CN111452305A - Large-particle testing mold for epoxy molding compound and testing method thereof - Google Patents
Large-particle testing mold for epoxy molding compound and testing method thereof Download PDFInfo
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- CN111452305A CN111452305A CN202010473863.6A CN202010473863A CN111452305A CN 111452305 A CN111452305 A CN 111452305A CN 202010473863 A CN202010473863 A CN 202010473863A CN 111452305 A CN111452305 A CN 111452305A
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- injection molding
- molding compound
- epoxy molding
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- 229920006336 epoxy molding compound Polymers 0.000 title claims abstract description 49
- 238000012360 testing method Methods 0.000 title claims abstract description 42
- 239000002245 particle Substances 0.000 title claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 65
- 238000001746 injection moulding Methods 0.000 claims abstract description 59
- 208000015943 Coeliac disease Diseases 0.000 claims abstract description 27
- 238000009826 distribution Methods 0.000 claims abstract description 6
- 210000004877 mucosa Anatomy 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 238000004140 cleaning Methods 0.000 claims description 5
- 230000003247 decreasing effect Effects 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 238000004321 preservation Methods 0.000 claims description 5
- 238000001721 transfer moulding Methods 0.000 claims description 5
- 241001133184 Colletotrichum agaves Species 0.000 claims description 2
- 238000010998 test method Methods 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
- B29C45/2606—Guiding or centering means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
- B29C45/2708—Gates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
- B29C45/4005—Ejector constructions; Ejector operating mechanisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
- B29C45/2708—Gates
- B29C2045/2712—Serial gates for moulding articles in successively filled serial mould cavities
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention relates to an epoxy molding compound large particle test mold which comprises an upper mold and a lower mold, wherein an injection molding mechanism is arranged at the upper part of the lower mold, an injection molding hole is formed in the upper mold, the injection molding mechanism comprises a plurality of mold cavities formed in the upper surface of the lower mold and a main material channel for mold cavity injection molding, the mold cavities are communicated with the main material channel through a material distribution channel, and an exhaust channel is formed between the mold cavities and the outer wall of the lower mold; the replaceable sprue set is arranged on the material distributing channel and comprises a mounting bracket, and a plurality of sprues which correspond to the material distributing channel one to one are arranged on the mounting bracket. According to the invention, by arranging the replaceable gate group, the tests of products with different specifications can be completed by different gate sizes, so that various use requirements are met; the ejector pin mechanism is matched with the die cavity, so that the demoulding is convenient and quick; by arranging a plurality of die cavities, a plurality of groups of data can be obtained through one-time injection molding test, and the test efficiency is improved; the arrangement of the positioning mechanism prevents the lower die and the upper die from being matched and dislocated.
Description
Technical Field
The invention relates to the field of thermosetting plastics, in particular to an epoxy molding compound large particle testing mold and a testing method thereof.
Background
The epoxy molding compound is mainly used for packaging electronic components, integrated circuits and the like, and generally comprises epoxy resin, phenolic resin, inorganic filler, catalyst and other additives. The epoxy molding compound is injected and packaged with a specially designed gate under the conditions of high temperature and high pressure. In order to ensure that the packaged electronic component is uniform and compact, the epoxy molding compound is usually rapidly filled at a certain angle when flowing to the mold cavity, and therefore, the gate needs to be designed to be relatively narrow compared with the runner. Meanwhile, the epoxy molding compound is required to have no particles larger than the size of the gate, otherwise, the gate is blocked, and the defects of incomplete sealing (missing position) and the like are caused during the packaging of the client. The large particles in epoxy molding compounds originate mainly from two aspects: 1. filler of epoxy molding compound, 2, part cured in advance in the production process of epoxy molding compound. The first case is mainly based on controlling the granularity of the filler, and the second case is generated in the production process and is caused by various conditions. Thus, it was necessary to evaluate whether each batch of the epoxy molding compound contained large particles exceeding the gate size.
The existing testing method is to sieve the epoxy molding compound after dissolving the epoxy molding compound by using an organic solvent, and judge whether the particles are smaller than the aperture of a sieve mesh by using the sieve meshes with different apertures, and the principle is as follows: the inorganic filler and the precured portion cannot be dissolved by the solvent. The main disadvantages of the prior art are: 1. the organic solvent is flammable and volatile, and is harmful to human bodies and the environment; 2. the method is only used for screening and comparing the relationship between particles in a sample and the size of the aperture of the screen mesh, belongs to destructive experiments, cannot carry out massive inspection, and often causes the condition that a detection result is not matched with the service condition of a client.
Disclosure of Invention
The invention aims to solve the technical problem of providing an epoxy molding compound large-particle testing mold and a testing method thereof aiming at the defects of the prior art, wherein the method mainly changes the original traditional method of using a solvent to dissolve and then passing through standard sieves with different apertures, and adopts the packaging condition of a simulation client to evaluate whether the epoxy molding compound can meet the use requirement.
The technical problem to be solved by the invention is realized by the following technical scheme, the invention is an epoxy molding compound large particle test mould, which comprises an upper mould and a lower mould, wherein the upper part of the lower mould is provided with an injection molding mechanism, the upper mould is provided with an injection molding hole which is arranged corresponding to the injection molding mechanism,
the method is characterized in that:
the injection molding mechanism comprises a plurality of mold cavities arranged on the upper surface of the lower mold and a main material channel for injection molding of the mold cavities, each mold cavity is communicated with the main material channel through a material distribution channel, and an exhaust groove is arranged between each mold cavity and the outer wall of the lower mold;
the replaceable sprue set is arranged on the material distributing channel and comprises a mounting support, a plurality of sprues which correspond to the material distributing channel one by one are arranged on the mounting support, each sprue is formed by mutually connecting a horizontal plane close to the direction of the main material channel and an inclined plane close to the direction of the mold cavity, the horizontal plane is connected with the material distributing channel, the inclined plane inclines upwards towards the direction of the mold cavity to form an inclined angle of 15-45 degrees, and a gap for passing epoxy molding compound is reserved between the top end of the inclined plane and the upper surface of the lower mold.
The technical problem to be solved by the invention can be further realized by the following technical scheme. The method is characterized in that: the gap is 0.12 mm-0.16 mm or 0.20 mm-0.26 mm or 0.4 mm-0.5 mm.
The technical problem to be solved by the invention can be further realized by the following technical scheme. The width of the connection part of the horizontal surface and the inclined surface of the gate is 0.8mm or 1.2mm or 2 mm.
The technical problem to be solved by the invention can be further realized by the following technical scheme. Be equipped with in the lower part of lower mould with die cavity complex be used for the thimble mechanism of drawing of patterns, all seted up the thimble hole at the lower surface of each die cavity, thimble mechanism include with the thimble of thimble hole one-to-one, the bottom of thimble is passed through the connecting plate and is connected, is equipped with the thimble pressure head at the both ends of connecting plate along the thimble direction, set up on the upper surface of lower mould with thimble pressure head complex pressure head through-hole, be equipped with a plurality of spring locating piece at the lower fixed surface of connecting plate, the below of spring locating piece is equipped with and is used for the spring that pops out the connecting plate, is equipped.
The technical problem to be solved by the invention can be further realized by the following technical scheme. The die cavities are arranged in two rows which are arranged side by side, and the main material channel is arranged on the central axis of the two rows of die cavities.
The technical problem to be solved by the invention can be further realized by the following technical scheme. Two sprue mounting grooves are formed in the lower dies on the two sides of the main material channel, and the mounting frame capable of replacing the sprue group is mounted in the sprue mounting grooves.
The technical problem to be solved by the invention can be further realized by the following technical scheme. Still be equipped with positioning mechanism between lower mould and last mould, positioning mechanism including setting up first locating pin and the second locating pin at the upper surface of lower mould, first locating pin and second locating pin diagonal angle set up and the size is different, seted up on last mould with first locating pin and second locating pin one-to-one first locating hole and second locating hole.
The technical problem to be solved by the invention can be further realized by the following technical scheme. The depth of the exhaust groove is 0.3 mm-0.6 mm.
The technical problem to be solved by the invention can be further realized by the following technical scheme. The diameter of the injection molding hole is gradually reduced from top to bottom.
The invention aims to solve another technical problem and is realized by the following technical scheme, and the large-particle test method of the epoxy molding compound is characterized by comprising the following steps of: the method uses the large-particle test mold of the epoxy molding compound, which comprises the following steps;
(1) selecting a replaceable sprue set with corresponding product specifications, filling the replaceable sprue set into a lower die, locking an upper die and a lower die, pouring 80g of epoxy molding compound samples into a die cavity for injection molding when the temperatures of the mutually locked lower die and upper die are kept constant at 173-177 ℃, wherein the injection molding speed is 8.5-11.5 cm/s, and the injection molding pressure is 6.73-7.07 MPa;
(2) after the injection molding is finished, solidifying for 60-300 s, opening the upper die, and ejecting the sample in the die cavity by the ejector pin mechanism under the action of the spring;
(3) the thickness of the excess material of the central block after the sample is molded is 3.0 mm-5.0 mm, and the added sample amount is properly increased or decreased according to the thickness of the excess material;
(4) after the thickness of the excess material meets the requirement, observing whether all the die cavities are filled fully, and making a record;
(5) cleaning residual samples on the lower die, the die cavity, the exhaust groove and the upper die, and putting the lower die and the upper die back on the transfer molding press for heat preservation;
(6) repeating the operation for more than five times, and calculating the underfill ratio which is the number of unfilled die cavities/the total number of die cavities;
(7) and (4) observing whether the sample and the exhaust groove have the mucosa phenomenon or not when the sample and the exhaust groove are cleaned, recording the test times of the mucosa phenomenon, and evaluating the molding performance of the product.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, by arranging the replaceable gate group, the tests of products with different specifications can be completed by different gate sizes, and various use requirements are met.
And secondly, the ejector pin mechanism is matched with the die cavity to realize convenient and quick demoulding.
And thirdly, by arranging a plurality of die cavities, a plurality of groups of data can be obtained through one-time injection molding test, and the test efficiency is improved.
And fourthly, the invention prevents the matching dislocation between the lower die and the upper die through the arrangement of the positioning mechanism.
Drawings
FIG. 1 is a top view of a lower die;
FIG. 2 is a front view of the lower die;
FIG. 3 is a schematic view of an alternative gate set configuration;
FIG. 4 is an enlarged view of portion A of FIG. 3;
FIG. 5 is a schematic structural view of the ejector pin mechanism;
fig. 6 is a top view of the upper die.
Detailed Description
The following further describes particular embodiments of the present invention to facilitate further understanding of the present invention by those skilled in the art, and does not constitute a limitation to the right thereof.
Example 1, a large particle test mold for epoxy molding compound,
comprises an upper die 2 and a lower die 2, an injection molding mechanism is arranged at the upper part of the lower die 2, an injection molding hole 202 which is arranged corresponding to the injection molding mechanism is arranged on the upper die 1,
the injection molding mechanism comprises a plurality of mold cavities 102 arranged on the upper surface of the lower mold 2 and main material channels 106 for injection molding of the mold cavities, each mold cavity 102 is communicated with the main material channels 106 through a material distribution channel 107, and an exhaust groove 103 is arranged between each mold cavity 102 and the outer wall of the lower mold 2;
the replaceable gate set 108 is arranged on the material distributing channel 103, the replaceable gate set 108 comprises a mounting bracket 10801, a plurality of gates 10802 corresponding to the material distributing channel 107 one by one are arranged on the mounting bracket 10801, each gate 10802 is formed by mutually connecting a horizontal plane 10804 close to the main material distributing channel 106 direction and an inclined plane 10803 close to the cavity 102 direction, the horizontal plane 10804 is connected with the material distributing channel 107, the inclined plane 10803 inclines upwards towards the cavity 102 direction to form an inclined angle of 15 degrees, and a gap for passing epoxy molding compound is reserved between the top end of the inclined plane and the upper surface of the lower die 1.
The gap is 0.12 mm-0.16 mm.
The width of the junction between the horizontal surface and the inclined surface of the gate is 0.8 mm.
The lower part of the lower die 2 is provided with a thimble mechanism 105 which is matched with the die cavity 102 and used for demoulding, the lower surface of each die cavity 102 is provided with a thimble hole 104, the thimble mechanism 105 comprises thimbles 10503 which are in one-to-one correspondence with the thimble holes 104, the bottoms of the thimbles 10503 are connected through a connecting plate 10502, thimble press heads 10501 are arranged at the two ends of the connecting plate 10502 along the direction of the thimble 10503, press head through holes which are matched with the thimble press heads 10501 are arranged on the upper surface of the lower die 1, a plurality of spring positioning blocks 10504 are fixedly arranged on the lower surface of the connecting plate 10502, a spring 110 which is used for ejecting the connecting plate 10502 is arranged below the spring positioning block 10504.
The mold cavities 102 are arranged in two rows arranged side by side, and the main material passage 106 is arranged on the central axis of the two rows of mold cavities 102.
Two sprue mounting grooves are formed in the lower die 1 on two sides of the main material channel 106, and the mounting frame capable of replacing the sprue group is mounted in the sprue mounting grooves.
Still be equipped with positioning mechanism between lower mould 1 and last mould 2, positioning mechanism including setting up first locating pin and 101 second locating pin 109 at the upper surface of lower mould 1, first locating pin 101 and second locating pin 109 diagonal angle set up and the size is different, last mould 2 seted up with first locating pin 101 and second locating pin 109 one-to-one first locating hole 203 and second locating hole 201.
The depth of the exhaust groove 103 is 0.3 mm.
The diameter of the injection molding hole 202 is gradually reduced from top to bottom.
A large particle testing method of epoxy molding compound, which uses the large particle testing mold of epoxy molding compound as described in any one of the above items, and comprises the following steps;
(1) selecting a replaceable gate group 108 with corresponding product specifications, loading the replaceable gate group into a lower die 1, locking an upper die 2 and the lower die 1, pouring 80g of epoxy molding compound samples into an injection molding hole 202 when the temperatures of the lower die 1 and the upper die 2 which are mutually locked are constant at 173 ℃, and performing injection molding on a die cavity 102 at the injection molding speed of 8.5 cm/s and the injection molding pressure of 6.73 MPa;
(2) after the injection molding is finished, curing for 60s, opening the upper mold 1, and ejecting the sample in the mold cavity 102 by the ejector pin mechanism 105 under the action of the spring 110;
(3) the thickness of the excess material of the central block after the sample is molded is 3.0mm, and the added sample amount is properly increased or decreased according to the thickness of the excess material;
(4) after the thickness of the excess material meets the requirement, observing whether all the die cavities 102 are filled fully, and making a record;
(5) cleaning residual samples on the lower die 1, the die cavity 102, the exhaust groove 103 and the upper die 2, and putting the lower die 1 and the upper die 2 back on the transfer molding press for heat preservation;
(6) repeating the operation for more than five times, and calculating the underfill ratio which is the number of unfilled die cavities/the total number of die cavities;
(7) and (4) observing whether the sample and the exhaust groove have the mucosa phenomenon or not when the sample and the exhaust groove are cleaned, recording the test times of the mucosa phenomenon, and evaluating the molding performance of the product.
Example 2, a large particle test mold for epoxy molding compound,
comprises an upper die 2 and a lower die 2, an injection molding mechanism is arranged at the upper part of the lower die 2, an injection molding hole 202 which is arranged corresponding to the injection molding mechanism is arranged on the upper die 1,
the injection molding mechanism comprises a plurality of mold cavities 102 arranged on the upper surface of the lower mold 2 and main material channels 106 for injection molding of the mold cavities, each mold cavity 102 is communicated with the main material channels 106 through a material distribution channel 107, and an exhaust groove 103 is arranged between each mold cavity 102 and the outer wall of the lower mold 2;
the replaceable gate set 108 is arranged on the material distributing channel 103, the replaceable gate set 108 comprises a mounting bracket 10801, a plurality of gates 10802 corresponding to the material distributing channel 107 one by one are arranged on the mounting bracket 10801, each gate 10802 is formed by mutually connecting a horizontal plane 10804 close to the main material distributing channel 106 direction and an inclined plane 10803 close to the cavity 102 direction, the horizontal plane 10804 is connected with the material distributing channel 107, the inclined plane 10803 inclines upwards towards the cavity 102 direction to form an inclined angle of 45 degrees, and a gap for passing epoxy molding compound is reserved between the top end of the inclined plane and the upper surface of the lower die 1.
The gap is 0.4 mm-0.5 mm.
The width of the junction between the horizontal surface and the inclined surface of the gate was 2 mm.
The lower part of the lower die 2 is provided with a thimble mechanism 105 which is matched with the die cavity 102 and used for demoulding, the lower surface of each die cavity 102 is provided with a thimble hole 104, the thimble mechanism 105 comprises thimbles 10503 which are in one-to-one correspondence with the thimble holes 104, the bottoms of the thimbles 10503 are connected through a connecting plate 10502, thimble press heads 10501 are arranged at the two ends of the connecting plate 10502 along the direction of the thimble 10503, press head through holes which are matched with the thimble press heads 10501 are arranged on the upper surface of the lower die 1, a plurality of spring positioning blocks 10504 are fixedly arranged on the lower surface of the connecting plate 10502, a spring 110 which is used for ejecting the connecting plate 10502 is arranged below the spring positioning block 10504.
The mold cavities 102 are arranged in two rows arranged side by side, and the main material passage 106 is arranged on the central axis of the two rows of mold cavities 102.
Two sprue mounting grooves are formed in the lower die 1 on two sides of the main material channel 106, and the mounting frame capable of replacing the sprue group is mounted in the sprue mounting grooves.
Still be equipped with positioning mechanism between lower mould 1 and last mould 2, positioning mechanism including setting up first locating pin and 101 second locating pin 109 at the upper surface of lower mould 1, first locating pin 101 and second locating pin 109 diagonal angle set up and the size is different, last mould 2 seted up with first locating pin 101 and second locating pin 109 one-to-one first locating hole 203 and second locating hole 201.
The depth of the exhaust groove 103 is 0.6 mm.
The diameter of the injection molding hole 202 is gradually reduced from top to bottom.
A large particle testing method of epoxy molding compound, which uses the large particle testing mold of epoxy molding compound as described in any one of the above items, and comprises the following steps;
(1) selecting a replaceable gate group 108 with corresponding product specifications, filling the replaceable gate group into a lower die 1, locking an upper die 2 and the lower die 1, pouring 80g of epoxy molding compound samples into an injection molding hole 202 when the temperatures of the lower die 1 and the upper die 2 which are mutually locked are constant at 177 ℃, and performing injection molding on a die cavity 102 at the injection molding speed of 11.5cm/s and the injection molding pressure of 7.07 MPa;
(2) after the injection molding is finished, curing for 300s, opening the upper mold 1, and ejecting the sample in the mold cavity 102 by the ejector pin mechanism 105 under the action of the spring 110;
(3) after the sample is molded, the thickness of the excess material of the central block is 35.0mm, and the added sample amount is properly increased or decreased according to the thickness of the excess material;
(4) after the thickness of the excess material meets the requirement, observing whether all the die cavities 102 are filled fully, and making a record;
(5) cleaning residual samples on the lower die 1, the die cavity 102, the exhaust groove 103 and the upper die 2, and putting the lower die 1 and the upper die 2 back on the transfer molding press for heat preservation;
(6) repeating the operation for more than five times, and calculating the underfill ratio which is the number of unfilled die cavities/the total number of die cavities;
(7) and (4) observing whether the sample and the exhaust groove have the mucosa phenomenon or not when the sample and the exhaust groove are cleaned, recording the test times of the mucosa phenomenon, and evaluating the molding performance of the product.
Example 3, a large particle test mold for epoxy molding compound,
comprises an upper die 2 and a lower die 2, an injection molding mechanism is arranged at the upper part of the lower die 2, an injection molding hole 202 which is arranged corresponding to the injection molding mechanism is arranged on the upper die 1,
the injection molding mechanism comprises a plurality of mold cavities 102 arranged on the upper surface of the lower mold 2 and main material channels 106 for injection molding of the mold cavities, each mold cavity 102 is communicated with the main material channels 106 through a material distribution channel 107, and an exhaust groove 103 is arranged between each mold cavity 102 and the outer wall of the lower mold 2;
the replaceable gate set 108 is arranged on the material distributing channel 103, the replaceable gate set 108 comprises a mounting bracket 10801, a plurality of gates 10802 corresponding to the material distributing channel 107 one by one are arranged on the mounting bracket 10801, each gate 10802 is formed by mutually connecting a horizontal plane 10804 close to the main material distributing channel 106 direction and an inclined plane 10803 close to the cavity 102 direction, the horizontal plane 10804 is connected with the material distributing channel 107, the inclined plane 10803 inclines upwards towards the cavity 102 direction to form an inclined angle of 30 degrees, and a gap for passing epoxy molding compound is reserved between the top end of the inclined plane and the upper surface of the lower die 1.
The gap is 0.20 mm-0.26 mm.
The width of the junction between the horizontal surface and the inclined surface of the gate was 1.2 mm.
The lower part of the lower die 2 is provided with a thimble mechanism 105 which is matched with the die cavity 102 and used for demoulding, the lower surface of each die cavity 102 is provided with a thimble hole 104, the thimble mechanism 105 comprises thimbles 10503 which are in one-to-one correspondence with the thimble holes 104, the bottoms of the thimbles 10503 are connected through a connecting plate 10502, thimble press heads 10501 are arranged at the two ends of the connecting plate 10502 along the direction of the thimble 10503, press head through holes which are matched with the thimble press heads 10501 are arranged on the upper surface of the lower die 1, a plurality of spring positioning blocks 10504 are fixedly arranged on the lower surface of the connecting plate 10502, a spring 110 which is used for ejecting the connecting plate 10502 is arranged below the spring positioning block 10504.
The mold cavities 102 are arranged in two rows arranged side by side, and the main material passage 106 is arranged on the central axis of the two rows of mold cavities 102.
Two sprue mounting grooves are formed in the lower die 1 on two sides of the main material channel 106, and the mounting frame capable of replacing the sprue group is mounted in the sprue mounting grooves.
Still be equipped with positioning mechanism between lower mould 1 and last mould 2, positioning mechanism including setting up first locating pin and 101 second locating pin 109 at the upper surface of lower mould 1, first locating pin 101 and second locating pin 109 diagonal angle set up and the size is different, last mould 2 seted up with first locating pin 101 and second locating pin 109 one-to-one first locating hole 203 and second locating hole 201.
The depth of the exhaust groove 103 is 0.45 mm.
The diameter of the injection molding hole 202 is gradually reduced from top to bottom.
A large particle testing method of epoxy molding compound, which uses the large particle testing mold of epoxy molding compound as described in any one of the above items, and comprises the following steps;
(1) selecting a replaceable gate group 108 with corresponding product specifications, loading the replaceable gate group into a lower die 1, locking an upper die 2 and the lower die 1, pouring 80g of epoxy molding compound samples into an injection molding hole 202 when the temperatures of the lower die 1 and the upper die 2 which are mutually locked are constant at 175 ℃, and performing injection molding on a die cavity 102 at the injection molding speed of 9.75cm/s and the injection molding pressure of 6.90 MPa;
(2) after the injection molding is finished, solidifying for 180s, opening the upper die 1, and ejecting the sample in the die cavity 102 by the ejector pin mechanism 105 under the action of the spring 110;
(3) the thickness of the excess material of the central block after the sample is molded is 4.0mm, and the added sample amount is properly increased or decreased according to the thickness of the excess material;
(4) after the thickness of the excess material meets the requirement, observing whether all the die cavities 102 are filled fully, and making a record;
(5) cleaning residual samples on the lower die 1, the die cavity 102, the exhaust groove 103 and the upper die 2, and putting the lower die 1 and the upper die 2 back on the transfer molding press for heat preservation;
(6) repeating the operation for more than five times, and calculating the underfill ratio which is the number of unfilled die cavities/the total number of die cavities;
(7) and (4) observing whether the sample and the exhaust groove have the mucosa phenomenon or not when the sample and the exhaust groove are cleaned, recording the test times of the mucosa phenomenon, and evaluating the molding performance of the product.
Claims (10)
1. An epoxy molding compound large particle test mould comprises an upper mould and a lower mould, wherein the upper part of the lower mould is provided with an injection molding mechanism, the upper mould is provided with an injection molding hole which is arranged corresponding to the injection molding mechanism,
the method is characterized in that:
the injection molding mechanism comprises a plurality of mold cavities arranged on the upper surface of the lower mold and a main material channel for injection molding of the mold cavities, each mold cavity is communicated with the main material channel through a material distribution channel, and an exhaust groove is arranged between each mold cavity and the outer wall of the lower mold;
the replaceable sprue set is arranged on the material distributing channel and comprises a mounting support, a plurality of sprues which correspond to the material distributing channel one by one are arranged on the mounting support, each sprue is formed by mutually connecting a horizontal plane close to the direction of the main material channel and an inclined plane close to the direction of the mold cavity, the horizontal plane is connected with the material distributing channel, the inclined plane inclines upwards towards the direction of the mold cavity to form an inclined angle of 15-45 degrees, and a gap for passing epoxy molding compound is reserved between the top end of the inclined plane and the upper surface of the lower mold.
2. The large particle testing mold and method of epoxy molding compound as claimed in claim 1, wherein: the gap is 0.12 mm-0.16 mm or 0.20 mm-0.26 mm or 0.4 mm-0.5 mm.
3. The large particle testing mold of epoxy molding compound as claimed in claim 2, wherein: the width of the connection part of the horizontal surface and the inclined surface of the gate is 0.8mm or 1.2mm or 2 mm.
4. The large particle testing mold of epoxy molding compound as claimed in claim 1, wherein: be equipped with in the lower part of lower mould with die cavity complex be used for the thimble mechanism of drawing of patterns, all seted up the thimble hole at the lower surface of each die cavity, thimble mechanism include with the thimble of thimble hole one-to-one, the bottom of thimble is passed through the connecting plate and is connected, is equipped with the thimble pressure head at the both ends of connecting plate along the thimble direction, set up on the upper surface of lower mould with thimble pressure head complex pressure head through-hole, be equipped with a plurality of spring locating piece at the lower fixed surface of connecting plate, the below of spring locating piece is equipped with and is used for the spring that pops out the connecting plate, is equipped.
5. The large particle testing mold of epoxy molding compound as claimed in claim 1, wherein: the die cavities are arranged in two rows which are arranged side by side, and the main material channel is arranged on the central axis of the two rows of die cavities.
6. The large particle testing mold of epoxy molding compound as claimed in claim 5, wherein: two sprue mounting grooves are formed in the lower dies on the two sides of the main material channel, and the mounting frame capable of replacing the sprue group is mounted in the sprue mounting grooves.
7. The large particle testing mold of epoxy molding compound as claimed in claim 1, wherein: still be equipped with positioning mechanism between lower mould and last mould, positioning mechanism including setting up first locating pin and the second locating pin at the upper surface of lower mould, first locating pin and second locating pin diagonal angle set up and the size is different, seted up on last mould with first locating pin and second locating pin one-to-one first locating hole and second locating hole.
8. The large particle testing mold of epoxy molding compound as claimed in claim 1, wherein: the depth of the exhaust groove is 0.3 mm-0.6 mm.
9. The large particle testing mold of epoxy molding compound as claimed in claim 1, wherein: the diameter of the injection molding hole is gradually reduced from top to bottom.
10. A large particle test method of an epoxy molding compound is characterized by comprising the following steps: the method uses the large particle test mold of the epoxy molding compound as claimed in any one of claims 1 to 9, and comprises the following steps;
(1) selecting a replaceable sprue set with corresponding product specifications, filling the replaceable sprue set into a lower die, locking an upper die and a lower die, pouring 80g of epoxy molding compound samples into a die cavity for injection molding when the temperatures of the mutually locked lower die and upper die are kept constant at 173-177 ℃, wherein the injection molding speed is 8.5-11.5 cm/s, and the injection molding pressure is 6.73-7.07 MPa;
(2) after the injection molding is finished, solidifying for 60-300 s, opening the upper die, and ejecting the sample in the die cavity by the ejector pin mechanism under the action of the spring;
(3) the thickness of the excess material of the central block after the sample is molded is 3.0 mm-5.0 mm, and the added sample amount is properly increased or decreased according to the thickness of the excess material;
(4) after the thickness of the excess material meets the requirement, observing whether all the die cavities are filled fully, and making a record;
(5) cleaning residual samples on the lower die, the die cavity, the exhaust groove and the upper die, and putting the lower die and the upper die back on the transfer molding press for heat preservation;
(6) repeating the operation for more than five times, and calculating the underfill ratio which is the number of unfilled die cavities/the total number of die cavities;
(7) and (4) observing whether the sample and the exhaust groove have the mucosa phenomenon or not when the sample and the exhaust groove are cleaned, recording the test times of the mucosa phenomenon, and evaluating the molding performance of the product.
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| CN202010473863.6A CN111452305B (en) | 2020-05-29 | 2020-05-29 | Large-particle testing mold for epoxy molding compound and testing method thereof |
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| CN202010473863.6A CN111452305B (en) | 2020-05-29 | 2020-05-29 | Large-particle testing mold for epoxy molding compound and testing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112848126A (en) * | 2021-01-14 | 2021-05-28 | 武汉圣维林环节能技术有限公司 | Injection molding mechanism for improving porous filling quality |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112848126A (en) * | 2021-01-14 | 2021-05-28 | 武汉圣维林环节能技术有限公司 | Injection molding mechanism for improving porous filling quality |
| CN112848126B (en) * | 2021-01-14 | 2022-10-21 | 广州五羊新兴科技有限公司 | Injection molding mechanism for improving porous filling quality |
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