CN111477570A - Processing apparatus of regeneration wafer processing - Google Patents
Processing apparatus of regeneration wafer processing Download PDFInfo
- Publication number
- CN111477570A CN111477570A CN202010320790.7A CN202010320790A CN111477570A CN 111477570 A CN111477570 A CN 111477570A CN 202010320790 A CN202010320790 A CN 202010320790A CN 111477570 A CN111477570 A CN 111477570A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02032—Preparing bulk and homogeneous wafers by reclaiming or re-processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
Abstract
The invention belongs to the technical field of regenerated wafers, and particularly relates to a processing device for processing regenerated wafers, aiming at the problem that removal operation in the process of processing the regenerated wafers pollutes surrounding equipment and has poor effect, the processing device comprises a base, wherein a movable guide rail is fixed at the top of the base, the top of the movable guide rail is connected with a placing seat, a spraying mechanism is arranged above the middle position of the base, a sucking disc material taking mechanism is arranged above the positions on two sides of the base, the movable guide rail is provided with two receiving grooves which are respectively positioned at two ends of the base, and the top of the placing seat is provided with a cylindrical structure. According to the invention, the wafer is subjected to the operation of removing the surface film, metal and dirt in the accommodating groove, so that the cleaning liquid is prevented from being splashed to the outside to cause pollution to other parts, the cleaning liquid is pumped back to the outside by using the suction pipe to be centralized, so that resource waste is avoided, and the cleaning liquid in the accommodating groove is circulated through the spray holes and the suction pipe, so that the washing effect is improved.
Description
Technical Field
The invention relates to the technical field of recycled wafers, in particular to a processing device for processing a recycled wafer.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and the wafer is called a wafer because the shape of the wafer is circular, various circuit element structures can be manufactured on the silicon wafer to form IC products with specific electrical functions, finished products which do not meet the specification can not be directly used in the wafer production and processing process, and a regenerated wafer is generated by removing films, metals and pollutants on the surface of the processed wafer.
Because the wafer is small in size, in the process of removing the regenerated wafer, if the wafer is directly put into cleaning solution to be cleaned, subsequent collection is difficult to perform and the wafer is easy to damage, in the prior art, aiming at the removal treatment of the regenerated wafer, a single wafer is generally sequentially conveyed to a conveying seat through a sucker material taking mechanism, the single wafer sequentially passes through a treatment station, the cleaning solution is sprayed to the surface of the wafer to remove films, metals and pollutants, but the cleaning solution is usually directly washed on the wafer on the plane, so that the cleaning solution flows around, the resources are wasted, other equipment is polluted, and the removal effect on the surface of the wafer is poor.
Disclosure of Invention
The invention provides a processing device for processing a recycled wafer, which is based on the technical problems that the removal operation in the processing process of the recycled wafer pollutes surrounding equipment and the effect is poor.
The invention provides a processing device for processing a regenerated wafer, which comprises a base, wherein a movable guide rail is fixed at the top of the base, the top of the movable guide rail is connected with a placing seat, a spraying mechanism is arranged above the middle position of the base, a sucking disc material taking mechanism is arranged above the positions on two sides of the base, the movable guide rail is provided with two ends which are respectively positioned on the base, the top of the placing seat is provided with a cylindrical accommodating groove, the bottom of the accommodating groove is provided with a penetrated sliding groove, the inner wall of the sliding groove is connected with a lifting seat in a sliding manner, the top of the lifting seat is provided with a sucking disc mechanism, the spraying mechanism is provided with a limiting seat which is connected with the inner wall of the accommodating groove in a sliding manner, the middle position of the top of the limiting seat is connected with a lifting mechanism, a liquid injection cavity is arranged in the limiting seat, the bottom of, a penetrating suction pipe is fixed on one side of the limiting seat, vertically-arranged air cylinders are fixed on two sides of the outer wall of the top of the base, and a supporting table is fixed in the middle of the outer wall of the top of the base.
Preferably, a plurality of groups of lugs are fixed on the top of the lifting seat, each group of lugs is arranged in an annular array distribution, and the annular inner diameters formed by the plurality of groups of lugs are sequentially increased.
Preferably, the inner wall and the outer wall of the lug are both arranged into an arc-shaped structure, and the width of the top end of the lug is smaller than that of the bottom end of the lug.
Preferably, the both sides of lift seat bottom all are fixed with the registration arm, and are fixed with the connecting plate that the level was placed between the bottom of two registration arms, and the both ends of connecting plate outer wall all are fixed with the stopper, and the both ends at base top all are fixed with spacing, the bottom of stopper and the top sliding connection of spacing, and the position that spacing top and brace table correspond is fixed with the electro-magnet, magnetic adsorption between electro-magnet and the stopper.
Preferably, the connecting seat is fixed on the top of the cylinder and the supporting table, the mounting groove is formed in the middle of the top of the connecting seat, the electromagnetic block is fixed on the inner wall of the mounting groove, and the electromagnetic block and the connecting plate are magnetically adsorbed.
Preferably, the gas pocket is seted up at the top of lug, and the intermediate position in the seat that goes up and down has seted up the circulation chamber, and the top and the gas pocket intercommunication in circulation chamber communicate between the top of circulation chamber lateral wall and the registration arm top, and the outer wall of registration arm is fixed with the solenoid valve, and the perforation has been seted up with the position that the registration arm corresponds in connecting plate bottom, and the wind hole that corresponds the position with the perforation is all seted up to the connecting seat both sides that are located a supporting bench top, and a supporting bench's inside is fixed with the fan, and the fan passes through tuber pipe and two.
Preferably, the wind hole sets up to round platform column structure, and the top internal diameter of wind hole is greater than its bottom internal diameter, and the top internal diameter of wind hole is greater than the fenestrate internal diameter in corresponding position.
Preferably, an extension pipe is slidably connected to the bottom of the inner wall of the suction pipe.
Preferably, the extension pipe is arranged in a net-shaped structure, an auxiliary plate is fixed at the bottom end of the extension pipe, a spring is connected between the top of the auxiliary plate and the bottom end of the suction pipe, the spring is sleeved outside the extension pipe in a sliding mode, and the auxiliary plate is arranged in a net-shaped structure.
Compared with the prior art, the invention provides a processing device for processing a recycled wafer, which has the following beneficial effects:
1. the processing device for processing the regenerated wafer is characterized in that a containing groove is arranged at the top of a placing seat connected on a movable guide rail, a lifting seat of a sucker mechanism is arranged at the bottom of the containing groove, when the wafer taking and placing operation is carried out through the external sucking disc material taking mechanism, the lifting seat is lifted to be flush with the placing seat by using the air cylinder, when the placing seat is moved to a processing station by using the movable guide rail, the lifting seat is lowered to the bottom of the containing groove, the limiting seat extends into the containing groove, the spraying holes and the suction pipes on the limiting seat are used for respectively washing and pumping back the cleaning liquid, so that the wafer can finish the operation of removing surface films, metals and dirt in the containing groove, the cleaning liquid is prevented from being splashed to the outside to cause pollution of other parts, the cleaning liquid is pumped back by the suction pipes for centralized treatment to avoid resource waste, and the cleaning liquid in the containing groove is circulated through the spraying holes and the suction pipes to improve the washing effect.
2. This processing apparatus of regeneration wafer processing, top through at the lift seat is provided with the multiunit lug, every group lug is annular array distribution, the annular internal diameter that the multiunit lug constitutes increases in proper order, and set interval distribution between the lug, and the cross-section of lug sets arc structure, thereby make and constitute the clearance that has the cleaning fluid that can circulate between wafer bottom and the lift seat, and reduce the contact surface of wafer and lift seat, with the in-process of circulation cleaning fluid in accomodating the inslot, wash the bottom of wafer simultaneously, and avoid needing to turn over again and carry out repeated removal operation, improve the effect of getting rid of to the wafer surface in the actual regeneration wafer course of working.
3. This processing apparatus of regeneration wafer processing, through be provided with the fan in a supporting bench, the fan passes through the wind hole, the registration arm, the gas pocket intercommunication at a plurality of penetrating holes and lug top, the wafer is located and accomodates the inslot and when the washing liquid circulates, usable fan convulsions and make and adsorb between lug and the wafer and remain stable, when the washing liquid is full of and accomodates the groove, can pause the washing liquid circulation and make the gas pocket circulation blow and breathe in, and guarantee the complete cleaning to the wafer surface, usable fan upwards bloies from the gas pocket and accelerates the drying of wafer after getting rid of the operation, thereby reinforcing means is actual to the effect of getting rid of on wafer surface.
4. This processing apparatus of regeneration wafer processing, there is the extension pipe through the bottom at the suction tube utilizing spring coupling, set the extension pipe to net section of thick bamboo structure, carry out the operation of taking back of washing liquid with the outer wall that utilizes the extension pipe, and utilize the contractility of spring and extension pipe, can guarantee that the extension pipe extends to the storage tank bottom and takes out the washing liquid completely, and avoid long-time use in-process, because the suction tube is not hard up to descend and cause its bottom direct with the storage tank bottom collision and cause the damage, in order to guarantee the long-time result of use of device.
Drawings
FIG. 1 is a schematic diagram of an overall structure of a processing apparatus for recycling wafer processing according to the present invention;
FIG. 2 is a schematic cross-sectional view of a processing apparatus for reclaiming wafer processing according to the present invention;
FIG. 3 is a schematic diagram of a lift seat structure of a processing apparatus for processing a recycled wafer according to the present invention;
fig. 4 is a schematic diagram of a suction pipe structure of a processing apparatus for recycling wafer processing according to the present invention.
In the figure: the device comprises a base 1, a moving guide rail 2, a placing seat 3, a lifting seat 4, a limiting block 5, a cylinder 6, a supporting table 7, a connecting seat 8, a limiting seat 9, spray holes 10, a suction pipe 11, a positioning pipe 12, a connecting plate 13, a limiting frame 14, an electromagnetic block 15, a convex block 16, an air hole 17, an air hole 18, an extending pipe 19, an auxiliary plate 20 and a spring 21.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1-4, a processing device for processing a recycled wafer, comprising a base 1, a movable guide rail 2 fixed on the top of the base 1, a placing seat 3 connected with the top of the movable guide rail 2, a spraying mechanism arranged above the middle position of the base 1, a sucking disc material taking mechanism arranged above the two side positions of the base 1, two ends of the base 1 respectively arranged on the movable guide rail 2, a cylindrical containing groove arranged on the top of the placing seat 3, a through sliding groove arranged on the bottom of the containing groove, a lifting seat 4 connected with the inner wall of the sliding groove in a sliding manner, a sucking disc mechanism arranged on the top of the lifting seat 4, a limiting seat 9 connected with the inner wall of the containing groove in a sliding manner, a lifting mechanism connected with the middle position of the top of the limiting seat 9, a liquid injection cavity arranged in the limiting seat 9, and a plurality of spray holes 10 arranged on the bottom, the top of annotating the liquid chamber is connected with the water injection pipe, one side of spacing seat 9 is fixed with penetrable suction tube 11, the both sides of 1 top outer wall of base all are fixed with vertical cylinder 6 of placing, and the intermediate position of 1 top outer wall of base is fixed with brace table 7, make the wafer accomplish the surperficial film in accomodating the inslot, the operation of getting rid of metal and filth, avoid the washing liquid to sputter the outside pollution that causes other parts, utilize suction tube 11 to take out the washing liquid centralized processing and avoid causing the wasting of resources, it circulates and improve the flushing effect to make through orifice 10 and suction tube 11 and accomodate inslot washing liquid circulation.
In the invention, a plurality of groups of lugs 16 are fixed at the top of a lifting seat 4, each group of lugs 16 is arranged in an annular array distribution, the annular inner diameter formed by the plurality of groups of lugs 16 is sequentially increased, so that a gap capable of circulating cleaning liquid is formed between the bottom of a wafer and the lifting seat 4, the bottom of the wafer is cleaned simultaneously in the process of circulating the cleaning liquid in a containing groove, repeated removing operation of re-turning is avoided, the removing effect on the surface of the wafer in the actual regeneration wafer processing process is improved, the inner wall and the outer wall of each lug 16 are both arranged in an arc structure, the width of the top end of each lug 16 is smaller than that of the bottom end of each lug, the contact surface between the wafer and the lifting seat 4 is reduced, and the removing effect on the surface;
the connecting seats 8 are fixed on the tops of the air cylinder 6 and the supporting table 7, the middle positions of the tops of the connecting seats 8 are provided with mounting grooves, electromagnetic blocks 15 are fixed on the inner walls of the mounting grooves, and the electromagnetic blocks 15 and the connecting plates 13 are magnetically adsorbed, so that the stability of connection between the air cylinder 6 and the lifting seat 4 is ensured;
the top of the bump 16 is provided with an air hole 18, the middle position in the lifting seat 4 is provided with a circulation cavity, the top of the circulation cavity is communicated with the air hole 18, the top of the side wall of the circulation cavity is communicated with the top of the positioning tube 12, the outer wall of the positioning tube 12 is fixed with an electromagnetic valve, the bottom of the connecting plate 13 is provided with a through hole at the position corresponding to the positioning tube 12, two sides of the connecting seat 8 at the top of the supporting seat 7 are provided with air holes 17 at the positions corresponding to the through holes, a fan is fixed in the supporting seat 7 and connected with the two air holes 17 through an air pipe, the fan can stabilize the wafer and the bump 16, the fan can be used for periodically floating and descending the wafer to enhance the removal operation of the surface of the wafer, the air circulation on the surface of the wafer clamped by the fan can be used for accelerating the drying after the removal operation is finished, the air holes 17 are arranged into, the inner diameter of the top end of the air hole 17 is larger than that of the through hole at the corresponding position, so that the through hole is aligned with the air hole 17;
the bottom of the inner wall of the suction pipe 11 is connected with an extension pipe 19 in a sliding manner, so that the damage of equipment caused by hard collision when the suction pipe 11 extends into the bottom of the accommodating groove is avoided, the extension pipe 19 is arranged into a net-shaped structure, an auxiliary plate 20 is fixed at the bottom end of the extension pipe 19, a spring 21 is connected between the top of the auxiliary plate 20 and the bottom end of the suction pipe 11, the spring 21 is sleeved outside the extension pipe 19 in a sliding manner, and the auxiliary plate 20 is arranged into a net-shaped structure.
When in use, the movable guide rail 2 is utilized to move the placing seat 3 in the horizontal direction, when the placing seat 3 corresponds to the cylinder 6 at one side, the cylinder 6 is utilized to jack the lifting seat 4 to be flush with the top of the placing seat 3, the wafer is placed on a lifting seat 4 through an external sucking disc material taking mechanism, the lifting seat 4 is lowered through an air cylinder 6, the electrification of an electromagnetic block 15 is cut off, the wafer is placed in a storage groove in the top of a placing seat 3 in a flat mode, the placing seat 3 is moved to the position right below a limiting seat 9 through a movable guide rail 2, the lifting seat 4 is guaranteed to be stable through the adsorption of an electromagnet on a limiting frame 14 and a limiting block 5, the limiting seat 9 is lowered into the storage groove through the lifting mechanism, cleaning liquid is sprayed to the surface of the wafer from a spray hole 10 through a liquid injection pipe to perform removal operation, the wafer is removed in the storage groove, and the pollution of other equipment caused by the scattered cleaning liquid is avoided;
the device enables a wafer to be placed on a convex block 16 at the top of a lifting seat 4, a gap for cleaning liquid to flow is formed between the bottom of the wafer and the lifting seat 4, so that the top and the bottom outer walls of the wafer are removed simultaneously, a fan is utilized to generate negative pressure in an air hole 18 at the top of the convex block 16 in the spraying process of a spraying hole 10 so as to ensure that the wafer is stable, the cleaning liquid is injected for a certain time and is suspended, the fan is enabled to perform blowing and exhausting operations periodically, the wafer floats and descends along with the airflow period of the air hole 18 so as to ensure that the surface of the wafer is completely contacted with the cleaning liquid, then the air hole 18 is utilized to keep the wafer stable, and a water injection pipe and a suction pipe 11 are utilized to circulate the cleaning liquid in a containing groove so as to further enhance the removal effect on films;
after the removal operation is completed, the limiting seat 9 is lifted by the aid of the lifting mechanism, air can be blown from the air holes 18 by the aid of the fan to accelerate the drying effect of the surface of the wafer, the movable guide rail 2 is used for moving the placing seat 3 to the position of the air cylinder 6 on the other side after a period of time, the lifting seat 4 is jacked up to be flush with the top of the placing seat 3 by the aid of the air cylinder 6, and therefore the wafer is taken out through the external sucking disc taking mechanism.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (9)
1. A processing device for processing regenerated wafers comprises a base (1), wherein a movable guide rail (2) is fixed at the top of the base (1), a placing seat (3) is connected at the top of the movable guide rail (2), a spraying mechanism is arranged above the middle position of the base (1), and sucking disc material taking mechanisms are arranged above the positions at two sides of the base (1), the processing device is characterized in that the movable guide rail (2) is provided with two ends which are respectively positioned at the base (1), the top of the placing seat (3) is provided with a cylindrical containing groove, the bottom of the containing groove is provided with a penetrated sliding groove, the inner wall of the sliding groove is slidably connected with a lifting seat (4), the top of the lifting seat (4) is provided with a sucking disc mechanism, the spraying mechanism is provided with a limiting seat (9) slidably connected with the inner wall of the containing groove, and the middle position at the top of the limiting seat (9) is connected with, set up in spacing seat (9) and annotate the liquid chamber, and annotate the bottom in liquid chamber and seted up a plurality of orifices (10), the top of annotating the liquid chamber is connected with the water injection pipe, one side of spacing seat (9) is fixed with penetrable suction tube (11), the both sides of base (1) top outer wall all are fixed with vertical cylinder (6) of placing, and the intermediate position of base (1) top outer wall is fixed with brace table (7).
2. The processing apparatus for recycling wafer processing according to claim 1, wherein a plurality of sets of bumps (16) are fixed on the top of the lifting base (4), and each set of bumps (16) is disposed in an annular array, and the inner diameters of the rings formed by the plurality of sets of bumps (16) are sequentially increased.
3. The handling device for reprocessed wafers of claim 2, wherein the inner and outer walls of the bumps (16) are configured in an arc configuration, and the top width of the bumps (16) is smaller than the bottom width thereof.
4. The processing apparatus for processing the recycled wafers as claimed in claim 2 or 3, wherein the two sides of the bottom of the lifting seat (4) are both fixed with positioning tubes (12), a horizontally placed connecting plate (13) is fixed between the bottom ends of the two positioning tubes (12), the two ends of the outer wall of the connecting plate (13) are both fixed with limit blocks (5), the two ends of the top of the base (1) are both fixed with limit frames (14), the bottom of each limit block (5) is slidably connected with the top of each limit frame (14), the positions of the top of each limit frame (14) corresponding to the support table (7) are fixed with electromagnets, and the electromagnets and the limit blocks (5) are magnetically adsorbed.
5. The processing device for processing the recycled wafers as claimed in claim 4, wherein the connecting seat (8) is fixed on the top of the cylinder (6) and the supporting platform (7), a mounting groove is formed in the middle of the top of the connecting seat (8), an electromagnetic block (15) is fixed on the inner wall of the mounting groove, and the electromagnetic block (15) is magnetically adsorbed with the connecting plate (13).
6. The processing device for processing the recycled wafers as claimed in claim 4, wherein the top of the bump (16) is provided with an air hole (18), a circulation cavity is formed in the middle position in the lifting seat (4), the top of the circulation cavity is communicated with the air hole (18), the top end of the side wall of the circulation cavity is communicated with the top end of the positioning tube (12), the outer wall of the positioning tube (12) is fixed with an electromagnetic valve, the bottom of the connecting plate (13) is provided with a through hole at a position corresponding to the positioning tube (12), two sides of the connecting seat (8) at the top of the supporting table (7) are provided with air holes (17) at positions corresponding to the through holes, a fan is fixed inside the supporting table (7), and the fan is connected with the two air holes (17) through an air pipe.
7. The processing device for the machining of the recycled wafers as claimed in claim 6, wherein the air holes (17) are arranged in a truncated cone-shaped structure, the inner diameter of the top ends of the air holes (17) is larger than that of the bottom ends of the air holes, and the inner diameter of the top ends of the air holes (17) is larger than that of the through holes at the corresponding positions.
8. The handling device for reconstituted wafer processing according to claim 1, characterized in that the bottom of the inner wall of said suction pipe (11) is slidingly connected with an extension pipe (19).
9. The processing apparatus for recycling wafer processing according to claim 8, wherein the extension pipe (19) is configured as a mesh-like cylindrical structure, an auxiliary plate (20) is fixed to the bottom end of the extension pipe (19), a spring (21) is connected between the top of the auxiliary plate (20) and the bottom end of the suction pipe (11), the spring (21) is slidably sleeved outside the extension pipe (19), and the auxiliary plate (20) is configured as a mesh-like structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010320790.7A CN111477570A (en) | 2020-04-22 | 2020-04-22 | Processing apparatus of regeneration wafer processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010320790.7A CN111477570A (en) | 2020-04-22 | 2020-04-22 | Processing apparatus of regeneration wafer processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111477570A true CN111477570A (en) | 2020-07-31 |
Family
ID=71755265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010320790.7A Withdrawn CN111477570A (en) | 2020-04-22 | 2020-04-22 | Processing apparatus of regeneration wafer processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111477570A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112792036A (en) * | 2020-12-31 | 2021-05-14 | 至微半导体(上海)有限公司 | System and method for recycling wafer cleaning solution in semiconductor wet process |
| CN113467199A (en) * | 2021-09-06 | 2021-10-01 | 宁波润华全芯微电子设备有限公司 | Device convenient to dismantle and capable of preventing wafer from being polluted by splashing liquid |
-
2020
- 2020-04-22 CN CN202010320790.7A patent/CN111477570A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112792036A (en) * | 2020-12-31 | 2021-05-14 | 至微半导体(上海)有限公司 | System and method for recycling wafer cleaning solution in semiconductor wet process |
| CN113467199A (en) * | 2021-09-06 | 2021-10-01 | 宁波润华全芯微电子设备有限公司 | Device convenient to dismantle and capable of preventing wafer from being polluted by splashing liquid |
| CN113467199B (en) * | 2021-09-06 | 2021-11-12 | 宁波润华全芯微电子设备有限公司 | Device convenient to dismantle and capable of preventing wafer from being polluted by splashing liquid |
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Application publication date: 20200731 |