CN102841002A - Epoxy molding compound test mould - Google Patents
Epoxy molding compound test mould Download PDFInfo
- Publication number
- CN102841002A CN102841002A CN 201210299578 CN201210299578A CN102841002A CN 102841002 A CN102841002 A CN 102841002A CN 201210299578 CN201210299578 CN 201210299578 CN 201210299578 A CN201210299578 A CN 201210299578A CN 102841002 A CN102841002 A CN 102841002A
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- CN
- China
- Prior art keywords
- epoxy molding
- molding compound
- mould
- micrometers
- grooves
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses an epoxy molding compound test mould comprising an upper mould and a lower mould. The epoxy molding compound test mould is characterized in that an injection molding hole is arranged on the upper mould, and a round-table-shaped groove is arranged a position of the lower mould corresponding to the injection molding hole of the upper mould. A plurality of grooves with different depths are arranged with the grooves as a center in radial mode. The number of the grooves is 6. Optimized, the depth of the grooves is respectively 5 micrometers, 10 micrometers, 30 micrometers, 50 micrometers, 100 micrometers and 200 micrometers. A positioning hole is arranged on the upper mould, and a positioning pin corresponding to the positioning hole is arranged on the lower mould. Through heating injection molding to the epoxy molding compound, and according to flowing length of solidified epoxy molding compound in the grooves with different depths, the epoxy molding compound test mould detects flash value, and judges fluidity of the epoxy molding compound simultaneously.
Description
Technical field
The present invention relates to a kind of epoxy molding plastic testing mould, be used to test the flash situation of epoxy molding plastic.
Background technology
Epoxy molding plastic is the thermoplasticity epoxy molding plastic by it, needs its flash situation of test, the flowability after the heating of the combination degree of test wrapper epoxy resins and filler just, and judgement epoxy molding plastic.This needs the mould of design special to test.
Summary of the invention
The object of the invention is to provide a kind of epoxy molding plastic testing mould that is used to test the flash situation of epoxy molding plastic.
The present invention adopts following technical scheme for realizing above-mentioned purpose:
A kind of epoxy molding plastic testing mould; Comprise upper die and lower die; It is characterized in that: said patrix is provided with injecting hole, and said counterdie and patrix injecting hole corresponding section are provided with the truncated cone-shaped groove, is the radial groove that is provided with many different depths in center with said groove.
It is further characterized in that: said groove quantity is 6.
Preferably: said depth of groove is respectively 5 μ m, 10 μ m, 30 μ m, 50 μ m, 100 μ m, 200 μ m.
Said patrix is provided with pilot hole, and said counterdie is provided with corresponding with it register pin.
The present invention can according to the trickling length testing flash value of epoxy molding plastic in the groove of different depth of solidifying, and judge its flowability simultaneously through the heating injection moulding to epoxy molding plastic.
Description of drawings
Fig. 1 is a patrix synoptic diagram of the present invention;
Fig. 2 is a counterdie synoptic diagram of the present invention.
Embodiment
Like Fig. 1, a kind of epoxy molding plastic testing mould shown in 2; Comprise upper die and lower die; Said patrix is provided with injecting hole 4, and said counterdie and patrix injecting hole corresponding section are provided with the truncated cone-shaped groove, is the radial groove 1 that is provided with many different depths in center with said groove.Said groove 1 quantity is 6.Said groove 1 degree of depth is respectively 5 μ m, 10 μ m, 30 μ m, 50 μ m, 100 μ m, 200 μ m.Said patrix is provided with pilot hole 3, and said counterdie is provided with corresponding with it register pin 2.
During use,, add 3-5 gram epoxy molding plastic with the preheating on press of upper and lower mould matched moulds; Carry out injection moulding, pressurize a period of time, die sinking; Measure the trickling length of epoxy molding plastic in the groove of different depth of solidifying, 5 μ m, 10 μ m grooves measure length and explain then that than short the flash situation is better; According to 100 μ m, the epoxy molding plastic length of the curing in the 200 μ m grooves can tentatively be judged its flowability.
Claims (4)
1. epoxy molding plastic testing mould; Comprise upper die and lower die; It is characterized in that: said patrix is provided with injecting hole, and said counterdie and patrix injecting hole corresponding section are provided with the truncated cone-shaped groove, is the radial groove that is provided with many different depths in center with said groove.
2. a kind of epoxy molding plastic testing mould according to claim 1 is characterized in that: said groove quantity is 6.
3. a kind of epoxy molding plastic testing mould according to claim 2 is characterized in that: said depth of groove is respectively 5 μ m, 10 μ m, 30 μ m, 50 μ m, 100 μ m, 200 μ m.
4. a kind of epoxy molding plastic testing mould according to claim 1, it is characterized in that: said patrix is provided with pilot hole, and said counterdie is provided with corresponding with it register pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210299578 CN102841002A (en) | 2012-08-22 | 2012-08-22 | Epoxy molding compound test mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210299578 CN102841002A (en) | 2012-08-22 | 2012-08-22 | Epoxy molding compound test mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102841002A true CN102841002A (en) | 2012-12-26 |
Family
ID=47368565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210299578 Pending CN102841002A (en) | 2012-08-22 | 2012-08-22 | Epoxy molding compound test mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102841002A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105058686A (en) * | 2015-07-21 | 2015-11-18 | 深圳市盛元半导体有限公司 | Method for fast detecting flowing length of IC packaging material |
| CN111452305A (en) * | 2020-05-29 | 2020-07-28 | 江苏华海诚科新材料股份有限公司 | Large-particle testing mold for epoxy molding compound and testing method thereof |
-
2012
- 2012-08-22 CN CN 201210299578 patent/CN102841002A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105058686A (en) * | 2015-07-21 | 2015-11-18 | 深圳市盛元半导体有限公司 | Method for fast detecting flowing length of IC packaging material |
| CN111452305A (en) * | 2020-05-29 | 2020-07-28 | 江苏华海诚科新材料股份有限公司 | Large-particle testing mold for epoxy molding compound and testing method thereof |
| CN111452305B (en) * | 2020-05-29 | 2022-02-11 | 江苏华海诚科新材料股份有限公司 | Large-particle testing mold for epoxy molding compound and testing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121226 |