CN111477769B - OLED packaging device and packaging method thereof - Google Patents
OLED packaging device and packaging method thereof Download PDFInfo
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- CN111477769B CN111477769B CN202010288087.2A CN202010288087A CN111477769B CN 111477769 B CN111477769 B CN 111477769B CN 202010288087 A CN202010288087 A CN 202010288087A CN 111477769 B CN111477769 B CN 111477769B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
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Abstract
The application provides an OLED packaging device and a packaging method thereof, wherein the packaging device comprises: a base; the bearing platform is fixed on the base and used for bearing the substrate to be packaged; the driving assembly is fixed on the base; a fixed member mounted on the drive assembly; a coating member mounted on the fixing member for containing coating glue; an ultraviolet light source mounted on the fixing member for providing light to the coating member; according to the method, the packaging adhesive material in the coating component is coated after being subjected to ultraviolet irradiation, so that the substrate to be packaged can be effectively prevented from being irradiated by ultraviolet light in the packaging process, and the electrical property of the substrate is ensured.
Description
Technical Field
The application relates to the field of display, in particular to an OLED packaging device and a packaging method thereof.
Background
Organic Light Emitting Devices (OLEDs) are attracting much attention because of their self-luminescence, low driving voltage, fast response, wide viewing angle, and the like. Organic light emitting materials are very sensitive to water and oxygen, and the presence of trace amounts of moisture can cause severe degradation or even complete failure of the display quality, and therefore encapsulation is critical for OLEDs.
The existing packaging method is to coat a glue material on a packaging cover plate, then press the packaging cover plate and a substrate to be packaged together, irradiate the glue material by ultraviolet light, and then heat the glue material to solidify the glue material, thereby achieving the sealing effect. However, when the ultraviolet light irradiates the substrate to be packaged, the ultraviolet light may affect the electrical property of the display panel, and further affect the display effect of the display panel.
Therefore, the conventional OLED packaging technology has a technical problem that the electrical property of the display panel is affected by the packaging process, and needs to be solved.
Disclosure of Invention
The embodiment of the application provides an OLED packaging device and a packaging method thereof, which can solve the technical problem that the electrical property of a display panel is influenced by a packaging process in the existing OLED packaging technology.
The application provides an OLED packaging device, includes:
a base;
the bearing platform is fixed on the base and used for bearing the packaging cover plate;
the driving assembly is fixed on the base;
a fixed member mounted on the drive assembly;
a coating member mounted on the fixing member for containing coating glue;
an ultraviolet light source mounted on the fixing member for providing light to the coating member.
In the OLED encapsulation device of the present application, the ultraviolet light source is disposed at least one of the top or side of the coating member.
In some embodiments, the coating member material is a transparent material.
In some embodiments, the OLED encapsulation device further comprises an adjusting member for adjusting an irradiation parameter of the ultraviolet light source according to a parameter of the coating glue in the coating member.
In some embodiments, the OLED encapsulation device further includes a control means for controlling a coating amount of the coating means.
In some embodiments, the OLED encapsulation device further includes a first detection component, configured to detect whether the encapsulation cover plate is placed on the bearing platform, and trigger the ultraviolet light source to operate when the encapsulation cover plate is detected.
In some embodiments, the first detection component is a distance sensor or an optical sensor.
In some embodiments, the OLED encapsulation device further includes a second detection component for detecting the energy of the coating glue in the coating member, and when the energy is greater than a threshold value, the ultraviolet light source is triggered to stop working.
In some embodiments, the driving assembly is configured to drive the fixing member to move in a first direction in a first state, drive the fixing member to move in a second direction in a second state, and drive the fixing member to move in a third direction in a third state, wherein the first direction is perpendicular to a package surface of the package cover plate, and the first direction, the second direction, and the third direction are perpendicular to each other.
Meanwhile, the application also provides an OLED packaging method, the OLED packaging device is used for packaging, and the OLED packaging method comprises the following steps:
placing the package cover plate on a bearing platform;
turning on the ultraviolet light source, and irradiating the coating glue in the coating member;
coating the irradiated coating glue on the packaging cover plate;
and attaching the packaging cover plate and the substrate to be packaged, and curing the coating adhesive on the packaging cover plate to finish packaging.
The beneficial effect of this application does:
the application provides an OLED packaging device and a packaging method thereof, wherein the packaging device comprises: a base; the bearing platform is fixed on the base and used for bearing the substrate to be packaged; the driving assembly is fixed on the base; a fixed member mounted on the drive assembly; a coating member mounted on the fixing member for containing coating glue; an ultraviolet light source mounted on the fixing member for providing light to the coating member; according to the method, the packaging adhesive material in the coating component is coated after being subjected to ultraviolet irradiation, so that the substrate to be packaged can be effectively prevented from being irradiated by ultraviolet light in the packaging process, and the electrical property of the substrate is ensured.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
FIG. 1 is a schematic structural diagram of an OLED packaging device according to the present application;
FIG. 2 is a schematic view of the working process of the OLED packaging device of the present application;
fig. 3 to 7 are diagrams of OLED method implementation of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different architectures of the present application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
The application provides an OLED packaging device and a packaging method thereof, which can solve the technical problem that the electrical property of a display panel is influenced by a packaging process in the existing OLED packaging technology.
As shown in fig. 1, the present application provides an OLED encapsulation device, including: a base 100; a carrying platform 110 fixed on the base 100 for carrying the package cover 200; a driving assembly 120 fixed on the base 100; a fixing member 130 mounted on the driving assembly; a coating member 140 mounted on the fixing member for containing coating glue; an ultraviolet light source 150 installed on the fixing member for providing light to the coating member.
In one embodiment, the ultraviolet light source 150 is a UV lamp tube disposed on two opposite sides of the coating member.
In one embodiment, the ultraviolet light source 150 is a UV lamp tube, and the ultraviolet light source is disposed on one side of the coating member.
In one embodiment, the ultraviolet light source 150 is a UV lamp tube, which is disposed on top of the coating member.
In one embodiment, the ultraviolet light sources 150 are UV bulbs and the array of ultraviolet light sources is disposed about the coating member.
In one embodiment, the distance between the uv light source 150 and the coating member 140 is less than or equal to 5mm, which can provide energy to the maximum extent, improve the light efficiency more effectively, and reduce the energy consumption to a large extent.
In one embodiment, the coating member is a transparent member for direct irradiation by an ultraviolet light source.
In one embodiment, the OLED encapsulation device further comprises an adjusting member for adjusting an irradiation parameter of the ultraviolet light source according to a parameter of coating glue in the coating member; the parameters of the coating glue are the type and the volume of the coating glue, the irradiation parameters of the ultraviolet light source are irradiation time and energy, and the irradiation time and the energy required by different coating glues are different.
In one embodiment, the effective light emitting area of the ultraviolet light source is larger than the projection area of the coating member, the illumination is equal to or more than 100mw/cm2, the effective spectral range of the ultraviolet LED lamp is between 350 and 450nm, and the peak wavelength is 365 nm.
In one embodiment, the coating glue comprises a frame glue and an underfill glue. The frame glue has the functions of bonding the substrate to be packaged and the packaging cover plate, blocking water vapor from invading and controlling the thickness of the OLED panel box. The coating glue is thermosetting glue or ultraviolet curing glue, the thermosetting glue can be heated without ultraviolet irradiation, and the ultraviolet curing glue can be irradiated and coated by adjusting ultraviolet irradiation parameters according to the performance of the glue material. The thermosetting coating glue is added with single crystal resin and phenol resin besides resin, and the ultraviolet curing coating glue is added with epoxy resin which has crosslinking effect under ultraviolet irradiation.
In one embodiment, the OLED encapsulation device further includes a control member for controlling a coating amount of the coating member.
In one embodiment, the OLED encapsulation device further includes a first detection component, which is generally a distance sensor or an optical sensor, for detecting whether the encapsulation cover plate is placed on the carrying platform, and when detecting that the encapsulation cover plate is present, triggering the ultraviolet light source to operate.
In one embodiment, the OLED encapsulation device further includes a second detection component for detecting the energy of the coating glue in the coating member, and when the energy is greater than a threshold value, the ultraviolet light source is triggered to stop working. The second detection component is an energy sensing device, and the energy of the coating glue is judged through the ultraviolet energy received by the coating glue.
In one embodiment, the coating member comprises a rubber hose and a coating head, wherein the rubber hose is a transparent rubber hose and is used for accommodating coating rubber; the gluing head is a hole-shaped nozzle or a crack nozzle, the gluing head controls the glue outlet amount through electric voltage, one or more gluing heads can be configured according to requirements, the gluing heads can be detached and cleaned at any time and reused, and the distance between the gluing heads and the glass substrate is generally about 0.2 mm.
In one embodiment, the driving assembly 120 includes a first slide rail 121, a second slide rail 122 and a sliding member 123, the first slide rail 121 and the second slide rail 122 are disposed on the bearing platform 110 in parallel, the first slide rail 121 and the second slide rail 122 are disposed on two sides of the bearing platform 110 in parallel, the sliding member 123 is disposed in a direction perpendicular to the first slide rail 121 and the second slide rail 122, and in a first state, the fixing member 130 moves in a first direction along the sliding member 123 under the driving of the driving assembly 120; in the second state, the fixing member 130 moves along the first sliding rail 121 in the second direction under the driving of the driving assembly 120, and in the third state, the fixing member 130 moves along the second sliding rail 122 in the third direction under the driving of the driving assembly 120, wherein the first direction is perpendicular to the package cover, and the first direction, the second direction and the third direction are perpendicular to each other.
The application provides an OLED packaging device, includes: a base; the bearing platform is fixed on the base and used for bearing the packaging cover plate; the driving assembly is fixed on the base; a fixed member mounted on the drive assembly; a coating member mounted on the fixing member for containing coating glue; an ultraviolet light source mounted on the fixing member for providing light to the coating member; by coating the packaging adhesive material in the coating member after ultraviolet irradiation, the substrate to be packaged can be effectively prevented from being irradiated by ultraviolet light in the packaging process, and the electrical property of the substrate is ensured.
As shown in fig. 2, the present application further provides an OLED packaging method using the above OLED packaging apparatus for packaging, which includes the steps of:
s1: placing the packaging cover plate on the bearing platform;
s2: turning on an ultraviolet light source, and irradiating coating glue in the coating member;
s3: coating the irradiated coating glue on the packaging cover plate;
s4: and (5) attaching the packaging cover plate and the substrate to be packaged, and curing the coating glue on the packaging cover plate to complete packaging.
In one embodiment, the carrier platform has a plurality of package cover plates thereon.
The following detailed description of the workflow with reference to fig. 3 to 7
In step S1, as shown in fig. 3, a package cover 200 is provided, and the package cover is made of a material, typically a glass cover or a metal cover, both of which are tightly packaged to effectively isolate the penetration of water and oxygen into the device package layer. The metal cover plate has good thermal conductivity and high mechanical strength, but the metal cover plate has high weight and high cost and is easy to warp and deform, and meanwhile, the metal cover plate cannot be used for top emission due to the metal opacity; the glass cover plate has good electric shielding property and electric insulating property, can resist oxidation after being chemically stable, but has poor mechanical strength, is fragile and is easy to generate slight cracks. The material of the encapsulating cover plate is selected according to the encapsulation requirements of the OLED.
Meanwhile, the desiccant sheet is adhered to the packaging cover plate 200 in advance, the desiccant sheet can effectively eliminate water and oxygen generated in the packaging process, and can absorb residual water and oxygen in the sealed space after packaging is completed, and can also absorb water vapor and other waste gas released by decomposition of organic materials when the device works, so that the drying of the internal working environment of the device is maintained, and the probability of hydrolysis or oxidation of the organic materials and metals is effectively reduced.
In some embodiments, the uv light source is triggered to start working when the first detection component, which is typically a distance sensor or an optical sensor, detects that the package cover 200 is placed on the carrying platform 110.
In step S2, if the coating adhesive is an ultraviolet curing coating adhesive, the adjusting member of the packaging device starts to start to adjust the irradiation parameters of the ultraviolet light source, such as the irradiation time and the energy of the ultraviolet light source, according to the parameters of the coating adhesive in the coating member, such as the type and the volume of the coating adhesive, and the irradiation time and the energy required by different coating adhesives are different; and after the second adjusting component is started, the ultraviolet light source performs coating glue pretreatment to reach the energy required by the coating glue, and the ultraviolet light source is closed to perform coating.
In step S3, the coating glue includes frame glue and filling glue, the frame glue adheres to the package cover plate and the substrate, the box thickness is increased by isolating water and oxygen, and the filling glue supports the cover plate. The coating glue is a thermosetting type or ultraviolet curing type glue, the thermosetting type coating glue is added with single crystal resin and phenol resin besides resin, and the ultraviolet curing type coating glue is added with epoxy resin which has a crosslinking effect under ultraviolet irradiation. In this embodiment, the coating glue is one or both of an ultraviolet curable glue and a thermosetting glue. As shown in fig. 4, a circle of frame glue 211 is coated on the cover plate, and then the filling glue 212 is filled in the cover plate, wherein the coating glue needs to be subjected to vacuum defoaming treatment before use to prevent bubbles from being generated and prevent the package cover plate and the substrate to be packaged from being detached after adhesion. The area of the filling layer is the same as that of the OLED device of the substrate to be packaged, and the filling layer is used for supporting the packaging cover plate 200.
As shown in fig. 5, before step S4 is performed, a substrate 300 to be packaged should be provided, before the substrate 300 to be packaged is attached, a light emitting device 310 should be manufactured by evaporation or inkjet printing, where the OLED device 310 includes a substrate, a driving circuit layer, a first electrode, a light emitting functional layer, a second electrode, and a protective layer; wherein the drive circuit is formed on one side of the substrate; the first electrode is formed on one side, far away from the substrate, of the driving circuit layer; the light-emitting functional layer is formed on one side of the first electrode, which is far away from the driving circuit layer; a second electrode formed on a side of the light-emitting functional layer away from the first electrode; and the protective layer is formed on one side of the second electrode, which is far away from the light-emitting function layer, and covers the second electrode. As shown in fig. 6, an inorganic water-blocking layer 320 is formed over the OLED device 310 by a chemical vapor deposition method, and the inorganic water-blocking layer is two or more inorganic thin films with good water and oxygen blocking capability and used for covering a hole transport layer or an organic light-emitting layer device. However, defects such as pinholes, cracks, and the like are inevitably generated during the process of forming the inorganic thin film, resulting in a decrease in the barrier ability of the inorganic water-resistant layer. In addition, the inorganic water-resistant layer with excessive thickness can generate larger internal stress, thereby seriously affecting the packaging quality. For this reason, defects and internal stress of the inorganic water-blocking layer can be reduced by installing the organic water-blocking layer between the two inorganic water-blocking layers, so that the packaging quality can be improved.
In step S4, as shown in fig. 7, the package cover 200 coated with the coating glue is placed on the supporting platform 110, the package cover 200 is adsorbed by the supporting platform 110 under negative pressure, the substrate to be packaged is adsorbed by the package cover 200 through the electrostatic principle, the temperatures of the two substrates are kept substantially the same, and the package cover 200 and the substrate to be packaged are roughly aligned in a vacuum environment. After rough alignment, the distance between the glass substrates is less than 0.2mm, the height of the packaging substrate is continuously reduced, accurate alignment is started, the sliding deviation of the packaging substrate is minimized, vacuum alignment is completed, the glass substrates are finally placed into the atmosphere, under the action of gravity, the two glass substrates are naturally attached, the normally attached vacuum degree is required to be about 1Pa, and then thermosetting treatment is carried out under the condition of 60 degrees, so that the cover plate and the organic layer and the electrode between the cover plate and the base plate can be sealed, oxygen, water vapor and dust in the atmosphere are isolated, and the functional layers of the OLED are prevented from reacting with water oxygen in the air.
According to the above embodiments:
the application provides an OLED packaging device and a packaging method thereof, wherein the packaging device comprises: a base; the bearing platform is fixed on the base and used for bearing the substrate to be packaged; the driving assembly is fixed on the base; a fixed member mounted on the drive assembly; a coating member mounted on the fixing member for containing coating glue; an ultraviolet light source mounted on the fixing member for providing light to the coating member; according to the method, the packaging adhesive material in the coating component is coated after being subjected to ultraviolet irradiation, so that the substrate to be packaged can be effectively prevented from being irradiated by ultraviolet light in the packaging process, and the electrical property of the substrate is ensured.
The OLED packaging device and the packaging method thereof provided by the embodiments of the present application are described in detail above, and specific examples are applied herein to explain the principles and embodiments of the present application, and the description of the embodiments is only used to help understand the technical solutions and core ideas of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (7)
1. An OLED packaging apparatus, comprising:
a base;
the bearing platform is fixed on the base and used for bearing the packaging cover plate;
the driving assembly is fixed on the base;
a fixed member mounted on the drive assembly;
a coating member mounted on the fixing member for containing coating glue;
the ultraviolet light source is arranged on the fixed component and used for providing illumination for the coating component, the driving component comprises a first slide rail, a second slide rail and a sliding component, the first slide rail and the second slide rail are oppositely arranged on two sides of the bearing platform and are parallel to two sides of the bearing platform, the sliding component is arranged in the vertical direction of the first slide rail and the second slide rail, and in a first state, the fixed component moves towards a first direction along the sliding component under the driving of the driving component; when the first state is detected, the fixing member moves towards a first direction along the first slide rail under the driving of the driving assembly, and when the second state is detected, the fixing member moves towards a second direction along the second slide rail under the driving of the driving assembly;
the OLED packaging device further comprises a first detection assembly and a second detection assembly, wherein the first detection assembly is used for detecting whether the packaging cover plate is placed on the bearing platform or not, and when the packaging cover plate is detected, the ultraviolet light source is triggered to work; the second detection component is used for detecting the energy of the coating glue in the coating component, and when the energy is larger than a threshold value, the ultraviolet light source is triggered to stop working.
2. The OLED encapsulation device of claim 1, wherein the ultraviolet light source is disposed at least one of a top portion or a side portion of the coating member.
3. The OLED encapsulation device of claim 1, wherein the coating member material is a transparent material.
4. The OLED encapsulation device according to claim 1, further comprising an adjustment member for adjusting an irradiation parameter of the ultraviolet light source according to a parameter of coating glue in the coating member.
5. The OLED encapsulation device according to claim 1, further comprising a control member for controlling a coating amount of the coating member.
6. The OLED encapsulation device of claim 1, wherein the first detection component is a distance sensor or an optical sensor.
7. An OLED encapsulation method, characterized in that the OLED encapsulation device of any one of claims 1 to 6 is used for encapsulation, the OLED encapsulation method comprises:
placing the package cover plate on the bearing platform;
turning on the ultraviolet light source, and irradiating coating glue in the coating member;
coating the irradiated coating glue on the packaging cover plate;
and attaching the packaging cover plate and the substrate to be packaged, and curing the coating glue on the packaging cover plate to finish packaging.
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| CN202010288087.2A CN111477769B (en) | 2020-04-14 | 2020-04-14 | OLED packaging device and packaging method thereof |
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| CN110221484A (en) * | 2019-05-17 | 2019-09-10 | 深圳市华星光电半导体显示技术有限公司 | The preparation method and apparatus for coating of display panel |
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| JP2014225380A (en) * | 2013-05-16 | 2014-12-04 | 積水化学工業株式会社 | Sealant for organic electroluminescent display element and manufacturing method of organic electroluminescent display element |
| CN104096660A (en) * | 2014-07-16 | 2014-10-15 | 京东方科技集团股份有限公司 | Glue dispensing jig |
| CN107207836A (en) * | 2015-07-21 | 2017-09-26 | 古河电气工业株式会社 | Electronic component encapsulation curability hygroscopicity resin composition, resin cured matter and electronic device |
| CN110221484A (en) * | 2019-05-17 | 2019-09-10 | 深圳市华星光电半导体显示技术有限公司 | The preparation method and apparatus for coating of display panel |
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