides a circuit board, which is manufactured according to the manufacturing method of the transparent conductive circuit board in the embodiment.
EXAMPLE III
The invention provides a transparent display device which comprises the circuit board in the second embodiment. Referring to fig. 3, the transparent display device includes a front transparent cover glass 1, a transparent glass display module 2, a rear tempered glass 3, a high-strength aluminum profile box 4, a latch 5, a circuit board 6, a receiving card 7, a power supply 8, and a rear cover 9. The circuit board is the circuit board described in the second embodiment. The receiving card 7 and the power supply 8 are electrically connected with the circuit board respectively. The high-strength aluminum profile box 4 reinforces the overall structure of the transparent display device. The front transparent protective glass 1, the transparent glass display module 2 and the rear toughened glass 3 are attached to each other. The front transparent protection shell 1 is made of glass or acrylic materials so as to protect the front surface of the transparent display device, and has the characteristics of water resistance, explosion resistance and corrosion resistance. The transparent glass display module adopts graphene super-hydrophobic material process for protection, and is light, thin, low-carbon, energy-saving, high in light transmittance and high in resolution ratio to perform precision machining on the lamp beads and the copper foil circuit board. The rear tempered glass 3 enhances the impact resistance and pressure resistance of the transparent display device.
In summary, the embodiments of the present invention provide a method for manufacturing a transparent conductive circuit board, a circuit board and a transparent display device, in which an insulating transparent carrier is used as a circuit board carrier, and cutting is performed according to a preset sample board; performing laser positioning hole opening according to a preset sample plate; and carrying out ultrasonic cleaning on the circuit board bearing body after the laser positioning hole is opened, and carrying out ultraviolet drying on the cleaned circuit board bearing body, so that oil contamination impurities on the surface of the glass bearing body are removed, and the circuit board bearing body is ensured to be dry and clean. And carrying out laser radiation selective roughening modification treatment on the circuit board carrier according to a preset circuit diagram pattern, so that the roughness of the surface of the circuit board carrier is changed, and the effective combination of the glass substrate and the metal layer is facilitated. And cleaning and drying the coarsened circuit board bearing plate again to remove dust particles left during the selective coarsening modification treatment of the laser radiation. And plating a layer of high-activity substance film on the circuit board carrier, wherein the high-activity substance film increases the adhesiveness of the electroless plating metal film. Plating a first metal film on the high-activity material film; and plating a second metal film on the first metal film. And carrying out circuit detection on the circuit board carrier. The manufacturing method of the transparent conductive circuit board can realize high-strength combination between the glass substrate and the circuit layer, and the circuit layer has high conductivity. In addition, the invention omits a series of complicated steps such as photoetching, exposure, development and the like in the traditional magnetron sputtering method or vacuum evaporation method, and reduces the production cost.
It should also be noted that the exemplary embodiments mentioned in this patent describe some methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the above-described steps, that is, the steps may be performed in the order mentioned in the embodiments, may be performed in an order different from the order in the embodiments, or may be performed simultaneously.
As described above, only the specific embodiments of the present invention are provided, and it can be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes of the system, the module and the unit described above may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again. It should be understood that the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present invention, and these modifications or substitutions should be covered within the scope of the present invention.
Claims (10)
1. A method for manufacturing a transparent conductive circuit board is characterized by comprising the following steps:
cutting materials according to a preset sample board by taking an insulating transparent carrier as a circuit board carrier;
performing laser positioning hole opening according to a preset sample plate;
carrying out ultrasonic cleaning on the circuit board carrier after the laser positioning hole is opened;
carrying out ultraviolet drying on the cleaned circuit board carrier;
carrying out laser radiation selective coarsening modification treatment on the circuit board carrier according to a preset circuit diagram pattern;
cleaning and drying the coarsened circuit board bearing plate again;
plating a layer of high-activity material film on the circuit board carrier;
plating a first metal film on the high-activity material film;
plating a second metal film on the first metal film;
and carrying out circuit detection on the circuit board carrier.
2. The method of claim 1, wherein the ultrasonic cleaning of the circuit board carrier comprises: washing with anhydrous ethanol for 10min, and washing with deionized water for 20 min.
3. The method for manufacturing a transparent conductive circuit board according to claim 2, wherein the process conditions for performing the laser radiation selective roughening modification treatment on the circuit board carrier are as follows:
the laser wavelength is 355nm, and the laser energy density is 27.64J/CM2The laser pulse frequency was 100kHZ and the laser scanning speed was 200 mm/s.
4. The method for manufacturing a transparent conductive circuit board according to claim 3, wherein the step of cleaning and drying the roughened circuit board carrier plate again comprises: ultrasonically cleaning with dilute hydrofluoric acid for 5min, washing with sodium hydroxide for 1min, and drying.
5. The method of claim 4, wherein plating a high-activity material film on the circuit board carrier comprises: and plating a layer of high-activity material film on the circuit board carrier in a direct soaking mode.
6. The method of claim 5, wherein plating a high-activity material film on the circuit board carrier further comprises: and strengthening the high-activity substance film covered on the circuit board carrier by laser radiation activation.
7. The method for manufacturing a transparent conductive circuit board according to claim 6, wherein the process conditions for strengthening the high active material film covered on the circuit board carrier by laser radiation activation are as follows: the laser scanning speed is 50-100mm/s, and the laser energy density is 9.04-10.44J/CM2And the activation scanning filling interval is 7.5-10 um.
8. The method of claim 7, wherein the first metal film is one of copper, chromium and titanium; the second layer of metal film is copper or tin; the thickness of the first layer of metal film is greater than the thickness of the second layer of metal film.
9. A circuit board comprising the transparent conductive circuit board manufacturing method according to any one of claims 1 to 8.
10. A transparent display device comprising the circuit board of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010266281.0A CN111479408A (en) | 2020-04-07 | 2020-04-07 | Transparent conductive circuit board manufacturing method, circuit board and transparent display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010266281.0A CN111479408A (en) | 2020-04-07 | 2020-04-07 | Transparent conductive circuit board manufacturing method, circuit board and transparent display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111479408A true CN111479408A (en) | 2020-07-31 |
Family
ID=71750203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010266281.0A Pending CN111479408A (en) | 2020-04-07 | 2020-04-07 | Transparent conductive circuit board manufacturing method, circuit board and transparent display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111479408A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114745871A (en) * | 2022-03-21 | 2022-07-12 | 江西福昌发电路科技有限公司 | Laser drilling dust removal process for HDI circuit board production |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6347382A (en) * | 1986-08-15 | 1988-02-29 | Matsushita Electric Works Ltd | Production of nitride ceramic wiring board |
| CN103304276A (en) * | 2012-03-14 | 2013-09-18 | 比亚迪股份有限公司 | Method for metalizing ceramic substrate surface and high-power LED (light-emitting display) base |
| CN104732891A (en) * | 2013-12-20 | 2015-06-24 | 乐金显示有限公司 | Transparent display device and transparent organic light emitting display device |
| CN105101656A (en) * | 2015-07-31 | 2015-11-25 | 歌尔声学股份有限公司 | Conductor line and manufacture method thereof |
| CN209433749U (en) * | 2018-09-29 | 2019-09-24 | 杭州亿奥光电有限公司 | A kind of transparency LED glass display screen |
-
2020
- 2020-04-07 CN CN202010266281.0A patent/CN111479408A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6347382A (en) * | 1986-08-15 | 1988-02-29 | Matsushita Electric Works Ltd | Production of nitride ceramic wiring board |
| CN103304276A (en) * | 2012-03-14 | 2013-09-18 | 比亚迪股份有限公司 | Method for metalizing ceramic substrate surface and high-power LED (light-emitting display) base |
| CN104732891A (en) * | 2013-12-20 | 2015-06-24 | 乐金显示有限公司 | Transparent display device and transparent organic light emitting display device |
| CN105101656A (en) * | 2015-07-31 | 2015-11-25 | 歌尔声学股份有限公司 | Conductor line and manufacture method thereof |
| CN209433749U (en) * | 2018-09-29 | 2019-09-24 | 杭州亿奥光电有限公司 | A kind of transparency LED glass display screen |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114745871A (en) * | 2022-03-21 | 2022-07-12 | 江西福昌发电路科技有限公司 | Laser drilling dust removal process for HDI circuit board production |
| CN114745871B (en) * | 2022-03-21 | 2024-01-26 | 江西福昌发电路科技有限公司 | Laser drilling and ash removal process for producing HDI circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107949164A (en) | A kind of circuit substrate coil line etch process with higher rate | |
| JPS60101994A (en) | Plating of through hole | |
| JP3641632B1 (en) | Conductive sheet, product using the same, and manufacturing method thereof | |
| TW201542351A (en) | Roughened copper foil, copper-clad laminate, and printed wiring board | |
| US8052858B2 (en) | Pretreatment method for electroless plating material and method for producing member having plated coating | |
| CN103619773B (en) | The manufacture method of electronics cover glass, electronics cover glass, the cover glass manufacture method of glass substrate and touch sensor module for electronics | |
| CN101722367A (en) | Method for drilling holes on printed circuit board | |
| JPWO2007135874A1 (en) | Glass substrate with transparent electrode and manufacturing method thereof | |
| JPWO2013089178A1 (en) | Cover glass for electronic equipment, manufacturing method thereof, and manufacturing method of touch sensor module | |
| CN101469075B (en) | Method for preparing two-sided polyimide / silver compound film | |
| CN101400213A (en) | Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing method | |
| US20110036493A1 (en) | Surface treatment method for copper and surface treatment method for printed wiring board | |
| CN111479408A (en) | Transparent conductive circuit board manufacturing method, circuit board and transparent display device | |
| CN106535502A (en) | Electroplating method of high-aspect ratio circuit board | |
| CN114190011A (en) | High-heat-dissipation PCB and manufacturing process thereof | |
| CN102762037A (en) | Ceramic circuit board and manufacturing method thereof | |
| KR101553635B1 (en) | Method of manufacturing printed circuit board, and printed circuit board obtained using method of manufacturing printed circuit board | |
| KR20040038728A (en) | Desmear and texturing method | |
| JPS63168077A (en) | Manufacture of printed wiring board | |
| TWI751794B (en) | Touch sensor module and method of fabricating the same | |
| CN115038234A (en) | Manufacturing method of flexible circuit board | |
| Cobley | Alternative surface modification processes in metal finishing and electronic manufacturing industries | |
| KR20180074619A (en) | Production method of glass plate with film | |
| CN103796434B (en) | A kind of ultrathin FPC method for processing blind hole | |
| US6003225A (en) | Fabrication of aluminum-backed printed wiring boards with plated holes therein |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200731 |