CN111432611A - VPX machine case with heat dissipation function - Google Patents
VPX machine case with heat dissipation function Download PDFInfo
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- CN111432611A CN111432611A CN202010392693.9A CN202010392693A CN111432611A CN 111432611 A CN111432611 A CN 111432611A CN 202010392693 A CN202010392693 A CN 202010392693A CN 111432611 A CN111432611 A CN 111432611A
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- vpx
- generation chip
- board card
- card slot
- heat dissipation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
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- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a VPX case with a heat dissipation function, which comprises a case and a VPX board card slot, wherein the VPX board card slot is arranged in the case; the temperature difference power generation device is characterized by further comprising a temperature difference power generation chip, an interface heat conduction material and a cooling fan, wherein the temperature difference power generation chip is arranged between the shell and the VPX board card slot; the hot end of the temperature difference power generation chip is in contact with the VPX board card slot, the cold end of the temperature difference power generation chip is in contact with the shell, and the fan is installed between the shell and the VPX board card slot; the interface heat conduction material is filled in a contact surface between the cold end of the thermoelectric generation chip and the shell, and a contact surface between the hot end of the thermoelectric generation chip and the VPX board card slot so as to reduce heat conduction resistance; the thermoelectric generation chip provides power for the cooling fan. This embodiment utilizes thermoelectric generation chip to absorb heat energy, utilizes radiator fan to dispel the heat simultaneously, improves the radiating efficiency when the energy saving.
Description
Technical Field
The invention relates to the technical field of communication, in particular to a VPX case with a heat dissipation function.
Background
The multi-Protocol exchange (VPX) is a new generation of high-speed serial bus standard proposed by vita (VME international trade association) in 2007 on the basis of its VME bus parallel bus technology. The VPX bus technology improves the power supply capability of a power supply, and in one slot of the VME bus, the power supply with 5V can only provide 90W of maximum power. The VPX bus can provide 115W power only with 5V power, and 384W and 768W power can be provided with 12V and 48V power, so that the VPX daughter card can integrate more modules with high power supply, and the heat dissipation problem of the VPX bus architecture is more serious.
At present, the traditional heat dissipation methods include the following:
1. the metal conduction heat dissipation depends on the convection and radiation heat dissipation of the VPX case and air. This method has a disadvantage of low heat dissipation efficiency.
2. One way of liquid cooling heat dissipation is to mount the VPX board card on an aluminum plate or other metal plate with a higher thermal conductivity, to transfer heat to the sidewall, where the sidewall integrates a cold plate function, and to take away the heat through the cooling liquid. The other mode is that the VPX plate is arranged on the surface of the water cooling plate, then the VPX plate is connected to a liquid cooling pipeline through an interface, and cooling liquid is directly distributed to the water cooling plate of the VPX plate card for heat exchange. The mode has the defects of complex heat dissipation device, large volume, high cost, inconvenient installation and maintenance, easy occurrence of liquid leakage and low safety.
3. The forced air cooling heat dissipation mode is that a fan is adopted to carry out forced convection on air cooling heat dissipation fins of the VPX board card, and heat of the VPX board card is taken away through heat convection between air and the fins. For the forced air cooling heat dissipation mode, the fan has large power consumption, so that the forced air cooling heat dissipation mode is not suitable for use occasions with limited power consumption, such as aircraft equipment, vehicle-mounted equipment and the like.
Disclosure of Invention
The invention provides a VPX case with a heat dissipation function, aiming at solving the problem of poor heat dissipation of the VPX case, and the heat dissipation of the VPX case can be improved.
In order to achieve the purpose of the invention, the technical scheme is as follows: a VPX case with a heat dissipation function comprises a case and a VPX board card slot, wherein the VPX board card slot is arranged in the case; the temperature difference power generation device is characterized by further comprising a temperature difference power generation chip, an interface heat conduction material and a cooling fan, wherein the temperature difference power generation chip is arranged between the shell and the VPX board card slot; the hot end of the temperature difference power generation chip is in contact with the VPX board card slot, the cold end of the temperature difference power generation chip is in contact with the shell, and the fan is installed between the shell and the VPX board card slot; the interface heat conduction material is filled in a contact surface between the cold end of the thermoelectric generation chip and the shell, and a contact surface between the hot end of the thermoelectric generation chip and the VPX board card slot so as to reduce heat conduction resistance; the thermoelectric power generation chip converts the heat energy into electric energy and provides a power supply for the cooling fan.
The heat energy generated by the VPX board card slot during working can be converted into electric energy by adopting the thermoelectric generation chip, and the electric energy is supplied to the cooling fan for working. The heat dissipation fan further dissipates heat of the VPX board card slot after working, and interface heat conduction materials are filled in the contact surface between the cold end of the thermoelectric generation chip and the shell and the contact surface between the hot end of the thermoelectric generation chip and the VPX board card slot so as to increase the heat conductivity between the thermoelectric generation chip and the shell and between the thermoelectric generation chip and the VPX board card slot, so that the heat conduction thermal resistance is reduced.
This embodiment utilizes thermoelectric generation chip to absorb heat energy, dispels the heat through utilizing radiator fan, improves the radiating efficiency when the energy saving.
Preferably, the inside surface of casing is equipped with local boss, the height of local boss unanimous with thermoelectric generation chip's thickness dimension, local boss and thermoelectric generation chip's cold junction contact.
Furthermore, the outer side surface of the casing is provided with radiating fins, and the radiating fins correspond to the local bosses.
And furthermore, an air inlet is formed in the bottom of the shell, an air outlet is formed in the top of the shell, and an air channel passing through the VPX board card slot is formed.
Furthermore, the interface heat conduction material adopts a heat conduction silica gel gasket, and the thickness of the heat conduction silica gel gasket is 1-3 mm.
Furthermore, the interface heat conduction material adopts heat conduction silicone grease, and the coating thickness of the heat conduction silicone grease is 0.2-0.4 mm.
Still further, both sides of the casing are provided with handles.
The invention has the following beneficial effects:
the heat energy generated by the VPX board card slot during working can be converted into electric energy by adopting the thermoelectric generation chip, and the electric energy is supplied to the cooling fan for working. This embodiment utilizes thermoelectric generation chip to absorb heat energy, dispels the heat through utilizing radiator fan, improves the radiating efficiency when the energy saving.
Drawings
Fig. 1 is a structural sectional view of a VPX chassis having a heat dissipation function according to embodiment 1.
Fig. 2 is a rear sectional view of a VPX chassis with heat dissipation function according to embodiment 2.
In the figure, 1-machine shell, 2-cooling fan, 3-VPX board card, 4-interface heat conduction material, 5-thermoelectric power generation chip, 6-VPX board card slot, 7-air inlet, 8-handle and 9-air outlet.
Detailed Description
The invention is described in detail below with reference to the drawings and the detailed description.
Example 1
As shown in fig. 1 and 2, a VPX chassis with a heat dissipation function includes a housing 1 and a VPX board card slot 6, where the VPX board card slot 6 is disposed inside the housing 1; the temperature difference power generation device further comprises a temperature difference power generation chip 5, an interface heat conduction material 4 and a cooling fan 2, wherein the temperature difference power generation chip 5 is arranged between the shell 1 and the VPX board card slot 6; the hot end of the temperature difference power generation chip 5 is in contact with the VPX board card slot 6, the cold end of the temperature difference power generation chip 5 is in contact with the casing 1, and the cooling fan 2 is arranged between the casing 1 and the VPX board card slot 6; the interface heat conduction material 4 is filled in a contact surface between the cold end of the thermoelectric generation chip 5 and the shell 1, and a contact surface between the hot end of the thermoelectric generation chip 5 and the VPX board card slot 6 so as to reduce heat conduction resistance; the thermoelectric generation chip 5 converts the heat energy into electric energy and provides power for the cooling fan 2. The VPX board card slot 6 is used for installing the VPX board card 3.
In this embodiment, the thermoelectric generation chip 5 is adopted to convert the heat energy generated by the VPX board card slot 6 during operation into electric energy, and the electric energy is provided to the cooling fan 2 for operation. After the heat dissipation fan 2 works, heat is further dissipated from the VPX board card slot 6, and in order to increase the heat conductivity between the thermoelectric generation chip 5 and the casing 1 and between the thermoelectric generation chip 5 and the VPX board card slot 6, the interface heat conduction material 4 is filled in the contact surface between the cold end of the thermoelectric generation chip 5 and the casing 1, the hot end of the thermoelectric generation chip 5 and the contact surface of the VPX board card slot 6, so that the heat conduction resistance is reduced.
This embodiment utilizes thermoelectric generation chip 5 to absorb heat energy, dispels the heat through utilizing radiator fan 2, improves the radiating efficiency when the energy saving.
In a specific embodiment, the inner side surface of the casing 1 is provided with local bosses which are arranged at the top and the bottom of the casing 1; the height of local boss be unanimous with thermoelectric generation chip 5's thickness dimension, can satisfy thermoelectric generation chip 5's installation demand. The local boss is in contact with the cold end of the thermoelectric generation chip 5.
In a specific embodiment, the outer side surface of the casing 1 is provided with heat dissipation fins, and the heat dissipation fins correspond to the local bosses, that is, the heat dissipation fins are arranged on the outer side of the casing corresponding to the local bosses inside the casing 1, and the heat dissipation fins can meet the heat dissipation requirement of the thermoelectric power generation chip. The heat dissipation fin described in this embodiment is the content of the prior art.
In a specific embodiment, an air inlet 7 is arranged at the bottom of the casing 1, an air outlet 9 is arranged at the top of the casing 1 to form an air duct passing through the VPX board card slot 6, and a heat dissipation fan 2 is arranged at the air outlet 9. In practical application, the positions of the air inlet 7 and the air outlet 9 may not be limited, as long as the air duct design is met.
The cooling fan 2 is preferably a turbofan, the turbofan is also called a centrifugal fan, and the air flow direction of the turbofan is perpendicular to the rotating shaft, so that cold air can be sucked to the top of the machine shell from an air inlet at the bottom of the machine shell through a vpx board card and discharged from an air outlet at the top of the machine shell to form an air draft system, and the turbofan can output larger air volume in a smaller space. In a specific embodiment, the heat dissipation fan may use an axial fan, and cool air is sucked from the air inlet 7 at the bottom of the housing 1 to the top of the VPX chassis through the VPX board 3, preferably blown to the air outlet 9, and exhausted from the air outlet 9 at the top of the housing 1, in this case, the distance between the housing 1 and the VPX board slot 6 is larger than that in the case of using a turbo fan.
In a specific embodiment, the interface heat conduction material 4 is a heat conduction silica gel gasket, and the heat conduction silica gel gasket is preferably a GPA3000 and/or HGD5000 heat conduction silica gel gasket with a thickness of 1-3 mm. Long-term and large-scale tests prove that when GPA3000 and/or HGD5000 heat-conducting silica gel gaskets with the thickness of 1-3mm are selected, the heat dissipation efficiency brought by the extrusion contact is the highest.
In the embodiment, the heat-conducting silica gel gasket is in pressing contact with the thermoelectric generation chip 5, and the compression amount is 20-40%. Specifically, the compression amount described in this embodiment is the reduction amount of the volume of the gasket after compression. When the compression amount of the heat-conducting non-metallic gasket is less than 20%, the heat resistance between the heating chip and the local boss is large due to the heat-conducting non-metallic gasket, and the heat dissipation effect is relatively poor. When the compression amount is more than 40%, the heat-conducting non-metallic gasket is gradually converted into a rigid material due to excessive pressure, so that the heat-generating chip is damaged by the excessive pressure and the heat-dissipating efficiency is not increased. When the compression amount is 20-40%, the heat dissipation effect is best, and the use safety of the thermoelectric generation chip 5 is highest.
In a specific embodiment, the interface heat conduction material 4 is made of heat conduction silicone grease, preferably KDZ-2 and/or RKT L-DRZ-1, and the coating thickness is 0.2-0.4 mm.
In a specific embodiment, the two sides of the casing 1 are both provided with handles 8, which is convenient for operating the VPX chassis. The casing 1 is made of aluminum alloy materials.
The working principle of the embodiment is as follows: when the VPX board card 3 works and generates heat, and when a certain temperature is reached, the temperature difference power generation chip 5 absorbs the heat of the VPX board card 3 to realize heat dissipation, meanwhile, the temperature difference power generation chip 5 can generate power to supply power to the heat dissipation fan 2, the heat dissipation fan 2 drives air to enter from the air inlet 7 and discharge from the air outlet 9 to take away hot air in the machine shell, and further heat dissipation is realized.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (7)
1. A VPX case with a heat dissipation function comprises a case and a VPX board card slot, wherein the VPX board card slot is arranged in the case; the method is characterized in that: the temperature difference power generation device is characterized by further comprising a temperature difference power generation chip, an interface heat conduction material and a cooling fan, wherein the temperature difference power generation chip is arranged between the shell and the VPX board card slot; the hot end of the temperature difference power generation chip is in contact with the VPX board card slot, the cold end of the temperature difference power generation chip is in contact with the shell, and the fan is installed between the shell and the VPX board card slot; the interface heat conduction material is filled in a contact surface between the cold end of the thermoelectric generation chip and the shell, and a contact surface between the hot end of the thermoelectric generation chip and the VPX board card slot so as to reduce heat conduction resistance; the thermoelectric power generation chip converts the heat energy into electric energy and provides a power supply for the cooling fan.
2. The VPX chassis with heat dissipation function of claim 1, wherein: the inboard surface of casing is equipped with local boss, the height of local boss unanimous with thermoelectric generation chip's thickness dimension, local boss and thermoelectric generation chip's cold junction contact.
3. The VPX chassis with heat dissipation function of claim 2, wherein: the outer side surface of the shell is provided with radiating fins, and the radiating fins correspond to the local bosses.
4. The VPX cabinet with heat dissipation function of claim 3, wherein: the bottom of the shell is provided with an air inlet, and the top of the shell is provided with an air outlet, so that an air duct passing through the VPX board card slot is formed.
5. The VPX chassis with heat dissipation function of claim 1, wherein: the interface heat conduction material adopts a heat conduction silica gel gasket, and the thickness of the heat conduction silica gel gasket is 1-3 mm.
6. The VPX chassis with heat dissipation function of claim 1, wherein: the interface heat conduction material adopts heat conduction silicone grease, and the coating thickness of the interface heat conduction material is 0.2-0.4 mm.
7. A VPX cabinet with a heat dissipation function according to any one of claims 1 to 6, wherein: handles are arranged on two sides of the casing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2020103576085 | 2020-04-29 | ||
| CN202010357608 | 2020-04-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111432611A true CN111432611A (en) | 2020-07-17 |
| CN111432611B CN111432611B (en) | 2022-09-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010392693.9A Active CN111432611B (en) | 2020-04-29 | 2020-05-11 | VPX machine case with heat dissipation function |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201075884Y (en) * | 2007-09-24 | 2008-06-18 | 华为技术有限公司 | Radiating device and electronic equipment cabinet |
| CN207516919U (en) * | 2017-11-10 | 2018-06-19 | 上海鼎钛克电子有限公司 | A kind of high efficiency and heat radiation VPX system platforms |
| CN108599623A (en) * | 2018-05-11 | 2018-09-28 | 东北大学 | A kind of modular thermo-electric generation radiator |
| CN108693945A (en) * | 2018-07-16 | 2018-10-23 | 长沙理工大学 | A kind of self power generation high-availability computer radiator and from temperature difference control method |
| CN108829207A (en) * | 2018-08-22 | 2018-11-16 | 北京航天长征飞行器研究所 | A kind of snap-gauge shell, VPX cabinet and VPX processor |
| CN209149239U (en) * | 2018-12-10 | 2019-07-23 | 上海鼎钛克电子有限公司 | Heat radiating type VPX system test platform |
| CN110062565A (en) * | 2019-04-25 | 2019-07-26 | 中国船舶重工集团公司第七一六研究所 | Soaking plate based on thermoelectric cooling technology reinforces server efficient radiating apparatus and method |
-
2020
- 2020-05-11 CN CN202010392693.9A patent/CN111432611B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201075884Y (en) * | 2007-09-24 | 2008-06-18 | 华为技术有限公司 | Radiating device and electronic equipment cabinet |
| CN207516919U (en) * | 2017-11-10 | 2018-06-19 | 上海鼎钛克电子有限公司 | A kind of high efficiency and heat radiation VPX system platforms |
| CN108599623A (en) * | 2018-05-11 | 2018-09-28 | 东北大学 | A kind of modular thermo-electric generation radiator |
| CN108693945A (en) * | 2018-07-16 | 2018-10-23 | 长沙理工大学 | A kind of self power generation high-availability computer radiator and from temperature difference control method |
| CN108829207A (en) * | 2018-08-22 | 2018-11-16 | 北京航天长征飞行器研究所 | A kind of snap-gauge shell, VPX cabinet and VPX processor |
| CN209149239U (en) * | 2018-12-10 | 2019-07-23 | 上海鼎钛克电子有限公司 | Heat radiating type VPX system test platform |
| CN110062565A (en) * | 2019-04-25 | 2019-07-26 | 中国船舶重工集团公司第七一六研究所 | Soaking plate based on thermoelectric cooling technology reinforces server efficient radiating apparatus and method |
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| CN111432611B (en) | 2022-09-20 |
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