CN111472050A

CN111472050A - Special etching equipment for quartz wafer production and use method thereof

Info

Publication number: CN111472050A
Application number: CN202010277329.8A
Authority: CN
Inventors: 陈鸣明
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-04-10
Filing date: 2020-04-10
Publication date: 2020-07-31
Anticipated expiration: 2040-04-10
Also published as: CN111472050B

Abstract

The invention relates to the field of quartz wafer production equipment, in particular to special etching equipment for quartz wafer production and a using method thereof. According to the special etching equipment for producing the quartz wafers and the using method thereof, the conveying belt is driven by the driving mechanism to convey the quartz wafers at a constant speed, so that the etching time is easy to control, the etching solution is automatically injected, the output quantity of the etching solution is uniform and controllable, waste liquid is recovered while the etched quartz wafers are cleaned, and the cleaning effect and the waste liquid recovery efficiency are improved.

Description

Special etching equipment for quartz wafer production and use method thereof

Technical Field

The invention relates to the field of quartz wafer production equipment, in particular to special etching equipment for quartz wafer production and a using method thereof.

Background

When a quartz wafer is subjected to wet etching process treatment, the quartz wafer is firstly placed in an etching solution, and then the quartz wafer is placed in a cleaning solution for cleaning after a period of time, so that on one hand, the labor intensity of workers is increased in the transfer process of the quartz wafer, on the other hand, the etching depth is often difficult to control due to the fact that the contact time of the etching solution and the quartz wafer is difficult to control, and after etching is finished, when the quartz wafer is cleaned by the cleaning solution, the mixed waste liquid is difficult to recycle, so that the recycling difficulty of the cleaning solution and the etching solution is increased.

Disclosure of Invention

The invention aims to provide etching equipment special for quartz wafer production and a using method thereof, so as to solve the problems in the background technology.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a special sculpture equipment of quartz wafer production, including the grudging post, be provided with actuating mechanism and conveyer belt on the grudging post, and actuating mechanism is located the conveyer belt top, actuating mechanism's both sides all are provided with link assembly, and the link assembly on right side connects sculpture solution output mechanism, washing liquid output mechanism is connected to left link assembly, and washing liquid output mechanism is connected with waste liquid recovery mechanism, the conveyer belt is connected with actuating mechanism through sprocket assembly, and the equidistance is fixed with a plurality of solution ponds on the conveyer belt, and the solution pond all can be located sculpture solution output mechanism, washing liquid output mechanism under.

Preferably, the driving mechanism comprises a frame and a gear rotationally connected to the vertical frame through a fixed shaft, the gear is connected with the driving motor and is in transmission connection with the conveying belt through a chain wheel assembly, the gear is located on the inner side of the frame, first teeth arranged in the horizontal direction are fixed on the upper side edge and the lower side edge of the inner side of the frame, second teeth are arranged on the gear, the length of the second teeth is not larger than one half of the circumference of the gear, and the second teeth can be meshed with the first teeth.

Preferably, the connecting rod assembly comprises a first guide sleeve and a second guide sleeve which are fixed on the stand, a first horizontal connecting rod is inserted in the first guide sleeve and can slide in the first guide sleeve, a third horizontal connecting rod is inserted in the second guide sleeve and can slide in the second guide sleeve, the upper end of the third connecting rod is hinged with the corresponding first connecting rod through the second connecting rod, and the first connecting rod and the third connecting rod are perpendicular to each other.

Preferably, the first guide sleeves and the second guide sleeves in the two groups of connecting rod assemblies are symmetrically arranged on the left side and the right side of the gear, and one ends, opposite to the first connecting rods, of the two groups of connecting rod assemblies are fixedly connected with one sides, corresponding to the frame, of the two groups of connecting rod assemblies respectively.

Preferably, the etching solution output mechanism comprises a first valve cylinder and a limiting block, the first valve cylinder is fixed to the lower end of a connecting rod on the right side, the limiting block is fixed to the vertical frame, the lower end of the first valve cylinder is open, a first valve column is connected to the inside of the first valve cylinder in a sliding mode, the upper end of the first valve column is connected with the upper wall of the inside of the first valve cylinder through a first spring, a sliding groove is formed in the upper portion of the side wall of the first valve cylinder, the moving direction of the sliding groove is parallel to the moving direction of the axis of the first valve cylinder, a pressing rod is fixed to the first valve column and.

Preferably, the etching solution output mechanism further comprises an etching solution tank fixed on the vertical frame, a first through hole is formed in the lower portion of the side wall of the first valve cylinder, the first valve column can seal the first through hole, the first through hole is communicated with the bottom of the etching solution tank through a first water delivery pipe, and the position of the etching solution tank is higher than that of the first valve cylinder.

Preferably, the cleaning liquid output mechanism comprises a hanging plate fixed at the lower end of the left connecting rod III, a vertical downward column barrel and a valve barrel II are fixed on the lower surface of the hanging plate, the lower ends of the column barrel and the valve barrel II are both in an open shape, the valve barrel II is connected with the valve barrel II in a sliding mode, the lower end of the valve barrel II is exposed to the outside of the lower end of the valve barrel II, the upper end of the valve barrel II is connected with the upper wall of the valve barrel II through a spring II, a through hole II is formed in the middle of the side wall of the valve barrel II, and the through hole II is communicated with the column barrel through a connecting.

Preferably, the cleaning liquid output mechanism further comprises a cleaning liquid box fixed on the stand, the cleaning liquid box is higher than the valve cylinder II, a third through hole is formed in the middle of the side wall of the valve cylinder II, the valve column II can seal the second through hole and the third through hole, the third through hole is communicated with the bottom of the cleaning liquid box through a second water delivery pipe, and a first channel is arranged in the middle of the valve column II and can enable the first through hole to be communicated with the second through hole.

Preferably, the waste liquid recovery mechanism comprises a waste liquid tank, a water pump fixed on the vertical frame and a press switch fixed on the upper portion of the inner wall of the valve cylinder II, the press switch is electrically connected with the water pump, the valve column II can be in buckling contact with the press switch, a through hole IV is formed in the lower portion of the side wall of the valve cylinder II, the valve column II can seal the through hole IV, the water pump is respectively communicated with the through hole IV and the waste liquid tank through a water suction pipe, a channel II is formed in the lower end of the valve column II, the upper end of the channel II can be communicated with the through hole IV, a U-shaped notch is formed in the side wall of the lower port of the channel II, and.

The invention also provides a using method of the special etching equipment for quartz wafer production, which comprises the following steps:

the method comprises the following steps: the driving mechanism drives the conveying belt to convey the quartz wafers at a constant speed, and drives the etching solution output mechanism and the cleaning solution output mechanism to move intermittently up and down through the connecting rod assemblies on two sides;

step two: outputting etching solution to the interior of the solution pool below the etching solution output mechanism through the etching solution output mechanism;

step three: and (4) outputting the cleaning liquid to the interior of the solution pool below the cleaning liquid output mechanism through the cleaning liquid output mechanism, and simultaneously recovering the cleaned waste liquid by using the waste liquid recovery mechanism.

Compared with the prior art, the invention has the beneficial effects that:

according to the invention, the driving mechanism drives the conveying belt to convey the quartz wafer at a constant speed, so that the etching time is easy to control, the etching quality of the quartz wafer is improved, the etching solution is output to the quartz wafer at intervals through the connecting rod assemblies on two sides, the etching solution is automatically injected, manual operation is not needed, time and labor are saved, the output quantity of the etching solution is uniform and controllable, automatic plugging is realized, then the etched quartz wafer is cleaned, waste liquid is recovered while the etched quartz wafer is cleaned, and the cleaning effect and the waste liquid recovery efficiency are improved.

Drawings

FIG. 1 is a first schematic view of the cross-sectional structure of the final assembly of the present invention;

FIG. 2 is a schematic view of the cross-sectional structure of the final assembly of the present invention;

FIG. 3 is a schematic view of a driving portion according to the present invention;

FIG. 4 is a schematic structural diagram of an etching solution output mechanism in the present invention;

FIG. 5 is a schematic structural view of a cleaning liquid output mechanism according to the present invention;

fig. 6 is a schematic view of a two-axis sectional structure of the valve cylinder according to the present invention.

In the figure: 1-erecting a frame; 2-a connecting rod assembly; 3-etching solution output mechanism; 4-cleaning liquid output mechanism; 5-a conveyer belt; 6-a solution pool; 7-cleaning liquid tank; 8-a water pump; 9-a suction pipe; 10-waste liquid tank; 11-a frame; 111-tooth one; 12-a gear; 121-tooth two; 13-a sprocket assembly; 14-connecting rod one; 15-a first guide sleeve; 16-link two; 17-link three; 18-a second guide sleeve; 19-a second water conveying pipe; 20-etching a solution tank; 21-a water delivery pipe I; 22-a limiting block; 23-valve cylinder one; 24-spool one; 25-a chute; 26-a pressure bar; 27-a first spring; 28-through hole one; 29-a hanger plate; 30-column casing; 31-valve cylinder two; 32-connecting tube; 33-valve column two; 34-spring two; 35-a push switch; 36-channel one; 37-channel two; 38-notch; 39-through hole two; 40-through hole III; 41-four through holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by workers skilled in the art without any inventive work based on the embodiments of the present invention, are within the scope of the present invention.

Referring to fig. 1-6, the present invention provides a technical solution: the utility model provides a special sculpture equipment of quartz wafer production, including grudging post 1, be provided with actuating mechanism and conveyer belt 5 on the grudging post 1, and actuating mechanism is located conveyer belt 5 top, actuating mechanism's both sides all are provided with link assembly 2, and link assembly 2 on right side connects sculpture solution output mechanism 3, washing liquid output mechanism 4 is connected to left link assembly 2, wherein the link assembly 2 structure of the actuating mechanism left and right sides is the same, and washing liquid output mechanism 4 is connected with waste liquid recovery mechanism, conveyer belt 5 is connected with actuating mechanism through sprocket assembly 13, and the equidistant a plurality of solution ponds 6 that are fixed with on conveyer belt 5, and solution pond 6 all can be located sculpture solution output mechanism 3, washing liquid output mechanism 4 is under.

In this embodiment, the driving mechanism includes a frame 11 and a gear 12 rotationally connected to the stand 1, the gear 12 is connected to the driving motor, and the gear 12 is in transmission connection with the conveyor belt 5 through a sprocket assembly 13, that is, the gear 12 can drive the conveyor belt 5 to run through the sprocket assembly 13, the sprocket assembly 13 is composed of two sprockets and a chain, one of the sprockets and the gear 12 is coaxially fixed to an output shaft of the driving motor, the gear 12 is located inside the frame 11, and the upper and lower sides of the inside of the frame 11 are respectively fixed with a first tooth 111 arranged in the horizontal direction, the gear 12 is provided with a second tooth 121, the length of the second tooth 121 is not greater than one half of the circumference of the gear 12, and the second tooth 121 can be engaged with the first two teeth 111.

In this embodiment, the connecting rod assembly 2 includes a first guide sleeve 15 and a second guide sleeve 18 fixed on the stand 1, a first horizontally-disposed connecting rod 14 is inserted in the first guide sleeve 15, the first connecting rod 14 is slidable in the first guide sleeve 15, a third horizontally-disposed connecting rod 17 is inserted in the second guide sleeve 18, the third connecting rod 17 is slidable in the second guide sleeve 18, the upper end of the third connecting rod 17 is hinged to the corresponding first connecting rod 14 through the second connecting rod 16, and the first connecting rod 14 and the third connecting rod 17 are perpendicular to each other.

In this embodiment, the first guide sleeves 15 and the second guide sleeves 18 of the two groups of link assemblies 2 are symmetrically arranged on the left and right sides of the gear 12, and opposite ends of the two first links 14 are respectively and fixedly connected to one side corresponding to the frame 11.

In this embodiment, etching solution output mechanism 3 is including fixing valve section of thick bamboo 23 of three 17 lower extremes of connecting rod on the right side and fixing stopper 22 on grudging post 1, valve section of thick bamboo 23 lower extreme opening, and valve section of thick bamboo 23 inside sliding connection has valve column 24, be connected through spring 27 between the inside upper wall of valve column 24 upper end and valve section of thick bamboo 23, spout 25 has been seted up on the lateral wall upper portion of valve section of thick bamboo 23, and the trend of spout 25 is parallel with the axis trend of valve section of thick bamboo 23, be fixed with depression bar 26 on the valve column 24, and depression bar 26 is located the top of stopper 22, and can support the knot with stopper 22 and contact.

In this embodiment, the etching solution output mechanism 3 further includes an etching solution tank 20 fixed on the vertical frame 1, a first through hole 28 is formed in the lower portion of the side wall of the first valve cylinder 23, the first valve column 24 can block the first through hole 28, the first through hole 28 is communicated with the bottom of the etching solution tank 20 through a first water delivery pipe 21, and the etching solution tank 20 is higher than the first valve cylinder 23.

In this embodiment, the cleaning liquid output mechanism 4 includes a hanging plate 29 fixed to the lower end of the left link rod three 17, a vertically downward column tube 30 and a valve tube two 31 are fixed to the lower surface of the hanging plate 29, the lower ends of the column tube 30 and the valve tube two 31 are both in an open shape, a valve tube two 33 is slidably connected to the inside of the valve tube two 31, the lower end of the valve tube two 33 is exposed to the outside of the lower end of the valve tube two 31, the upper end of the valve tube two 33 is connected to the inner upper wall of the valve tube two 31 through a spring two 34, a through hole two 39 is formed in the middle of the side wall of the valve tube two 31, and the through hole two 39 is communicated with the column tube 30.

In this embodiment, the cleaning liquid output mechanism 4 further includes a cleaning liquid tank 7 fixed on the vertical frame 1, the height of the cleaning liquid tank 7 is higher than the height of the second valve cylinder 31, the middle portion of the sidewall of the second valve cylinder 31 is provided with a third through hole 40, the second valve column 33 can seal the second through hole 39 and the third through hole 40, the third through hole 40 is communicated with the bottom of the cleaning liquid tank 7 through the second water pipe 19, the middle portion of the second valve column 33 is provided with a first channel 36, and the first channel 36 can enable the first through hole 39 to be communicated with the second through hole 40.

In this embodiment, the waste liquid recovery mechanism comprises a waste liquid tank 10, a water pump 8 fixed on the vertical frame 1, and a press switch 35 fixed on the upper part of the inner wall of the second valve cylinder 31, the press switch 35 is electrically connected with the water pump 8, the second valve post 33 can be in abutting contact with the press switch 35, the lower part of the side wall of the second valve cylinder 31 is provided with a fourth through hole 41, the second valve post 33 can seal the fourth through hole 41, the water pump 8 is respectively communicated with the fourth through hole 41 and the waste liquid tank 10 through the water suction pipe 9, the lower end of the second valve post 33 is provided with a second channel 37, the upper end of the second channel 37 can be communicated with the fourth through hole 41, the side wall of the lower port of the second channel 37 is provided with a U-shaped gap 38, and the opening of the notch 38 is downward, and the water delivery pipe I21, the water delivery pipe II 19 and the water suction pipe 9 are all flexible hoses, so that the water delivery pipe I21, the water delivery pipe II 19 and the water suction pipe 9 are prevented from being dragged and damaged due to the upper part and the lower part of the valve cylinder I23 and the valve cylinder II 31.

In addition, the application also provides a using method matched with the equipment, and the using method and the advantages of the invention are as follows: when the special etching equipment for quartz wafer production is used for etching quartz wafers, the working process comprises the following steps:

the method comprises the following steps: starting a driving motor, the driving motor drives a conveying belt 5 to run through a chain wheel component 13, the conveying belt 5 runs anticlockwise in the embodiment, namely, a solution pool 6 on the upper portion of the conveying belt 5 runs from right to left, a quartz wafer to be etched is placed in the solution pool 6 at the right end of the upper portion of the conveying belt 5, the solution pool 6 on the upper portion of the conveying belt 5 moves from right to left along with the conveying belt 5, the driving motor drives a gear 12 to rotate while the conveying belt 5 runs, the gear 12 rotates anticlockwise in the embodiment, when a second tooth 121 on the gear 12 is meshed with a first rack 111 on the lower portion of the inner side of a frame 11, the gear 12 drives the frame 11 to move rightwards, the right movement of the frame 11 synchronously drives two first connecting rods 14 to move rightwards, the first connecting rod 14 on the right side of the frame 11 pushes a third connecting rod 17 on the right side to move downwards through the corresponding second connecting rod 16, and therefore, the Outputting etching solution inside the solution pool 6, and utilizing a hydrofluoric acid example in the etching solution to generate chemical reaction with quartz composition silicon oxide, thereby realizing the etching of the quartz wafer and obtaining the quartz wafer meeting the requirements;

when the left connecting rod I14 moves to the right, the corresponding connecting rod II 16 pulls the left connecting rod III 17 to move upwards, so that the left connecting rod III 17 drives the cleaning liquid output mechanism 4 to move upwards, the cleaning liquid output to the interior of the solution pool 6 positioned below the cleaning liquid output mechanism 4 is stopped, the etched quartz wafer is cleaned, and meanwhile, the waste liquid recovery mechanism finishes the recovery of waste liquid in the corresponding solution pool 6;

when the second teeth 121 on the gear 12 are meshed with the first racks 111 on the upper inner side of the frame 11, the gear 12 drives the frame 11 to move leftwards, the left movement of the frame 11 synchronously drives the first two connecting rods 14 to move leftwards, and the first connecting rod 14 on the right side of the frame 11 moves leftwards, and pulls the third connecting rod 17 on the right side to move upwards through the corresponding second connecting rod 16, so that the etching solution output mechanism 3 is driven to move upwards through the third connecting rod 17 on the right side and stops outputting the etching solution to the interior of the solution pool 6 below the etching solution output mechanism 3, and excessive output of the etching solution is avoided, and the quartz wafer is prevented from being excessively etched;

when the left connecting rod I14 moves left, the corresponding connecting rod II 16 pushes the left connecting rod III 17 to move downwards, so that the left connecting rod III 17 drives the cleaning liquid output mechanism 4 to move downwards, cleaning liquid begins to be output to the inside of the solution pool 6 positioned below the cleaning liquid output mechanism 4, etched quartz wafers are cleaned, meanwhile, the waste liquid recovery mechanism begins to recover waste liquid cleaned in the corresponding solution pool 6, cleaning and waste liquid recovery are carried out simultaneously, the difficulty in waste liquid recovery is reduced, the quartz wafers are convenient to clean, and due to the fact that the conveying belt 5 runs at a constant speed, the time from the position right below the etching solution output mechanism 3 to the position right below the cleaning liquid output mechanism 4 is uniform, control is easy, and the etching quality of the quartz wafers is improved;

step two: the valve cylinder I23 is driven by the connecting rod III 17 on the right to move downwards, the valve column I24 and the pressure rod 26 on the valve column I24 are synchronously driven to move downwards, when the pressure rod 26 is contacted with the limiting block 22, the downward movement is stopped, namely the valve column I24 and the pressure rod 26 stop moving downwards, the valve column I24 moves upwards relatively in the valve cylinder I23 along with the continuous downward movement of the valve cylinder I23, the spring I27 is compressed, the spring I27 obtains a restoring force, meanwhile, the valve column I24 moves upwards relative to the valve cylinder I23 and is staggered with the through hole I28, the blockage of the through hole I28 is removed, the through hole I28 is opened, so that the etching solution in the etching solution box 20 enters the valve cylinder I23 through the water pipe I21 and the through hole I28 and is injected into the solution pool 6 which is just below the valve cylinder I23 at the moment, the etching treatment is carried out on the quartz wafer in the solution pool 6, and the automatic injection of the etching solution is, manual operation is not needed, and time and labor are saved;

the connecting rod III 17 on the right side drives the valve cylinder I23 to move upwards, meanwhile, the valve cylinder I24 and the pressure rod 26 on the valve cylinder I24 are synchronously driven to move upwards, the valve cylinder I23 moves upwards to enable the valve cylinder I24 to move downwards relative to the valve cylinder I23, the spring 27 is extended and reset, and the valve cylinder I24 moves downwards relative to the valve cylinder I23, meanwhile, the through hole I28 is plugged, so that the etching solution in the etching solution tank 20 stops outputting, the output quantity of the etching solution in each solution pool 6 is uniform and controllable, automatic plugging is realized, manual operation is not needed, and time and labor are saved;

step three: when the connecting rod III 17 on the right side drives the valve cylinder I23 to move upwards, the connecting rod III 17 on the left side drives the hanging plate 29 and the valve cylinder II 31 and the column cylinder 30 on the lower surface of the hanging plate 29 to synchronously move downwards, the valve cylinder II 31 moves downwards and synchronously drives the valve cylinder II 33 to move downwards, when the valve cylinder II 33 is contacted with the bottom of the solution pool 6 just below the valve cylinder II 31 at the moment, along with the continuous downward movement of the valve cylinder II 31, the valve cylinder II 33 moves upwards relative to the valve cylinder II 31 and compresses the spring II 34, so that the spring II 34 obtains a restoring force, the channel I36 on the valve cylinder II 33 moves upwards relative to the valve cylinder I31 and is communicated with the through hole II 39 and the through hole III 40, so that the cleaning solution in the cleaning solution tank 7 sequentially passes through the water pipe II 9, the through hole III 40, the channel I36, the through hole II 39 and the connecting pipe 32 to enter the column cylinder 30, and is injected into the corresponding solution pool 6 to clean the etched quartz, when the second through hole 39 is communicated with the third through hole 40, the second valve post 33 is in abutting contact with the press switch 35, so that the water pump 8 is electrified to work, meanwhile, the second channel 37 is communicated with the fourth through hole 41, the water pump 8 conveys the waste liquid in the solution pool 6 from the lower end of the second channel 37 to the second channel 37 and the fourth through hole 41, and the waste liquid is conveyed into the waste liquid tank 10 through the water suction pipe 9, the waste liquid after flushing is recycled, a notch at the lower port of the second channel 37 is convenient for sucking the waste liquid at the bottom of the solution pool 6 into the waste liquid tank 10, the waste liquid recycling efficiency is improved, automatic injection of cleaning liquid is realized, manual operation is not needed, time and labor are saved, the waste liquid is recycled while the etched quartz wafer is flushed, and the cleaning effect and the waste liquid recycling efficiency are improved;

when the link three 17 on the right side drives the valve cylinder I23 to move downwards, the link three 17 on the left side drives the hanging plate 29 and the valve cylinder II 31 and the column cylinder 30 on the lower surface of the hanging plate 29 to move upwards synchronously, when the valve cylinder II 31 moves upwards, the valve cylinder II 33 moves downwards relative to the valve cylinder II 31, the pressure on the spring II 34 is gradually reduced, the spring II 34 is extended and reset, when the valve cylinder II 33 moves downwards relative to the valve cylinder II 31, the channel I36 moves downwards relative to the valve cylinder I31 and is staggered with the through hole II 39 and the through hole III 40, so that the valve cylinder II 33 can carry out through hole II 39 and the through hole III 40, cleaning liquid in the cleaning liquid tank 7 can not enter the column cylinder 30, the washing on the quartz wafer in the corresponding solution tank 6 is stopped, and when the through hole II 39 and the through hole III 40 are blocked, the valve cylinder II 33 is far away from the press switch 35, so that the power is cut off by the water pump 8, and simultaneously the channel II 37, namely, the second valve column 33 plugs the fourth through hole 41, so that the quartz wafer washing and the waste liquid recovery are completed, the automatic plugging is realized, the manual operation is not needed, and the time and the labor are saved;

in this embodiment, in the process that the second tooth 121 of the gear 12 is engaged with the first tooth 111 on the upper side inside the frame 11, the frame 11 drives the two first connecting rods 14 to move leftward simultaneously, at this time, the etching solution output mechanism 3 moves upward to stop outputting the etching solution, the cleaning solution output mechanism 4 moves downward to wash the quartz wafer in the solution pool 6 below the etching solution output mechanism, and when the operation time of the cleaning solution output mechanism 8 is emphasized, in the process that the 12 drives the first tooth 11 to move leftward, the cleaning solution output mechanism 3 can wash the etched quartz wafer for a period of time, and the water pump 8 can absorb the waste solution in the solution pool 6 for a period of time, when the second tooth 121 of the gear 12 starts to engage with the first tooth 111 on the lower side inside the frame 11, the frame 11 drives the two first connecting rods 14 to move rightward simultaneously, at this time, the cleaning solution output mechanism 4 moves upward to stop cleaning the solution pool 6, and simultaneously, waste recovery is completed, the water pump 8 is powered off to stop working, the etching solution output mechanism 3 moves downwards, etching solution is output to the inside of the solution pool 6 conveyed by the conveyer belt 5 below the etching solution output mechanism, and the etching solution is used for etching the quartz wafer in the solution pool 6, so that a cycle is formed.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a special etching equipment of quartz wafer production, includes grudging post (1), its characterized in that: the vertical frame (1) is provided with a driving mechanism and a conveying belt (5), the driving mechanism is positioned above the conveying belt (5), two sides of the driving mechanism are provided with connecting rod assemblies (2), the connecting rod assembly (2) on the right side is connected with an etching solution output mechanism (3), the connecting rod assembly (2) on the left side is connected with a cleaning solution output mechanism (4), and the cleaning solution output mechanism (4) is connected with a waste liquid recovery mechanism;

the conveying belt (5) is connected with the driving mechanism through the chain wheel assembly (13), a plurality of solution pools (6) are fixed on the conveying belt (5) at equal intervals, and the solution pools (6) can be located under the etching solution output mechanism (3) and the cleaning solution output mechanism (4).

2. The etching apparatus special for quartz wafer production according to claim 1, characterized in that: drive mechanism includes that frame (11) and dead axle rotate gear (12) of connection on grudging post (1), gear (12) are connected with driving motor, and gear (12) are connected with conveyer belt (5) transmission through sprocket assembly (13), gear (12) are located the inboard of frame (11), and the inboard upper and lower side of frame (11) all is fixed with tooth one (111) that are the horizontal direction and arrange, be provided with tooth two (121) on gear (12), and the length of tooth two (121) is not more than the half of gear (12) girth, tooth two (121) all can with two tooth one (111) meshing connection.

3. The etching apparatus special for quartz wafer production according to claim 2, characterized in that: the connecting rod assembly (2) comprises a first guide sleeve (15) and a second guide sleeve (18) which are fixed on the stand (1), a first horizontal connecting rod (14) is inserted in the first guide sleeve (15), the first connecting rod (14) can slide in the first guide sleeve (15), a third horizontal connecting rod (17) is inserted in the second guide sleeve (18), the third connecting rod (17) can slide in the second guide sleeve (18), the upper end of the third connecting rod (17) is hinged with the corresponding first connecting rod (14) through a second connecting rod (16), and the first connecting rod (14) and the third connecting rod (17) are perpendicular to each other.

4. The etching apparatus special for quartz wafer production according to claim 3 and the characteristics thereof are that: a first guide sleeve (15) and a second guide sleeve (18) in the two groups of connecting rod assemblies (2) are symmetrically arranged on the left side and the right side of the gear (12), and one ends, opposite to the first connecting rods (14), of the two groups of connecting rod assemblies are fixedly connected with one sides, corresponding to the frame (11), respectively.

5. The etching apparatus special for quartz wafer production according to claim 4, wherein: etching solution output mechanism (3) are including fixing valve section of thick bamboo one (23) of connecting rod three (17) lower extreme on right side and fixing stopper (22) on grudging post (1), valve section of thick bamboo one (23) lower extreme opening, and valve section of thick bamboo one (23) inside sliding connection have valve column one (24), be connected through spring one (27) between the inside upper wall of valve column one (24) upper end and valve section of thick bamboo one (23), spout (25) have been seted up on the lateral wall upper portion of valve section of thick bamboo one (23), and the trend of spout (25) is parallel with the axis trend of valve section of thick bamboo one (23), be fixed with depression bar (26) on valve column one (24), and depression bar (26) are located the top of stopper (22) to can support with stopper (22) and detain the contact.

6. The etching apparatus special for quartz wafer production according to claim 5, characterized in that: the etching solution output mechanism (3) further comprises an etching solution box (20) fixed on the vertical frame (1), a first through hole (28) is formed in the lower portion of the side wall of the first valve cylinder (23), the first valve column (24) can seal the first through hole (28), the first through hole (28) is communicated with the bottom of the etching solution box (20) through a first water delivery pipe (21), and the position of the etching solution box (20) is higher than that of the first valve cylinder (23).

7. The etching apparatus special for quartz wafer production according to claim 4, wherein: the cleaning liquid output mechanism (4) comprises a hanging plate (29) fixed at the lower end of a left connecting rod III (17), a vertical downward column barrel (30) and a valve barrel II (31) are fixed on the lower surface of the hanging plate (29), the lower ends of the column barrel (30) and the valve barrel II (31) are both in an open shape, the valve barrel II (33) is connected to the inside of the valve barrel II (31) in a sliding mode, the lower end of the valve barrel II (33) is exposed to the outside of the lower end of the valve barrel II (31), the upper end of the valve barrel II (33) is connected with the upper wall of the inside of the valve barrel II (31) through a spring II (34), a through hole II (39) is formed in the middle of the side wall of the valve barrel II (31), and the through hole II (39) is communicated with the column barrel (30) through a connecting pipe (.

8. The etching apparatus special for quartz wafer production according to claim 7, wherein: the cleaning liquid output mechanism (4) further comprises a cleaning liquid box (7) fixed on the stand (1), the position of the cleaning liquid box (7) is higher than that of the valve cylinder II (31), the middle of the side wall of the valve cylinder II (31) is provided with a through hole III (40), the valve column II (33) can seal the through hole II (39) and the through hole III (40), the through hole III (40) is communicated with the bottom of the cleaning liquid box (7) through a water delivery pipe II (19), the middle of the valve column II (33) is provided with a channel I (36), and the channel I (36) can enable the through hole I (39) to be communicated with the through hole II (40).

9. The etching apparatus special for quartz wafer production according to claim 8, wherein: the waste liquid recovery mechanism comprises a waste liquid box (10), a water pump (8) fixed on the stand (1) and a press switch (35) fixed on the upper portion of the inner wall of the second valve cylinder (31), the press switch (35) is electrically connected with the water pump (8), the second valve column (33) can be in abutting contact with the press switch (35), a fourth through hole (41) is formed in the lower portion of the side wall of the second valve cylinder (31), the second valve column (33) can block the fourth through hole (41), the water pump (8) is respectively communicated with the fourth through hole (41) and the waste liquid box (10) through a water suction pipe (9), a second channel (37) is formed in the lower end of the second valve column (33), the upper end of the second channel (37) can be communicated with the fourth through hole (41), a U-shaped notch (38) is formed in the side wall of the lower end opening of the second channel (37), and the opening of the notch (38) faces downwards.

10. Use method of a quartz wafer production dedicated etching apparatus according to any one of claims 1 to 9, characterized in that: the method comprises the following steps:

the method comprises the following steps: the driving mechanism drives the conveying belt (5) to convey the quartz wafers at a constant speed, and drives the etching solution output mechanism (3) and the cleaning solution output mechanism (4) to move intermittently up and down through the connecting rod assemblies (2) on two sides;

step two: outputting etching solution to the interior of a solution pool (6) positioned below the etching solution output mechanism (3) through the etching solution output mechanism (3);

step three: the cleaning liquid is output to the interior of the solution pool (6) positioned below the cleaning liquid output mechanism (4) through the cleaning liquid output mechanism (4), and meanwhile, the waste liquid after cleaning is recovered through the waste liquid recovery mechanism.