CN111477560A - 太阳能电池用镓、硼掺杂单晶硅棒区分的快速检测方法 - Google Patents
太阳能电池用镓、硼掺杂单晶硅棒区分的快速检测方法 Download PDFInfo
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- CN111477560A CN111477560A CN202010405563.4A CN202010405563A CN111477560A CN 111477560 A CN111477560 A CN 111477560A CN 202010405563 A CN202010405563 A CN 202010405563A CN 111477560 A CN111477560 A CN 111477560A
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- 238000001514 detection method Methods 0.000 title claims abstract description 53
- 229910021421 monocrystalline silicon Inorganic materials 0.000 title claims abstract description 30
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 22
- 239000010703 silicon Substances 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 15
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 8
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 8
- 229910052796 boron Inorganic materials 0.000 claims description 8
- 229910052733 gallium Inorganic materials 0.000 claims description 8
- 230000004069 differentiation Effects 0.000 claims description 3
- 239000013078 crystal Substances 0.000 abstract description 28
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 5
- 230000007306 turnover Effects 0.000 abstract description 3
- 230000008859 change Effects 0.000 description 6
- 238000004088 simulation Methods 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
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CN202010405563.4A CN111477560B (zh) | 2020-05-14 | 2020-05-14 | 太阳能电池用镓、硼掺杂单晶硅棒区分的快速检测方法 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112986685A (zh) * | 2021-02-09 | 2021-06-18 | 西安奕斯伟硅片技术有限公司 | 单晶硅棒电阻率的测量方法及装置 |
Citations (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59177973A (ja) * | 1983-03-29 | 1984-10-08 | Toshiba Corp | 非晶質シリコン光起電力装置の評価法 |
EP0350305A2 (en) * | 1988-07-07 | 1990-01-10 | Nkk Corporation | Method and apparatus for manufacturing silicon single crystals |
WO2000073542A1 (fr) * | 1999-05-28 | 2000-12-07 | Shin-Etsu Handotai Co., Ltd. | Monocristal de czochralski dope au ga et son procede de fabrication |
WO2002017362A2 (en) * | 2000-08-22 | 2002-02-28 | President And Fellows Of Harvard College | Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices |
JP2002104897A (ja) * | 2000-09-26 | 2002-04-10 | Shin Etsu Handotai Co Ltd | シリコン結晶及びシリコン結晶ウエーハ並びにその製造方法 |
JP2002128591A (ja) * | 2000-10-24 | 2002-05-09 | Shin Etsu Handotai Co Ltd | シリコン結晶及びシリコン結晶ウエーハ並びにその製造方法 |
JP2002226295A (ja) * | 2001-01-31 | 2002-08-14 | Shin Etsu Handotai Co Ltd | チョクラルスキー法によるシリコン単結晶製造工程の管理方法及びチョクラルスキー法による高抵抗シリコン単結晶の製造方法並びにシリコン単結晶 |
JP2006269962A (ja) * | 2005-03-25 | 2006-10-05 | Shin Etsu Handotai Co Ltd | 半導体ウエーハのドーパント汚染の評価方法 |
CN101399297A (zh) * | 2008-10-24 | 2009-04-01 | 无锡尚德太阳能电力有限公司 | 一种掺镓单晶硅太阳电池及其制造方法 |
JP2009215135A (ja) * | 2008-03-12 | 2009-09-24 | Sharp Corp | シリコン単結晶インゴットの製造方法 |
CN101792933A (zh) * | 2010-03-10 | 2010-08-04 | 嘉兴明通光能科技有限公司 | 太阳能级硅单晶混合掺杂配料方法 |
CN102081063A (zh) * | 2009-12-01 | 2011-06-01 | 王正园 | 掺硼磷cz硅棒及配料中硼、磷快速分析法 |
US20120056135A1 (en) * | 2010-09-03 | 2012-03-08 | Deluca John P | Silicon Single Crystal Doped with Gallium, Indium, or Aluminum |
JP2013175666A (ja) * | 2012-02-27 | 2013-09-05 | Tohoku Univ | Si結晶の結晶品質評価方法及び結晶品質評価装置 |
JP2014162699A (ja) * | 2013-02-27 | 2014-09-08 | Kyocera Corp | シリコンインゴットの製造方法 |
JP2014168042A (ja) * | 2013-01-31 | 2014-09-11 | Niigata Univ | シリコンウェーハ表層中の原子空孔評価方法及び装置 |
CN107541772A (zh) * | 2017-07-17 | 2018-01-05 | 晶科能源有限公司 | 一种掺镓单晶棒的制备方法 |
US20180237937A1 (en) * | 2015-08-12 | 2018-08-23 | Sk Siltron Co., Ltd. | Method for growing single crystal |
CN109056055A (zh) * | 2018-09-28 | 2018-12-21 | 包头美科硅能源有限公司 | 一种单晶硅棒的生产方法 |
JP2019108248A (ja) * | 2017-12-19 | 2019-07-04 | 株式会社Sumco | シリコン単結晶の製造方法 |
CN110349875A (zh) * | 2018-04-03 | 2019-10-18 | 江苏微导纳米装备科技有限公司 | 一种测量晶圆表面电荷密度变化的方法 |
JP2020007163A (ja) * | 2018-07-02 | 2020-01-16 | 信越半導体株式会社 | 原料結晶の抵抗率の測定方法及びfzシリコン単結晶の製造方法 |
CN111037766A (zh) * | 2019-12-19 | 2020-04-21 | 江苏高照新能源发展有限公司 | 一种用于光伏电池的低成本单晶硅片的制作方法 |
US20200141024A1 (en) * | 2017-04-25 | 2020-05-07 | Sumco Corporation | N-type silicon single crystal production method, n-type silicon single crystal ingot, silicon wafer, and epitaxial silicon wafer |
-
2020
- 2020-05-14 CN CN202010405563.4A patent/CN111477560B/zh active Active
Patent Citations (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59177973A (ja) * | 1983-03-29 | 1984-10-08 | Toshiba Corp | 非晶質シリコン光起電力装置の評価法 |
EP0350305A2 (en) * | 1988-07-07 | 1990-01-10 | Nkk Corporation | Method and apparatus for manufacturing silicon single crystals |
WO2000073542A1 (fr) * | 1999-05-28 | 2000-12-07 | Shin-Etsu Handotai Co., Ltd. | Monocristal de czochralski dope au ga et son procede de fabrication |
WO2002017362A2 (en) * | 2000-08-22 | 2002-02-28 | President And Fellows Of Harvard College | Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices |
JP2002104897A (ja) * | 2000-09-26 | 2002-04-10 | Shin Etsu Handotai Co Ltd | シリコン結晶及びシリコン結晶ウエーハ並びにその製造方法 |
JP2002128591A (ja) * | 2000-10-24 | 2002-05-09 | Shin Etsu Handotai Co Ltd | シリコン結晶及びシリコン結晶ウエーハ並びにその製造方法 |
JP2002226295A (ja) * | 2001-01-31 | 2002-08-14 | Shin Etsu Handotai Co Ltd | チョクラルスキー法によるシリコン単結晶製造工程の管理方法及びチョクラルスキー法による高抵抗シリコン単結晶の製造方法並びにシリコン単結晶 |
JP2006269962A (ja) * | 2005-03-25 | 2006-10-05 | Shin Etsu Handotai Co Ltd | 半導体ウエーハのドーパント汚染の評価方法 |
JP2009215135A (ja) * | 2008-03-12 | 2009-09-24 | Sharp Corp | シリコン単結晶インゴットの製造方法 |
CN101399297A (zh) * | 2008-10-24 | 2009-04-01 | 无锡尚德太阳能电力有限公司 | 一种掺镓单晶硅太阳电池及其制造方法 |
CN102081063A (zh) * | 2009-12-01 | 2011-06-01 | 王正园 | 掺硼磷cz硅棒及配料中硼、磷快速分析法 |
CN101792933A (zh) * | 2010-03-10 | 2010-08-04 | 嘉兴明通光能科技有限公司 | 太阳能级硅单晶混合掺杂配料方法 |
US20120056135A1 (en) * | 2010-09-03 | 2012-03-08 | Deluca John P | Silicon Single Crystal Doped with Gallium, Indium, or Aluminum |
JP2013175666A (ja) * | 2012-02-27 | 2013-09-05 | Tohoku Univ | Si結晶の結晶品質評価方法及び結晶品質評価装置 |
JP2014168042A (ja) * | 2013-01-31 | 2014-09-11 | Niigata Univ | シリコンウェーハ表層中の原子空孔評価方法及び装置 |
JP2014162699A (ja) * | 2013-02-27 | 2014-09-08 | Kyocera Corp | シリコンインゴットの製造方法 |
US20180237937A1 (en) * | 2015-08-12 | 2018-08-23 | Sk Siltron Co., Ltd. | Method for growing single crystal |
US20200141024A1 (en) * | 2017-04-25 | 2020-05-07 | Sumco Corporation | N-type silicon single crystal production method, n-type silicon single crystal ingot, silicon wafer, and epitaxial silicon wafer |
CN107541772A (zh) * | 2017-07-17 | 2018-01-05 | 晶科能源有限公司 | 一种掺镓单晶棒的制备方法 |
JP2019108248A (ja) * | 2017-12-19 | 2019-07-04 | 株式会社Sumco | シリコン単結晶の製造方法 |
CN110349875A (zh) * | 2018-04-03 | 2019-10-18 | 江苏微导纳米装备科技有限公司 | 一种测量晶圆表面电荷密度变化的方法 |
JP2020007163A (ja) * | 2018-07-02 | 2020-01-16 | 信越半導体株式会社 | 原料結晶の抵抗率の測定方法及びfzシリコン単結晶の製造方法 |
CN109056055A (zh) * | 2018-09-28 | 2018-12-21 | 包头美科硅能源有限公司 | 一种单晶硅棒的生产方法 |
CN111037766A (zh) * | 2019-12-19 | 2020-04-21 | 江苏高照新能源发展有限公司 | 一种用于光伏电池的低成本单晶硅片的制作方法 |
Non-Patent Citations (2)
Title |
---|
李养贤等: "快中子辐照直拉硅中受主和施主的研究", 《物理学报》 * |
王学孟,叶子锐,沈 辉,梁璟强,尹浩平: "《晶体硅太阳电池缺陷检测与分类评价体系》", 《激光与光电子学进展》 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112986685A (zh) * | 2021-02-09 | 2021-06-18 | 西安奕斯伟硅片技术有限公司 | 单晶硅棒电阻率的测量方法及装置 |
CN112986685B (zh) * | 2021-02-09 | 2023-11-10 | 西安奕斯伟材料科技股份有限公司 | 单晶硅棒电阻率的测量方法及装置 |
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