CN111431019A - Double-sided conduction cooling multi-slice laser head - Google Patents
Double-sided conduction cooling multi-slice laser head Download PDFInfo
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- CN111431019A CN111431019A CN202010112706.2A CN202010112706A CN111431019A CN 111431019 A CN111431019 A CN 111431019A CN 202010112706 A CN202010112706 A CN 202010112706A CN 111431019 A CN111431019 A CN 111431019A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/07—Construction or shape of active medium consisting of a plurality of parts, e.g. segments
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0404—Air- or gas cooling, e.g. by dry nitrogen
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0405—Conductive cooling, e.g. by heat sinks or thermo-electric elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
Abstract
The embodiment of the invention provides a double-sided conduction cooling multi-slice laser head, which comprises: the gain medium, the heat sink, the cooling metal, a first contact object between the gain medium and the heat sink and a second contact object between the heat sink and the cooling metal; the gain medium and the heat sink are both in a sheet shape and are arranged separately in parallel at intervals; the cooling metal is arranged at the periphery of the gain medium and the heat sink, the cooling temperature is constant, the centers of the gain medium and the heat sink are coaxial, and the plane of the gain medium is vertical to the central axis; the edge of the gain medium is connected with the edge of the heat sink through a first contact; the edges of the two faces of the heat sink are connected with the inner wall of the cooling metal through the second contact. The double-sided conduction cooling multi-slice laser head provided by the embodiment of the invention has the advantages of no special requirements of gradual change, interval or gradient doping and the like of a gain medium, simple cooling action process, compact structure and good heat dissipation effect, and is favorable for high-power output of a multi-slice laser.
Description
Technical Field
The invention relates to the technical field of laser, in particular to a double-sided conduction cooling multi-slice laser head.
Background
In order to meet the requirements of higher power laser output and compact structure, especially under the traction of laser fusion requirements, high-power all-solid-state lasers based on a multi-slice structure are receiving wide attention. The structure adopts a plurality of thin gain media separated at intervals, can provide higher gain, and can effectively remove waste heat in the media through low-temperature helium or direct liquid cooling so as to ensure the normal operation of the laser.
In the prior art, for a low-temperature helium gas cooled laser amplifier, a gradually-changed and interval-doped or gradient-doped laminated gain medium is selected for multiple purposes, a liquid directly-cooled thin solid laser medium is obtained by directly immersing the thin gain medium into a cooling liquid, laser directly transmits the cooling liquid and the thin medium, the consumption of the laser penetrating through the cooling liquid and the thin sheet can be greatly reduced by selecting the cooling liquid with matched refractive index, the serial connection of a large number of thin sheets can be realized, and the method is one of the technical routes for realizing high-power output of one hundred thousand watts by the solid laser.
However, when cryogenic cooling is adopted, the gain medium is made of a stack of gradual and spaced doping or gradient doping, which undoubtedly increases the difficulty and complexity of the preparation of the gain medium; when liquid is adopted for direct cooling, as laser directly penetrates through cooling liquid, the flow field characteristic, the thermodynamic characteristic and various optical characteristics in laser oscillation are mutually coupled, so that the action process is complicated.
Disclosure of Invention
The embodiment of the invention provides a double-sided conduction cooling multi-slice laser head, which is used for solving the technical problems in the prior art.
In order to solve the above technical problem, in one aspect, an embodiment of the present invention provides a double-sided conduction cooling multi-sheet laser head, including:
The gain medium, the heat sink, the cooling metal, a first contact object between the gain medium and the heat sink and a second contact object between the heat sink and the cooling metal;
The gain medium and the heat sink are both sheet-shaped, and the gain medium and the heat sink are arranged in parallel at intervals and separately; the cooling metal is arranged on the periphery of the gain medium and the heat sink, the centers of the gain medium and the heat sink are coaxial, and the plane of the gain medium is vertical to the central axis;
The edge of the gain medium is connected with the edge of the heat sink through a first contact, so that a first interlayer is formed between the gain medium and the heat sink;
The edges of the two surfaces of the heat sink are connected with the inner wall of the cooling metal through a second contact, so that a second interlayer is formed between the heat sink and the cooling metal, and a third interlayer is formed between the gain medium and the cooling metal.
Further, the gain medium has a thickness of less than 10 millimeters.
Further, the thickness of the first interlayer is less than 100 microns.
Further, the gas pressure within the first interlayer is less than or equal to 1 bar.
Further, inert gas, hydrogen or nitrogen is filled in the first interlayer.
Further, the material of the heat sink is sapphire.
Further, the material of the cooling metal is copper, and the constant cooling temperature is 100K or 80K.
Further, the second interlayer is filled with vacuum, and the third interlayer is filled with vacuum.
Further, the gain medium is made of Yb CaF 2Or Yb is YAG.
Furthermore, helium is filled in the first interlayer.
The double-sided conduction cooling multi-slice laser head provided by the embodiment of the invention has the advantages of no special requirements of gradual change, interval or gradient doping and the like of a gain medium, simple cooling action process, compact structure and good heat dissipation effect, and is favorable for high-power output of a multi-slice laser.
Drawings
FIG. 1 is a schematic diagram of a double-sided conduction-cooled multi-slice laser head according to an embodiment of the present invention;
Fig. 2 is a schematic diagram of a heat dissipation principle of a double-sided conduction cooling multi-slice laser head provided by an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
the high-power all-solid-state laser of laser diode (L D) pump is a hot spot of competitive research in the field of current international laser technology, and has wide application in the fields of advanced manufacturing, precision detection, fusion research, military and the like, but the development of the high-power all-solid-state laser is always limited by the heat effect because a large amount of useless heat is generated while the gain medium outputs laser in the high-power pumping process, and the existence of the useless heat can cause adverse effects such as thermal lens, thermal stress, depolarization, birefringence and the like, so that the quality of laser beams is reduced, the output power is limited, even the working medium is damaged, and the maximum output power of the laser is severely limited.
The foreign Giesen et al realized the span from concept proposition to specific experiments for the thin-chip laser, and designed the scheme from single-pass to multi-pass pumping of the thin chip, which has become the most used pumping mode in the thin-chip laser. Many domestic units also carry out the research of the multi-pass pumping thin slice, but because the limited gain medium volume of the thin slice laser restricts the energy storage of the laser, the thin slice laser research of the multi-slice serial connection is carried out at home and abroad for realizing the laser output with higher power, the scheme of the multi-slice serial connection can make up the disadvantage of insufficient energy storage of a single thin slice laser, but the serial connection scheme structure is generally more complex and has larger volume.
In order to meet the requirements of higher power laser output and compact structure, especially under the traction of laser fusion requirements, high-power all-solid-state lasers based on a multi-slice structure are receiving wide attention. The structure adopts a plurality of thin gain media separated at intervals, can provide higher gain, and can effectively remove waste heat in the media through low-temperature helium or direct liquid cooling so as to ensure the normal operation of the laser. A gradual change and interval doping or gradient doping laminated gain medium is selected for a laser amplifier for cooling low-temperature helium at home and abroad, a solid laser medium of a liquid direct cooling sheet is directly immersed into cooling liquid, laser directly transmits the cooling liquid and the sheet medium, the consumption of the laser penetrating through the cooling liquid and the sheet can be greatly reduced by selecting the cooling liquid with matched refractive index, the serial connection of a large number of sheets can be realized, and the laser amplifier is one of technical routes for realizing high-power output of hundred thousand watts by solid laser.
At present, scholars at home and abroad always strive for high-power laser output of a thin-chip laser, and the problems of difficult energy storage improvement, difficult power scaling and amplification, complicated inter-chip serial optical system and failure to embody compact structure are caused by limited single-chip gain of the thin-chip laser. When the gain medium is developed from a single sheet to multiple sheets, the cooling mode is also directly connected with a heat sink from the initial end face, and the heat sink can be water-cooled, air-cooled, etc., and is developed to adopt low-temperature cooling and liquid direct cooling. However, for the design research of the multi-chip laser, when cryogenic cooling is adopted, the gain medium is subjected to gradual change and interval doping or gradient doping lamination, which undoubtedly increases the preparation difficulty and complexity of the gain medium; when liquid is adopted for direct cooling, as laser directly penetrates through cooling liquid, the flow field characteristic, the thermodynamic characteristic and various optical characteristics in laser oscillation are mutually coupled, so that the action process is complicated. Although some low frequency aberrations can be corrected by active optical control techniques, the beam quality of the laser beam needs to be better controlled when high frequency turbulence is generated in the laser light path.
In order to solve the technical problem, the embodiment of the invention provides a double-sided conduction cooled multi-sheet laser head, wherein a gain medium is a plurality of sheets which are separated at intervals, a heat dissipation method that heat is led into a heat sink from two sides of the gain medium through low-pressure gas and then is transferred to external cooling metal through the heat sink is adopted, the purpose of effectively dissipating heat of the multi-sheet laser head is achieved, and a new technical means is provided for the research of a high-power multi-sheet laser.
Fig. 1 is a schematic view of a double-sided conduction-cooled multi-slice laser head structure according to an embodiment of the present invention, and as shown in fig. 1, the embodiment of the present invention provides a double-sided conduction-cooled multi-slice laser head, including: the gain medium, the heat sink, the cooling metal, a first contact object between the gain medium and the heat sink and a second contact object between the heat sink and the cooling metal;
The gain medium and the heat sink are both sheet-shaped, and the gain medium and the heat sink are arranged in parallel at intervals and separately; the cooling metal is arranged on the periphery of the gain medium and the heat sink, the centers of the gain medium and the heat sink are coaxial, and the plane of the gain medium is vertical to the central axis;
The edge of the gain medium is connected with the edge of the heat sink through a first contact, so that a first interlayer is formed between the gain medium and the heat sink;
The edges of the two surfaces of the heat sink are connected with the inner wall of the cooling metal through a second contact, so that a second interlayer is formed between the heat sink and the cooling metal, and a third interlayer is formed between the gain medium and the cooling metal.
Specifically, fig. 2 is a schematic diagram of a heat dissipation principle of a double-sided conduction cooling multi-sheet laser head according to an embodiment of the present invention, and as shown in fig. 2, the entire structural system includes a plurality of discrete sheets of sheet gain media, a heat sink, a cooling metal, a gas layer between the gain media and the heat sink, a first contact between the gain media and the heat sink, and a second contact between the heat sink and the cooling metal. Pump light enters the laser head from the single-side direction or the double-side direction, part of pump light energy is absorbed by each thin gain medium and converted into heat, the heat is conducted into the heat sink through the gas layer between the gain medium and the heat sink, then the heat is finally transferred to cooling metal from the heat sink through the heat conduction of a contact object between the heat sink and the cooling metal, and the cooling metal is connected with an external cold source to always keep the temperature on the cooling metal at a constant cooling temperature. Thereby achieving the purpose of effectively dissipating heat of the laser head.
The double-sided conduction cooling multi-slice laser head provided by the embodiment of the invention has the advantages of no special requirements of gradual change, interval or gradient doping and the like of a gain medium, simple cooling action process, compact structure and good heat dissipation effect, and is favorable for high-power output of a multi-slice laser.
Based on any one of the above embodiments, further, the thickness of the gain medium is less than 10 mm.
Specifically, the thickness of each thin slice gain medium is selected to be in millimeter magnitude or thinner, the temperature gradient along the light beam direction can be ignored at the moment, and only the temperature gradient distribution perpendicular to the light beam direction on the thin slice gain medium needs to be concerned; the shape of the gain medium may be determined by the specific design.
In an embodiment of the invention, the thickness of the gain medium is less than 10 mm.
The double-sided conduction cooling multi-slice laser head provided by the embodiment of the invention has the advantages of no special requirements of gradual change, interval or gradient doping and the like of a gain medium, simple cooling action process, compact structure and good heat dissipation effect, and is favorable for high-power output of a multi-slice laser.
Further in accordance with any of the above embodiments, the thickness of the first interlayer is less than 100 microns.
Specifically, the thickness of the first interlayer between the gain medium and the heat sink is determined by the thickness of the contact between the gain medium and the heat sink, the thickness is selected to be as small as possible, generally in the order of micrometers or less, so as to ensure the heat transfer from the gain medium to the heat sink, and the existence of the gas layer avoids the direct contact between the gain medium and the heat sink, thereby reducing the thermal influence of the heat sink on the side surface of the gain medium.
In an embodiment of the invention, the thickness of the first interlayer is less than 100 microns.
The double-sided conduction cooling multi-slice laser head provided by the embodiment of the invention has the advantages of no special requirements of gradual change, interval or gradient doping and the like of a gain medium, simple cooling action process, compact structure and good heat dissipation effect, and is favorable for high-power output of a multi-slice laser.
Based on any embodiment above, further, the gas pressure within the first interlayer is less than or equal to 1 bar.
Specifically, the thickness of the first interlayer between the gain medium and the heat sink is determined by the thickness of a contact object between the gain medium and the heat sink, the thickness is selected to be as small as possible, generally, the thickness is micrometer-level or smaller, the air pressure can be selected to be bar-level or smaller, so that the heat is transmitted from the gain medium to the heat sink, and the existence of the air layer avoids the direct contact between the gain medium and the heat sink, so that the thermal influence of the heat sink on the side surface of the gain medium is reduced.
In an embodiment of the invention, the gas pressure in the first interlayer is less than or equal to 1 bar.
The double-sided conduction cooling multi-slice laser head provided by the embodiment of the invention has the advantages of no special requirements of gradual change, interval or gradient doping and the like of a gain medium, simple cooling action process, compact structure and good heat dissipation effect, and is favorable for high-power output of a multi-slice laser.
According to any one of the above embodiments, the first interlayer is filled with an inert gas, hydrogen gas or nitrogen gas.
Specifically, the thickness of the first interlayer between the gain medium and the heat sink is determined by the thickness of a contact object between the gain medium and the heat sink, the thickness is selected to be as small as possible, generally, the thickness is micrometer magnitude or less, the air pressure can be selected to be bar magnitude or less, air is filled in the interlayer to ensure the transfer of heat from the gain medium to the heat sink, and the existence of the air layer avoids the direct contact of the gain medium and the heat sink, so that the thermal influence of the heat sink on the side face of the gain medium is reduced.
In the embodiment of the invention, the first interlayer is filled with inert gas, hydrogen or nitrogen.
The double-sided conduction cooling multi-slice laser head provided by the embodiment of the invention has the advantages of no special requirements of gradual change, interval or gradient doping and the like of a gain medium, simple cooling action process, compact structure and good heat dissipation effect, and is favorable for high-power output of a multi-slice laser.
Based on any one of the above embodiments, further, the material of the heat sink is sapphire.
Specifically, the choice of the heat sink material is restrictive, and since the heat sink is located in the optical path, the existence of the heat sink cannot affect the quality of the light beam, the heat sink needs to be made of a material with high thermodynamic and optical properties, such as sapphire and the like; and the thickness of each heat sink can be set according to actual needs, and can be consistent or different.
The double-sided conduction cooling multi-slice laser head provided by the embodiment of the invention has the advantages of no special requirement on doping of a gain medium, simple action process, compact structure and good heat dissipation effect, and is beneficial to high-power output of a multi-slice laser.
According to any one of the above embodiments, further, the material of the cooling metal is copper, and the constant cooling temperature is 100K or 80K.
Specifically, the second contact between the heat sink and the cooling metal is a thin metal sheet welded with the heat sink, and the metal sheet can be selected to be consistent with the cooling metal material or selected according to specific requirements, and the welding process between the heat sink and the cooling metal can effectively reduce the influence of thermal stress on the heat sink due to the difference of the expansion coefficients of the heat sink and the cooling metal.
The cooling metal is connected with an external cold source, the temperature on the cooling metal is always kept at a constant cooling temperature, and the temperature is set according to specific cooling requirements.
In an embodiment of the invention, the material of the cooling metal is copper.
The double-sided conduction cooling multi-slice laser head provided by the embodiment of the invention has the advantages of no special requirements of gradual change, interval or gradient doping and the like of a gain medium, simple cooling action process, compact structure and good heat dissipation effect, and is favorable for high-power output of a multi-slice laser.
Based on any one of the above embodiments, further, a vacuum is filled in the second interlayer, and a vacuum is filled in the third interlayer.
Specifically, the gas filled in the second interlayer formed between the heat sink and the cooling metal and the third interlayer formed between the gain medium and the cooling metal are not limited, and may be an inert gas or a vacuum.
In the embodiment of the invention, the second interlayer is filled with vacuum, and the third interlayer is filled with vacuum.
The double-sided conduction cooling multi-slice laser head provided by the embodiment of the invention has the advantages of no special requirements of gradual change, interval or gradient doping and the like of a gain medium, simple cooling action process, compact structure and good heat dissipation effect, and is favorable for high-power output of a multi-slice laser.
The double-sided conduction-cooled multi-sheet laser head in each of the above embodiments is described below by way of a specific example:
Gain medium Yb CaF separated by five slices 2For example, each wafer is 5mm thick, the heat sink is made of sapphire material 2mm thick, the cooling metal is made of copper material, the gas between the gain medium and the heat sink is helium gas, the thickness of the gas layer is 50 microns, and the gas pressure is 1 bar; the pump light enters the laser head from the single side direction, part of pump light energy is absorbed by each thin gain medium and converted into heat, the heat is conducted into the heat sink through the helium layer between the gain medium and the heat sink, then the heat is finally transferred to the cooling metal from the heat sink through the heat conduction of the contact object between the heat sink and the cooling metal, the cooling metal is connected with an external cold source, the temperature on the cooling metal is always kept at a constant cooling temperature, and the temperature is set to be 100K here.
Through experiments, the maximum temperature difference between the highest value and the lowest value of the temperature caused by the absorption of the energy of the pump light under the action of the pump light is 28K and is far smaller than the maximum temperature difference 148K of the whole crystal rod structure based on the end face pump. Therefore, the multi-wafer laser system provided by the invention has an obvious good heat dissipation function, and has the advantages of no special requirements of gradual change, interval or gradient doping and the like of a gain medium, simple cooling action process, compact structure and the like.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A double-sided conduction cooled multi-chip laser head, comprising:
The gain medium, the heat sink, the cooling metal, a first contact object between the gain medium and the heat sink and a second contact object between the heat sink and the cooling metal;
The gain medium and the heat sink are both sheet-shaped, and the gain medium and the heat sink are arranged in parallel at intervals and separately; the cooling metal is arranged on the peripheries of the gain medium and the heat sink, the cooling temperature is constant, the centers of the gain medium and the heat sink are coaxial, and the plane of the gain medium is vertical to the central axis;
The edge of the gain medium is connected with the edge of the heat sink through a first contact, so that a first interlayer is formed between the gain medium and the heat sink;
The edges of the two surfaces of the heat sink are connected with the inner wall of the cooling metal through a second contact, so that a second interlayer is formed between the heat sink and the cooling metal, and a third interlayer is formed between the gain medium and the cooling metal.
2. The double-sided conduction cooled multi-chip laser head of claim 1 wherein the gain medium has a thickness of less than 10 mm.
3. The double-sided conduction cooled multi-sheet laser head of claim 1 wherein the thickness of the first interlayer is less than 100 microns.
4. The double-sided conduction cooled multi-sheet laser head of claim 1 wherein the gas pressure within the first interlayer is less than or equal to 1 bar.
5. The double-sided conduction cooled multi-sheet laser head of claim 1 wherein the first interlayer is filled with an inert gas, hydrogen or nitrogen.
6. The double-sided conduction cooled multi-sheet laser head of claim 1 wherein the material of the heat sink is sapphire.
7. The double-sided conduction cooled multi-sheet laser head of claim 1 wherein the material of the cooling metal is copper and the constant cooling temperature is 100K or 80K.
8. The double-sided conduction cooled multi-sheet laser head of claim 1 wherein the second interlayer is filled with a vacuum and the third interlayer is filled with a vacuum.
9. The double-sided conduction-cooled multi-chip laser head of claim 1 wherein the gain medium is Yb CaF 2Or Yb is YAG.
10. The double-sided conduction cooled multi-sheet laser head of claim 5 wherein the first interlayer is filled with helium gas.
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Citations (6)
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|---|---|---|---|---|
| US5363391A (en) * | 1992-04-24 | 1994-11-08 | Hughes Aircraft Company | Conductive face-cooled laser crystal |
| US20070183467A1 (en) * | 2006-02-03 | 2007-08-09 | Bae Systems Information | Method and apparatus for cooling semiconductor pumped lasers |
| EP1833127A1 (en) * | 2004-12-28 | 2007-09-12 | Osaka University | Solid laser module, optical amplifier, and laser oscillator |
| CN105071198A (en) * | 2015-08-31 | 2015-11-18 | 中国工程物理研究院应用电子学研究所 | Device for eliminating wave front distortion of laser gain module caused by window deformation |
| WO2016127978A1 (en) * | 2015-02-09 | 2016-08-18 | Friedrich-Schiller-Universität Jena | Device for cooling optical elements |
| US20170358898A1 (en) * | 2016-06-10 | 2017-12-14 | Inter-University Research Institute Corporation National Institutes Of Natural Sciences | Laser apparatus and manufacturing method thereof |
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2020
- 2020-02-24 CN CN202010112706.2A patent/CN111431019A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5363391A (en) * | 1992-04-24 | 1994-11-08 | Hughes Aircraft Company | Conductive face-cooled laser crystal |
| EP1833127A1 (en) * | 2004-12-28 | 2007-09-12 | Osaka University | Solid laser module, optical amplifier, and laser oscillator |
| US20070183467A1 (en) * | 2006-02-03 | 2007-08-09 | Bae Systems Information | Method and apparatus for cooling semiconductor pumped lasers |
| WO2016127978A1 (en) * | 2015-02-09 | 2016-08-18 | Friedrich-Schiller-Universität Jena | Device for cooling optical elements |
| CN105071198A (en) * | 2015-08-31 | 2015-11-18 | 中国工程物理研究院应用电子学研究所 | Device for eliminating wave front distortion of laser gain module caused by window deformation |
| US20170358898A1 (en) * | 2016-06-10 | 2017-12-14 | Inter-University Research Institute Corporation National Institutes Of Natural Sciences | Laser apparatus and manufacturing method thereof |
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Application publication date: 20200717 |