CN111451917B - Wafer scribing machine for semiconductor processing - Google Patents
Wafer scribing machine for semiconductor processing Download PDFInfo
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- CN111451917B CN111451917B CN202010282749.5A CN202010282749A CN111451917B CN 111451917 B CN111451917 B CN 111451917B CN 202010282749 A CN202010282749 A CN 202010282749A CN 111451917 B CN111451917 B CN 111451917B
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- pipe
- cooling liquid
- grinding wheel
- fixedly sleeved
- cutting mechanism
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention relates to the technical field of semiconductor processing, and discloses a wafer scribing machine for semiconductor processing, which comprises a sucker workbench, wherein a round crystal is arranged on the top surface of the sucker workbench, a cutting mechanism is arranged on the top surface of the round crystal, a grinding wheel is fixedly arranged on the front surface of the cutting mechanism, a main cooling box is fixedly sleeved on the top of the grinding wheel, two sides of the main cooling box are fixedly arranged on the front surface of the top of the cutting mechanism, and a curved spray pipe is fixedly sleeved on the inner side of the top of the main cooling box. According to the invention, the cooling liquid in the cooling liquid transfer box is conveyed to the cleaning channel consisting of the first transition pipe, the adjusting pipe, the second transition pipe and the pressure nozzle by the second small pumping mechanism, and then is sprayed out from the port at the bottom of the pressure nozzle and moves along with the cutting and dividing direction of the grinding wheel to clean the silicon powder cut by the grinding wheel in time, so that the cleanliness of a processed surface is ensured, and the dividing quality of the grinding wheel on the round crystal under the action of the cutting mechanism is improved.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a wafer scribing machine for semiconductor processing.
Background
The wafer scriber comprises a grinding wheel wafer scriber and a laser wafer scriber, the existing wafer scriber is still the grinding wheel wafer scriber which integrates the precise numerical control of the technologies such as a water-gas-electricity and air static pressure high-speed main shaft, precise mechanical transmission, a sensor, automation control and the like, and is mainly used for the scribing processing of materials such as silicon integrated circuits, light-emitting diodes and the like and the specific application of the materials such as the scribing of prepared wafers, but the existing wafers have some problems to be improved in the process of the scribing of the grinding wheel wafer scriber, firstly, the grinding wheel wafer scriber lacks a cooling and cleaning device to clean silicon powder generated in a wafer scribing groove and the surface of the wafer, the silicon powder generated in the wafer scribing groove and the silicon powder generated in the wafer surface are scattered and stacked, and the grinding wheel scribing device can perform secondary dividing friction with the silicon powder scattered and stacked when the dividing track is changed, the abrasion speed of the grinding wheel scribing is accelerated, the precision is reduced, the dividing notch of the wafer is rough and has fine notches, the dividing quality is affected, the cooling effect of the grinding wheel scribing is poor, and the service life of the grinding wheel scribing is accelerated without timely heat dissipated.
Disclosure of Invention
The invention provides a wafer dicing saw for semiconductor processing, which has the advantages of removing slag on a sector, avoiding secondary dividing friction and integrally cooling, and solves the problems in the background technology.
The invention provides the following technical scheme: a wafer scribing machine for semiconductor processing comprises a sucker workbench, wherein a round crystal is arranged on the top surface of the sucker workbench, a cutting mechanism is arranged on the top surface of the round crystal, a grinding wheel is fixedly mounted on the front surface of the cutting mechanism, a main cooling box is fixedly sleeved on the top of the grinding wheel, two sides of the main cooling box are fixedly mounted on the front surface of the top of the cutting mechanism, a curved spray pipe is fixedly sleeved on the inner side of the top of the main cooling box, a first small pumping mechanism is fixedly mounted on one side of the curved spray pipe, a cooling liquid transfer box is fixedly mounted at the bottom of the first small pumping mechanism, one side of the cooling liquid transfer box is fixedly mounted on the side surface of one side of the cutting mechanism, a second small pumping mechanism is fixedly mounted at the bottom of the cooling liquid transfer box, a first transition pipe is fixedly mounted at the bottom of the second small pumping mechanism, and an adjusting pipe is movably sleeved inside the bottom of the, the fixed steering gear that has cup jointed in top of control tube, one side meshing of steering gear is connected with the spur rack, the miniature electric telescopic handle of one side fixedly connected with of spur rack, the fixed mount that has cup jointed in surface of miniature electric telescopic handle, the top surface fixed mounting of mount has the backup pad, one side fixed mounting of backup pad is in one side of cutting mechanism bottom, the outside threaded connection of control tube bottom has the second transition pipe, the inboard threaded connection of second transition bottom of tubes portion has the pressure spray tube.
And carefully selecting, wherein the bottom of the curved spray pipe is fixedly sleeved with a guide spray pipe which is of an inclined structure.
Carefully, first small-size pumping mechanism both sides are including fixed mounting have first raceway and first suction pipe, and the fixed inside that connects in curved shape spray tube one side of one end of first raceway, the fixed inboard that cup joints at the coolant liquid crossing box top in the bottom of first suction pipe, the fixed water inlet pipe that has connect of one side of coolant liquid crossing box top.
And carefully selecting, wherein a second water suction pipe and a second water delivery pipe are fixedly installed on two sides of the second small pumping mechanism, one end of the second water suction pipe is fixedly adjusted at the bottom of the cooling liquid transfer box, and the bottom end of the second water delivery pipe is fixedly sleeved at the top of the first transition pipe.
And carefully selecting, wherein a ball is movably arranged between the inner wall of the bottom of the first transition pipe and the surface of the top of the adjusting pipe, a leakage-proof ring is fixedly sleeved at the bottom of the first transition pipe, and the leakage-proof ring is movably sleeved on the surface of the top of the adjusting pipe.
The pressure nozzle is characterized in that a sealing sleeve is fixedly sleeved on the inner side of the middle of the second transition pipe, the inner wall of the top of the sealing sleeve is tightly attached to the surface of the bottom end of the adjusting pipe, the inner wall of the bottom of the sealing sleeve is closely attached to the surface of the top end of the pressure nozzle, and one end of the pressure nozzle is in a conical shape.
Carefully selecting, the length value of the straight rack is equal to the girth value of half of the steering gear, the straight rack is parallel to the micro electric telescopic rod, and the stroke value of the micro electric telescopic rod is equal to the length value of the straight rack.
Carefully, the screws are movably sleeved inside the two sides of the cooling liquid transfer box, and the screws inside the cooling liquid transfer box are in threaded connection with the front side of the cutting mechanism.
The invention has the following beneficial effects:
1. according to the invention, the cooling liquid in the cooling liquid transfer box is conveyed to the cleaning channel consisting of the first transition pipe, the adjusting pipe, the second transition pipe and the pressure nozzle by the second small pumping mechanism, and then is sprayed out from the port at the bottom of the pressure nozzle and moves along with the cutting and dividing direction of the grinding wheel to clean the silicon powder cut by the grinding wheel in time, so that the cleanliness of a processed surface is ensured, and the dividing quality of the grinding wheel on the round crystal under the action of the cutting mechanism is improved.
2. According to the invention, the straight-line motion of the straight rack driven by the miniature electric telescopic rod can be converted into the reciprocating semi-circular motion of the steering gear through the meshing connection design of the straight rack and the steering gear, so that the steering gear drives the cleaning channel consisting of the adjusting pipe, the second transition pipe and the pressure spray pipe to perform sector cleaning motion, no silicon powder residue is left on the current cutting track of the grinding wheel and the tracks to be cut on two sides, the phenomenon that the scribing abrasion speed of the grinding wheel is accelerated and the precision is reduced due to the fact that the grinding wheel performs secondary dividing friction with the silicon powder accumulated on the tracks to be cut when the grinding wheel is replaced with a dividing track is avoided, and the dividing quality is further improved.
3. According to the invention, the cooling liquid in the cooling liquid transfer box is conveyed to the inside of the curved spray pipe through the first small pumping mechanism and then is obliquely sprayed to the front side and the back side of the grinding wheel from the port of the guide water spray pipe, so that the grinding wheel is comprehensively cooled, the influence of temperature on the service life of the grinding wheel is reduced, the normal service life of the grinding wheel is maintained, and the use cost of equipment is reduced.
Drawings
FIG. 1 is a schematic front view of the structure of the present invention;
FIG. 2 is a schematic cross-sectional view of the main cooling tank of the present invention;
FIG. 3 is a left side view of the curved nozzle of the present invention;
FIG. 4 is a schematic top view of a steering gear according to the present invention;
FIG. 5 is a schematic cross-sectional view of a second transition duct constructed in accordance with the present invention;
FIG. 6 is a schematic cross-sectional view of a first transition duct constructed in accordance with the present invention;
FIG. 7 is an enlarged view of A in FIG. 1.
In the figure: 1. a suction cup table; 2. carrying out wafer rounding; 3. a cutting mechanism; 4. a grinding wheel; 5. a main cooling tank; 6. a curved nozzle; 7. a first compact pumping mechanism; 8. a cooling liquid transfer box; 9. a second compact pumping mechanism; 10. a first transition duct; 11. an adjusting tube; 12. a steering gear; 13. straight rack; 14. a miniature electric telescopic rod; 15. a fixed mount; 16. a second transition duct; 17. a pressure nozzle; 18. a first water delivery pipe; 19. a first water suction pipe; 20. a support plate; 21. a second suction pipe; 22. a second water delivery pipe; 23. guiding the spray pipe; 24. sealing sleeves; 25. a ball bearing; 26. and (5) a leakage-proof ring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-7, a wafer scriber for semiconductor processing comprises a sucker worktable 1, a wafer 2 is disposed on the top surface of the sucker worktable 1, a cutting mechanism 3 is disposed on the top surface of the wafer 2, a grinding wheel 4 is fixedly mounted on the front surface of the cutting mechanism 3, a main cooling box 5 is fixedly sleeved on the top surface of the grinding wheel 4, two sides of the main cooling box 5 are fixedly mounted on the front surface of the top of the cutting mechanism 3, a curved spray pipe 6 is fixedly sleeved on the inner side of the top of the main cooling box 5, a guiding spray pipe 23 is fixedly sleeved on the bottom of the curved spray pipe 6, the guiding spray pipe 23 is an inclined structure, the inclined structure of the guiding spray pipe 23 can forcibly change the flowing direction of the cooling liquid entering the curved spray pipe 6, the guiding spray pipe 4 is guided to the front surface and the back surface of the grinding wheel 4, the contact area between the cooling liquid and the grinding wheel 4 is indirectly increased, the cooling effect is improved, a first small-sized pumping mechanism 7 is fixedly mounted on one side of the curved spray pipe 6, the two sides of the first small pumping mechanism 7 comprise a first water delivery pipe 18 and a first water suction pipe 19 which are fixedly installed, one end of the first water delivery pipe 18 is fixedly sleeved inside one side of the curved spray pipe 6, the bottom of the first water suction pipe 19 is fixedly sleeved inside the top of the cooling liquid transfer box 8, one side of the top of the cooling liquid transfer box 8 is fixedly sleeved with a water inlet pipe, the subsequent first small pumping mechanism 7 is used for delivering the cooling liquid inside the cooling liquid transfer box 8 to the inside of the curved spray pipe 6 and then obliquely spraying the cooling liquid to the front side and the back side of the grinding wheel 4 from the port of the guide water spraying pipe 23, so that the grinding wheel 4 is comprehensively cooled, the influence of temperature on the service life of the grinding wheel 4 is reduced, the normal service life of the grinding wheel is maintained, the use cost of equipment is reduced, the cooling liquid transfer box 8 is fixedly installed at the bottom of the first small pumping mechanism 7, screws are movably sleeved inside the two sides of the cooling liquid transfer box 8, and the screw thread in the coolant transition box 8 is connected to the front of the cutting mechanism 3, the thread connection design between the coolant transition box 8 and the cutting mechanism 3 is favorable for the subsequent disassembly and maintenance of the coolant transition box 8, and is convenient for people to use, one side of the coolant transition box 8 is fixedly arranged on the side surface of one side of the cutting mechanism 3, the bottom of the coolant transition box 8 is fixedly provided with a second small pumping mechanism 9, two sides of the second small pumping mechanism 9 comprise a second water suction pipe 21 and a second water delivery pipe 22, one end of the second water suction pipe 21 is fixedly adjusted at the bottom of the coolant transition box 8, the bottom end of the second water delivery pipe 22 is fixedly sleeved at the top of the first transition pipe 10, the coolant in the coolant transition box 8 is delivered to the subsequent cleaning channel consisting of the first transition pipe 10, the adjusting pipe 11, the second transition pipe 16 and the pressure spray pipe 17 through the second small pumping mechanism 9, then, the silicon powder cut out by the grinding wheel 4 is sprayed out through a port at the bottom of the pressure spray pipe 17 and moves together along the cutting and dividing direction of the grinding wheel 4 to clean the silicon powder cut out by the grinding wheel 4 in time, the cleanliness of a processed surface is ensured, the dividing quality of the grinding wheel 4 on the round crystal 2 under the action of the cutting mechanism 3 is improved, a first transition pipe 10 is fixedly arranged at the bottom of the second small pumping mechanism 9, an adjusting pipe 11 is movably sleeved in the inner part of the bottom of the first transition pipe 10, a ball 25 is movably arranged between the inner wall of the bottom of the first transition pipe 10 and the surface of the top of the adjusting pipe 11, a leakage-proof ring 26 is fixedly sleeved at the bottom of the first transition pipe 10, the leakage-proof ring 26 is movably sleeved on the surface of the top of the adjusting pipe 11, the ball 25 provides a friction-reducing structure for the relative rotation between the first transition pipe 10 and the adjusting pipe 11, the smoothness of the rotation is improved, and the leakage-proof ring 26 reduces the cooling liquid from the 10 and an adjusting pipe 11, a steering gear 12 is fixedly sleeved at the top of the adjusting pipe 11, one side of the steering gear 12 is connected with a spur rack 13 in a meshing manner, the length value of the spur rack 13 is equal to the perimeter value of half of the steering gear 12, the spur rack 13 is parallel to a micro electric telescopic rod 14, the stroke value of the micro electric telescopic rod 14 is equal to the length value of the spur rack 13, the limitation of the length of the spur rack 13 limits the rotation amplitude of the steering gear 12 to achieve the purpose of fan-shaped motion amplitude, the limitation of the motion overtravel between the spur rack 13 and the steering gear 12 is avoided, the micro electric telescopic rod 14 is fixedly connected to one side of the spur rack 13, a fixing frame 15 is fixedly sleeved on the surface of the micro electric telescopic rod 14, a supporting plate 20 is fixedly installed on the top surface of the fixing frame 15, one side of the supporting plate 20 is fixedly installed on one side of the bottom of the cutting mechanism 3, the outer side of the bottom end of the adjusting pipe 11 is in threaded connection with a second transition pipe 16, the inner side of the middle part of the second transition pipe 16 is fixedly sleeved with a sealing sleeve 24, the inner wall of the top part of the sealing sleeve 24 is tightly attached to the surface of the bottom end of the adjusting pipe 11, the inner wall of the bottom part of the sealing sleeve 24 is tightly attached to the surface of the top end of the pressure nozzle 17, one end of the pressure nozzle 17 is conical, the design of meshing connection of the spur rack 13 and the steering gear 12 can convert the linear motion of the miniature electric telescopic rod 14 driving the spur rack 13 into the reciprocating semi-circular motion of the steering gear 12, so that the steering gear 12 drives a cleaning channel consisting of the adjusting pipe 11, the second transition pipe 16 and the pressure nozzle 17 to carry out fan-shaped cleaning motion, no silicon powder residue is left on the current cutting track of the grinding wheel 4 and the tracks to be cut on two sides, and secondary dividing friction with, the abrasion speed of the grinding wheel scribing is accelerated, the precision is reduced, the dividing quality is further improved, and the inner side of the bottom of the second transition pipe 16 is in threaded connection with a pressure spraying pipe 17.
The working principle is as follows: when the device is used, the cutting mechanism 3 drives the grinding wheel 4 to cut and divide the round crystal 2 placed on the top surface of the sucker workbench 1, the first small-sized pumping mechanism 7 and the second small-sized pumping mechanism 9 are respectively started, the first small-sized pumping mechanism 7 conveys the cooling liquid in the cooling liquid transfer box 8 to the inside of the curved spray pipe 6, then the front and the back surfaces of the grinding wheel 4 in the rotating cutting and rotating state are respectively cooled through two rows of fixedly sleeved guide water spray pipes 23 at the bottom of the curved spray pipe 6, the second small-sized pumping mechanism 9 conveys the cooling liquid in the cooling liquid transfer box 8 to a cleaning channel consisting of the first transition pipe 10, the adjusting pipe 11, the second transition pipe 16 and the pressure spray pipe 17, and then silicon powder cut by the grinding wheel 4 is timely cleaned through the ejection of a port at the bottom of the pressure spray pipe 17 and the movement along with the cutting and dividing direction of the grinding wheel 4, when the top surface of the round crystal 2 needs to be cut along multiple tracks, the miniature electric telescopic rod 14 is opened, the meshing connection design of the straight rack 13 and the steering gear 12 can convert the linear motion of the miniature electric telescopic rod 14 driving the straight rack 13 into the reciprocating semi-circular motion of the steering gear 12, and further the steering gear 12 drives the cleaning channel consisting of the adjusting pipe 11, the second transition pipe 16 and the pressure nozzle 17 to perform fan-shaped cleaning motion, so that no silicon powder is left on the cutting tracks of the grinding wheel 4 and the cutting tracks on the two sides.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Meanwhile, in the drawings of the invention, the filling pattern is only used for distinguishing the layers and is not limited at all.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (1)
1. A wafer dicing saw for semiconductor processing, comprising a chuck table (1), characterized in that: the top surface of the sucker workbench (1) is provided with a round crystal (2), the top surface of the round crystal (2) is provided with a cutting mechanism (3), the front surface of the cutting mechanism (3) is fixedly provided with a grinding wheel (4), the top of the grinding wheel (4) is fixedly sleeved with a main cooling box (5), two sides of the main cooling box (5) are fixedly arranged on the front surface of the top of the cutting mechanism (3), the inner side of the top of the main cooling box (5) is fixedly sleeved with a curved spray pipe (6), one side of the curved spray pipe (6) is fixedly provided with a first small pumping mechanism (7), the bottom of the first small pumping mechanism (7) is fixedly provided with a cooling liquid transfer box (8), one side of the cooling liquid transfer box (8) is fixedly arranged on the side surface of one side of the cutting mechanism (3), the bottom of the cooling liquid transfer box (8) is fixedly provided with a second small pumping mechanism (9), a first transition pipe (10) is fixedly arranged at the bottom of the second small pumping mechanism (9), an adjusting pipe (11) is movably sleeved in the bottom of the first transition pipe (10), a steering gear (12) is fixedly sleeved at the top of the adjusting pipe (11), a spur rack (13) is connected to one side of the steering gear (12) in a meshing manner, one side of the straight rack (13) is fixedly connected with a miniature electric telescopic rod (14), a fixed frame (15) is fixedly sleeved on the surface of the miniature electric telescopic rod (14), a supporting plate (20) is fixedly arranged on the top surface of the fixing frame (15), one side of the supporting plate (20) is fixedly arranged on one side of the bottom of the cutting mechanism (3), the outer side of the bottom end of the adjusting pipe (11) is in threaded connection with a second transition pipe (16), the inner side of the bottom of the second transition pipe (16) is in threaded connection with a pressure nozzle (17);
the bottom of the curved spray pipe (6) is fixedly sleeved with a guide spray pipe (23), and the guide spray pipe (23) is of an inclined structure;
the two sides of the first small pumping mechanism (7) comprise a first water delivery pipe (18) and a first water suction pipe (19), one end of the first water delivery pipe (18) is fixedly sleeved inside one side of the curved spray pipe (6), the bottom of the first water suction pipe (19) is fixedly sleeved on the inner side of the top of the cooling liquid transfer box (8), and one side of the top of the cooling liquid transfer box (8) is fixedly sleeved with a water inlet pipe;
two sides of the second small pumping mechanism (9) comprise a second water suction pipe (21) and a second water delivery pipe (22), one end of the second water suction pipe (21) is fixedly adjusted at the bottom of the cooling liquid transfer box (8), and the bottom end of the second water delivery pipe (22) is fixedly sleeved at the top of the first transition pipe (10);
a ball (25) is movably mounted between the inner wall of the bottom of the first transition pipe (10) and the surface of the top of the adjusting pipe (11), a leakage-proof ring (26) is fixedly sleeved at the bottom of the first transition pipe (10), and the leakage-proof ring (26) is movably sleeved on the surface of the top of the adjusting pipe (11);
a sealing sleeve (24) is fixedly sleeved on the inner side of the middle part of the second transition pipe (16), the inner wall of the top of the sealing sleeve (24) is tightly attached to the surface of the bottom end of the adjusting pipe (11), the inner wall of the bottom of the sealing sleeve (24) is tightly attached to the surface of the top end of the pressure nozzle (17), and one end of the pressure nozzle (17) is conical;
the length value of the straight rack (13) is equal to the circumferential length value of half of the steering gear (12), the straight rack (13) is parallel to the micro electric telescopic rod (14), and the stroke value of the micro electric telescopic rod (14) is equal to the length value of the straight rack (13);
screws are movably sleeved inside the two sides of the cooling liquid transfer box (8), and the screws inside the cooling liquid transfer box (8) are in threaded connection with the front face of the cutting mechanism (3).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010282749.5A CN111451917B (en) | 2020-04-12 | 2020-04-12 | Wafer scribing machine for semiconductor processing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010282749.5A CN111451917B (en) | 2020-04-12 | 2020-04-12 | Wafer scribing machine for semiconductor processing |
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| CN111451917A CN111451917A (en) | 2020-07-28 |
| CN111451917B true CN111451917B (en) | 2021-08-20 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112542407B (en) * | 2020-12-07 | 2023-10-27 | 宁波昇特微电子科技有限公司 | Scribing machine for deep ultraviolet epitaxial chip processing |
| CN114227959A (en) * | 2021-12-14 | 2022-03-25 | 湖南艾凯瑞斯智能科技有限公司 | Grinding wheel scribing machine with auxiliary cutting and positioning function for wafer processing |
| CN114310378A (en) * | 2022-02-14 | 2022-04-12 | 安徽佳峰汽车部件有限公司 | Driving shaft perforating device for automobile machining production |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101850343A (en) * | 2010-06-10 | 2010-10-06 | 中国电子科技集团公司第四十五研究所 | Wafer two-fluid cleaning device |
| CN204913567U (en) * | 2015-08-21 | 2015-12-30 | 深圳市卓悦富激光科技有限公司 | Knife rest convenient to cutting tool cooling and washing |
| CN206009277U (en) * | 2016-08-22 | 2017-03-15 | 和怡然 | A kind of high school mathematicses drawing instrument cleaning device |
| JP7034683B2 (en) * | 2017-11-29 | 2022-03-14 | 株式会社ディスコ | Peeling device |
| CN110435023A (en) * | 2019-08-14 | 2019-11-12 | 郑州光力瑞弘电子科技有限公司 | The main cooling spray of cutter and cutter cooling device, scribing machine |
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Inventor after: Du Zhiyun Inventor after: Yu Ziwei Inventor after: Hu Tian Inventor after: Hu Xiamei Inventor after: Chen Yanqing Inventor before: Hu Xiamei Inventor before: Chen Yanqing |
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Effective date of registration: 20210721 Address after: 410000 room 301a06, Chuangye building, Hunan University Science Park, 186 Guyuan Road, high tech Development Zone, Changsha, Hunan Province Applicant after: Hunan aikairuisi Intelligent Technology Co.,Ltd. Address before: Room 1-402, building 647, Century Avenue, Chongfu Town, Tongxiang City, Jiaxing City, Zhejiang Province Applicant before: Jiaxing Juteng Information Technology Co.,Ltd. |
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| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Du Zhiyun Inventor after: Yu Ziwei Inventor after: Hu Tian Inventor after: Hu Xiamei Inventor after: Chen Yanqing Inventor before: Du Zhiyun Inventor before: Yu Ziwei Inventor before: Hu Tian Inventor before: Hu Xiamei Inventor before: Chen Yanqing |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |