CN111423833A - Low-temperature hot-melt pressure-sensitive adhesive and preparation method thereof - Google Patents
Low-temperature hot-melt pressure-sensitive adhesive and preparation method thereof Download PDFInfo
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- CN111423833A CN111423833A CN202010486683.1A CN202010486683A CN111423833A CN 111423833 A CN111423833 A CN 111423833A CN 202010486683 A CN202010486683 A CN 202010486683A CN 111423833 A CN111423833 A CN 111423833A
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- rubber
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- antioxidant
- sensitive adhesive
- melt pressure
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/383—Natural or synthetic rubber
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a low-temperature hot-melt pressure-sensitive adhesive and a preparation method thereof. Adding plasticizer into vertical double planetary disperser, stirring, adding antioxidant, ultraviolet stabilizer, ultraviolet absorbent, and liquid rubber, heating to 100 deg.C, adding tackifying resin in two batches, stirring for 60min, adding modified rubber, heating to 135 deg.C, stirring for 60min, and discharging. The low-temperature application performance of the pressure-sensitive adhesive is improved by adding the liquid rubber; by adding the liquid paraffin, the processing temperature of the hot-melt pressure-sensitive adhesive is effectively reduced.
Description
Technical Field
The invention relates to a hot-melt pressure-sensitive adhesive, in particular to a hot-melt pressure-sensitive adhesive with excellent low-temperature performance.
Background
Pressure Sensitive Adhesive (PSA) is an adhesive that is sensitive to pressure and can be adhered to an adherend under a slight pressure without using a solvent or other auxiliary means.
The pressure-sensitive adhesive tape is a new material prepared by coating pressure-sensitive adhesive on base materials such as cotton paper, cloth or plastic film.
The hot-melt pressure-sensitive adhesive tape is prepared by coating a pressure-sensitive adhesive on a substrate after hot-melting the pressure-sensitive adhesive. The hot melt pressure sensitive adhesive tape has no solvent, is beneficial to environmental protection and safe production, and has high production efficiency, so that the hot melt pressure sensitive adhesive tape is vigorously developed in various countries in the world at present.
However, the hot melt adhesive tape loses its tackiness at-10 ℃ and cannot be used. The application of the hot melt pressure sensitive adhesive tape is limited. Meanwhile, when the traditional hot-melt pressure-sensitive adhesive tape is produced, the traditional hot-melt pressure-sensitive adhesive tape is usually melted at 160-180 ℃ and coated. The operation completed under the condition not only consumes a large amount of electric energy, but also obviously reduces the service life of the coating machine, and is very easy to cause the phenomena of crinkling, scalding and the like of the cast film of the adhesive layer of the sanitary product, and the pressure-sensitive adhesive is also easy to age, decompose, coke, block the throat, the glue nozzle and the like, thereby greatly increasing the safety requirement of operators.
Therefore, research on low-temperature type hot melt pressure sensitive adhesives has become a hotspot. The research of the low-temperature hot-melt pressure-sensitive adhesive has a small amount of chemical modification besides physical modification. The chemical modification research mainly refers to the synthesis of new elastomers or the grafting of partial acrylic compounds on the elastomers to increase the pressure sensitivity. Haville et al synthesized a new elastomer, ionomer resin (butadiene/St/acrylic acid terpolymer), which was miscible with the high softening point end block aromatic tackifying resin in application. The research result shows that: compared with the traditional elastomer, the novel elastomer can reduce the creep property of the colloid; the adhesive prepared from the novel elastomer can be coated at 135 ℃, and the performance of the adhesive is not much different from that of a high-temperature hot-melt pressure-sensitive adhesive, but the low-temperature performance of the hot-melt pressure-sensitive adhesive tape is not improved.
Disclosure of Invention
In view of the above, the present invention seeks to find a low-temperature hot-melt rubber pressure-sensitive adhesive, which focuses mainly on physical modification, and starts with the basic raw materials in the formulation, changes the original traditional elastomer and tackifying resin system, or introduces a substance with a similar structure and good compatibility with the elastomer, so as to change the coating process from the traditional high-temperature operation to the low-temperature operation. Meanwhile, in some cold weather areas, the hot-melt pressure-sensitive adhesive has viscosity and can play a role.
In order to solve the problem, the invention provides a low-temperature hot-melt pressure-sensitive adhesive, so that the hot-melt rubber pressure-sensitive adhesive can still exert the performance under a low-temperature environment.
In order to achieve the above object, the present invention provides a low-temperature hot-melt pressure-sensitive adhesive comprising a tackifying resin, a liquid rubber, a modified rubber, an ultraviolet light stabilizer, an ultraviolet light absorber, a plasticizer and an antioxidant.
As a further description of the low-temperature hot-melt pressure-sensitive adhesive provided by the invention, preferably, the amount of the tackifying resin is 40 to 50 wt.%, the amount of the liquid rubber is 12 to 15 wt.%, the amount of the modifying rubber is 30 to 35 wt.%, the amount of the ultraviolet light stabilizer is 1.0 to 2.5 wt.%, the amount of the ultraviolet light absorber is 1.0 to 2.5 wt.%, the amount of the plasticizer is 7 to 24 wt.%, and the amount of the antioxidant is 0.5 to 1.5 wt.%.
As a further description of the low-temperature hot-melt pressure-sensitive adhesive of the present invention, preferably, the tackifying resin: the liquid rubber: the dosage ratio of the modified rubber is 22:6:12 (W/W).
As a further explanation of the low-temperature hot-melt pressure-sensitive adhesive, the tackifying resin is preferably rosin resin, the liquid rubber is polyisobutylene diene rubber, the modified rubber is SIS modified rubber, the ultraviolet light stabilizers are Chiguard228, ChiMASSORB119F L and TINVUIN329, the ultraviolet light absorbers are benzophenone, benzotriazole and oxalic acid aniline, the plasticizer is liquid paraffin and naphthenic oil, and the antioxidant is antioxidant 1010, antioxidant 264 and antioxidant 1076.
According to another aspect of the present invention, there is provided a method of preparing a low-temperature hot-melt pressure-sensitive adhesive, the method comprising: adding plasticizer into vertical double planetary disperser, stirring, adding antioxidant, ultraviolet stabilizer, ultraviolet absorbent, and liquid rubber, heating to 100 deg.C, adding tackifying resin in two batches, stirring for 60min, adding modified rubber, heating to 135 deg.C, stirring for 60min, and discharging.
As a further illustration of the process according to the present invention, it is preferred that the amount of tackifying resin is 40 to 50 wt.%, the amount of liquid rubber is 12 to 15 wt.%, the amount of modifying rubber is 30 to 35 wt.%, the amount of uv stabilizer is 1.0 to 2.5 wt.%, the amount of uv absorber is 1.0 to 2.5 wt.%, the amount of plasticizer is 7 to 24 wt.%, and the amount of antioxidant is 0.5 to 1,5 wt.%.
As a further illustration of the process of the present invention, it is preferred that the tackifying resin: liquid rubber: the amount ratio of the modified rubber is 22:6:12 (W/W).
As a further illustration of the process of the present invention, it is preferably characterized in that the tackifying resin is a rosin resin, preferably WIN L EX4210 (produced by the company of the industries ltd. zeuginese, sterling).
As a further illustration of the method of the present invention, preferably, the liquid rubber is a polyisobutylene rubber. The polyisobutylene rubber is added to increase the performance of the product well at low temperatures.
As a further explanation of the method of the present invention, it is preferable that the modified rubber is SIS modified rubber, preferably modified rubber SIS D1161 (shenzhen english group ltd). The addition of the SIS modified rubber improves the overall performance of the product, and meanwhile, the price is low, and the cost can be saved in the subsequent production.
As a further illustration of the method of the present invention, the UV light stabilizer is preferably a hindered amine stabilizer (HA L S) Chiguard228 (BASF), CHIMASSORB119F L (BASF), TINVUIN329(BASF), preferably TINVUIN329(BASF), the UV absorber is benzophenone, benzotriazole, or aniline oxalate, preferably benzophenone.
As a further illustration of the process of the present invention, the plasticizer is liquid paraffin, naphthenic oil, preferably liquid paraffin. The addition of the plasticizer lowers the processing temperature and increases the plasticity of the pressure sensitive adhesive.
As a further description of the method of the present invention, the antioxidant is antioxidant 1010, antioxidant 264 or antioxidant 1076. Preferably an antioxidant 1010.
Compared with the prior art, the invention has the following beneficial effects: (1) the low-temperature application performance of the pressure-sensitive adhesive is improved by adding the liquid rubber; (2) the liquid paraffin is added, so that the processing temperature of the hot-melt pressure-sensitive adhesive is effectively reduced.
The specific embodiment is as follows:
the invention will be further described with reference to specific examples, but the scope of the invention is not limited thereto:
example 1:
in a vertical double planetary disperser, 13.5kg of liquid paraffin (plasticizer) was added, stirred, and 1.5kg of antioxidant 1010 (Pasteur)
1010) 2.5kg of TINVUIN329 (ultraviolet light stabilizer, produced by BASF corporation), 2.5kg of benzophenone (ultraviolet absorber), 12kg of polyisobutylene diene (liquid rubber), heating to 100 ℃, then adding 22kg of rosin modified tackifying resin WIN L EX4210 (produced by Fujilin industry practice Co., Ltd., Sterculia), stirring for 30min, then adding 22kg of the rosin modified tackifying resin, stirring for 60min, then adding 24kg of modified rubber SIS D1161 (produced by Shenzhen English group Co., Ltd.), heating to 135 ℃, stirring for 60min, discharging to obtain the low-temperature hot melt pressure sensitive adhesive.
The low-temperature hot melting of the inventionThe pressure-sensitive adhesive is applied to preparing an adhesive tape sample, and the following properties of the adhesive tape sample are measured: adhesive force: 24N/25mm, adhesion at-10 ℃: 15 is N/25 mm; retention force: 24h/40 ℃; initial adhesion: 15#A ball.
Example 2:
in a vertical double planetary disperser, 7.5kg of naphthenic oil (plasticizer) was added, stirred, and 0.5kg of antioxidant 1076 (Pasteur)
1076) 1.0kg of CHIMASSORB119F L (ultraviolet light stabilizer, produced by BASF corporation), 1.0kg of benzotriazole (ultraviolet absorber), 13.5kg of polyisobutylene diene (liquid rubber), heating to 100 ℃, adding 24.75kg of rosin modified tackifying resin WIN L EX4210 (produced by FETROLING INDUSTRIAL CO., LTD, Stephania), stirring for 30min, adding 24.75kg of the rosin modified tackifying resin, stirring for 60min, adding 27kg of modified rubber SIS D1161 (produced by DEPHASLEIGHT CROSE GROUP Co., Ltd), heating to 135 ℃, stirring for 60min, discharging to obtain the low-temperature hot-melt pressure-sensitive adhesive.
The low-temperature hot-melt pressure-sensitive adhesive is applied to preparing an adhesive tape sample, and the following properties of the adhesive tape sample are measured: adhesion at 25 ℃: 28N/25 mm; adhesion at-10 ℃: 17 is N/25 mm; retention force: 24h/40 ℃; initial adhesion: 12#A ball.
Example 3:
in a vertical double planetary disperser, 23.5kg of liquid paraffin (plasticizer) was added, stirred, and 1.5kg of antioxidant 264 (Basff)
264) 2.5kg of Chiguard228 (UV stabilizer, from Pasteur), 2.5kg of oxalic acid aniline (UV absorber), 10.5kg of polyisobutylene diene (liquid rubber), heated to 100 ℃ and then added with 19.25kg of rosin modified tackifying resin WIN L EX4210 (from Fujiu Daizhun, Producted Ltd., Sterculations, Sterculia), stirred for 30min, then added with 19.25kg of the rosin modified tackifying resin, stirred for 60min, then added with 21kg of modified rubber SIS D1161 (from Shenzhen Yingqu, Co., Ltd.)And heating to 135 ℃, stirring for 60min, and discharging to obtain the low-temperature hot-melt pressure-sensitive adhesive.
The low-temperature hot-melt pressure-sensitive adhesive is applied to preparing an adhesive tape sample, and the following properties of the adhesive tape sample are measured: adhesion at 25 ℃: 27N/25 mm; adhesion at-10 ℃: 18 is N/25 mm; retention force: 24h/40 ℃; initial adhesion: 14#A ball.
It should be noted that the above summary and the detailed description are intended to demonstrate the practical application of the technical solutions provided by the present invention, and should not be construed as limiting the scope of the present invention. Various modifications, equivalent substitutions, or improvements may be made by those skilled in the art within the spirit and principles of the invention. The scope of the invention is to be determined by the appended claims.
Claims (8)
1. The low-temperature hot-melt pressure-sensitive adhesive is characterized by comprising tackifying resin, liquid rubber, modified rubber, an ultraviolet stabilizer, an ultraviolet absorbent, a plasticizer and an antioxidant.
2. A low-temperature hot-melt pressure-sensitive adhesive as claimed in claim 1, wherein the tackifier resin is used in an amount of 40 to 50 wt.%, the liquid rubber is used in an amount of 12 to 15 wt.%, the modified rubber is used in an amount of 30 to 35 wt.%, the ultraviolet light stabilizer is used in an amount of 1.0 to 2.5 wt.%, the ultraviolet light absorber is used in an amount of 1.0 to 2.5 wt.%, the plasticizer is used in an amount of 7 to 24 wt.%, and the antioxidant is used in an amount of 0.5 to 1,5 wt.%.
3. A low temperature hot melt pressure sensitive adhesive as claimed in claim 2, wherein the tackifying resin: the liquid rubber: the dosage ratio of the modified rubber is 22:6:12 (W/W).
4. A low-temperature hot-melt pressure-sensitive adhesive as claimed in any one of claims 1 to 3, wherein the tackifying resin is rosin resin, the liquid rubber is polyisobutylene diene rubber, the modified rubber is SIS modified rubber, the ultraviolet light stabilizer is Chiguard228, ChiMASSORB119F L or TINVUIN329, the ultraviolet light absorber is benzophenone, benzotriazole or oxalic acid aniline, the plasticizer is liquid paraffin or naphthenic oil, and the antioxidant is antioxidant 1010, antioxidant 264 or antioxidant 1076.
5. A method of preparing a low temperature hot melt pressure sensitive adhesive according to any one of claims 1 to 4, the method comprising: adding plasticizer into vertical double planetary disperser, stirring, adding antioxidant, ultraviolet stabilizer, ultraviolet absorbent, and liquid rubber, heating to 100 deg.C, adding tackifying resin in two batches, stirring for 60min, adding modified rubber, heating to 135 deg.C, stirring for 60min, and discharging.
6. The method of claim 5, wherein the tackifying resin is present in an amount of 40 to 50 wt.%, the liquid rubber is present in an amount of 12 to 15 wt.%, the modifying rubber is present in an amount of 30 to 35 wt.%, the ultraviolet light stabilizer is present in an amount of 1.0 to 2.5 wt.%, the ultraviolet light absorber is present in an amount of 1.0 to 2.5 wt.%, the plasticizer is present in an amount of 7 to 24 wt.%, and the antioxidant is present in an amount of 0.5 to 1,5 wt.%.
7. The method of claim 6, wherein the tackifying resin: the liquid rubber: the dosage ratio of the modified rubber is 22:6:12 (W/W).
8. The method of any one of claims 5-7, wherein the tackifying resin is rosin resin, the liquid rubber is polyisobutylene rubber, the modified rubber is SIS modified rubber, the ultraviolet light stabilizers are Chiguard228, ChiMASSORB119F L and TINVUIN329, the ultraviolet light absorbers are benzophenone, benzotriazole and oxalic acid aniline, the plasticizer is liquid paraffin and naphthenic oil, and the antioxidants are antioxidant 1010, antioxidant 264 and antioxidant 1076.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010486683.1A CN111423833A (en) | 2020-06-01 | 2020-06-01 | Low-temperature hot-melt pressure-sensitive adhesive and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010486683.1A CN111423833A (en) | 2020-06-01 | 2020-06-01 | Low-temperature hot-melt pressure-sensitive adhesive and preparation method thereof |
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| CN111423833A true CN111423833A (en) | 2020-07-17 |
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| CN202010486683.1A Pending CN111423833A (en) | 2020-06-01 | 2020-06-01 | Low-temperature hot-melt pressure-sensitive adhesive and preparation method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5274036A (en) * | 1992-11-17 | 1993-12-28 | Ralf Korpman Associates | Pressure sensitive adhesive |
| CN102660219A (en) * | 2012-04-28 | 2012-09-12 | 郑昭 | Method for preparing low-temperature-resistant hot-melt pressure-sensitive adhesive |
| CN110079256A (en) * | 2019-05-10 | 2019-08-02 | 无锡市万力粘合材料股份有限公司 | Hot-fusible pressure-sensitive adhesive of UV resistant and preparation method thereof |
| CN110734719A (en) * | 2019-11-04 | 2020-01-31 | 淄博鲁华泓锦新材料股份有限公司 | Modified hot-melt pressure-sensitive adhesive and preparation method thereof |
-
2020
- 2020-06-01 CN CN202010486683.1A patent/CN111423833A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5274036A (en) * | 1992-11-17 | 1993-12-28 | Ralf Korpman Associates | Pressure sensitive adhesive |
| CN102660219A (en) * | 2012-04-28 | 2012-09-12 | 郑昭 | Method for preparing low-temperature-resistant hot-melt pressure-sensitive adhesive |
| CN110079256A (en) * | 2019-05-10 | 2019-08-02 | 无锡市万力粘合材料股份有限公司 | Hot-fusible pressure-sensitive adhesive of UV resistant and preparation method thereof |
| CN110734719A (en) * | 2019-11-04 | 2020-01-31 | 淄博鲁华泓锦新材料股份有限公司 | Modified hot-melt pressure-sensitive adhesive and preparation method thereof |
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Application publication date: 20200717 |