CN111435832A - Tuning fork quartz wafer packaging structure and method - Google Patents
Tuning fork quartz wafer packaging structure and method Download PDFInfo
- Publication number
- CN111435832A CN111435832A CN201910034415.3A CN201910034415A CN111435832A CN 111435832 A CN111435832 A CN 111435832A CN 201910034415 A CN201910034415 A CN 201910034415A CN 111435832 A CN111435832 A CN 111435832A
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- Prior art keywords
- tuning fork
- quartz wafer
- fork quartz
- metal
- mounting
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- 239000010453 quartz Substances 0.000 title claims abstract description 112
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 112
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 82
- 239000002184 metal Substances 0.000 claims abstract description 82
- 235000014676 Phragmites communis Nutrition 0.000 claims abstract description 53
- 238000007789 sealing Methods 0.000 claims abstract description 31
- 244000273256 Phragmites communis Species 0.000 claims abstract description 24
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 238000002844 melting Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 abstract description 84
- 238000009434 installation Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000001179 sorption measurement Methods 0.000 abstract description 4
- 238000003754 machining Methods 0.000 abstract 1
- 239000013078 crystal Substances 0.000 description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/21—Crystal tuning forks
- H03H9/215—Crystal tuning forks consisting of quartz
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The invention relates to a tuning fork quartz wafer packaging structure which comprises a bottom plate, wherein two horizontal metal reeds are arranged on the bottom plate, and mounting platforms for horizontally mounting tuning fork quartz wafers are arranged on the two metal reeds; the two mounting platforms are both positioned on one side of the tuning fork quartz wafer with the metal electrode connecting port; the two metal reeds are respectively and electrically connected with the metal electrode connecting port of the tuning fork quartz wafer through the conductive parts; two pins which are respectively and electrically connected with the two metal reeds and the sealing cover are arranged on the bottom plate in a penetrating way; the utility model has the advantages of realized the installation of lying to the quartz wafer of tuning fork of KHZ level, the high space that occupies when having saved the quartz wafer installation of tuning fork, the product of having solved because of the quartz wafer of tuning fork of KHZ level can only vertically install the product that leads to and can't be done thin difficult problem, the quartz wafer of tuning fork is lain and is installed the back and is encapsulated by the sealed cowling again, sealed cowling occupation space also can be less, and have great adsorption surface, be suitable for and carry out paster production, thereby the machining efficiency of the quartz wafer of tuning fork has been improved by a wide margin.
Description
Technical Field
The invention relates to the technical field of tuning fork quartz wafers, in particular to a tuning fork quartz wafer packaging structure and a tuning fork quartz wafer packaging method.
Background
The tuning fork quartz wafer is also called tuning fork crystal oscillator, and refers to a crystal oscillator with a shape similar to that of a tuning fork, and the application fields comprise clocks, watch cores, mobile phones, tablet computers, microcomputers, calculators, automatic household appliance control, automatic industrial control and the like; with the progress of the technology and the change of market application, the tuning fork crystal oscillator has the development trend of miniaturization, high precision and low power consumption; at present, the annual tuning fork crystal oscillator yield of China exceeds 40 hundred million, and the yield accounts for about 40 percent of the whole world;
at present, for tuning fork quartz wafers with the lengths of 1-6mm, the widths of 0.5-3mm and the frequencies of KHZ, as the pins are arranged on the same side, the tuning fork quartz wafers can only adopt a vertical installation mode, occupy more height space, are not beneficial to thinning products and are not suitable for patch production after product packaging.
Disclosure of Invention
The present invention provides a tuning fork quartz wafer package structure and method, which is directed to overcome the above-mentioned drawbacks of the prior art.
The technical scheme adopted by the invention for solving the technical problems is as follows:
constructing a tuning fork quartz wafer packaging structure, wherein the tuning fork quartz wafer packaging structure comprises a bottom plate, two horizontal metal reeds are arranged on the bottom plate, and mounting platforms for the tuning fork quartz wafer to be horizontally mounted are arranged on the two metal reeds; the two mounting platforms are positioned on one side of the tuning fork quartz wafer with the metal electrode connecting port; the two metal reeds are respectively and electrically connected with the metal electrode connecting port of the tuning fork quartz wafer through conductive parts;
two pins which are respectively and electrically connected with the two metal reeds and a sealing cover which covers the metal reeds and the outside of the tuning fork quartz wafer are arranged on the bottom plate in a penetrating manner.
The tuning fork quartz wafer packaging structure is characterized in that the conductive piece is the mounting platform; and the mounting platform and the metal electrode connecting port of the tuning fork quartz wafer are fixed through conductive adhesive or welded and fixed.
The tuning fork quartz wafer packaging structure comprises an inverted L-shaped conducting strip, wherein the lower end of the longitudinal edge of the conducting strip is fixedly connected or integrally formed with a metal reed or fixedly and electrically connected through a connecting piece, and the upper surface of the transverse edge of the conducting strip is used for flatly mounting the tuning fork quartz wafer.
The tuning fork quartz wafer packaging structure comprises a mounting platform, a plurality of fixing plates and a plurality of fixing plates, wherein the mounting platform further comprises a longitudinal conductive baffle which is fixedly connected with the end part of the transverse edge of the conductive sheet or integrally formed; and when the mounting platform is fixedly welded with the metal electrode connector of the tuning fork quartz wafer, the mounting platform is fixedly welded with the metal electrode connector of the tuning fork quartz wafer through the conductive baffle.
In the tuning fork quartz wafer packaging structure, one side edge of each of the two metal spring pieces is provided with a first wiring flange, and the other side edge of each of the two metal spring pieces is provided with a first avoidance notch corresponding to the first wiring flange.
The tuning fork quartz wafer packaging structure is characterized in that the length of the metal reed provided with the first avoiding notch is longer than that of the metal reed provided with the first wiring flange, and the metal reed provided with the first avoiding notch is provided with a second wiring flange; on the metal reed provided with the first avoidance notch, the first avoidance notch is positioned between the mounting platform and the second wiring flange.
The tuning fork quartz wafer packaging structure is characterized in that a third wiring flange is arranged on the side edge of the metal reed provided with the first avoiding notch; and a second avoidance notch corresponding to the third wiring flange is arranged on the side edge of the metal reed provided with the first wiring flange.
The invention relates to a tuning fork quartz wafer packaging structure, wherein the conductive piece is an electric connecting piece; one end of the electric connecting sheet is electrically connected with the metal reed, and the other end of the electric connecting sheet is positioned on a mounting position of the mounting platform for mounting the tuning fork quartz wafer.
The tuning fork quartz wafer packaging structure also comprises an insulating gasket, wherein the upper surface of the insulating gasket is provided with a mounting groove for mounting the bottom plate; two the pin lower extreme all bends towards back of the body one side of keeping away from, insulating pad lower surface be provided with the limit complex holding tank of bending of pin.
A packaging method of a tuning fork quartz wafer is provided, according to the packaging structure of the tuning fork quartz wafer, and the implementation method comprises the following steps:
the first step is as follows: placing one end of the tuning fork quartz wafer with the metal electrode connectors on the two mounting platforms, and supporting the lower part of the other end of the tuning fork quartz wafer through an insulating sheet, wherein the metal electrode connectors of the tuning fork quartz wafer respectively correspond to the two mounting platforms;
the second step is that: conducting conductive adhesive dispensing on the mounting platform, electrically connecting the metal electrode connecting port of the tuning fork quartz wafer with the conductive piece by means of the conductive adhesive, solidifying the conductive adhesive, and taking down the insulating piece;
the third step: and covering a sealing cover outside the metal reed and the tuning fork quartz wafer, and performing butt-welding self-melting sealing on the sealing cover and the bottom plate in a vacuum environment.
The invention has the beneficial effects that: the horizontal installation of the tuning fork quartz wafer of KHZ level is realized, the height space occupied by the tuning fork quartz wafer during installation is saved, the problem that the product cannot be thinned due to the fact that the tuning fork quartz wafer of KHZ level can only be longitudinally installed is solved, the tuning fork quartz wafer is packaged by the sealing cover after being horizontally installed, the occupied space of the sealing cover is small, the sealing cover has a large adsorption surface, and the sealing cover is suitable for patch production, so that the processing efficiency of the tuning fork quartz wafer is greatly improved; the whole structure is simple, the cost is extremely low, and the method is suitable for popularization and production.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described with reference to the accompanying drawings and embodiments, wherein the drawings in the following description are only part of the embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive efforts according to the accompanying drawings:
FIG. 1 is a schematic diagram of a tuning fork quartz chip package structure according to a preferred embodiment of the present invention;
FIG. 2 is an exploded view of a tuning fork quartz chip package according to a preferred embodiment of the present invention;
FIG. 3 is a side view of the tuning fork quartz chip package without the sealing cap according to the preferred embodiment of the present invention;
FIG. 4 is a top view of the tuning fork quartz chip package without the sealing cap and the tuning fork quartz chip according to the preferred embodiment of the present invention;
FIG. 5 is a top view of a tuning fork quartz chip package without a sealing cap and without a tuning fork quartz chip according to another preferred embodiment of the present invention;
FIG. 6 is a side view of a tuning fork quartz chip package without a sealing cap according to another preferred embodiment of the present invention;
FIG. 7 is a flowchart illustrating a method for packaging a tuning fork quartz chip according to a preferred embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without inventive step, are within the scope of the present invention.
Example one
The tuning fork quartz wafer packaging structure according to the preferred embodiment of the present invention is shown in fig. 1, and referring to fig. 2-4, the tuning fork quartz wafer packaging structure comprises a bottom plate 1, two horizontal metal reeds 2 are arranged on the bottom plate 1, and mounting platforms 20 for the tuning fork quartz wafer 3 to lie down are arranged on the two metal reeds 2; the two mounting platforms 20 are both positioned at one side of the tuning fork quartz wafer 3 with metal electrode connecting ports; the two metal reeds 2 are respectively and electrically connected with the metal electrode connecting ports of the tuning fork quartz wafers 3 through conductive pieces;
two pins 10 which are respectively and electrically connected with the two metal reeds 2 and a sealing cover 11 which covers the metal reeds 2 and the tuning fork quartz wafer 3 are arranged on the bottom plate 1 in a penetrating manner;
the horizontal installation of the tuning fork quartz wafer 3 of KHZ level is realized, the height space occupied by the tuning fork quartz wafer 3 during installation is saved, the problem that the product cannot be thinned due to the fact that the tuning fork quartz wafer 3 of KHZ level can only be longitudinally installed is solved, the tuning fork quartz wafer 3 is packaged by the sealing cover 11 after being horizontally installed, the height space occupied by the sealing cover 11 is smaller, the sealing cover has a larger adsorption surface, and the method is suitable for patch production, so that the processing efficiency of the tuning fork quartz wafer 3 is greatly improved; the whole structure is simple, the cost is extremely low, and the method is suitable for popularization and production;
by applying the packaging structure, the quartz crystal wafer of the tuning fork of KHZ grade can be packaged in the sealing cover with the length of 4.8-8.8mm, the width of 1-5mm and the height of 1-3mm, so that the occupied space of the quartz crystal wafer of the tuning fork of KHZ grade after packaging can be greatly reduced.
Preferably, the conductive member is a mounting platform 20; the mounting platform 20 and a metal electrode connecting port of the tuning fork quartz wafer 3 are fixed through conductive adhesive or welded and fixed; after the tuning fork quartz wafer 3 is placed on the mounting platform 20, the conductive adhesive is directly dispensed, fixed and electrically connected, or the tuning fork quartz wafer is directly welded, so that the assembly can be completed, and the processing is very simple.
Preferably, the mounting platform 20 comprises an inverted L-shaped conductive sheet 200, the lower end of the longitudinal edge of the conductive sheet 200 is fixedly connected or integrally formed with the metal reed 2 or fixed and electrically connected through a connector, and the upper surface of the transverse edge of the conductive sheet 200 is used for flatly mounting the tuning fork quartz wafer 3, so that the buffering performance is guaranteed, and the tuning fork quartz wafer 3 is conveniently and stably assembled.
Preferably, the mounting platform 20 further includes a longitudinal conductive baffle 201, and the conductive baffle 201 is fixedly connected to or integrally formed with the end of the transverse edge of the conductive sheet 200; when the mounting platform 20 is fixedly welded with the metal electrode connecting port of the tuning fork quartz wafer 3, the mounting platform is fixedly welded with the metal electrode connecting port of the tuning fork quartz wafer 3 through the conductive baffle 201; the quartz crystal wafer 3 of the tuning fork can be conveniently positioned when placed, and the dispensing operation is convenient.
Preferably, the two metal reeds 2 are provided with a first wiring flange 21 on one side edge thereof, and a first avoiding notch 22 corresponding to the first wiring flange 21 on the other side edge thereof; the width of the metal reed 2 is convenient to ensure, and the whole width of the two metal reeds is reduced.
Preferably, the length of the metal reed 2 provided with the first avoiding notch 22 is longer than that of the metal reed 2 provided with the first wiring flange 21, and the metal reed 2 provided with the first avoiding notch 22 is provided with a second wiring flange 23; on the metal reed 2 provided with the first avoidance notch 22, the first avoidance notch 22 is positioned between the mounting platform 20 and the second wiring flange 23; reduce metal reed 2's material, through first wiring flange and second wiring flange, be favorable to guaranteeing that metal reed assembles and the electricity with the outside has sufficient area occasionally to be connected to improve the reliability.
Preferably, the tuning fork quartz wafer packaging structure further comprises an insulating gasket 4, and the upper surface of the insulating gasket 4 is provided with a mounting groove 40 for mounting the bottom plate; the lower ends of the two pins 10 are bent towards the opposite side, and the lower surface of the insulating gasket 4 is provided with an accommodating groove 41 matched with the bent edge of the pin 10; preferably, the insulating gasket is provided with a through hole for the pin to pass through; the paster operation is convenient to carry out.
Example two
As shown in fig. 5, the present embodiment is substantially the same as the first embodiment, and the same parts are not repeated herein, except that: a third wiring flange 24 is arranged on the side edge of the metal reed 2 provided with the first avoidance notch 22; a second avoidance notch 25 corresponding to the third wiring flange 24 is arranged on the side edge of the metal reed 2 provided with the first wiring flange 21; the two metal reeds 2 with the structure can also realize the effect of the embodiment, and although the materials of the metal reeds 2 are increased, the installation reliability can be improved.
EXAMPLE III
As shown in fig. 6, the present embodiment is substantially the same as the first embodiment, and the same parts are not repeated herein, except that: the conductive piece is an electric connection sheet 5; one end of the electric connecting sheet 5 is electrically connected with the metal reed 2, and the other end is positioned on a mounting position of the mounting platform 20 for mounting the tuning fork quartz wafer 3; in this manner, the mounting platform may be electrically conductive or non-conductive; meanwhile, the electrical connection sheet 5 is located at the mounting position portion of the mounting platform 20, and may be laid, inclined or longitudinal.
Example four
According to the tuning fork quartz wafer packaging structure, as shown in fig. 7, the implementation method is as follows:
s01: placing one end of the tuning fork quartz wafer with the metal electrode connectors on the two mounting platforms, and supporting the lower part of the other end of the tuning fork quartz wafer through an insulating sheet, wherein the metal electrode connectors of the tuning fork quartz wafer respectively correspond to the two mounting platforms;
s02: conducting conductive adhesive dispensing on the mounting platform, electrically connecting the metal electrode connecting port of the tuning fork quartz wafer with the conductive piece by means of the conductive adhesive, solidifying the conductive adhesive, and taking down the insulating piece;
s03: covering a sealing cover outside the metal reed and the tuning fork quartz wafer, and performing butt-welding self-melting sealing on the sealing cover and the bottom plate in a vacuum environment;
preferably, the conductive adhesive is conductive silver adhesive;
the horizontal installation of the tuning fork quartz wafer of KHZ level is realized, the height space occupied by the tuning fork quartz wafer during installation is saved, the problem that the product cannot be thinned due to the fact that the tuning fork quartz wafer of KHZ level can only be longitudinally installed is solved, the tuning fork quartz wafer is packaged by the sealing cover after being horizontally installed, the height space occupied by the sealing cover is smaller, the sealing cover has a larger adsorption surface, and the sealing cover is suitable for patch production, so that the processing efficiency of the tuning fork quartz wafer is greatly improved; the whole structure is simple, the cost is extremely low, and the method is suitable for popularization and production.
The traditional tuning fork crystal is in cylindrical vertical extrusion packaging; the disadvantages are that 1, two electrodes on the wafer are connected and fixed by solder paste, so that when reflow soldering is carried out on a pcb of a product, the wafer on the tuning fork crystal can fall off or move, and finally the tuning fork crystal cannot be used; the selected mounting and connecting mode is conductive silver adhesive, the conductive silver adhesive can resist 500 ℃, and the soldering paste is melted at 160 ℃.
2. Extrusion packaging is conventional. The traditional extrusion packaging places are also sealed by tin plating, and the problem that a large amount of sealing degree is poor due to the fact that the tin plating layer is affected while reflow soldering is carried out is solved. And the butt-welding self-melting sealing is adopted, so that the stability is good and the influence of high temperature is avoided.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (10)
1. A tuning fork quartz wafer packaging structure is characterized by comprising a bottom plate, wherein two horizontal metal reeds are arranged on the bottom plate, and mounting platforms for the tuning fork quartz wafer to be horizontally mounted are arranged on the two metal reeds; the two mounting platforms are positioned on one side of the tuning fork quartz wafer with the metal electrode connecting port; the two metal reeds are respectively and electrically connected with the metal electrode connecting port of the tuning fork quartz wafer through conductive parts;
two pins which are respectively and electrically connected with the two metal reeds and a sealing cover which covers the metal reeds and the outside of the tuning fork quartz wafer are arranged on the bottom plate in a penetrating manner.
2. The tuning fork quartz wafer package structure of claim 1, wherein the conductive member is the mounting platform; and the mounting platform and the metal electrode connecting port of the tuning fork quartz wafer are fixed through conductive adhesive or welded and fixed.
3. The package structure of claim 2, wherein the mounting platform comprises an inverted L-shaped conductive plate, the lower end of the longitudinal edge of the conductive plate is fixedly connected or integrally formed with the metal spring or fixed and electrically connected by a connector, and the upper surface of the transverse edge of the conductive plate is used for flatly mounting the tuning fork quartz wafer.
4. The packaging structure of claim 3, wherein the mounting platform further comprises a longitudinal conductive baffle, and the conductive baffle is fixedly connected with or integrally formed with the end of the transverse edge of the conductive plate; and when the mounting platform is fixedly welded with the metal electrode connector of the tuning fork quartz wafer, the mounting platform is fixedly welded with the metal electrode connector of the tuning fork quartz wafer through the conductive baffle.
5. The package structure of claim 1, wherein the two metal reeds have a first wiring flange formed on one side edge thereof and a first avoiding notch formed on the other side edge thereof, the first avoiding notch corresponding to the first wiring flange.
6. The packaging structure of claim 5, wherein the length of the metal reed provided with the first avoiding notch is longer than that of the metal reed provided with the first wiring flange, and a second wiring flange is arranged on the metal reed provided with the first avoiding notch; on the metal reed provided with the first avoidance notch, the first avoidance notch is positioned between the mounting platform and the second wiring flange.
7. The packaging structure of claim 5, wherein a third wiring flange is disposed on the side of the metal reed on which the first avoiding notch is disposed; and a second avoidance notch corresponding to the third wiring flange is arranged on the side edge of the metal reed provided with the first wiring flange.
8. The package structure of claim 1, wherein the conductive member is an electrical connection pad; one end of the electric connecting sheet is electrically connected with the metal reed, and the other end of the electric connecting sheet is positioned on a mounting position of the mounting platform for mounting the tuning fork quartz wafer.
9. The tuning fork quartz wafer packaging structure of any one of claims 1 to 8, wherein the tuning fork quartz wafer packaging structure further comprises an insulating gasket, and a mounting groove for mounting the bottom plate is formed on the upper surface of the insulating gasket; two the pin lower extreme all bends towards back of the body one side of keeping away from, insulating pad lower surface be provided with the limit complex holding tank of bending of pin.
10. A tuning fork quartz wafer packaging method, the tuning fork quartz wafer packaging structure according to any one of claims 1-9, characterized in that the implementation method is as follows:
the first step is as follows: placing one end of the tuning fork quartz wafer with the metal electrode connectors on the two mounting platforms, and supporting the lower part of the other end of the tuning fork quartz wafer through an insulating sheet, wherein the metal electrode connectors of the tuning fork quartz wafer respectively correspond to the two mounting platforms;
the second step is that: conducting conductive adhesive dispensing on the mounting platform, electrically connecting the metal electrode connecting port of the tuning fork quartz wafer with the conductive piece by means of the conductive adhesive, solidifying the conductive adhesive, and taking down the insulating piece;
the third step: and covering a sealing cover outside the metal reed and the tuning fork quartz wafer, and performing butt-welding self-melting sealing on the sealing cover and the bottom plate in a vacuum environment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910034415.3A CN111435832A (en) | 2019-01-15 | 2019-01-15 | Tuning fork quartz wafer packaging structure and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910034415.3A CN111435832A (en) | 2019-01-15 | 2019-01-15 | Tuning fork quartz wafer packaging structure and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111435832A true CN111435832A (en) | 2020-07-21 |
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ID=71580013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910034415.3A Pending CN111435832A (en) | 2019-01-15 | 2019-01-15 | Tuning fork quartz wafer packaging structure and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111435832A (en) |
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2019
- 2019-01-15 CN CN201910034415.3A patent/CN111435832A/en active Pending
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