CN111430289B - Wafer positioning and calibrating device and wafer positioning and calibrating method - Google Patents

Wafer positioning and calibrating device and wafer positioning and calibrating method Download PDF

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Publication number
CN111430289B
CN111430289B CN202010376015.3A CN202010376015A CN111430289B CN 111430289 B CN111430289 B CN 111430289B CN 202010376015 A CN202010376015 A CN 202010376015A CN 111430289 B CN111430289 B CN 111430289B
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wafer
image
actual position
positioning
bearing table
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CN111430289A (en
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毕迪
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Shanghai Guona Semiconductor Technology Co ltd
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Shanghai Guona Semiconductor Technology Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a wafer positioning and calibrating device and a wafer positioning and calibrating method, wherein the wafer positioning and calibrating device comprises: the wafer positioning device comprises a bearing table, an image acquisition device, a wafer transmission device and a control device, wherein the image acquisition device is used for acquiring an actual position image of a wafer on the bearing table; the control device is connected with the image acquisition device and the wafer conveying device, a reference image of the wafer at a first reference position is stored in the control device, the control device acquires an actual position image acquired by the image acquisition device and compares and analyzes the actual position image and the reference image to acquire deviation data of the actual position and the reference image, and the mechanical arm is adjusted according to the deviation data to enable the wafer to fall at a second reference position. The wafer positioning and calibrating device disclosed by the embodiment of the invention has the advantages of simple structure, good stability, low energy consumption, high speed, accuracy, systematic data management and the like.

Description

Wafer positioning and calibrating device and wafer positioning and calibrating method
Technical Field
The invention relates to the field of semiconductor equipment, in particular to a wafer positioning and calibrating device and a wafer positioning and calibrating method.
Background
In the prior art, as a wafer alignment device which is one of the key parts of the semiconductor equipment, an optical sensor system (a light source + a photosensitive sensor) is usually adopted to cooperate with a turntable to rotate to obtain notch information of the edge of the wafer, so as to realize wafer alignment. However, due to the structural problem of the notch mark itself, there is a great precision deviation for determining the position of the notch mark, and the turntable must rotate one or more circles in the process of obtaining the notch of the wafer, so the efficiency is low, and the reliability of the mechanical device is also an unstable factor, so the working performance of the wafer alignment device directly affects the precision and efficiency of the semiconductor process.
Disclosure of Invention
The invention aims to provide a wafer positioning and calibrating device which is less in time consumption, high in reliability, capable of improving positioning accuracy and capable of performing systematic data analysis and detection on wafer positions.
The wafer positioning and calibrating device according to the embodiment of the invention comprises: the wafer bearing device comprises a bearing table, a first positioning device and a second positioning device, wherein the bearing table is used for bearing a wafer and is provided with a first reference position for placing the wafer; the image acquisition device is used for acquiring an actual position image of the wafer on the bearing table; the wafer conveying device is provided with an adjustable mechanical arm, the mechanical arm is used for clamping and transferring wafers, the mechanical arm is provided with a tray suitable for placing the wafers, and the tray is provided with a second reference position; the control device is connected with the image acquisition device and the wafer conveying device, a reference image of the wafer located at the first reference position is stored in the control device, the control device acquires the actual position image of the wafer acquired by the image acquisition device and compares and analyzes the actual position image and the reference image so as to acquire deviation data of the actual position image and the reference image, and the position where the wafer is grabbed by the mechanical arm is adjusted according to the deviation data so that the wafer falls on the second reference position.
According to the wafer positioning and calibrating device provided by the embodiment of the invention, the actual position image of the wafer is acquired through the image acquisition device, the actual position image is compared and analyzed with the reference image through the control device to obtain the deviation data of the actual position quasi image and the reference image, and the wafer taking position of the mechanical arm is adjusted according to the deviation data to realize the positioning and calibrating of the wafer, so that the positioning and calibrating device not only can realize high-speed accurate scanning positioning and reduce the calibrating time, but also the bearing table does not need to rotate, so that the wafer positioning and calibrating device is simple in structure and low in energy consumption. Furthermore, the control device acquires, compares and analyzes the actual position image of the wafer, is convenient to collect, analyze and detect the position data of the wafer, realizes analysis, processing and monitoring operation through big data sampling, and has the advantages of high speed, accuracy, systematic data management and the like.
According to some embodiments of the present invention, the wafer positioning and calibrating device further includes a light supplement device for supplementing light for the image acquisition device when acquiring an actual position image of the wafer on the susceptor, and the light supplement device is disposed above the susceptor to illuminate the wafer on the susceptor.
According to some embodiments of the invention, the image capturing device is a plurality of image capturing devices, and the plurality of image capturing devices are arranged at different positions relative to the bearing table to capture the actual position images of the wafer arranged on the bearing table from different angles.
Optionally, the number of the image acquisition devices is two, and the two image acquisition devices are respectively arranged on one axial side of the bearing table and one radial side of the bearing table.
Furthermore, the two image acquisition devices are a first image acquisition device and a second image acquisition device, a camera of the first image acquisition device is arranged opposite to the upper surface of the bearing table to be calibrated so as to acquire front or back images of the wafer, the second image acquisition device is arranged on the side surface of the bearing table, and the camera of the second image acquisition device is arranged opposite to the side surface of the bearing table so as to acquire side images of the wafer.
According to some embodiments of the invention, the image acquisition device is a CIS image sensor.
The invention also provides a wafer positioning and calibrating method.
The wafer positioning calibration method according to the embodiment of the invention comprises the following steps: placing a wafer on a bearing table; the image acquisition device acquires an actual position image of the wafer on the bearing table; comparing and analyzing the actual position image with a reference image of a first reference position of the wafer on the bearing table to obtain deviation data of the reference image and the actual position image; and adjusting the wafer transmission device according to the deviation data to adjust the wafer taking position of the wafer transmission device, so that the wafer falls on a second reference position of the wafer transmission device.
According to the wafer positioning and calibrating method provided by the embodiment of the invention, the actual position image of the wafer is acquired by the image acquisition device and is compared with the reference image for analysis, so that the wafer taking position of the wafer transmission device is adjusted, the deviation between the wafer and the first reference position on the bearing table is compensated, the wafer can accurately fall on the second reference position, the positioning and calibration of the wafer are realized, the image acquisition device can be used for quickly acquiring the image without being matched with the rotating bearing table, the stability and the reliability are high, the wafer transmission device is adjusted according to the deviation data of the comparison analysis through the image comparison analysis, the datamation capability can be improved, and the datamation management, the detection and the position deviation early warning can be easily realized further according to the data of the image comparison analysis.
According to some embodiments of the present invention, the image acquisition device acquires actual position images of the wafer at different angles, compares the actual position images with the reference images at corresponding angles, acquires a plurality of sets of deviation data, and adjusts the wafer transmission device according to the plurality of sets of deviation data.
According to some embodiments of the present invention, the step of obtaining the deviation data between the reference image and the actual position image by comparing and analyzing the actual position image and the reference image of the first reference position of the wafer on the susceptor table includes: and comparing and analyzing the actual position image with the reference image to obtain deviation data of the outer edge of the wafer and the positioning notch, and adjusting the wafer transmission device according to the deviation data of the outer edge of the wafer and the positioning notch.
According to some embodiments of the present invention, the step of comparing and analyzing the actual position image with a reference image of a first reference position of the wafer on the susceptor to obtain deviation data between the reference image and the actual position image includes: and respectively obtaining the centroid coordinates of the reference image and the actual position image of the wafer by using a mathematical algorithm, and comparing the centroid coordinates of the actual position image with the centroid coordinates of the reference image to obtain deviation data of the reference image and the actual position image.
Drawings
FIG. 1 is a schematic view of an angle structure of a wafer positioning and calibrating apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view of another exemplary embodiment of an angle structure of a wafer positioning and calibrating apparatus;
fig. 3 is a flowchart of a wafer positioning calibration method according to an embodiment of the invention.
Reference numerals;
100: a wafer positioning and calibrating device;
1: first image capturing apparatus, 2: a second image acquisition device;
3: wafer, 31: positioning the notch;
4: a light supplement device;
5: a wafer transfer device;
6: a bearing platform.
Detailed Description
The following describes a wafer positioning calibration device according to the present invention in detail with reference to the accompanying drawings and the detailed description.
The wafer positioning calibration apparatus 100 according to an embodiment of the present invention is described below with reference to the drawings.
As shown in fig. 1 and 2, a wafer positioning calibration apparatus 100 according to an embodiment of the present invention may include a susceptor 6, an image capturing device (e.g., a first image capturing device 1 and a second image capturing device 2 as shown in fig. 1 and 2), a wafer transfer device 5, and a control device.
The bearing table 6 is used for bearing the wafer 3, the bearing table 6 is provided with a first reference positioning position for placing the wafer 3, and when the wafer 3 is placed at the first reference position, the wafer can be conveyed to the reference position of other process equipment when other subsequent processes are executed after the alignment of the wafer is finished. The susceptor 6 does not need to rotate and has a bearing function, so that the stability and reliability of the wafer positioning and calibrating device 100 can be improved.
The image acquisition device is used for gathering the actual position image that wafer 3 is located plummer 6, like this, places on plummer 6 after wafer 3 takes out from the wafer box, can obtain the actual position image of placing wafer 3 on plummer 6 through the image acquisition device in real time accurately fast to be used for fixing a position and calibrating wafer 3, thereby can reduce the length of time that the location needs. Optionally, the image acquisition device may be a CIS image sensor, and the CIS image sensor can rapidly scan and image the wafer 3 at a high speed and accurately, and is convenient to cooperate with big data sampling to analyze, process and monitor the operation condition and trend. Therefore, the wafer 3 can be quickly and accurately positioned and calibrated.
The wafer conveying device 5 is provided with an adjustable mechanical arm, and the mechanical arm is used for clamping and transferring the wafer 3, so that the clamping position of the mechanical arm can be adjusted according to the actual position state of the wafer 3 placed on the bearing table 6 when the wafer 3 is clamped, and the position error of the wafer 3 deviating from the first reference position can be compensated by adjusting the mechanical arm. The mechanical arm is provided with a tray suitable for placing the wafer 3, the tray is provided with a second reference position corresponding to the first reference position of the bearing table 6, specifically, when the wafer 3 is located at the first reference position, the mechanical arm clamps the wafer 3 from the first reference position, the adjustment of the mechanical arm is not needed, the wafer 3 can fall on the second reference position of the tray, and when the wafer 3 deviates from the first reference position, the wafer taking position of the mechanical arm is adjusted, so that the wafer 3 falls on the second reference position of the tray, and the positioning and the manufacturing of the subsequent process of the wafer 3 are facilitated.
The control device is connected with the image acquisition device and the wafer conveying device 5, so that the control device can acquire the actual position image of the wafer 3 acquired by the image acquisition device on the bearing table 6, control the wafer conveying device 5 to clamp and convey the wafer 3 and control and adjust the wafer taking position of the mechanical arm. The control device stores a reference image of the wafer 3 at the first reference position, and it should be noted that the reference image is a wafer image captured by the image capturing device when the wafer 3 is at the first reference position, and the reference image can be used as a standard image for determining whether the wafer 3 is at the first reference position and a deviation between the position of the wafer 3 and the first reference position.
Specifically, the control device may compare and analyze the actual position image of the wafer with a reference image, wherein the position of the image acquisition device is stationary, so that the reference image and the actual position image are compared with each other, that is, the standard state image and the real-time state image of the wafer 3 at the same angle are compared, and thus deviation data between the actual position image of the wafer and the reference image can be obtained, and the control device may adjust the position where the robot arm grasps the wafer 3 according to the deviation data, so that the wafer 3 falls on the second reference position. For example, specifically, through analysis of deviation data of the reference image and the actual position image of the wafer 3, the position deviation of the actual position of the wafer 3 in the horizontal direction and in the vertical direction from the position of the wafer 3 at the first reference position can be determined, and by adjusting the wafer taking position of the robot arm, the corresponding position deviation compensation is performed on the position of the wafer 3, so that the wafer 3 can accurately fall on the second reference position on the tray.
Therefore, according to the wafer positioning and calibrating device 100 of the embodiment of the present invention, the image acquisition device acquires the actual position image of the wafer 3, the control device compares and analyzes the actual position image with the reference image to obtain the deviation data between the actual position image and the reference image, and the robot arm is adjusted according to the deviation data to adjust the wafer taking position, so as to position and calibrate the wafer 3. Furthermore, the control device acquires and analyzes the actual position image, conveniently collects, analyzes and detects the position data of the wafer 3, realizes analysis, processing and monitoring operation through big data sampling, and has the advantages of high speed, accuracy, systematic data management and the like.
In some embodiments of the present invention, the wafer positioning and calibrating device 100 further includes a light supplement device 4, and the light supplement device 4 is used for supplementing light when the image acquisition device acquires the actual position image of the wafer 3. Like this, when image acquisition device gathered the image, can provide sufficient light through light filling device 4, improve the definition of the image that image acquisition device gathered to help the contrastive analysis of wafer actual position image and benchmark image, and then be favorable to improving the precision of wafer location calibration.
Optionally, the light supplement device 4 is disposed above the susceptor 6 to provide light to the wafer 3 on the susceptor 6. Therefore, the light supplementing device 4 is beneficial to supplementing light for the image acquisition device to acquire images, and further, the light supplementing device 4 is arranged above the side of the bearing table 6. Therefore, the light supplement device 4 can be prevented from emitting direct illumination to the surface of the wafer 3, and the influence of the illumination on the surface of the wafer 3 is reduced. In the example shown in fig. 2, the fill light device 4 is located above the wafer 3 and at the side of the wafer 3.
In some embodiments of the present invention, the number of the image capturing devices is multiple, so that the multiple image capturing devices can capture multiple actual wafer position images, multiple sets of deviation data can be provided by comparing and analyzing the multiple actual wafer position images with the corresponding reference images, and the position where the robot arm captures the wafer 3 is adjusted according to the multiple sets of deviation data, so as to further improve the accuracy of positioning and calibrating the wafer 3. The plurality of image acquisition devices can be arranged at different positions relative to the bearing table 6 to acquire actual position images of the wafer 3 arranged on the bearing table 6 from different angles, namely the plurality of image acquisition devices can be fixedly arranged at different positions, so that the plurality of image acquisition devices can acquire the actual position images of the wafer 3 from different angles, and the actual position images of the wafer 3 from different angles are contrasted and analyzed to acquire deviation data, so that the accuracy of acquiring the deviation data can be further improved, and the positioning and calibrating effects of the wafer 3 are improved.
Optionally, two image capturing devices are provided, and two image capturing devices are respectively provided on one axial side of the susceptor 6 and one radial side of the susceptor 6, that is, one image capturing device is provided on one axial side of the susceptor 6, for example, the image capturing devices may be provided above, directly above, below, directly above, etc. the image capturing devices may be provided on one side of the susceptor 6, so that at least a part of the front or back image of the wafer 3 can be captured by the image capturing devices provided on one side of the calibration susceptor axial direction; another image capturing device may be disposed on one side of the susceptor 6 in the radial direction, for example, the image capturing device may be disposed at a position around the circumferential direction of the wafer on the susceptor 6, so that the image capturing device can capture at least a part of the side surface image of the wafer 3, and thus, the two image capturing devices can capture a part of the side surface image and a part of the front surface or the back surface image of the wafer 3, so as to capture the three-dimensional image of the wafer 3, and thus, the wafer taking position of the robot arm can be adjusted in the three-dimensional direction.
In some specific examples, as shown in fig. 1 and fig. 2, the two image capturing devices are a first image capturing device 1 and a second image capturing device 2, the first image capturing device 1 is disposed on one side of the axial direction of the carrier table 6, and a camera of the first image capturing device 1 is disposed opposite to the upper surface of the carrier table 6, so as to capture a front or back image of the wafer 3, so that deviation data of the wafer 3 in the horizontal direction, for example, deviation data of the center position of the wafer 3 on the actual position image of the wafer and the center position of the center on the reference image, can be obtained by comparing the actual position image of the wafer captured by the first image capturing device 1 with the corresponding reference image. The second image acquisition device 2 is arranged on the side surface of the bearing table 6, and the camera of the second image acquisition device 2 is over against the side surface of the bearing table 6 so as to acquire the side surface image of the wafer 3. In this way, the actual position image of the wafer acquired by the second image acquisition device 2 is analyzed with the reference image, so that deviation data of the wafer 3 in the vertical direction can be acquired, and whether the wafer 3 is horizontal or not can be judged according to the deviation data. Therefore, deviation data of the wafer 3 in the horizontal direction and the vertical direction can be acquired through the first image acquisition device 1 and the second image acquisition device 2, and the wafer taking position of the wafer transmission device 3 is adjusted according to the deviation data so as to compensate the deviation between the position of the wafer 3 and the first reference position in the vertical direction and the horizontal direction, realize the calibration of the positioning of the wafer 3 and further improve the positioning precision.
A wafer alignment calibration method that can be performed by the wafer alignment calibration apparatus 100 according to an embodiment of the present invention will be described below with reference to the drawings.
As shown in fig. 3, a wafer positioning calibration method according to an embodiment of the present invention may include:
s1: placing the wafer 3 on a bearing table 6; specifically, the wafer 3 is placed in a wafer cassette, and during the preparation process of the wafer 3, the wafer 3 can be taken out of the wafer cassette and placed on the bearing table 6 for positioning and calibration, wherein the bearing table 6 is fixed, so that compared with the bearing table 6 which rotates in the prior art, the wafer 3 is simple in structure and low in energy consumption.
S2: the image acquisition device acquires an actual position image of the wafer 3 on the bearing table 6; that is, when the wafer 3 is placed on the susceptor, the actual position image of the wafer 3 on the susceptor 6 can be collected by the image collecting device, it should be noted that the susceptor 6 has a first reference position for placing the wafer 3, when the wafer 3 is taken out from the wafer cassette and placed on the susceptor 6, the position of the wafer 3 is deviated from the first reference position, the image collecting device can collect the actual position image of the wafer 3 taken out from the wafer cassette and placed on the calibration stage in real time, and the deviation between the position of the wafer 3 and the first reference position can be analyzed by the actual position image.
S3: comparing and analyzing the actual position image of the wafer with a reference image of a first reference position of the wafer 3 on the bearing table 6 to obtain deviation data of the reference image and the actual position image; specifically, the image capturing device may capture a reference image of the wafer 3 at a first reference position as a comparison image, determine whether the wafer 3 is at the first reference position by comparing the reference image with the actual position image of the wafer, and obtain deviation data between the reference image and the corrected actual position image by analyzing the reference image and the actual position image of the wafer, so as to obtain a deviation between the position of the wafer 3 and the first reference position. Specifically, the centroid coordinates of the reference image and the actual position image of the wafer are respectively obtained by using a mathematical algorithm, and then the comparison is performed to obtain deviation data of the reference image and the actual position image, that is, to obtain the deviation between the actual position of the wafer 3 and the first reference position.
S4: and adjusting the wafer taking position of the wafer conveying device 5 according to the deviation data so that the wafer 3 falls on the second reference position of the wafer conveying device 5. Specifically, the deviation between the wafer 3 and the first reference position can be obtained according to the deviation between the actual position image of the wafer and the reference image, and the wafer taking position of the wafer conveying device 5 is adjusted according to the deviation data, so that the deviation between the position of the wafer 3 and the first reference position is compensated by adjusting the wafer taking position, and the wafer 3 can be accurately located at the second reference position.
Therefore, according to the wafer positioning and calibrating method provided by the embodiment of the invention, the actual position image of the wafer 3 is acquired by the image acquisition device and is compared with the reference image for analysis, so that the wafer taking position of the wafer transmission device 5 is adjusted, the deviation between the wafer 3 and the first reference position on the bearing table 6 is compensated, the wafer 3 can accurately fall on the second reference position, the positioning and calibration of the wafer 3 are realized, the image acquisition device can rapidly acquire the image without being matched with a rotating bearing table, the stability and the reliability are high, the wafer transmission device 5 is adjusted according to the deviation data of the comparison analysis through the image comparison analysis, the datamation capability can be improved, and the datamation management, the detection and the position deviation early warning can be easily realized according to the data of the image comparison analysis.
In some embodiments of the present invention, the image capturing device captures actual position images of the wafer 3 at different angles, compares the actual position images with reference images at corresponding angles, obtains multiple sets of deviation data, and adjusts the wafer transferring device 5 according to the multiple sets of deviation data. In this way, the accuracy of the positioning calibration of the wafer 3 is further improved by performing the integrated processing based on the plurality of sets of deviation data through the comparative analysis of the plurality of sets of actual position images and the reference image.
Optionally, a positioning notch 31 is formed in the wafer 3, and in the step of comparing and analyzing the actual position image of the wafer with the reference image of the first reference position of the wafer 3 on the susceptor 6 to obtain deviation data between the reference image and the actual position image, the method includes: comparing and analyzing the actual position image with the reference image to obtain the deviation data of the positioning gap 31, and adjusting the wafer transmission device 5 according to the deviation data of the positioning gap 31. Specifically, the positioning notch 31 of the wafer 3 is used for accurately positioning the wafer 3 in the preparation process of the wafer 3, when analyzing the actual position image and the reference image of the wafer, the actual position image and the outer contour of the wafer 3 on the reference image can be compared and analyzed to obtain deviation data of the outer contour of the wafer 3, meanwhile, the actual position image and the position of the positioning notch 31 of the wafer 3 on the reference image can be compared and analyzed to obtain deviation data of the positioning notch 31, and according to analysis and integration of the outer contour of the wafer 3 and the deviation data of the positioning notch 31, the deviation between the position of the wafer 3 and the first reference position can be further accurately determined, the wafer taking position of the wafer transmission device 5 can be adjusted, the deviation data between the actual position of the wafer 3 and the first reference position can be compensated, so that the wafer 3 can accurately fall on the second reference position of the wafer transmission device 5, and subsequent processes of the wafer 3 can be facilitated.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (6)

1. A wafer positioning calibration device, comprising:
the wafer bearing device comprises a bearing table, a first positioning device and a second positioning device, wherein the bearing table is used for bearing a wafer, the wafer is provided with a positioning notch, and the bearing table is provided with a first reference position for placing the wafer;
the two image acquisition devices are arranged at different positions relative to the bearing table and used for acquiring the actual position images of the wafer on the bearing table from different angles, wherein one image acquisition device is arranged at one axial side of the bearing table, and the other image acquisition device is arranged at one radial side of the bearing table;
the wafer conveying device is provided with an adjustable mechanical arm, the mechanical arm is used for clamping and transferring the wafer, the mechanical arm is provided with a tray suitable for placing the wafer, and the tray is provided with a second reference position;
the control device is connected with the two image acquisition devices and the wafer conveying device, reference images of wafers located at the first reference position are stored in the control device, the control device acquires the actual position images of the two image acquisition devices at different angles, the actual position images of the different angles and the reference images of corresponding angles are compared and analyzed, deviation data of the outer contours and the positioning gaps of a plurality of groups of wafers are acquired, and the mechanical arm is adjusted according to the deviation data to enable the wafers to fall on the second reference position.
2. The wafer positioning and calibrating device of claim 1, further comprising a light supplement device for supplementing light when the image acquisition device acquires the actual position image of the wafer, wherein the light supplement device is disposed above the susceptor to illuminate the wafer on the susceptor.
3. The wafer positioning and calibrating device of claim 1, wherein the two image capturing devices are a first image capturing device and a second image capturing device, the camera of the first image capturing device is disposed opposite to the upper surface of the carrier to capture the front or back image of the wafer, the second image capturing device is disposed at the side of the carrier and the camera of the second image capturing device is disposed opposite to the side of the carrier to capture the side image of the wafer.
4. The wafer positioning calibration device according to any one of claims 1 to 3, wherein the image acquisition device is a CIS image sensor.
5. A method for calibrating wafer positioning is characterized in that,
placing a wafer with a positioning notch on a bearing table;
the image acquisition device acquires actual position images of the wafer at different angles of the bearing table;
comparing and analyzing the actual position image and a reference image of a first reference position of the wafer on the bearing table to obtain deviation data of the outer contour and the positioning notch of the wafer, wherein the actual position images at different angles and the reference images at corresponding angles are compared and analyzed to obtain multiple groups of deviation data;
and adjusting the wafer taking position of the wafer transmission device according to the plurality of groups of deviation data so that the wafer falls on a second reference position of the wafer transmission device.
6. The method as claimed in claim 5, wherein the step of comparing the actual position image with a reference image of a first reference position of the wafer on the stage to obtain deviation data between the reference image and the actual position image comprises: and respectively obtaining the centroid coordinates of the reference image and the actual position image of the wafer by using a mathematical algorithm, and comparing the centroid coordinates of the actual position image with the centroid coordinates of the reference image to obtain deviation data of the reference image and the actual position image.
CN202010376015.3A 2020-05-07 2020-05-07 Wafer positioning and calibrating device and wafer positioning and calibrating method Withdrawn - After Issue CN111430289B (en)

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