CN108682639A - A kind of wafer wet etching system - Google Patents
A kind of wafer wet etching system Download PDFInfo
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- CN108682639A CN108682639A CN201810491385.4A CN201810491385A CN108682639A CN 108682639 A CN108682639 A CN 108682639A CN 201810491385 A CN201810491385 A CN 201810491385A CN 108682639 A CN108682639 A CN 108682639A
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- wafer
- material storage
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- storage tube
- reactive tanks
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- 238000001039 wet etching Methods 0.000 title claims abstract description 18
- 238000005530 etching Methods 0.000 claims abstract description 66
- 238000003860 storage Methods 0.000 claims abstract description 66
- 239000000463 material Substances 0.000 claims abstract description 65
- 239000007788 liquid Substances 0.000 claims abstract description 43
- 238000000429 assembly Methods 0.000 claims description 6
- 230000000712 assembly Effects 0.000 claims description 6
- 239000007921 spray Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 5
- 239000012535 impurity Substances 0.000 description 10
- 239000013078 crystal Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 4
- 206010044565 Tremor Diseases 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Abstract
The invention belongs to wet etching technique fields, specifically a kind of wafer wet etching system, including mobile module, handling module, No.1 reactive tank, No. two reactive tanks, No. three reactive tanks and material storage tube, reaction warehouse inner wall bottom surface is installed with No.1 reactive tank, No. two reactive tanks and No. three reactive tanks；Mobile module is fixedly mounted at the top of the side surface of reaction warehouse inner wall；Handling module is mounted on mobile module, and material storage tube is used for storing wafer；Handling module is for capturing material storage tube；Material storage tube is delivered to from feeding gate in reaction warehouse；Mobile module is sequentially placed into No. three reactive tanks, No. two reactive tanks and No.1 reactive tank and etches by coordinating the wafer in material storage tube with handling module；Wafer in last material storage tube is removed by discharge door；Present invention is mainly used for being performed etching to wafer, the service efficiency of etching liquid can be improved, mass etching can be carried out to wafer, improve etching efficiency.
Description
Technical field
The invention belongs to wet etching technique field, specifically a kind of wafer wet etching system.
Background technology
Various etching technics are often used in semiconductor fabrication, wherein wet-etching technology is mainly using reaction
The lithographic technique that liquid is removed engraving, is chemically reacted specifically by reaction solution and engraving, makes engraving portion
Divide and be detached from crystal column surface, has obtained required surface on wafer in this way.But it needs to consume in the mass production of wafer
A large amount of etching liquid, if it is possible to the utilization of etching liquid is improved, then can improve production cost.
Also occurs the technical solution of some Wet-method etching devices in the prior art, such as application No. is 201420593668.7
A Chinese patent disclose a kind of Wet-method etching device, described device includes at least：Etching tank and at least two filterings
Device；The etching tank is connect with each filter by the first, second pipeline；Correspondence is set respectively on first, second pipeline
There is the first, second valve；The inlet tube communicated with the first pipe is equipped between first valve and the filter；Institute
State the outlet tube for being equipped between the second valve and the filter and being communicated with the second pipe.Although the technical solution can prolong
The service life of long etching tank, still, the technical solution cannot improve the service efficiency of etching liquid, cause the waste of cost,
Meanwhile the program can not achieve mass and produce automatically；So that the invention is restricted.
Invention content
In order to make up for the deficiencies of the prior art, the present invention proposes a kind of wafer wet etching system, and the present invention mainly uses
It is performed etching in wafer, the service efficiency of etching liquid can be improved, mass etching can be carried out to wafer；The present invention passes through
No.1 reactive tank, No. two reactive tanks and No. three reactive tanks coordinate to carry out classification etching to wafer；Pass through mobile module, crawl mould
Block and material storage tube cooperation to carry out mass etching to wafer；Improve the etching efficiency of wafer.
The technical solution adopted by the present invention to solve the technical problems is：The present invention proposes a kind of wafer wet etching system
It unites, including reaction warehouse, feeding gate and discharge door is equipped in reaction warehouse；Wherein, reaction warehouse is not the innovation of the present invention, herein
It does not repeat.Further include mobile module, handling module, No.1 reactive tank, No. two reactive tanks, No. three reactive tanks and material storage tube, institute
It states reaction warehouse inner wall bottom surface and is installed with No.1 reactive tank, No. two reactive tanks and No. three reactive tanks；The mobile module is solid
Dingan County is at the top of the side surface of reaction warehouse inner wall；The handling module is mounted on mobile module, and the material storage tube is for depositing
Put wafer；Handling module is for capturing material storage tube；When work, material storage tube is delivered to from feeding gate in reaction warehouse；It is mobile
It is anti-to be sequentially placed into No. three reactive tanks, No. two reactive tanks and No.1 by coordinating the wafer in material storage tube with handling module for module
It answers in slot and etches；Wafer in last material storage tube is removed by discharge door；
The No.1 reactive tank is connect by No.1 solenoid valve with No. two reactive tanks；No. two reactive tanks pass through No. two electricity
Magnet valve is connect with No. three reactive tanks；The inner wall of No. three reactive tanks be equipped with No. three nozzles, it is used for will be in No. two reactive tanks
Etching liquid be ejected on the material storage tube in No. three reactive tanks；The inner wall of No. two reactive tanks is equipped with No. two nozzles, its use
In the etching liquid in No.1 reactive tank is ejected on the material storage tube in No. two reactive tanks；No. two nozzles and No. three nozzles for pair
The remaining impurity of crystal column surface is cleared up, meanwhile, improve the utilization rate of etching liquid；When work, No.1 reactive tank, No. two it is anti-
Slot and No. three reactive tanks is answered to be respectively arranged with the etching liquid of same purity, material storage tube is successively in No. three reactive tanks, No. two reactive tanks and one
Ultrasonic wave etching is carried out in number reactive tank, is used to tremble in the bubble of crystal column surface and impurity and be removed；When mobile module and crawl mould
During block cooperation lifts material storage tube；No. two nozzles and No. three nozzles respectively spray material storage tube, for wafer
The impurity on surface is cleared up.
The material storage tube includes three horn bodies, No.1 supporting rack, grip block and storing plate；The grip block passes through No.1 branch
Support is fixedly mounted on the top surface of three horn bodies, and clamping plate shape is circular ring shape, and grip block is for coordinating handling module to use；
The storing plate is set on the inner wall of three horn bodies, and storing plate can be dismantled from No. three cylinder inboard walls；Storing plate is for storing
Wafer；The surface of the three horns body is equipped with No. three openings；No. three openings by etching liquid for being delivered to storing plate；
The storing plate is equipped with No. four through-holes and No. four openings；No. four through-holes are for enabling etching liquid to pass through storage
Flitch；No. four openings are equipped with clamping unit, and clamping unit is for being clamped wafer；The clamping unit includes more
A hold assembly, hold assembly act on the side surface of wafer, and hold assembly is on the one hand for being fixed wafer, another party
Face is for making crystal column surface be come into full contact with etching liquid；Hold assembly is manipulator, Elastic buckle etc..Storing plate is removably pacified
On the inner wall of three horn bodies, wafer is set to by storing plate in material storage tube, material storage tube be immersed in No.1 reactive tank, No. two it is anti-
When answering in slot and No. three reactive tanks, etching liquid performs etching wafer by No. three openings.
Preferably, the mobile module include No.1 sliding block, fixed link, fixed plate, sliding extension bar, No.1 mounting base,
The top plate inner wall of multistage atmospheric pressure pole, mounting plate and link, the reaction warehouse is equipped with No.1 sliding slot, and the No.1 sliding block is used for
It is slided in No.1 sliding slot；The top surface of the fixed plate is fixedly connected by fixed link with No.1 sliding block；The fixed plate
Side surface is mounted on by sliding extension bar on the inner wall of reaction warehouse；The multistage atmospheric pressure pole is fixedly mounted by No.1 mounting base
In the bottom surface of fixed plate；The bottom end of the multistage atmospheric pressure pole is fixedly connected by mounting plate with link；The link is used
In being fixedly connected with handling module.No.1 sliding block is moved in No.1 sliding rail and is controlled by controller；Mobile module cooperation crawl
Module moves a unit by No. three reactive tanks, No. two reactive tanks are synchronous with the material storage tube in No.1 reactive tank to the left, wherein
One unit refers to the material storage tube in No. three reactive tanks and is moved to the distance walked in No. two reactive tanks；Then handling module and shifting
The nearest material storage tube of feeding gate is fed through in No. three reactive tanks by the cooperation of dynamic model block；Etching liquid can to the wafer in material storage tube into
Row three-level etches, and improves the utilization rate of etching liquid, meanwhile, improve the surface cleanness after wafer etching.
Preferably, the handling module includes No.1 support plate, No.1 supporting rod, circular cylinder and telescopic unit；Described one
Number support plate is fixedly connected by No. two supporting racks with the top surface of circular cylinder；Circular cylinder is internally provided with telescopic unit, stretches single
Member is connect by shaft with No.1 motor；Telescopic unit is for capturing material storage tube；When motor rotates, the length of telescopic unit
Degree can change, and telescopic unit length becomes in short-term, and telescopic unit is located at the inside of circular cylinder, for making circular cylinder pass through storing
Grip block in cylinder；When telescopic unit length, a telescopic unit part be located at circular cylinder outside, its by with clamping
Plate coordinates to capture material storage tube.
Preferably, the telescopic unit includes guide rod, fixed block, limited block and rotating disc, on the side wall of the circular cylinder
The mode circumferentially arranged is uniformly provided with No. two openings；The fixed block is fixedly mounted on the side wall of guide rod, and guide rod is located at two
Number opening in；It is equipped with spring between No. two openings and fixed block；The rotating disc is fixed by shaft and No.1 motor to be connected
It connects, the outer wall of rotating disc and the end thereof contacts of guide rod；The rotating disc is cam disc；The limited block is fixedly mounted on circular cylinder
Inner wall in, limited block is for limiting guide rod.Cam disc reaches circular cylinder by coordinating with guide rod to change guide rod
External distance, realizes fixation of the telescopic unit to material storage tube.
Preferably, the quantity of the multiple hold assembly is six to nine；Hold assembly includes fixed column, connecting rod, two
Number sliding block and No.1 spring；The side surface of fixed column and one end of two connecting rods respectively are hinged, each in two connecting rods
The other end of connecting rod is hinged on No. two sliding blocks, and No.1 spring is fixedly connected between two connecting rods.Multiple hold assemblies
It is effectively fixed for being carried out to wafer, while No.1 spring with connecting rod cooperation by that can make hold assembly to different-diameter
Wafer is fixed；Fixed column is contacted with the side surface of wafer for line, for enabling etching liquid to be flowed in crystal column surface, is improved
The etching efficiency of wafer, but also the impurity of crystal column surface can slide from crystal column surface, to improve crystal column surface
Cleannes.
The beneficial effects of the invention are as follows：
1. a kind of wafer wet etching system of the present invention, the present invention includes that mobile module, handling module, No.1 are anti-
Slot, No. two reactive tanks, No. three reactive tanks and material storage tube, the No.1 reactive tank, No. two reactive tanks and No. three reactive tanks is answered to be used for
Multistage etching, the mobile module and handling module are carried out for driving material storage tube to move to the wafer in material storage tube, realized
The mass of wafer etches；Meanwhile after a period of time that works, the etching liquid in No. three reactive tanks is discharged, in No. two reactive tanks
Etching liquid is conveyed to No. three reactive tanks, and then the etching liquid in No.1 reactive tank is conveyed to No. two reactive tanks, then is reacted to No.1
Pure etching liquid is conveyed in slot, the impurity residual quantity for reducing crystal column surface, meanwhile, improve etching liquid utilizes effect
Rate.
2. a kind of wafer wet etching system of the present invention is equipped with storing plate between of the invention in the material storage tube,
Storing plate is equipped with No. four openings；The clamping unit is set in No. four openings, it is used to that wafer to be fixed；The clamping
Unit includes multiple hold assemblies, and multiple hold assemblies coordinate jointly to be clamped to wafer；Improve the clamping of wafer
Degree.
3. a kind of wafer wet etching system of the present invention, hold assembly of the present invention includes fixed column, connects
Extension bar, No. two sliding blocks and No.1 spring；Fixed column is hinged with No. two sliding blocks by connecting rod, and the side surface hinged two of fixed column
A connecting rod is clamped by No.1 spring between two connecting rods；No. two sliding blocks make fixed column by coordinating with connecting rod
Movement, No.1 spring make fixed column be clamped the side surface of wafer by coordinating with connecting rod；For making hold assembly
The wafer of different-diameter can be clamped, meanwhile, it improves wafer and is easily installed in hold assembly, improve production effect
Rate.
Description of the drawings
The invention will be further described below in conjunction with the accompanying drawings.
Fig. 1 is the front view of the present invention；
Fig. 2 is the partial enlarged view of A in Fig. 1；
Fig. 3 is B-B sectional views in Fig. 2；
Fig. 4 is C-C sectional views in Fig. 2；
Fig. 5 is the partial enlarged view of D in Fig. 3；
In figure：Reaction warehouse 1, feeding gate 11, discharge door 12, mobile module 2, handling module 3, No.1 reactive tank 13, two
14, No. three reactive tanks 15 of reactive tank, material storage tube 4, wafer 16, the nozzle 51, two of solenoid valve 18, three of No.1 solenoid valve 17, two
Number nozzle 52, three horn bodies 41, No.1 supporting rack 42, grip block 43, storing plate 44, No. three openings, 45, No. four through-holes 46, four
Opening 47, hold assembly 48, No.1 sliding block 21, fixed link 22, fixed plate 23, sliding extension bar 24, No.1 mounting base 25, multistage
Atmospheric pressure pole 26, link 28, No.1 sliding slot 29, No.1 support plate 31, No.1 supporting rod 32, circular cylinder 33, stretches mounting plate 27
Unit 34, No.1 motor 35, guide rod 61, fixed block 62, limited block 63,64, No. two openings 65 of rotating disc, fixed column 71, connection
Bar 72, No. two sliding blocks 73, No.1 springs 74.
Specific implementation mode
In order to make the technical means, the creative features, the aims and the efficiencies achieved by the present invention be easy to understand, tie below
Specific implementation mode is closed, the present invention is further explained.
As shown in Figures 1 to 5, a kind of wafer wet etching system of the present invention, including reaction warehouse 1, in reaction warehouse 1
Equipped with feeding gate 11 and discharge door 12；Wherein, reaction warehouse 1 is not the innovation of the present invention, and therefore not to repeat here.Further include moving
Dynamic model block 2, handling module 3, the reactive tank 15 of reactive tank 14, three of No.1 reactive tank 13, two and material storage tube 4, the reaction warehouse 1
Inner wall bottom surface is installed with 13, No. two reactive tanks 14 of No.1 reactive tank and No. three reactive tanks 15；The mobile module 2 is fixed
At the top of the side surface of 1 inner wall of reaction warehouse；The handling module 3 is mounted on mobile module 2, and the material storage tube 4 is used for
Storing wafer 16；Handling module 3 is for capturing material storage tube 4；When work, material storage tube 4 is delivered to reaction from feeding gate 11
In storehouse 1；Mobile module 2 is sequentially placed into No. three reactive tanks 15, two by coordinating the wafer 16 in material storage tube 4 with handling module 3
It is etched in number reactive tank 14 and No.1 reactive tank 13；Wafer 16 in last material storage tube 4 is removed by discharge door 12；
The No.1 reactive tank 13 is connect by No.1 solenoid valve 17 with No. two reactive tanks 14；No. two reactive tanks 14 are logical
No. two solenoid valves 18 are crossed to connect with No. three reactive tanks 15；The inner wall of No. three reactive tanks 15 is equipped with No. three nozzles 51, its use
It is ejected on the material storage tube 4 in No. three reactive tanks 15 in by the etching liquid in No. two reactive tanks 14；No. two reactive tanks 14
Inner wall is equipped with No. two nozzles 52, its storing for being used to be ejected into the etching liquid in No.1 reactive tank 13 in No. two reactive tanks 14
On cylinder 4；No. two nozzles 52 and No. three nozzles 51 are used to clear up the impurity of 16 remained on surface of wafer, meanwhile, improve quarter
Lose the utilization rate of liquid；When work, 13, No. two reactive tanks 14 of No.1 reactive tank and No. three reactive tanks 15 are respectively arranged with the quarter of same purity
Liquid is lost, material storage tube 4 carries out ultrasonic wave etching in 15, No. two reactive tanks 14 of No. three reactive tanks and No.1 reactive tank 13 successively,
For trembling and removing the bubble on 16 surface of wafer and impurity；When mobile module 2 and handling module 3 coordinate the mistake for lifting material storage tube 4
Cheng Zhong；No. two nozzles 52 and No. three nozzles 51 respectively spray material storage tube 4, are carried out for the impurity to 16 surface of wafer clear
Reason.
The material storage tube 4 includes three horn bodies 41, No.1 supporting rack 42, grip block 43 and storing plate 44；The grip block
43 are fixedly mounted on the top surface of three horn bodies 41 by No.1 supporting rack 42, and 43 shape of grip block is circular ring shape, grip block 43
For coordinating handling module 3 to use；The storing plate 44 is set on the inner wall of three horn bodies 41, and storing plate 44 can be from three horns
It is dismantled on 41 inner wall of body；Storing plate 44 is used for storing wafer 16；The surface of the three horns body 41 is equipped with No. three openings 45；No. three
Opening 45 by etching liquid for being delivered to storing plate 44；
The storing plate 44 is equipped with No. four through-holes 46 and No. four openings 47；No. four through-holes 46 are for making etching liquid energy
Enough across storing plate 44；No. four openings 47 are equipped with clamping unit, and clamping unit is for being clamped wafer 16；It is described
Clamping unit includes multiple hold assemblies 48, and hold assembly 48 acts on the side surface of wafer 16, and 48 one side of hold assembly is used
It is fixed in wafer 16, is on the other hand used to that 16 surface of wafer to be made to come into full contact with etching liquid；Hold assembly 48 is machinery
Hand, Elastic buckle etc..Storing plate 44 is detachably arranged on the inner wall of three horn bodies 41, and wafer 16 is set to by storing plate 44
In material storage tube 4, when material storage tube 4 is immersed in 13, No. two reactive tanks 14 of No.1 reactive tank and No. three reactive tanks 15, etching liquid passes through
No. three openings 45 perform etching wafer 16.
As one embodiment of the present invention, the mobile module 2 includes No.1 sliding block 21, fixed link 22, fixed plate
23, sliding extension bar 24, No.1 mounting base 25, multistage atmospheric pressure pole 26, mounting plate 27 and link 28, the top of the reaction warehouse 1
Plate inner wall is equipped with No.1 sliding slot 29, and the No.1 sliding block 21 in No.1 sliding slot 29 for sliding；The top of the fixed plate 23
Surface is fixedly connected by fixed link 22 with No.1 sliding block 21；It is installed by sliding extension bar 24 side surface of the fixed plate 23
On the inner wall of reaction warehouse 1；The multistage atmospheric pressure pole 26 is fixedly mounted on the bottom surface of fixed plate 23 by No.1 mounting base 25；
The bottom end of the multistage atmospheric pressure pole 26 is fixedly connected by mounting plate 27 with link 28；The link 28 is for being fixedly connected
Handling module 3.No.1 sliding block 21 is moved in No.1 sliding rail and is controlled by controller；Mobile module 2 coordinates handling module 3 will
15, No. two reactive tanks 14 of No. three reactive tanks are synchronous with the material storage tube 4 in No.1 reactive tank 13 to move a unit to the left,
In, a unit refers to the material storage tube 4 in No. three reactive tanks 15 and is moved to the distance walked in No. two reactive tanks 14；Then it captures
The nearest material storage tube 4 of feeding gate 11 is fed through in No. three reactive tanks 15 by module 3 and the cooperation of mobile module 2；Etching liquid can be right
Wafer 16 in material storage tube 4 carries out three-level etching, improves the utilization rate of etching liquid, meanwhile, after improving the etching of wafer 16
Surface cleanness.
As one embodiment of the present invention, the handling module 3 include No.1 support plate 31, No.1 supporting rod 32,
Circular cylinder 33 and telescopic unit 34；The No.1 support plate 31 is fixed by No. two supporting racks and the top surface of circular cylinder 33 to be connected
It connects；Circular cylinder 33 is internally provided with telescopic unit 34, and telescopic unit 34 is connect by shaft with No.1 motor 35；Telescopic unit 34 is used
It is captured in material storage tube 4；When motor rotates, the length of telescopic unit 34 can change, and 34 length of telescopic unit shortens
When, telescopic unit 34 is located at the inside of circular cylinder 33, for making circular cylinder 33 pass through the grip block 43 in material storage tube 4；When flexible
When 34 length of unit, the part of telescopic unit 34 positioned at the outside of circular cylinder 33, its by with grip block 43 coordinate come pair
Material storage tube 4 is captured.
As one embodiment of the present invention, the telescopic unit 34 includes guide rod 61, fixed block 62,63 and of limited block
Rotating disc 64, the mode circumferentially arranged on the side wall of the circular cylinder 33 are uniformly provided with No. two openings 65；The fixed block 62
It is fixedly mounted on the side wall of guide rod 61, guide rod 61 is located in No. two openings 65；Between No. two openings 65 and fixed block 62
Equipped with spring；The rotating disc 64 is fixedly connected by shaft with No.1 motor 35, the outer wall of rotating disc 64 and the one of guide rod 61
End in contact；The rotating disc 64 is cam disc；The limited block 63 is fixedly mounted in the inner wall of circular cylinder 33, and limited block 63 is used
It is limited in guide rod 61.Cam disc by with guide rod 61 coordinate change guide rod 61 reach outside circular cylinder 33 away from
From realizing fixation of the telescopic unit 34 to material storage tube 4.
As one embodiment of the present invention, the quantity of the multiple hold assembly 48 is six to nine；Hold assembly
48 include fixed column 71,72, No. two sliding blocks 73 of connecting rod and No.1 spring 74；The side surface of fixed column 71 is connect with two respectively
One end of bar 72 is hinged, and the other end of each connecting rod 72 is hinged on No. two sliding blocks 73 in two connecting rods 72, two companies
No.1 spring 74 is fixedly connected between extension bar 72.Multiple hold assemblies 48 are used to effectively fix wafer 16, while one
Number spring 74 with the cooperation of connecting rod 72 by that can make hold assembly 48 that the wafer 16 of different-diameter be fixed；Fixed column 71
It is contacted for line with the side surface of wafer 16, for enabling etching liquid in 16 surface flow of wafer, improves the etching of wafer 16
Efficiency, but also the impurity on 16 surface of wafer can slide from 16 surface of wafer, to improve the cleannes on 16 surface of wafer.
It is etched in use, being sequentially placed into 15, No. two reactive tanks 14 of No. three reactive tanks and No.1 reactive tank 13；Last storing
Wafer 16 in cylinder 4 is removed by discharge door 12；No. two nozzles 52 and No. three nozzles 51 are used for 16 remained on surface of wafer
Impurity is cleared up, meanwhile, improve the utilization rate of etching liquid；When work, 13, No. two reactive tanks 14 of No.1 reactive tank and No. three
Reactive tank 15 is respectively arranged with the etching liquid of same purity；Wafer 16 is mounted on by storing plate 44 on the inner wall of material storage tube 4, storing
Cylinder 4 is delivered to from feeding gate 11 in reaction warehouse 1；Mobile module 2 is used for material storage tube 4 successively by coordinating with handling module 3
Ultrasonic wave etching is carried out in 15, No. two reactive tanks 14 of No. three reactive tanks and No.1 reactive tank 13；When mobile module 2 and crawl mould
During the cooperation of block 3 lifts material storage tube 4；No. two nozzles 52 and No. three nozzles 51 respectively spray material storage tube 4；
It works after the time of one end, then the etching liquid discharge in No. three reactive tanks 15 opens No. two solenoid valves 18, by No. two
Etching liquid in reactive tank 14 is delivered in No. three reactive tanks 15；No. two solenoid valves 18 are closed, then open No.1 solenoid valve 17, it will
Etching liquid in No.1 reactive tank 13 is delivered in No. two reactive tanks 14；Pure etching is finally passed through to No.1 reactive tank 13
Liquid；It then proceedes to perform etching wafer 16.
The basic principles, main features and advantages of the invention have been shown and described above.The technical staff of the industry should
Understand, the present invention is not limited to the above embodiments, and the above embodiments and description only describe the originals of the present invention
Reason, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes and improvements
It all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by appended claims and its equivalent circle
It is fixed.
Claims (5)
1. a kind of wafer wet etching system, including reaction warehouse (1), feeding gate (11) and discharge door are equipped in reaction warehouse (1)
(12)；It is characterized in that：Further include mobile module (2), handling module (3), No.1 reactive tank (13), No. two reactive tanks (14),
No. three reactive tanks (15) and material storage tube (4), reaction warehouse (1) the inner wall bottom surface are installed with No.1 reactive tank (13), two
Number reactive tank (14) and No. three reactive tanks (15)；The mobile module (2) is fixedly mounted on the side surface top of reaction warehouse (1) inner wall
Portion；The handling module (3) is mounted on mobile module (2), and the material storage tube (4) is used for storing wafer (16)；Handling module
(3) it is used to capture material storage tube (4)；
The No.1 reactive tank (13) is connect by No.1 solenoid valve (17) with No. two reactive tanks (14)；No. two reactive tanks
(14) it is connect with No. three reactive tanks (15) by No. two solenoid valves (18)；The inner wall of No. three reactive tanks (15) is equipped with No. three
Nozzle (51), its material storage tube (4) for being used to be ejected into the etching liquid in No. two reactive tanks (14) in No. three reactive tanks (15)；
The inner wall of No. two reactive tanks (14) be equipped with No. two nozzles (52), its be used for by No.1 reactive tank (13) etching liquid spray
It is mapped on the material storage tube (4) in No. two reactive tanks (14)；
The material storage tube (4) includes three horn bodies (41), No.1 supporting rack (42), grip block (43) and storing plate (44)；It is described
Grip block (43) is fixedly mounted on the top surface of three horn bodies (41) by No.1 supporting rack (42), and grip block (43) shape is circle
Annular, grip block (43) is for coordinating handling module (3) to use；The storing plate (44) is set to the inner wall of three horn bodies (41)
On, storing plate (44) can be dismantled from three horn body (41) inner walls；Storing plate (44) is used for storing wafer (16)；Described No. three
The surface of cylinder (41) is equipped with No. three openings (45)；No. three openings (45) are used to etching liquid being delivered to storing plate (44)；
The storing plate (44) is equipped with No. four through-holes (46) and No. four openings (47)；No. four through-holes (46) are for making etching
Liquid energy is enough across storing plate (44)；No. four openings (47) are equipped with clamping unit, clamping unit be used for wafer (16) into
Row clamping；The clamping unit includes multiple hold assemblies (48).
2. a kind of wafer wet etching system according to claim 1, it is characterised in that：The mobile module (2) includes
No.1 sliding block (21), fixed link (22), fixed plate (23), sliding extension bar (24), No.1 mounting base (25), multistage atmospheric pressure pole
(26), mounting plate (27) and link (28), the top plate inner wall of the reaction warehouse (1) are equipped with No.1 sliding slot (29), and described one
Number sliding block (21) is used for the sliding in No.1 sliding slot (29)；The top surface of the fixed plate (23) passes through fixed link (22) and No.1
Sliding block (21) is fixedly connected；The side surface of the fixed plate (23) is mounted on the interior of reaction warehouse (1) by sliding extension bar (24)
On wall；The multistage atmospheric pressure pole (26) is fixedly mounted on the bottom surface of fixed plate (23) by No.1 mounting base (25)；It is described more
The bottom end of grade atmospheric pressure pole (26) is fixedly connected by mounting plate (27) with link (28)；The link (28) connects for fixed
Connect handling module (3).
3. a kind of wafer wet etching system according to claim 2, it is characterised in that：The handling module (3) includes
No.1 support plate (31), No.1 supporting rod (32), circular cylinder (33) and telescopic unit (34)；The No.1 support plate (31) passes through
No. two supporting racks are fixedly connected with the top surface of circular cylinder (33)；Circular cylinder (33) is internally provided with telescopic unit (34), stretches single
First (34) are connect by shaft with No.1 motor (35)；Telescopic unit (34) is for capturing material storage tube (4).
4. a kind of wafer wet etching system according to claim 3, it is characterised in that：The telescopic unit (34) includes
Guide rod (61), fixed block (62), limited block (63) and rotating disc (64) circumferentially arrange on the side wall of the circular cylinder (33)
Mode is uniformly provided with No. two openings (65)；The fixed block (62) is fixedly mounted on the side wall of guide rod (61), guide rod (61) position
In No. two openings (65)；It is equipped with spring between No. two openings (65) and fixed block (62)；The rotating disc (64) passes through
Shaft is fixedly connected with No.1 motor (35), the end thereof contacts of the outer wall and guide rod (61) of rotating disc (64)；The rotating disc
(64) it is cam disc；The limited block (63) is fixedly mounted in the inner wall of circular cylinder (33), and limited block (63) is used for guide rod
(61) it is limited.
5. a kind of wafer wet etching system according to claim 4, it is characterised in that：The multiple hold assembly (48)
Quantity be six to nine；Hold assembly (48) includes fixed column (71), connecting rod (72), No. two sliding blocks (73) and No.1 spring
(74)；The side surface of fixed column (71) and one end of two connecting rods (72) respectively are hinged, each in two connecting rods (72)
The other end of connecting rod (72) is hinged on No. two sliding blocks (73), and No.1 spring is fixedly connected between two connecting rods (72)
(74)。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810491385.4A CN108682639B (en) | 2018-05-21 | 2018-05-21 | Wafer wet etching system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810491385.4A CN108682639B (en) | 2018-05-21 | 2018-05-21 | Wafer wet etching system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108682639A true CN108682639A (en) | 2018-10-19 |
| CN108682639B CN108682639B (en) | 2020-09-29 |
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ID=63807410
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810491385.4A Active CN108682639B (en) | 2018-05-21 | 2018-05-21 | Wafer wet etching system |
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| Country | Link |
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| CN (1) | CN108682639B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109930153A (en) * | 2019-04-24 | 2019-06-25 | 深圳市华星光电技术有限公司 | Etching liquid and etching device |
| CN111472050A (en) * | 2020-04-10 | 2020-07-31 | 陈鸣明 | Special etching equipment for quartz wafer production and use method thereof |
| CN113363183A (en) * | 2021-05-21 | 2021-09-07 | 夏秋月 | Wet etching device with timing protection function |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070057482A (en) * | 2005-12-02 | 2007-06-07 | 삼성전자주식회사 | Wet etching apparatus |
| CN204179068U (en) * | 2014-11-26 | 2015-02-25 | 乐山新天源太阳能科技有限公司 | For the wet-method etching equipment of silicon chip |
-
2018
- 2018-05-21 CN CN201810491385.4A patent/CN108682639B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070057482A (en) * | 2005-12-02 | 2007-06-07 | 삼성전자주식회사 | Wet etching apparatus |
| CN204179068U (en) * | 2014-11-26 | 2015-02-25 | 乐山新天源太阳能科技有限公司 | For the wet-method etching equipment of silicon chip |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109930153A (en) * | 2019-04-24 | 2019-06-25 | 深圳市华星光电技术有限公司 | Etching liquid and etching device |
| CN111472050A (en) * | 2020-04-10 | 2020-07-31 | 陈鸣明 | Special etching equipment for quartz wafer production and use method thereof |
| CN111472050B (en) * | 2020-04-10 | 2021-08-03 | 陈鸣明 | Special etching equipment for quartz wafer production and use method thereof |
| CN113363183A (en) * | 2021-05-21 | 2021-09-07 | 夏秋月 | Wet etching device with timing protection function |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108682639B (en) | 2020-09-29 |
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Effective date of registration: 20200826 Address after: Industrial Park, laobagang Town, Hai'an City, Nantong City, Jiangsu Province Applicant after: JIANGSU MINGXIN MICROELECTRONICS Co.,Ltd. Address before: 214432 Jiangsu Chengjiang Wuxi East Road 99 Jiangyin Jiangyin Changjiang Electronics Industry Co., Ltd. Applicant before: Chen Tao |
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