CN204694708U - A kind of epoxy molding plastic overlap testing mould - Google Patents

A kind of epoxy molding plastic overlap testing mould Download PDF

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Publication number
CN204694708U
CN204694708U CN201520383071.4U CN201520383071U CN204694708U CN 204694708 U CN204694708 U CN 204694708U CN 201520383071 U CN201520383071 U CN 201520383071U CN 204694708 U CN204694708 U CN 204694708U
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China
Prior art keywords
epoxy molding
molding plastic
overlap
testing mould
patrix
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CN201520383071.4U
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Chinese (zh)
Inventor
蒋小娟
崔亮
谭伟
成兴明
颜廷丹
张慧
李兰侠
刘红杰
陈畅
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JIANGSU HUAHAI CHENGKE NEW MATERIAL Co.,Ltd.
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JIANGSU HUAHAI CHENGKE NEW MATERIALS CO Ltd
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Abstract

A kind of epoxy molding plastic overlap testing mould, comprise upper die and lower die, described patrix is provided with injecting hole; Be provided with the strip groove type die cavity corresponding with patrix injecting hole at described counterdie, be provided with the different groove of 5 degree of depth from described die cavity is perpendicular, described depth of groove is respectively 5 μm, 10 μm, 15 μm, 20 μm, 50 μm.Patrix is provided with dowel hole, is provided with the register pin corresponded at counterdie.Upper and lower mould is equipped with handle pilot hole.The utility model measures epoxy molding plastic when the overlap length of different depth recess, can be measured successively according to a direction by slide calliper rule, without the need to calculating, direct reading slide calliper rule display data, improve the accuracy of test data, improve the efficiency of test, be more conducive to the quality controlling epoxy molding plastic.

Description

A kind of epoxy molding plastic overlap testing mould
Technical field
The utility model relates to a kind of testing mould of epoxy molding plastic quality detection, for testing the overlap of epoxy molding plastic.
Background technology
Epoxy molding plastic is when packaging electronic parts, by certain pressure, temperature, be injected in die cavity, in encapsulation process, understand on some pin spilling into electronic element by the gap of mould and mould, affect quality and the efficiency of electronic devices and components, therefore need the index controlling overlap, to meet the requirement of client in the formula Design of epoxy molding plastic and production run.
Existing technical scheme is: existing mold patrix is provided with injecting hole, and counterdie and patrix injecting hole corresponding position are provided with truncated cone-shaped groove, and centered by groove, radiation installing is equipped with the groove of 6-8 bar different depth.During use, by the preheating on press of upper and lower mould matched moulds, add epoxy molding plastic and carry out injection moulding, the die sinking of pressurize a period of time, measure the overlap length of epoxy molding plastic in the groove of different depth of solidification.
Prior art shortcoming is: after existing mold injection completes, and measuring inconvenience also needs to carry out simple computation, affects the accuracy of test data and the complicacy of operation; In existing scheme, groove depth can not the actual conditions of simulant-client mould more accurately, and data do not have referential.
Summary of the invention
Technical problem to be solved in the utility model is for the deficiencies in the prior art, provides a kind of and can improve the accuracy of test and simplify the epoxy molding plastic testing mould of test process.
Technical problem to be solved in the utility model is achieved through the following technical solutions.The present invention is a kind of epoxy molding plastic overlap testing mould, be characterized in, comprise upper die and lower die, described patrix is provided with injecting hole, described counterdie is provided with the rectangular recess formula die cavity corresponding with patrix injecting hole, extends many parallel and overlap grooves that the degree of depth is different from die cavity is perpendicular.
The technical problems to be solved in the utility model can also be come to realize further by the following technical programs.Above-described epoxy molding plastic overlap testing mould, its further preferred technical scheme is: described overlap groove is 5 and extends towards counterdie the same side.
The technical problems to be solved in the utility model can also be come to realize further by the following technical programs.Above-described epoxy molding plastic overlap testing mould, its further preferred technical scheme is: described overlap depth of groove is gradually dark from top to bottom, and the degree of depth is followed successively by 5 μm, 10 μm, 15 μm, 20 μm, 50 μm.
The technical problems to be solved in the utility model can also be come to realize further by the following technical programs.Above-described epoxy molding plastic overlap testing mould, its further preferred technical scheme is: described counterdie is provided with thermometer hole, and thermometer hole vertically leads to counterdie half position from bed die center side.
The technical problems to be solved in the utility model can also be come to realize further by the following technical programs.Above-described epoxy molding plastic overlap testing mould, its further preferred technical scheme is: described upper die and lower die are equipped with handle pilot hole.
The technical problems to be solved in the utility model can also be come to realize further by the following technical programs.Above-described epoxy molding plastic overlap testing mould, its further preferred technical scheme is: described patrix is provided with dowel hole, and described counterdie is provided with the register pin corresponded.
Compared with prior art, the utility model has following technique effect:
1, counterdie is provided with the rectangular recess formula die cavity corresponding with patrix injecting hole, many parallel and overlap grooves that the degree of depth is different are extended from die cavity is perpendicular, the degree of depth is gradually dark from top to bottom, at measurement epoxy molding plastic when the overlap length of different depth overlap groove, can being measured successively from top to bottom according to a direction by slide calliper rule, without the need to calculating, directly reading slide calliper rule display data, improve the accuracy of test data, simplify test process.
2, the groove depth of 5 flash gutters Simulation of depth client moulds is come fixed, and be followed successively by 5 μm, 10 μm, 15 μm, 20 μm, 50 μm from top to bottom, groove depth is more meticulous, improves the accuracy of test.
3, counterdie is provided with thermometer hole, can control mold temperature more accurately, reaches more suitable test condition.
4, upper and lower mould is equipped with handle pilot hole, expediently the matched moulds of counterdie, is convenient to patrix to remove from counterdie at the end of test, is convenient for measuring data, more convenient operation.
Accompanying drawing explanation
Fig. 1 is the utility model upper die structure schematic diagram.
Fig. 2 is the utility model lower die structure schematic diagram.
Embodiment
With reference to the accompanying drawings, further describe concrete technical scheme of the present utility model, so that those skilled in the art understands the utility model further, and do not form the restriction of its right.
Embodiment 1, with reference to Fig. 1, Fig. 2, a kind of epoxy molding plastic testing mould, comprise patrix 1, counterdie 2, described patrix is provided with injecting hole 8; Be provided with the strip groove type die cavity 6 corresponding with patrix injecting hole at described counterdie, vertically extend 5 parallel and overlap grooves 3 that the degree of depth is different along die cavity longer sides side.
Embodiment 2, in a kind of epoxy molding plastic testing mould described in embodiment 1: described overlap groove is 5 and extends towards counterdie the same side.
Embodiment 3, described in embodiment 2 in a kind of epoxy molding plastic testing mould: described overlap groove is gradually dark from top to bottom, and the degree of depth is respectively 5 μm, 10 μm, 15 μm, 20 μm, 50 μm.
Embodiment 4, in a kind of epoxy molding plastic testing mould described in embodiment 1: bed die is provided with thermometer hole 7, thermometer hole leads to counterdie half position from bed die center side.
Embodiment 5, in a kind of epoxy molding plastic testing mould described in embodiment 1: upper die and lower die are equipped with handle pilot hole 4.
Embodiment 6, in a kind of epoxy molding plastic testing mould described in embodiment 1: patrix is provided with dowel hole 9, described counterdie is provided with the register pin 5 corresponded.

Claims (6)

1. an epoxy molding plastic overlap testing mould, it is characterized in that: comprise upper die and lower die, described patrix is provided with injecting hole, and described counterdie is provided with the rectangular recess formula die cavity corresponding with patrix injecting hole, extends many parallel and overlap grooves that the degree of depth is different from die cavity is perpendicular.
2. epoxy molding plastic overlap testing mould according to claim 1, is characterized in that: described overlap groove is 5 and extends towards counterdie the same side.
3. epoxy molding plastic overlap testing mould according to claim 2, is characterized in that: 5 overlap grooves are gradually dark from top to bottom, and the degree of depth is followed successively by 5 μm, 10 μm, 15 μm, 20 μm, 50 μm.
4. epoxy molding plastic overlap testing mould according to claim 1, is characterized in that: described counterdie is provided with thermometer hole.
5. epoxy molding plastic overlap testing mould according to claim 1, is characterized in that: described upper die and lower die are equipped with handle pilot hole.
6. epoxy molding plastic overlap testing mould according to claim 1, it is characterized in that: described patrix is provided with dowel hole, described counterdie is provided with the register pin corresponded.
CN201520383071.4U 2015-06-05 2015-06-05 A kind of epoxy molding plastic overlap testing mould Active CN204694708U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520383071.4U CN204694708U (en) 2015-06-05 2015-06-05 A kind of epoxy molding plastic overlap testing mould

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520383071.4U CN204694708U (en) 2015-06-05 2015-06-05 A kind of epoxy molding plastic overlap testing mould

Publications (1)

Publication Number Publication Date
CN204694708U true CN204694708U (en) 2015-10-07

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CN201520383071.4U Active CN204694708U (en) 2015-06-05 2015-06-05 A kind of epoxy molding plastic overlap testing mould

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CN (1) CN204694708U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111452305A (en) * 2020-05-29 2020-07-28 江苏华海诚科新材料股份有限公司 Large-particle testing mold for epoxy molding compound and testing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111452305A (en) * 2020-05-29 2020-07-28 江苏华海诚科新材料股份有限公司 Large-particle testing mold for epoxy molding compound and testing method thereof
CN111452305B (en) * 2020-05-29 2022-02-11 江苏华海诚科新材料股份有限公司 Large-particle testing mold for epoxy molding compound and testing method thereof

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Address after: 222047 No. 66 Dongfang Avenue, Lingang Industrial Zone, Lianyungang Economic and Technological Development Zone, Lianyungang City, Jiangsu Province

Patentee after: JIANGSU HUAHAI CHENGKE NEW MATERIAL Co.,Ltd.

Address before: 222047 No. 66 Dongfang Avenue, Lingang Industrial Zone, Lianyungang Economic and Technological Development Zone, Lianyungang City, Jiangsu Province

Patentee before: JIANGSU HHCK ADVANCED MATERIAL CO.,LTD.