CN111430287A - Automatic transistor assembling machine - Google Patents
Automatic transistor assembling machine Download PDFInfo
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- CN111430287A CN111430287A CN202010267663.5A CN202010267663A CN111430287A CN 111430287 A CN111430287 A CN 111430287A CN 202010267663 A CN202010267663 A CN 202010267663A CN 111430287 A CN111430287 A CN 111430287A
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- 230000007246 mechanism Effects 0.000 claims abstract description 342
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 92
- 229910052742 iron Inorganic materials 0.000 claims abstract description 46
- 238000007599 discharging Methods 0.000 claims abstract description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000000741 silica gel Substances 0.000 claims abstract description 15
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims description 133
- 230000000903 blocking effect Effects 0.000 claims description 8
- 238000009966 trimming Methods 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention relates to the technical field of transistor assembly, in particular to an automatic transistor assembling machine, which comprises a turntable and a turntable driving mechanism for driving the turntable to rotate, wherein a plurality of jigs for placing products are arranged on the circumferential array of the turntable; the automatic transistor assembling machine further comprises a screw feeding mechanism, an iron sheet feeding mechanism, a silica gel dispensing mechanism, a radiating fin feeding mechanism, a transistor feeding mechanism, an insulating electric ring feeding mechanism, a nut feeding mechanism and a discharging mechanism which are arranged on the periphery of the turntable. The automatic transistor assembling machine solves the problem of low assembling efficiency caused by the fact that transistor assembling cannot be carried out fully automatically.
Description
Technical Field
The invention relates to the technical field of transistor assembly, in particular to an automatic transistor assembly machine.
Background
The transistor is a solid semiconductor device, including diode, triode, field effect transistor, thyristor, etc., sometimes refer to bipolar device in particular, and it has many functions of detection, rectification, amplification, switching, voltage regulation, signal modulation, etc. The transistor is used as a variable current switch, can control output current based on input voltage, is different from a common mechanical switch, controls opening and closing of the transistor by using an electric signal, and can be switched at a very high speed which can reach more than 100 GHz.
The existing transistor can be used only by being assembled, but the existing transistor assembly is generally carried out by full labor or semi-automation, and the full automation cannot be realized from the feeding, the assembling and the blanking, so that the assembly efficiency of the transistor is generally low.
Disclosure of Invention
In order to overcome the defects and shortcomings in the prior art, the invention aims to provide an automatic transistor assembling machine, which solves the problem of low assembling efficiency caused by the fact that transistor assembling cannot be carried out automatically.
The invention is realized by the following technical scheme:
an automatic transistor assembling machine comprises a rotary table and a rotary table driving mechanism for driving the rotary table to rotate, wherein a plurality of jigs for placing products are arranged on the circumferential array of the rotary table; the automatic transistor assembling machine further comprises a screw feeding mechanism, an iron sheet feeding mechanism, a radiating fin feeding mechanism, a transistor feeding mechanism, an insulating electric ring feeding mechanism, a nut feeding mechanism and a discharging mechanism which are arranged around the turntable; the screw feeding mechanism is used for feeding external screws to the jig; the iron sheet feeding mechanism is used for feeding external iron sheets to the jig; the radiating fin feeding mechanism is used for feeding external radiating fins to the jig; the transistor feeding mechanism is used for feeding an external transistor to the jig and enabling the transistor to be attached to the iron sheet, and is also used for trimming pins of the transistor; the insulating electric ring feeding mechanism is used for feeding an external insulating electric ring and assembling the insulating electric ring to a transistor in the jig; the nut feeding mechanism is used for feeding an external nut to the transistor in the jig and screwing the nut on the screw; the blanking mechanism is used for blanking the transistor which is screwed down by the nut to the outside.
The invention also discloses an automatic transistor assembling machine which comprises a turntable and a turntable driving mechanism for driving the turntable to rotate, wherein a plurality of jigs for placing transistors are arranged on the circumferential array of the turntable; the automatic transistor assembling machine further comprises a screw feeding mechanism, an iron sheet feeding mechanism, a silica gel dispensing mechanism, a transistor feeding mechanism, a nut feeding mechanism and a discharging mechanism which are arranged around the turntable; the screw feeding mechanism is used for feeding external screws to the jig; the iron sheet feeding mechanism is used for feeding external iron sheets to the jig; the silica gel dispensing mechanism is used for dispensing heat silica gel on iron sheets in the jig; the transistor feeding mechanism is used for feeding an external transistor to the jig and enabling the transistor to be attached to the iron sheet, and is also used for trimming pins of the transistor; the nut feeding mechanism is used for feeding an external nut to the transistor in the jig and screwing the nut on the screw; the blanking mechanism is used for blanking the transistor which is screwed down by the nut to the outside.
The blanking mechanism comprises a material taking mechanism, a first material tray stacking mechanism, a material tray conveying mechanism and a second material tray stacking mechanism, wherein the first material tray stacking mechanism and the second material tray stacking mechanism are respectively arranged at two ends of the material tray conveying mechanism;
the first material tray stacking mechanism is used for stacking a plurality of material trays, and the material tray conveying mechanism is used for conveying the material trays from the first material tray stacking mechanism to the second material tray stacking mechanism; the material taking mechanism is used for taking out the transistor loaded in the jig and transferring the transistor to a material tray of the material tray conveying mechanism.
The material taking mechanism comprises a material taking part, a material taking z-axis driving mechanism, a material taking x-axis driving mechanism and a material taking y-axis driving mechanism, the material taking y-axis driving mechanism is arranged above the material tray conveying mechanism and used for driving the material taking x-axis driving mechanism to move along the direction perpendicular to the conveying direction of the conveying belt, the material taking x-axis driving mechanism is used for driving the material taking z-axis driving mechanism to move along the conveying direction of the conveying belt, the material taking z-axis driving mechanism is used for driving the material taking part to lift, and the material taking part is used for adsorbing transistors from the jig.
The first material tray stacking mechanism comprises a first material tray accommodating groove, an upper material tray contact piece and a lower material tray contact piece, and the first material tray accommodating groove is formed in one end of the material tray conveying mechanism and communicated with the material tray conveying mechanism; the first tray accommodating groove is used for accommodating trays and stacking the trays, and the upper tray contact piece and the lower tray contact piece are respectively used for ejecting and supporting the turned-over edge of the tray;
the lateral wall of first charging tray storage tank is equipped with the through-hole that is used for supplying charging tray conflict piece and unloading dish conflict piece to pass respectively, the top of unloading dish conflict piece is located to the charging tray conflict piece, the charging tray conflict piece sets up with unloading dish conflict piece interval, the interval between charging tray conflict piece and the unloading dish conflict piece is not less than the turn-ups thickness of charging tray.
The number of the through holes is two, and the two through holes are symmetrically arranged on two side walls of the first material tray accommodating groove; the number of the upper tray contact pieces and the number of the lower tray contact pieces are two respectively, the two upper tray contact pieces are symmetrically arranged about the first tray accommodating groove, and the two lower tray contact pieces are symmetrically arranged about the first tray accommodating groove.
The charging tray conveying mechanism comprises a first conveying belt and a second conveying belt, and the first conveying belt and the second conveying belt are connected end to end; the first material tray stacking mechanism is arranged above the first conveying belt, and the second material tray stacking mechanism is arranged above the second conveying belt.
And a blocking ejection piece for blocking the movement of the material tray is arranged below the first conveying belt close to the second conveying belt.
The blanking mechanism further comprises a material tray discharging mechanism which is arranged in a cross mode with the first conveying belt, and the material tray discharging mechanism is used for driving the second conveying belt to move transversely.
The second tray stacking mechanism comprises a second tray accommodating groove, a tray jacking plate and a plurality of rotation supporting parts, the second tray accommodating groove is formed in one end of the tray conveying mechanism and communicated with the tray conveying mechanism, and the plurality of rotation supporting parts are respectively and rotatably connected to the inner side wall of the second tray accommodating groove; the second material tray accommodating groove is used for accommodating material trays and stacking the material trays, and the material tray jacking plate is arranged below the second material tray accommodating groove and is used for jacking the material trays from the material tray conveying mechanism to the second material tray accommodating groove;
a reset torsion spring is arranged between the rotary contact piece and the second tray accommodating groove, a protruding part is arranged on one inward side of the rotary contact piece, a vertical surface is arranged on one side of the protruding part, and an inclined surface is arranged on the other side of the protruding part; when charging tray conveying mechanism carries the charging tray to the below of second charging tray storage tank, charging tray jack-up board pushes up the charging tray from charging tray conveying mechanism to second charging tray storage tank, and the turn-ups of charging tray is along conflicting ascending on one side in the inclined plane on the bottom on inclined plane for rotate conflict piece and toward the upset outward, the turn-ups of charging tray breaks away from the inclined plane after rotate conflict piece and resets, the turn-ups of charging tray are contradicted in the perpendicular.
The invention has the beneficial effects that:
the problem of the unable full automation of transistor equipment leads to the packaging efficiency lower is solved: the automatic transistor assembling machine is provided with the rotary table, the rotary table driving mechanism and the plurality of jigs, the jigs are driven to move to the mechanisms of each process step through the rotation of the rotary table, and the automatic transistor assembling machine can be used for automatically loading, assembling and unloading transistors, so that the assembling efficiency of the transistors is improved.
Drawings
The invention is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be obtained on the basis of the following drawings without inventive effort.
Fig. 1 is a schematic perspective view of embodiment 1 of the present invention.
Fig. 2 is a schematic perspective view of embodiment 2 of the present invention.
Fig. 3 is a schematic perspective view of embodiment 3 of the present invention.
Fig. 4 is a schematic structural view of the blanking mechanism of the present invention.
Fig. 5 is a schematic structural diagram of a material taking mechanism of the present invention.
Fig. 6 is a schematic structural diagram of the first tray stacking mechanism of the present invention.
Fig. 7 is a schematic structural diagram of a second tray stacking mechanism and a tray conveying mechanism of the invention.
Fig. 8 is a schematic structural view of the rotary contact member of the present invention.
Reference numerals
A rotating disk-11, a fixture-12,
a screw feeding mechanism-21, an iron sheet feeding mechanism-22, a radiating fin feeding mechanism-23, a transistor feeding mechanism-24, an insulating electric ring feeding mechanism-25, a nut feeding mechanism-26, a silica gel dispensing mechanism-27,
a feeding mechanism-3, a feeding mechanism,
a material taking mechanism-31, a material taking member-311, a material taking z-axis driving mechanism-312, a material taking x-axis driving mechanism-313, a material taking y-axis driving mechanism-314,
a first tray stacking mechanism-32, a first tray accommodating groove-321, an upper tray contact-322, a lower tray contact-323, a through hole-324,
a tray conveying mechanism-33, a first conveying belt-331, a second conveying belt-332, a blocking ejection piece-333, a tray discharging mechanism-334,
a second tray stacking mechanism-34, a second tray receiving groove-341, a tray jacking plate-342, a rotation contact piece-343, a protrusion-344, a vertical surface-345, a slope-346,
a tray-4 and a flange-41.
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
It should be noted that the structures shown in the drawings are only used for matching the disclosure of the present invention, so as to be understood and read by those skilled in the art, and are not used to limit the conditions of the present invention, so that the present invention has no technical significance, and any modifications or adjustments of the structures should still fall within the scope of the technical contents of the present invention without affecting the function and the achievable purpose of the present invention.
Example 1
As shown in fig. 1, 5, 6, 7 and 8, an automatic transistor assembling machine includes a turntable 11 and a turntable driving mechanism (not shown in the drawings) for driving the turntable 11 to rotate, wherein a plurality of jigs 12 for placing products are arranged in a circumferential array of the turntable 11; the automatic transistor assembling machine further comprises a screw feeding mechanism 21, an iron sheet feeding mechanism 22, a radiating fin feeding mechanism 23, a transistor feeding mechanism 24, an insulating electric ring feeding mechanism 25, a nut feeding mechanism 26 and a discharging mechanism 3, wherein the screw feeding mechanism 21, the iron sheet feeding mechanism 22, the radiating fin feeding mechanism 23, the transistor feeding mechanism 24, the insulating electric ring feeding mechanism 25, the nut feeding mechanism 26 and the discharging mechanism 3 are all arranged on the periphery of the turntable 11; the screw feeding mechanism 21 is used for feeding external screws to the jig 12; the iron sheet feeding mechanism 22 is used for feeding external iron sheets to the jig 12; the heat sink feeding mechanism 23 is used for feeding external heat sinks to the jig 12; the transistor feeding mechanism 24 is used for feeding an external transistor to the jig 12 and enabling the transistor to be attached to an iron sheet, and the transistor feeding mechanism 24 is also used for trimming pins of the transistor; the insulating electric ring feeding mechanism 25 is used for feeding an external insulating electric ring and assembling the insulating electric ring to a transistor in the jig 12; the nut feeding mechanism 26 is used for feeding an external nut to the transistor in the jig 12, and the nut feeding mechanism 26 is also used for screwing the nut to the screw; the blanking mechanism 3 is used for blanking the transistor after the nut is screwed down.
In actual use, the turntable 11 is driven by the turntable driving mechanism to rotate according to a certain frequency and amplitude, and the frequency and the amplitude depend on the time for assembling each mechanism; the screw is firstly put into the corresponding position of the jig 12 by the screw feeding mechanism 21, the jig 12 is also provided with a position (positioning groove) for placing the iron sheet, the radiating fin and the transistor, the turntable 11 rotates to the iron sheet feeding mechanism 22 at the next station to feed the iron sheet, and so on, and finally the transistor is assembled and discharged in the discharging mechanism 3.
In this embodiment, the prior art is referred to for the structure of the screw feeding mechanism 21, the iron sheet feeding mechanism 22, the heat sink feeding mechanism 23, the transistor feeding mechanism 24, the insulating electric ring feeding mechanism 25, and the nut feeding mechanism 26, and the principle of how the screw feeding mechanism 21 performs screw feeding, how the iron sheet feeding mechanism 22 performs iron sheet feeding, how the heat sink feeding mechanism 23 performs heat sink feeding, how the transistor feeding mechanism 24 performs transistor feeding, how the insulating electric ring feeding mechanism 25 performs insulating electric ring feeding, and how the nut feeding mechanism 26 performs nut locking, and details thereof are not repeated herein.
Specifically, the blanking mechanism (3) comprises a material taking mechanism (31), a first material tray stacking mechanism (32), a material tray conveying mechanism (33) and a second material tray stacking mechanism (34), the first material tray stacking mechanism (32) and the second material tray stacking mechanism (34) are respectively arranged at two ends of the material tray conveying mechanism (33), and the material taking mechanism (31) is arranged on the material tray conveying mechanism (33) and located between the first material tray stacking mechanism (32) and the second material tray stacking mechanism (34); the first tray stacking mechanism (32) is used for stacking a plurality of trays (4), and the tray conveying mechanism (33) is used for conveying the trays (4) from the first tray stacking mechanism (32) to the second tray stacking mechanism (34); the material taking mechanism (31) is used for taking out the transistors loaded in the jig (12) and transferring the transistors to a material tray (4) of the material tray conveying mechanism (33).
In order to facilitate storage and transportation of the assembled transistor, the blanked transistor is accommodated by the tray 4 in this embodiment; the first tray stacking mechanism 32 of this embodiment can stack a plurality of empty trays 4. Specifically, the first tray stacking mechanism 32 includes a first tray accommodating groove 321, an upper tray contact 322, and a lower tray contact 323, and the first tray accommodating groove 321 is disposed at one end of the tray conveying mechanism 33 and is communicated with the tray conveying mechanism 33; the first tray accommodating groove 321 is used for accommodating trays 4 and stacking the trays 4, and the upper tray contact 322 and the lower tray contact 323 are respectively used for ejecting and contacting with the flanges 41 of the trays 4; the side wall of the first tray accommodating groove 321 is provided with a through hole 324 through which the upper tray contact element 322 and the lower tray contact element 323 can pass, the upper tray contact element 322 is arranged above the lower tray contact element 323, the upper tray contact element 322 and the lower tray contact element 323 are arranged at intervals, and the interval between the upper tray contact element 322 and the lower tray contact element 323 is not less than the thickness of the flanging 41 of the tray 4. The number of the through holes 324 is two, and the two through holes are symmetrically arranged on two side walls of the first tray accommodating groove 321; the number of the upper tray contact elements 322 and the number of the lower tray contact elements 323 are two, the two upper tray contact elements 322 are symmetrically arranged about the first tray accommodating groove 321, and the two lower tray contact elements 323 are symmetrically arranged about the first tray accommodating groove 321.
In actual use, a plurality of trays 4 are stacked into a tray stack and accommodated in the first tray accommodating groove 321, and the shape of the first tray accommodating groove 321 is consistent with that of the tray 4; the upper tray contact elements 322 on both sides of the first tray accommodating groove 321 support the flange 41 of the tray 4 at the bottommost part of the tray stack, so that the tray stack is suspended in the tray conveying mechanism 33 and the tray 4 is prevented from contacting the tray conveying mechanism 33; when the material tray 4 is needed to store the transistor, the upper material tray abutting part 322 is controlled to extend into the through hole 324 so that the upper material tray abutting part 322 is supported on the penultimate material tray 4 at the bottom end of the material tray stack, at this moment, the lower material tray abutting part 323 retracts, the material tray 4 at the bottom end of the material tray stack automatically falls onto the material tray conveying mechanism 33, and the material tray conveying mechanism 33 drives the material tray 4 to move to a corresponding position so as to allow the material taking mechanism 31 to place the transistor. And set up charging tray supporting part 322 and unloading dish supporting part 323 respectively through the both sides at first charging tray storage tank 321 for charging tray 4 both sides all obtain the bearing, guarantee the stability that the charging tray pile piled up.
Concretely, extracting mechanism (31) is including getting material piece (311), getting material z axle actuating mechanism (312), getting material x axle actuating mechanism (313) and getting material y axle actuating mechanism (314), get the top that material y axle actuating mechanism (314) were located charging tray conveying mechanism (33), get material y axle actuating mechanism (314) and be used for driving to get material x axle actuating mechanism (313) and remove along the direction of perpendicular to transmission band (33) transmission, get material x axle actuating mechanism (313) and be used for driving to get material z axle actuating mechanism (312) and remove along the direction of transmission band (33) transmission, it is used for the drive to get material piece (311) and goes up and down to get material z axle actuating mechanism (312), it is used for adsorbing the transistor from tool (12) to get material piece (311). In this embodiment, the conveying direction of the tray conveying mechanism 33 is parallel to the x-axis; a sucking disc (not shown in the figure) is arranged on the material taking part 311, the sucking disc is communicated with an external air source, and the material taking part 311 is used for sucking the transistor in a vacuumizing mode; the material taking z-axis driving mechanism 312, the material taking x-axis driving mechanism 313 and the material taking y-axis driving mechanism 314 are driving mechanisms consisting of motors, belts and belt pulleys, and the structure and the principle of the driving mode belong to the prior art; for the principles of how the material-taking y-axis driving mechanism 314 is used to drive the material-taking x-axis driving mechanism 313 to move on the y-axis, how the material-taking x-axis driving mechanism 313 is used to drive the material-taking z-axis driving mechanism 312 to move on the x-axis, and how the material-taking z-axis driving mechanism 312 is used to drive the material-taking member 311 to ascend and descend, reference may be made to the prior art, and details thereof are not repeated herein.
Specifically, the second tray stacking mechanism 34 includes a second tray accommodating groove 341, a tray jacking plate 342, and a plurality of rotation stoppers 343, the second tray accommodating groove 341 is disposed at one end of the tray conveying mechanism 33 and is communicated with the tray conveying mechanism 33, and the plurality of rotation stoppers 343 are rotatably connected to the inner side wall of the second tray accommodating groove 341, respectively; the second tray receiving groove 341 is configured to receive trays 4 and stack the trays 4, and the tray lifting plate 342 is disposed below the second tray receiving groove 341 and configured to lift the trays 4 from the tray conveying mechanism 33 to the second tray receiving groove 341; a return torsion spring (not shown) is arranged between the rotary contact piece 343 and the second tray receiving groove 341, a protrusion 344 is arranged on an inward side of the rotary contact piece 343, a vertical surface 345 is arranged on one side of the protrusion 344, and an inclined surface 346 is arranged on the other side of the protrusion 344; when the tray conveying mechanism 33 conveys the tray 4 to the lower side of the second tray receiving groove 341, the tray jacking plate 342 jacks the tray 4 from the tray conveying mechanism 33 to the second tray receiving groove 341, the flange 41 of the tray 4 rises along one side of the bottom of the inclined plane 346 in contact with the inclined plane 346, so that the rotary contact part 343 is turned over outwards, the flange 41 of the tray 4 is reset after being separated from the inclined plane 346, and the flange 41 of the tray 4 is supported on the vertical plane 345.
During the actual use, after first charging tray 4 contradicts in rotating contact member 343, the next charging tray 4 removes the below to first charging tray 4 with the same mode, and the turn-ups 41 of the next charging tray 4 then pushes open the turn-ups 41 of first charging tray 4 and contradict in the bottom of first charging tray 4, and so on to play the effect of piling up charging tray 4 in second charging tray storage groove 341.
Specifically, the tray conveying mechanism 33 includes a first conveying belt 331 and a second conveying belt 332, and the first conveying belt 331 and the second conveying belt 332 are connected end to end; the first tray stacking mechanism 32 is arranged above the first conveyer belt 331, and the second tray stacking mechanism 34 is arranged above the second conveyer belt 332; the blanking mechanism 3 further comprises a tray discharging mechanism 334 which is arranged to intersect with the first conveyer belt 331, and the tray discharging mechanism 334 is used for driving the second conveyer belt 332 to move transversely. In this embodiment, the tray conveying mechanism 33 is divided into two parts, and when the trays 4 in the second tray accommodating groove 341 are fully stacked, the second conveying belt 332 and the second tray stacking mechanism 34 are driven to move transversely outward by controlling the tray discharging mechanism 334, so that the manipulator can take out all the trays 4 from the second tray accommodating groove 341 conveniently; and after the material disc 4 is taken out, the material disc discharging mechanism 334 is controlled to reset so as to stack the material disc 4 of the next round.
Specifically, the blocking ejector 333 for blocking the movement of the tray 4 is arranged below the first conveyor belt 331 and close to the second conveyor belt 332, so that the tray 4 is temporarily stopped after the tray 4 moves to the position where the blocking ejector 333 is located, and the transistor is conveniently placed on the tray 4 by the material taking mechanism 31.
In summary, the automatic transistor assembling machine of the present embodiment has the following effects:
the problem of the unable full automation of transistor equipment leads to the packaging efficiency lower is solved: the automatic transistor assembling machine is provided with the rotary table 11, the rotary table driving mechanism and the plurality of jigs 12, the jigs 12 are driven to move to the mechanisms of each process step through the rotation of the rotary table 11, and the full-automatic feeding, assembling and discharging are carried out on transistors through the mechanisms, so that the assembling efficiency of the transistors is improved.
Example 2
As shown in fig. 2, 5, 6, 7 and 8, the automatic transistor assembling machine of the present embodiment includes a turntable 11 and a turntable driving mechanism for driving the turntable 11 to rotate, wherein a plurality of jigs 12 for placing transistors are arranged in a circumferential array of the turntable 11; the automatic transistor assembling machine further comprises a screw feeding mechanism 21, an iron sheet feeding mechanism 22, a silica gel dispensing mechanism 27, a transistor feeding mechanism 24, a nut feeding mechanism 26 and a discharging mechanism 3, wherein the screw feeding mechanism 21, the iron sheet feeding mechanism 22, the radiating fin feeding mechanism 23, the transistor feeding mechanism 24, the insulating electric coil feeding mechanism 25, the nut feeding mechanism 26 and the discharging mechanism 3 are sequentially arranged along the rotating direction of the turntable 11; the screw feeding mechanism 21 is used for feeding external screws to the jig 12; the iron sheet feeding mechanism 22 is used for feeding external iron sheets to the jig 12; the silica gel dispensing mechanism 27 is used for dispensing heat silica gel on the iron sheet in the jig 12; the transistor feeding mechanism 24 is used for feeding an external transistor to the jig 12, so that the transistor is attached to the iron sheet and pins of the transistor are cut; the nut feeding mechanism 26 is used for feeding external nuts to the transistors in the jig 12 and screwing the nuts to the screws; the blanking mechanism 3 is used for blanking the transistor which is screwed down by the nut to the outside.
Since different transistors are assembled in different manners and different parts, the automatic transistor assembling machine of the present embodiment automatically assembles the transistors by providing the screw feeding mechanism 21, the iron sheet feeding mechanism 22, the silicone dispensing mechanism 27, the transistor feeding mechanism 24, the nut feeding mechanism 26, and the blanking mechanism 3. Since the screw feeding mechanism (21), the iron piece feeding mechanism 22, the transistor feeding mechanism 24, the nut feeding mechanism 26 and the blanking mechanism 3 are common processes for transistor assembly, the screw feeding mechanism 21, the iron piece feeding mechanism 22, the transistor feeding mechanism 24, the nut feeding mechanism 26 and the blanking mechanism 3 of the present embodiment are the same as those of embodiment 1; in addition, as for the structure of the dispensing mechanism 27 and the principle of how to dispense heat-dissipating silicone on the iron sheet, reference may be made to the prior art, and details thereof are not repeated herein.
Example 3
As shown in fig. 3, 5, 6, 7 and 8, the automatic transistor assembling machine of the present embodiment includes a turntable 11 and a turntable driving mechanism for driving the turntable 11 to rotate, wherein a plurality of jigs 12 for placing products are arranged in a circumferential array of the turntable 11; the automatic transistor assembling machine further comprises a screw feeding mechanism 21, an iron sheet feeding mechanism 22, a radiating fin feeding mechanism 23, a point silica gel mechanism 27, a transistor feeding mechanism 24, an insulating electric ring feeding mechanism 25, a nut feeding mechanism 26 and a discharging mechanism 3, wherein the screw feeding mechanism 21, the iron sheet feeding mechanism 22, the point silica gel mechanism 27, the radiating fin feeding mechanism 23, the transistor feeding mechanism 24, the insulating electric ring feeding mechanism 25, the nut feeding mechanism 26 and the discharging mechanism 3 are sequentially arranged on the periphery of the turntable 11 along the rotating direction of the turntable 11.
In this embodiment, since the screw feeding mechanism 21, the iron sheet feeding mechanism 22, the heat sink feeding mechanism 23, the point silica gel mechanism 27, the transistor feeding mechanism 24, the insulating coil feeding mechanism 25, the nut feeding mechanism 26 and the blanking mechanism 3 are arranged on the turntable 11, full-automatic feeding, assembling and blanking of two different types of transistors can be satisfied, which can be realized only by setting different rotation frequencies and amplitudes of the turntable 11 when assembling different transistors, and simultaneously, the space can be saved.
It should be noted that the turntable 11, the jig 12, the screw feeding mechanism 21, the iron sheet feeding mechanism 22, the heat sink feeding mechanism 23, the silicone dispensing mechanism 27, the transistor feeding mechanism 24, the insulating coil feeding mechanism 25, the nut feeding mechanism 26, and the blanking mechanism 3 in this embodiment are the same as those in embodiments 1 and 2, and therefore, the description thereof is omitted.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (10)
1. An automatic kludge of transistor which characterized in that: the rotary table comprises a rotary table (11) and a rotary table driving mechanism for driving the rotary table (11) to rotate, wherein a plurality of jigs (12) for placing products are arranged on the circumferential array of the rotary table (11);
the automatic transistor assembling machine further comprises a screw feeding mechanism (21), an iron sheet feeding mechanism (22), a radiating fin feeding mechanism (23), a transistor feeding mechanism (24), an insulating electric ring feeding mechanism (25), a nut feeding mechanism (26) and a discharging mechanism (3) which are arranged around the rotary table (11);
the screw feeding mechanism (21) is used for feeding external screws to the jig (12); the iron sheet feeding mechanism (22) is used for feeding external iron sheets to the jig (12); the radiating fin feeding mechanism (23) is used for feeding external radiating fins to the jig (12); the transistor feeding mechanism (24) is used for feeding an external transistor to the jig (12) and enabling the transistor to be attached to an iron sheet, and the transistor feeding mechanism (24) is also used for trimming pins of the transistor; the insulating electric ring feeding mechanism (25) is used for feeding an external insulating electric ring and assembling the insulating electric ring to a transistor in the jig (12); the nut feeding mechanism (26) is used for feeding an external nut to the transistor in the jig (12) and screwing the nut to the screw; the blanking mechanism (3) is used for blanking the transistor which is screwed down by the nut to the outside.
2. An automatic kludge of transistor which characterized in that: the transistor-forming device comprises a rotary table (11) and a rotary table driving mechanism for driving the rotary table (11) to rotate, wherein a plurality of jigs (12) for placing transistors are arranged on the circumferential array of the rotary table (11);
the automatic transistor assembling machine further comprises a screw feeding mechanism (21), an iron sheet feeding mechanism (22), a silica gel dispensing mechanism (27), a transistor feeding mechanism (24), a nut feeding mechanism (26) and a discharging mechanism (3), wherein the screw feeding mechanism, the iron sheet feeding mechanism, the silica gel dispensing mechanism, the transistor feeding mechanism and the nut feeding mechanism are arranged around the turntable (11);
the screw feeding mechanism (21) is used for feeding external screws to the jig (12); the iron sheet feeding mechanism (22) is used for feeding external iron sheets to the jig (12); the silica gel dispensing mechanism (27) is used for radiating silica gel on iron sheets in the jig (12); the transistor feeding mechanism (24) is used for feeding an external transistor to the jig (12) and enabling the transistor to be attached to an iron sheet, and the transistor feeding mechanism (24) is also used for trimming pins of the transistor; the nut feeding mechanism (26) is used for feeding an external nut to the transistor in the jig (12) and screwing the nut to the screw; the blanking mechanism (3) is used for blanking the transistor which is screwed down by the nut to the outside.
3. The automatic transistor assembling machine according to any one of claims 1 or 2, characterized in that: the blanking mechanism (3) comprises a material taking mechanism (31), a first material tray stacking mechanism (32), a material tray conveying mechanism (33) and a second material tray stacking mechanism (34), the first material tray stacking mechanism (32) and the second material tray stacking mechanism (34) are respectively arranged at two ends of the material tray conveying mechanism (33), and the material taking mechanism (31) is arranged on the material tray conveying mechanism (33) and is positioned between the first material tray stacking mechanism (32) and the second material tray stacking mechanism (34);
the first tray stacking mechanism (32) is used for stacking a plurality of trays (4), and the tray conveying mechanism (33) is used for conveying the trays (4) from the first tray stacking mechanism (32) to the second tray stacking mechanism (34); the material taking mechanism (31) is used for taking out the transistors loaded in the jig (12) and transferring the transistors to a material tray (4) of the material tray conveying mechanism (33).
4. The automatic transistor assembling machine according to claim 3, wherein: the material taking mechanism (31) comprises a material taking part (311), a material taking z-axis driving mechanism (312), a material taking x-axis driving mechanism (313) and a material taking y-axis driving mechanism (314), the material taking y-axis driving mechanism (314) is arranged above the tray conveying mechanism (33), the material taking y-axis driving mechanism (314) is used for driving the material taking x-axis driving mechanism (313) to move along the direction perpendicular to the conveying direction of the conveying belt (33), the material taking x-axis driving mechanism (313) is used for driving the material taking z-axis driving mechanism (312) to move along the direction of the conveying belt (33), the material taking z-axis driving mechanism (312) is used for driving the material taking part (311) to lift, and the material taking part (311) is used for adsorbing transistors from the jig (12).
5. The automatic transistor assembling machine according to claim 3, wherein: the first tray stacking mechanism (32) comprises a first tray accommodating groove (321), an upper tray abutting piece (322) and a lower tray abutting piece (323), and the first tray accommodating groove (321) is arranged at one end of the tray conveying mechanism (33) and communicated with the tray conveying mechanism (33); the first tray accommodating groove (321) is used for accommodating trays (4) and stacking the trays (4), and the upper tray contact piece (322) and the lower tray contact piece (323) are respectively used for ejecting and supporting flanges (41) of the trays (4);
the side wall of first charging tray storage tank (321) is equipped with through-hole (324) that are used for supplying respectively that charging tray supported contact piece (322) and unloading dish supported contact piece (323) pass, charging tray supported contact piece (322) locate the top of unloading dish supported contact piece (323), charging tray supported contact piece (322) and unloading dish supported contact piece (323) interval set up, the interval between charging tray supported contact piece (322) and the unloading dish supported contact piece (323) is not less than the thickness of charging tray (4) turn-ups (41).
6. The automatic transistor assembling machine according to claim 5, wherein: the number of the through holes (324) is two, and the two through holes are symmetrically arranged on two side walls of the first tray accommodating groove (321); the number of the upper tray contact pieces (322) and the number of the lower tray contact pieces (323) are two respectively, the two upper tray contact pieces (322) are symmetrically arranged about the first tray accommodating groove (321), and the two lower tray contact pieces (323) are symmetrically arranged about the first tray accommodating groove (321).
7. The automatic transistor assembling machine according to claim 3, wherein: the tray conveying mechanism (33) comprises a first conveying belt (331) and a second conveying belt (332), and the first conveying belt (331) is connected with the second conveying belt (332) end to end; the first tray stacking mechanism (32) is arranged above the first conveying belt (331), and the second tray stacking mechanism (34) is arranged above the second conveying belt (332).
8. The automatic transistor assembling machine according to claim 7, wherein: and a blocking ejection piece (333) for blocking the movement of the material tray (4) is arranged below the first conveying belt (331) close to the second conveying belt (332).
9. The automatic transistor assembling machine according to claim 7, wherein: the blanking mechanism (3) further comprises a material tray discharging mechanism (334) which is arranged in a cross mode with the first conveying belt (331), and the material tray discharging mechanism (334) is used for driving the second conveying belt (332) to move transversely.
10. The automatic transistor assembling machine according to claim 3, wherein: the second tray stacking mechanism (34) comprises a second tray accommodating groove (341), a tray jacking plate (342) and a plurality of rotating contact pieces (343), the second tray accommodating groove (341) is arranged at one end of the tray conveying mechanism (33) and communicated with the tray conveying mechanism (33), and the plurality of rotating contact pieces (343) are respectively connected to the inner side wall of the second tray accommodating groove (341) in a rotating manner; the second tray accommodating groove (341) is used for accommodating trays (4) and stacking the trays (4), and the tray jacking plate (342) is arranged below the second tray accommodating groove (341) and is used for jacking the trays (4) from the tray conveying mechanism (33) to the second tray accommodating groove (341);
a reset torsion spring is arranged between the rotating contact piece (343) and the second tray accommodating groove (341), a protruding part (344) is arranged on one inward side of the rotating contact piece (343), a vertical surface (345) is arranged on one side of the protruding part (344), and an inclined surface (346) is arranged on the other side of the protruding part (344); when the tray conveying mechanism (33) conveys the tray (4) to the lower part of the second tray accommodating groove (341), the tray jacking plate (342) jacks the tray (4) to the second tray accommodating groove (341) from the tray conveying mechanism (33), one side of the flange (41) of the tray (4) abuts against the inclined plane (346) and rises along the bottom of the inclined plane (346), so that the rotary abutting part (343) overturns outwards, the flange (41) of the tray (4) rotates to abut against the abutting part (343) to reset after being separated from the inclined plane (346), and the flange (41) of the tray (4) abuts against the vertical plane (345).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010267663.5A CN111430287A (en) | 2020-03-27 | 2020-03-27 | Automatic transistor assembling machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010267663.5A CN111430287A (en) | 2020-03-27 | 2020-03-27 | Automatic transistor assembling machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111430287A true CN111430287A (en) | 2020-07-17 |
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ID=71555793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010267663.5A Pending CN111430287A (en) | 2020-03-27 | 2020-03-27 | Automatic transistor assembling machine |
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| Country | Link |
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| CN (1) | CN111430287A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112705934A (en) * | 2020-12-03 | 2021-04-27 | 深圳市道和实业有限公司 | Intelligent chip assembling and processing device |
-
2020
- 2020-03-27 CN CN202010267663.5A patent/CN111430287A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112705934A (en) * | 2020-12-03 | 2021-04-27 | 深圳市道和实业有限公司 | Intelligent chip assembling and processing device |
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