CN111430265B - Shielding device and method for machine window and semiconductor device - Google Patents
Shielding device and method for machine window and semiconductor device Download PDFInfo
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- CN111430265B CN111430265B CN201911191281.2A CN201911191281A CN111430265B CN 111430265 B CN111430265 B CN 111430265B CN 201911191281 A CN201911191281 A CN 201911191281A CN 111430265 B CN111430265 B CN 111430265B
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- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 claims abstract description 65
- 239000010949 copper Substances 0.000 claims abstract description 65
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 64
- 238000004458 analytical method Methods 0.000 claims abstract description 15
- 239000007787 solid Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 21
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 244000171022 Peltophorum pterocarpum Species 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 6
- 230000006698 induction Effects 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000001960 triggered effect Effects 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application discloses a shielding device and method of a machine window and semiconductor equipment, wherein the shielding device of the machine window comprises a judging module, an analysis processing module and a motor driving module, the judging module is used for determining the type of a wafer conveying box and determining the covering state of the machine window, the analysis processing module is used for receiving the type of the wafer conveying box and the covering state of the machine window so as to output a control signal, and the motor driving module is used for receiving the control signal so as to drive a shielding part to move upwards or downwards along the machine window. The application avoids the occurrence of the phenomena of opening a window to check the state of internal components and the like when the machine mixed operation non-copper process has faults and dislocation.
Description
Technical Field
The present application relates to the field of semiconductor integrated circuit manufacturing technology, and in particular, to a shielding device and method for a machine window, and a semiconductor device.
Background
In order to avoid the influence of light on the copper process, the window of the mixed operation machine is subjected to fixed film covering and shielding treatment.
When the machine mixed operation non-copper process fails and misplaces, a window door is opened to check the state of an internal component, so as to judge whether the position of a wafer is horizontal, whether the orientation position of a mechanical arm of semiconductor equipment is correct, and the like, thereby generating unnecessary internal chain reaction, increasing loop time, and causing the phenomena of productivity waste, and the like.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, the present application is directed to a shielding device and method for a machine window, and a semiconductor device, so as to solve the problems in the prior art that when a machine mixed operation non-copper process fails and is misplaced, a window door needs to be opened to check the state of internal components, thereby judging whether the position of a wafer is horizontal, whether the orientation position of a manipulator of the semiconductor device is correct, etc., unnecessary internal linkage reactions are generated, loop time is increased, and waste of productivity is caused.
To achieve the above and other related objects, the present application provides a shielding device for a machine window, where the shielding device for a machine window includes:
the judging module is used for determining the type of the wafer transfer box and determining the coverage state of the machine window;
the analysis processing module is used for receiving the type of the wafer transfer box and the coverage state of the machine window so as to output a control signal;
and the motor driving module is used for receiving the control signal so as to drive the shielding component to move upwards or downwards along the machine window.
In an embodiment of the present application, the shielding device for a machine window further includes:
and the elastic support column is arranged in a support column hole of the set characteristic point position on the machine table, and is connected with the judging module.
In an embodiment of the present application, the determining module includes:
at least one first sensing module for sensing the position change of the elastomeric support column;
the first judging module is used for determining the type of the wafer transfer box according to the position change of the elastic support column;
the second sensing module is used for sensing the position change of the shielding component;
and the second judging module is used for determining the coverage state of the machine window according to the position change of the shielding component.
In one embodiment of the application, the first sensing module is mounted on elastomeric support columns.
In an embodiment of the application, the second sensing module is installed on the machine window, and when the shielding component is located at the top end or the bottom end of the machine window, the second sensing module is located at the bottom end or the top end of the machine window.
In one embodiment of the application, the types of pods include copper pods and non-copper pods.
In one embodiment of the present application, the change in the position of the shielding member includes the shielding member moving from the top to the bottom of the machine window, and the shielding member moving from the bottom to the top of the machine window.
The application also provides a shielding method of the machine window, which comprises the following steps:
determining the type of the wafer cassette;
determining the coverage state of the machine window;
and determining whether the shielding component moves and the moving direction according to the type of the wafer conveying box and the covering state of the machine window.
In one embodiment of the present application, the determining the type of the pod includes:
sensing and judging the position change of the elastic support column;
when the position of the elastic support column changes, judging the type of the wafer transfer box to be a copper wafer transfer box;
and judging the type of the wafer transfer box to be a non-copper wafer transfer box when the position of the elastic support column is unchanged.
In an embodiment of the present application, the determining the coverage status of the machine window includes:
sensing and judging the position change of the shielding component;
when the position of the shielding component changes, judging that the machine window is in a covering state;
and when the position of the shielding component is unchanged, judging that the machine window is in an uncovered state.
In an embodiment of the present application, the determining whether the shielding member moves and the moving direction according to the type of the wafer cassette and the coverage state of the machine window includes:
when the wafer transfer box is of a copper wafer transfer box type and the machine window is in a covering state, the shielding component does not move;
when the wafer transfer box is of a copper wafer transfer box type and the machine window is in an uncovered state, the shielding component moves upwards along the machine window;
when the wafer transfer box is of a non-copper wafer transfer box type and the machine window is in an uncovered state, the shielding part does not move;
when the wafer transfer box is of a non-copper wafer transfer box type and the machine window is in a covering state, the shielding component moves downwards along the machine window.
The application also provides a semiconductor device comprising the shielding device of the machine window, which comprises:
the wafer conveying box and/or the non-copper wafer conveying box are/is arranged in the machine body;
the machine window is arranged on the machine body and is connected with the shielding component;
a shielding member connected to the motor driving module;
and an elastic support column is arranged in the support column hole of the machine table carrier, on which the characteristic point position is set.
As described above, the shielding device and method for the machine window and the semiconductor device have the following beneficial effects:
the shielding device of the machine window of the application determines the type of the wafer transfer box by sensing the position change of the elastic support column; and determining the coverage state of the machine window by sensing the position change of the shielding component, and finally driving the shielding component to move upwards or downwards along the machine window. The application avoids unnecessary internal chain reaction caused by opening the window to check the state of the internal components when the machine mixed operation non-copper process has faults and dislocation, increases the loop time, and causes the occurrence of the phenomena of productivity waste and the like.
The shielding device for the machine window is convenient for operators to check the state of the machine at any time, and saves the time of checking operation. The shielding device of the machine window can also observe the running state of the machine at any time, and avoid the occurrence of abnormal phenomena in advance.
The shielding method of the machine window has higher intelligent degree, can automatically control shielding of the window, ensures that the machine window is in a covered state during copper processing and is in a non-covered state during non-copper processing.
Drawings
Fig. 1 is a block diagram of a machine for mixing an operation non-copper wafer cassette and a copper wafer cassette according to an embodiment of the present application.
Fig. 2 is a block diagram of a post-metal non-copper wafer cassette according to an embodiment of the present application.
Fig. 3 is a block diagram of a non-copper wafer cassette before metal provided in an embodiment of the present application.
Fig. 4 is a block diagram of a copper wafer transfer box according to an embodiment of the present application.
Fig. 5 is a block diagram of a shielding device for a machine window according to an embodiment of the present application.
Fig. 6 is a schematic block diagram of a shielding device for a machine window according to an embodiment of the present application.
Fig. 7 is a schematic circuit diagram of an analysis processing module of a shielding device for a machine window according to an embodiment of the present application.
Fig. 8 is a schematic circuit diagram of a first sensing module of a shielding device for a machine window according to an embodiment of the present application.
Fig. 9 is a schematic circuit diagram of a second sensing module of a shielding device for a machine window according to an embodiment of the present application.
Fig. 10 is a schematic circuit diagram of a motor driving module of a shielding device for a machine window according to an embodiment of the present application.
FIG. 11 is a flowchart illustrating a method for shielding a machine window according to an embodiment of the present application.
Fig. 12 is a flowchart of a method for shielding a machine window according to another embodiment of the present application.
Description of element reference numerals
1. Elastomeric support column
2. First induction module
3. Second induction module
4. Power supply module
5. Analysis processing module
6. Motor driving module
7. Machine body
8. Handle grip
9. Non-copper wafer transfer box
10. Copper wafer transfer box
11. Machine table
12. First characteristic point
13. Second characteristic point
14. Third characteristic point
15. Bottom end of machine table window
16. Top of machine window
17. First judging module
18. Second judging module
S1 to S3 steps
Detailed Description
Other advantages and effects of the present application will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present application with reference to specific examples. The application may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present application. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict.
It should be noted that the illustrations provided in the following embodiments merely illustrate the basic concept of the present application by way of illustration, and only the components related to the present application are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
Referring to fig. 1, fig. 2, fig. 3, and fig. 4, fig. 1 is a block diagram of a machine for mixing operation non-copper wafer transfer cassettes and copper wafer transfer cassettes according to an embodiment of the application. Fig. 2 is a block diagram of a post-metal non-copper wafer cassette according to an embodiment of the present application. Fig. 3 is a block diagram of a non-copper wafer cassette before metal provided in an embodiment of the present application. Fig. 4 is a block diagram of a copper wafer transfer box according to an embodiment of the present application. The non-copper wafer transfer box 9 and the copper wafer transfer box 10 are mixed and operated in the machine body 7, and a machine stage 11 is mounted at the bottom of the machine body 7. The copper pod 10 and the non-copper pod 9 have different structures, wherein the non-copper pod after the metal and the non-copper pod before the metal refer to the pod in the process. The first feature point 12 of the non-copper wafer transfer box after the metal is hollow, the second feature point 13 of the non-copper wafer transfer box before the metal is hollow, the third feature point 14 of the copper wafer transfer box 10 is solid, the feature point position is set on the machine table 11, and the elastic support column 1 is installed in the unused support column (PIN column) hole, when the position corresponding to the machine table 11 is the non-copper wafer transfer box 9, the elastic support column 1 is unchanged, and when the position corresponding to the machine table 11 is the copper wafer transfer box 10, the elastic support column 1 is in a compressed state because the feature point of the copper wafer transfer box 10 is solid.
Referring to fig. 5 and 6, fig. 5 is a block diagram of a shielding device for a machine window according to an embodiment of the present application. Fig. 5 is a block diagram of a shielding device for a machine window according to an embodiment of the present application. Fig. 6 is a schematic block diagram of a shielding device for a machine window according to an embodiment of the present application. A shielding device of a machine window comprises an elastic support column 1, a judging module, an analysis processing module 5 and a motor driving module 6. The elastic support column 1 is installed in a support column hole of a set feature point position on the machine table 11. The judging module comprises at least one first sensing module 2, at least one second sensing module 3, a first judging module 17 and a second judging module 18. The first sensing module 2 is used for sensing the position change of the elastomeric support columns. The first judging module 17 is configured to determine the type of the pod according to the change in the position of the elastomeric support column. The second sensing module 3 is used for sensing the position change of the shielding component. The second judging module 18 is configured to determine a coverage state of the machine window according to the position change of the shielding component. Specifically, the number of the first sensing modules 2 may correspond to the number of the elastomeric support columns 1, the first sensing modules 2 may be, but not limited to, disposed at the bottom ends of the elastomeric support columns 1, the first sensing modules 2 may be, but not limited to, one of a photoelectric sensor, a limit sensor, and an infrared sensor, the first sensing modules 2 may also be other sensing devices, and may be selected according to an actual application scenario, the elastomeric support columns 1 may be telescopic support columns, when the positions corresponding to the machine table 11 are non-copper wafer transfer boxes 9, the elastomeric support columns 1 do not change, the first sensing modules 2 are not triggered, when the positions corresponding to the machine table 11 are copper wafer transfer boxes 10, the top ends of the elastomeric support columns 1 are compressed to the bottom of the copper wafer transfer boxes 10, the bottom ends of the elastomeric support columns 1 extend out of the bottom of the first sensing modules 2, and the first sensing modules 2 are triggered. The number of the second induction modules 3 may correspond to the number of the machine window, the second induction modules 3 are installed on the machine window, when the shielding component is located at the top end 16 of the machine window, the second induction modules 3 are located at the bottom end 15 of the machine window, and when the shielding component is located at the bottom end 15 of the machine window, the second induction modules 3 are located at the top end 16 of the machine window. Specifically, the second sensing module 3 may be, but is not limited to, one of a photoelectric sensor, a limit sensor, and an infrared sensor, and if the second sensing module 3 is triggered, the machine window is indicated to be in a covered state, and if the second sensing module 3 is not triggered, the machine window is indicated to be in an uncovered state. The non-copper pod 9 and the copper pod 10 may be provided with handles 8.
Referring to fig. 7, fig. 7 is a schematic circuit diagram of an analysis processing module of a shielding device for a machine window according to an embodiment of the application. The analysis processing module 5 is configured to receive the type of the wafer cassette and the coverage state of the machine window, so as to output a control signal. Specifically, the control signals include a high level control signal and a low level control signal. The analysis processing module 5 may include, but is not limited to, a processor U1, the analysis processing module 5 may also be a single chip microcomputer and a microprocessor, the pin 10, the pin 11 and the pin 12 of the processor U1 are respectively connected to one end of the first switch K1, one end of the second switch K2 and one end of the third switch K3, the other end of the first switch K1, the other end of the second switch K2 and the other end of the third switch K3 are grounded, the pin 19 of the processor U1 is respectively connected to one end of the first capacitor C1 and one end of the crystal oscillator X1, the pin 18 of the processor U1 is respectively connected to one end of the second capacitor C2 and the other end of the crystal oscillator X1, the other end of the first capacitor C1 and the other end of the second capacitor C2 are grounded, the pin 9 of the processor U1 is respectively connected to one end of the third resistor R3 and one end of the third capacitor C3, the other end of the third resistor R3 is grounded, the other end of the third capacitor C3 is connected with a power supply, the pin 1 of the processor U1 is connected with the signal output end of the first sensing module 2, the pin 2 of the processor U1 is connected with the signal output end of the second sensing module 3, the pin 6 and the pin 7 of the processor U1 are connected with the motor driving module 6, when the pin 6 of the processor U1 outputs a high-level control signal and the pin 7 of the processor U1 outputs a low-level control signal, the direct current motor in the motor driving module 6 rotates positively, and when the pin 6 of the processor U1 outputs a low-level control signal and the pin 7 of the processor U1 outputs a high-level control signal, the direct current motor in the motor driving module 6 rotates reversely. Pressing the first switch K1, the direct current motor rotates forward, pressing the second switch K2, the direct current motor rotates reversely, pressing the third switch K3, the direct current motor stops rotating, and the operations of manually controlling the direct current motor to rotate forward, rotate reversely and stop rotating through a button are achieved.
Referring to fig. 8 and 9, fig. 8 is a schematic circuit diagram of a first sensing module of a shielding device for a machine window according to an embodiment of the application. Fig. 9 is a schematic circuit diagram of a second sensing module of a shielding device for a machine window according to an embodiment of the present application. The first sensing module 2 may include, but is not limited to, a first photo-sensor U2, a pin 1 of the first photo-sensor U2 is connected to a power supply through a first resistor R1, a pin 2 of the first photo-sensor U2 is grounded, a pin 5 of the first photo-sensor U2 is connected to one end of a second resistor R2, the other end of the second resistor R2 is connected to the power supply, a pin 5 of the first photo-sensor U2 outputs a first sensing signal, the first sensing signal is a type signal of a wafer transfer box, a pin 5 of the first photo-sensor U2 is connected to a pin 1 of the processor U1, and a pin 4 of the first photo-sensor U2 is grounded. The second sensing module 3 may include, but is not limited to, a second photo-sensor U3, where a pin 1 of the second photo-sensor U3 is connected to a power supply through a fourth resistor R4, a pin 2 of the second photo-sensor U3 is grounded, a pin 5 of the second photo-sensor U3 is connected to one end of a fifth resistor R5, the other end of the fifth resistor R5 is connected to the power supply, the pin 5 of the second photo-sensor U3 outputs a second sensing signal, the second sensing signal is a coverage status signal of a machine window, the pin 5 of the second photo-sensor U3 is connected to the pin 2 of the processor U1, and the pin 4 of the second photo-sensor U3 is grounded.
Referring to fig. 10, fig. 10 is a schematic circuit diagram of a motor driving module of a shielding device for a machine window according to an embodiment of the application. The motor driving module 6 includes, but is not limited to, a direct current motor, one end of the direct current motor is connected with an emitter of the first triode Q1 and an emitter of the second triode Q2 respectively, a base of the first triode Q1 is connected with an emitter of the seventh triode Q7, a base of the seventh triode Q7 is connected with one end of the sixth resistor R6 respectively, a base of the second triode Q2 and a collector of the third triode Q3 respectively, the base of the third triode Q3 receives a high level control signal or a low level control signal through a pin 6 of the processor U1, the other end of the direct current motor is connected with an emitter of the fourth triode Q4 and an emitter of the fifth triode Q5 respectively, a base of the fourth triode Q4 is connected with one end of the base of the eighth triode Q8, a base of the seventh resistor R7 respectively, the base of the sixth triode Q6 receives a high level control signal or a low level control signal through a pin 6 of the eighth resistor R6, a collector of the fourth triode Q7, a collector of the fourth triode Q8 is connected with another end of the seventh triode Q7, and another end of the fourth triode Q7. When the other end of the ninth resistor R9 receives the high-level control signal, and the other end of the eighth resistor R8 receives the low-level control signal, the direct current motor rotates forward, and when the other end of the ninth resistor R9 receives the low-level control signal, the other end of the eighth resistor R8 receives the high-level control signal, the direct current motor rotates reversely. When the direct current motor rotates in the forward direction, the shielding component moves upwards along the machine table window, and when the direct current motor rotates in the reverse direction, the shielding component moves downwards along the machine table window.
Referring to fig. 11 and 12, fig. 11 is a flowchart illustrating a method for shielding a machine window according to an embodiment of the application. Fig. 12 is a flowchart of a method for shielding a machine window according to another embodiment of the present application. Similar to the principle of the shielding device of the machine window, the application also provides a shielding method of the machine window, which comprises the following steps: s1, determining the type of the wafer transfer box. S2, determining the coverage state of the machine window. S3, determining whether the shielding component moves and the moving direction according to the type of the wafer conveying box and the covering state of the machine window. Specifically, the determining of the type of the wafer transfer box and the determining of the coverage state of the machine window have no obvious sequence, the determining of the type of the wafer transfer box may be performed first, then the determining of the coverage state of the machine window may be performed, the determining of the coverage state of the machine window may be performed first, then the determining of the type of the wafer transfer box may be performed, and the determining of the coverage state of the machine window and the determining of the type of the wafer transfer box may be performed simultaneously. In step S1, the type of pod may be determined by sensing a change in the position of the elastomeric support columns 1. In step S2, the covering state of the machine window may be determined by sensing the position change of the shielding member. Specifically, step S1 specifically includes the following operations: sensing and judging the position change of the elastic support column. And judging the type of the wafer transfer box as a copper wafer transfer box when the position of the elastic support column changes. And judging the type of the wafer transfer box to be a non-copper wafer transfer box when the position of the elastic support column is unchanged. Specifically, step S2 specifically includes the following operations: and sensing and judging the position change of the shielding component. When the position of the shielding component changes, the machine window is judged to be in a covering state. And when the position of the shielding component is unchanged, judging that the machine window is in an uncovered state. Specifically, in step S3, the type of the wafer cassette is determined to be the copper wafer cassette 10 by the first sensing module 2, and the machine window is determined to be in a covered state by the second sensing module 3, so that the analysis processing module 5 does not process. When the type of the wafer cassette is the copper wafer cassette 10 and the machine window is in an uncovered state, a high level control signal is output. That is, the type of the wafer cassette is determined to be the copper wafer cassette 10 by the first sensing module 2, and the high-level control signal is output by the analysis processing module 5 when the machine window is determined to be in an uncovered state by the second sensing module 3. When the wafer transfer box is of the non-copper wafer transfer box 9, and the machine window is in an uncovered state, no control signal is output. That is, the type of the wafer cassette is determined to be a non-copper wafer cassette 9 by the first sensing module 2, and the machine window is determined to be in an uncovered state by the second sensing module 3, so that the analysis processing module 5 does not process. When the wafer transfer box is of a non-copper wafer transfer box 9, and the machine window is in a covering state, a low-level control signal is output. That is, the type of the wafer transfer box is determined to be a non-copper wafer transfer box 9 by the first sensing module 2, and the machine window is determined to be in a covering state by the second sensing module 3, then the analysis processing module 5 outputs a low-level control signal. And receiving the control signal to drive the shielding material to move upwards or downwards along the machine table window. Specifically, the control signal is received by the motor driving module 6, when the control signal is a high-level control signal, the direct current motor in the motor driving module 6 rotates forward, the shielding material moves upward along the machine window, and when the control signal is a low-level control signal, the direct current motor in the motor driving module 6 rotates reversely, and the shielding material moves downward along the machine window.
Referring to fig. 5, similar to the shielding device of a machine window of the present application, the present application further provides a semiconductor device, which includes the shielding device of a machine window, the semiconductor device includes a machine body, a machine window, a shielding component, and a machine stage 11, wherein a copper wafer transfer box 10 and/or a non-copper wafer transfer box 9 are disposed in the machine body, the machine window is mounted on the machine body, the machine window is connected with the shielding component, and an elastic support column 1 is mounted in a support column hole on the machine stage 11 for setting a feature point position.
In summary, the shielding device for the machine window of the present application determines the type of the wafer cassette by sensing the position change of the elastomeric support column 1; and determining the coverage state of the machine window by sensing the position change of the shielding component, and finally driving the shielding component to move upwards or downwards along the machine window. The application avoids unnecessary internal chain reaction caused by opening the window to check the state of the internal components when the machine mixed operation non-copper process has faults and dislocation, increases the loop time, and causes the occurrence of the phenomena of productivity waste and the like.
The above embodiments are merely illustrative of the principles of the present application and its effectiveness, and are not intended to limit the application. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the application. Accordingly, it is intended that all equivalent modifications and variations of the application be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (7)
1. The utility model provides a shielding device of board window which characterized in that, shielding device of board window includes:
the judging module is used for determining the type of the wafer transfer box and determining the coverage state of the machine window;
the analysis processing module is used for receiving the type of the wafer transfer box and the coverage state of the machine window so as to output a control signal;
the motor driving module is used for receiving the control signal so as to drive the shielding component to move upwards or downwards along the machine window;
the elastic support column is arranged in a support column hole of a set feature point position on the machine table, and is connected with the judging module;
wherein, the judging module includes: at least one first sensing module for sensing a change in position of the elastomeric support column; the first judging module is used for determining the type of the wafer transfer box according to the position change of the elastic support column; the second sensing module is used for sensing the position change of the shielding component; the second judging module is used for determining the covering state of the machine window according to the position change of the shielding component, the type of the wafer conveying box comprises a copper wafer conveying box and a non-copper wafer conveying box, the first characteristic point and the second characteristic point of the non-copper wafer conveying box are hollow, the third characteristic point of the copper wafer conveying box is solid, the characteristic point position is set on the machine table, when the position of the elastic supporting column corresponding to the machine table is the non-copper wafer conveying box, the elastic supporting column does not deform elastically, and when the position of the elastic supporting column corresponding to the machine table is the copper wafer conveying box, the elastic supporting column deforms elastically and is in a compressed state.
2. The shielding device for a machine window according to claim 1, wherein: the first sensing module is mounted on an elastomeric support column.
3. The shielding device for a machine window according to claim 1, wherein: the second sensing module is arranged on the machine table window, and when the shielding component is positioned at the top end or the bottom end of the machine table window, the second sensing module is positioned at the bottom end or the top end of the machine table window.
4. The shielding device for a machine window according to claim 1, wherein: the position change of the shielding component comprises that the shielding component moves from the top end to the bottom end of the machine table window, and the shielding component moves from the bottom end to the top end of the machine table window.
5. A method for shielding a machine window, wherein the method for shielding a machine window is applied to the apparatus for shielding a machine window according to any one of claims 1 to 4, and the method for shielding a machine window comprises:
sensing and judging the position change of the elastic support column through a first sensing module, and determining the type of the wafer transfer box;
when the position of the elastic support column changes, judging the type of the wafer transfer box to be a copper wafer transfer box;
judging the type of the wafer transfer box to be a non-copper wafer transfer box when the position of the elastic support column is unchanged;
sensing and judging the position change of the shielding component through a second sensing module, and determining the coverage state of the machine window;
when the position of the shielding component changes, judging that the machine window is in a covering state;
when the position of the shielding component is unchanged, judging that the machine window is in an uncovered state;
and determining whether the shielding component moves and the moving direction according to the type of the wafer conveying box and the covering state of the machine window.
6. The method according to claim 5, wherein determining whether the shielding member moves and the direction of movement according to the type of the wafer cassette and the covering state of the machine window comprises:
when the wafer transfer box is of a copper wafer transfer box type and the machine window is in a covering state, the shielding component does not move;
when the wafer transfer box is of a copper wafer transfer box type and the machine window is in an uncovered state, the shielding component moves upwards along the machine window;
when the wafer transfer box is of a non-copper wafer transfer box type and the machine window is in an uncovered state, the shielding part does not move;
when the wafer transfer box is of a non-copper wafer transfer box type and the machine window is in a covering state, the shielding component moves downwards along the machine window.
7. A semiconductor device including a shielding apparatus for a machine window according to any one of claims 1 to 4, the semiconductor device comprising:
the machine body is internally provided with a copper wafer transfer box and/or a non-copper wafer transfer box;
the machine window is arranged on the machine body and is connected with the shielding component;
a shielding member connected to the motor driving module;
and an elastic support column is arranged in the support column hole of the machine table carrier, on which the characteristic point position is set.
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| CN201911191281.2A CN111430265B (en) | 2019-11-28 | 2019-11-28 | Shielding device and method for machine window and semiconductor device |
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| CN201911191281.2A CN111430265B (en) | 2019-11-28 | 2019-11-28 | Shielding device and method for machine window and semiconductor device |
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| CN111430265A CN111430265A (en) | 2020-07-17 |
| CN111430265B true CN111430265B (en) | 2023-09-12 |
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Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7015492B2 (en) * | 2003-08-15 | 2006-03-21 | Asm International N.V. | Method and apparatus for mapping of wafers located inside a closed wafer cassette |
| DE102008059793A1 (en) * | 2008-12-01 | 2010-06-10 | Grenzebach Maschinenbau Gmbh | Method and device for the fully automatic selection and packaging of photovoltaic modules |
| WO2013016941A1 (en) * | 2011-07-29 | 2013-02-07 | 无锡华瑛微电子技术有限公司 | Adjustable semiconductor processing device and control method thereof |
| CN102543803A (en) * | 2011-08-04 | 2012-07-04 | 上海华力微电子有限公司 | Novel film magazine with opening front end |
| US9442482B2 (en) * | 2013-04-29 | 2016-09-13 | GlobalFoundries, Inc. | System and method for monitoring wafer handling and a wafer handling machine |
| CN103991665B (en) * | 2014-05-13 | 2016-01-20 | 北京七星华创电子股份有限公司 | The collocation method of brilliant box storage case shelf |
| CN207503946U (en) * | 2017-12-04 | 2018-06-15 | 武汉新芯集成电路制造有限公司 | A kind of wafer device for loading and semiconductor processing equipment |
| CN208336173U (en) * | 2018-05-02 | 2019-01-04 | 深圳中科飞测科技有限公司 | Wafer transfer box conversion equipment |
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