CN111405751A - Structure for improving performance of MPI (Multi-layer printed Circuit) base material FPC (Flexible printed Circuit) antenna and preparation method - Google Patents
Structure for improving performance of MPI (Multi-layer printed Circuit) base material FPC (Flexible printed Circuit) antenna and preparation method Download PDFInfo
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- CN111405751A CN111405751A CN202010322201.9A CN202010322201A CN111405751A CN 111405751 A CN111405751 A CN 111405751A CN 202010322201 A CN202010322201 A CN 202010322201A CN 111405751 A CN111405751 A CN 111405751A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
Abstract
The invention relates to a structure for realizing the performance improvement of an MPI substrate FPC antenna and a preparation method thereof, comprising a plurality of groups of base layers and surface layers which are periodically and alternately arranged, wherein the base layers are hydrophilic and elastic polymer material layers, the surface layers are fluorinated siloxane materials, and the base layers and the surface layers are mutually combined through coupling acting force to form a special action bond to form a complete and firm soft-hard double-layer coating structure. According to the structure for improving the performance of the MPI base material FPC antenna and the preparation method thereof, the MPI base material FPC antenna surface formed by mutually combining the base layer and the surface layer has low-polarity fluorine-containing molecular groups, the dielectric constant r is not more than 3, the dielectric constant is reduced, the total thickness is 0.3-5um, the thickness of the antenna cannot be influenced, the elastic base layer can absorb a part of external stress, a certain deformation and displacement space is provided, and negative influence cannot be caused on the space design flexibility of the antenna.
Description
Technical Field
The invention belongs to the technical field of FPC (flexible printed circuit) antennas, and particularly relates to a structure for improving the performance of an MPI (multi-layer printed circuit) substrate FPC antenna and a preparation method thereof.
Background
With the rapid development and wide practical application of 5G technology, the receiving-end antenna of 5G terminal equipment also experiences great changes and technical challenges, in the previous design of the receiving-end antenna of a mobile phone of 5G, such as a typical 4G antenna design, a common scheme is to use an FPC flexible circuit board design to connect a conducting wire with relevant components, the FPC flexible circuit board usually adopts a Polyimide (PI) film with high insulation performance as a base material, and then the PI film surface is processed to form a flexible copper clad laminate (FCC L) and the like, and finally the FPC finished product is manufactured.
However, the traditional PI materials gradually become weak during the communication mode moving to 5G. The 5G technology uses a part of communication bands entering the "millimeter wave" range, the wavelength is in the millimeter range, and the communication waves with the frequency in the range of 30-300GHz are generally considered to be in the range, and 5G uses FR2 band generally in the range of 24.25-52.6GHz, and the loss of the used materials caused by the FPC antenna capable of receiving the millimeter wave band communication is high, and the materials are required to have low dielectric strength (characterized by Dk or dielectric constant r) and small dielectric loss angle (characterized by Df or loss tangent tan). However, the dielectric constant of the traditional PI material is about 3-4, the loss angle tan of the high-frequency band above 10GHz reaches 0.02-0.04, and meanwhile, due to certain water absorption, the dielectric strength is increased due to water absorption of the material, and the combination of the PI and the lower layer structure of the FPC is affected, so that the PI material is not sufficient as the basic material of the FPC antenna of the 5G device.
The effective and approved solution to this problem is to use other materials that meet the technical requirements to replace the conventional PI to make FPC antenna, and there are two common materials to replace PI, liquid crystal polymer (L CP) and Modified PI (MPI).
L CP is a liquid crystal polymer material, which has some characteristics of liquid crystal materials, such as high structural flexibility and sealing property, and has significantly reduced transmission loss (tan between 0.002 and 0.004) compared with PI, dielectric constant r is below 3, and lower water absorption compared with PI, thus rapidly becoming an excellent PI material substitute material.
The MPI (modified polyimide) is a PI material which is subjected to modification treatment, after the MPI material is treated, the transmission loss of the MPI material is relieved to a certain extent, the water absorption is improved, the working performance of the MPI material at a medium and low frequency (10 GHz) is very close to L CP, the L CP advantage is still obvious at a frequency band above 15GHz, and the water absorption is still obvious, but the MPI material has lower cost (the cost is 1-2 times of that of the traditional PI) compared with L CP obviously, and the production process is easier to realize, so that the MPI substrate FPC antenna is used more at present at a plurality of low frequency bands or is matched with L CP for use, which is a compromise choice at present.
However, how to enhance the water absorption and dielectric strength of the FPC antenna based on MPI by a simple and convenient means, not only ensures that the working performance meets the requirements of all working frequency bands from low frequency to high frequency, but also maintains the cost advantage of MPI, and solving the problem of the substrate of the FPC antenna of 5G equipment is still a focus of attention.
Disclosure of Invention
In order to solve the technical problems in the prior art, the invention aims to provide a structure for improving the performance of an MPI substrate FPC antenna and a preparation method thereof.
In order to achieve the purpose and achieve the technical effect, the invention adopts the technical scheme that:
the utility model provides a realize structure of MPI substrate FPC antenna performance improvement, includes that the period arrangement is in the double-deck structural layer of coating of a plurality of groups on MPI substrate FPC antenna surface, double-deck structural layer of coating includes stratum basale and the superficial layer that sets gradually from inside to outside, and stratum basale and superficial layer period alternate arrangement are in MPI substrate FPC antenna surface, and the stratum basale combines together through the functional group coupling between stratum basale and the superficial layer, and the stratum basale comprises macromolecular material, and the superficial layer comprises fluorinated siloxane material, possesses at least one kind among the macromolecular material and can react or the crosslinked group with the functional group on the fluorinated siloxane material.
Furthermore, the substrate layer and the surface layer can be combined together through one or a combination of more of intermolecular force, hydrogen bond force and electrostatic adsorption.
Furthermore, the molecular chain of the high polymer material is provided with at least one hydrophilic group capable of reacting or crosslinking with the functional group on the fluorinated siloxane material.
Further, the molecular chain of the polymer material also contains at least one functional group, and the stoichiometric ratio of the functional group or the functional group on the fluorinated siloxane material can react or crosslink.
Further, the hydrophilic group comprises one or a combination of more of hydroxyl and amino, and the fluorinated siloxane material is a siloxane material with low surface energy and containing a carboxyl functional group and a fluorinated group.
Furthermore, the molecular chain of the high polymer material contains one or a combination of a plurality of phenols and acid anhydrides, and the fluorinated siloxane material is a siloxane material with low surface energy and containing epoxy groups and fluorinated groups.
Further, the dielectric constant r of the substrate layer and the surface layer after being combined with each other is not more than 3.
Further, the thickness of the substrate layer and the surface layer after being combined with each other is 0.3-5 um.
Further, the method is characterized by comprising the following steps:
firstly coating a high polymer material on the surface of an MPI base material FPC antenna, and keeping the high polymer material in an uncured flow state before coating a fluorinated siloxane material;
step (2), coating fluorinated siloxane material, and curing to obtain a first group of complete and firm double-layer coating structure;
and (3) sequentially coating the first group of double-layer coating structures according to the step (1) and the step (2), and periodically arranging a plurality of groups of double-layer coating structure layers on the surface of the MPI base material FPC antenna.
Compared with the prior art, the invention has the beneficial effects that:
the invention discloses a structure and a preparation method for realizing the improvement of the antenna performance of an MPI (polyurethane-polyimide) substrate FPC (flexible printed circuit board), which comprises a plurality of groups of double-layer coating structure layers which are periodically arranged on the surface of the MPI substrate FPC antenna, wherein the double-layer coating structure layers comprise a base layer and a surface layer which are sequentially arranged from inside to outside, the base layer and the surface layer are periodically and alternately arranged on the surface of the MPI substrate FPC antenna, and the base layer and the surface layer are combined together through one or more of the combination of functional group coupling effect, intermolecular force, hydrogen bond acting force and electrostatic adsorption effect, the base layer is made of a high polymer material, the surface layer is made of a fluorinated siloxane material, and the high polymer material is provided with at least one group capable of reacting with or crosslinking with a functional group on the fluorinated siloxane material.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic cross-sectional view of the present invention;
wherein, 1-a substrate layer; 2-a surface layer; 3-MPI substrate FPC antenna.
Detailed Description
The embodiments of the present invention will be described in detail with reference to the accompanying drawings so that the advantages and features of the invention can be more easily understood by those skilled in the art, and the scope of the invention will be clearly and clearly defined.
As shown in fig. 1-2, a structure for improving the performance of an MPI substrate FPC antenna includes a plurality of groups of double-layer coating structure layers periodically arranged on the surface of an MPI substrate FPC antenna 3, where the double-layer coating structure layers include a base layer 1 and a surface layer 2 sequentially arranged from inside to outside, the base layer 1 and the surface layer 2 are periodically and alternately arranged on the surface of the MPI substrate FPC antenna 3, and it is not limited whether the surface of the MPI substrate FPC antenna 3 is flat or uneven, the base layer 1 and the surface layer 2 are coupled together through a functional group, the base layer 1 is made of a high polymer material, the surface layer 2 is made of a fluorinated siloxane material, and the high polymer material includes at least one group capable of reacting with or crosslinking with the functional group on the fluorinated siloxane material.
The molecular chain of the polymer material has at least one hydrophilic group capable of reacting with or crosslinking with a functional group on the fluorinated siloxane material.
The polymeric material also contains at least one functional group in the molecular chain in a stoichiometric ratio that is capable of reacting or crosslinking with the functional group or groups on the fluorinated siloxane material.
The hydrophilic group comprises one or more of hydroxyl and amino, and the fluorinated siloxane material is a siloxane material with low surface energy and containing a carboxyl functional group and a fluorinated group.
The molecular chain of the high polymer material contains one or a combination of a plurality of phenols and acid anhydrides, and the fluorinated siloxane material is a siloxane material with low surface energy and containing epoxy groups and fluorinated groups.
The dielectric constant r of the substrate layer 1 and the surface layer 2 is not more than 3 after being bonded to each other.
The thickness of the base layer 1 and the surface layer 2 after being combined with each other is 0.3-5 um.
A method for preparing a structure for improving the performance of an MPI substrate FPC antenna comprises the following steps:
step (1), firstly coating a high polymer material on the surface of an MPI base material FPC antenna 3, and before coating a fluorinated siloxane material, keeping the high polymer material in an uncured flow state;
step (2), coating fluorinated siloxane material, and curing for 5-12min at the temperature of 200-240 ℃ to obtain a first group of complete and firm double-layer coating structure;
and (3) sequentially coating the first group of double-layer coating structures according to the step (1) and the step (2), and periodically arranging a plurality of groups of double-layer coating structures on the surface of the MPI base material FPC antenna 3 to realize the performance improvement of the MPI base material FPC antenna 3, and improving the 5G terminal equipment FPC antenna of the MPI base material aiming at the short board of the MPI base material FPC antenna, and simultaneously still maintaining the advantages of the MPI base material FPC antenna, thereby making up for the deficiencies of the advantages.
The invention has the beneficial effects that:
the water absorption of the MPI substrate FPC antenna 3 is comprehensively reduced through the hydrophobic function of the surface layer 2 and the water and oxygen locking function of the inner substrate layer 1, the phenomenon that the combination of FPC layers is affected due to water absorption of PI is avoided, the communication loss of the MPI substrate is improved through the lower polarity and dielectric constant of the surface layer, the thickness can be controlled in a very thin range, the performance of the antenna is not affected, the coating has certain elasticity, the space design flexibility of the antenna is not affected, the use is convenient and fast, rapid automatic treatment can be carried out by matching with precise coating equipment, the overall process is simple, the overall scheme is established on the basis of MPI materials, and the cost is lower than that of complex materials such as L CP.
The base layer 1 and the surface layer 2 can also be designed to be combined together through one or more of intermolecular force, hydrogen bonding force and electrostatic adsorption.
Example 1
As shown in fig. 1-2, a structure for improving the performance of an MPI substrate FPC antenna includes a double-layer coating structure layer periodically arranged on the upper and lower surfaces of an MPI substrate FPC antenna 3, the double-layer coating structure layer includes a base layer 1 and a surface layer 2 sequentially arranged from inside to outside, the base layer 1 and the surface layer 2 are periodically and alternately arranged on the upper and lower surfaces of the MPI substrate FPC antenna 3, the upper and lower surfaces of the MPI substrate FPC antenna 3 are respectively attached to the base layer 1, the base layer 1 and the surface layer 2 are coupled together through functional groups, the base layer 1 is made of a high polymer material, the surface layer 2 is made of a fluorinated siloxane material, and the high polymer material includes at least one group capable of reacting with or crosslinking with the functional groups on the fluorinated siloxane material.
The dielectric constant r of the substrate layer 1 and the surface layer 2 is not more than 3 after being bonded to each other.
The thickness of the substrate layer 1 and the surface layer 2 after bonding to each other is 3 um.
The fluorinated siloxane material is composed of siloxane materials with low surface energy and containing carboxyl functional groups and fluorinated groups in molecular chains, the molecular chains of the high polymer materials contain amino hydrophilic groups, and when the stoichiometric ratio is sufficient, the amino functional groups and the carboxyl functional groups are subjected to functional group coupling to combine the substrate layer 1 and the surface layer 2 together.
A method for preparing a structure for improving the performance of an MPI substrate FPC antenna comprises the following steps: a base layer material (high polymer material) is coated on the surface of the MPI base material FPC antenna 3 through a dispenser, then a surface layer material (fluorinated siloxane material) is coated on the surface of the base layer material through the dispenser, and the curing is carried out for 5-12min at the temperature of 200-240 ℃, so that a complete and firm double-layer coating structure can be formed, the performance improvement of the MPI base material FPC antenna 3 is realized, the 5G terminal equipment FPC antenna of the MPI base material is improved aiming at a short board of the FPC antenna, and meanwhile, the advantages of the FPC antenna are still maintained, and the advantages are made up for the deficiencies.
The parts of the invention not described in detail can be realized by adopting the prior art, and are not described in detail herein.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. The utility model provides a realize structure of MPI substrate FPC antenna performance improvement, its characterized in that, includes that the cycle is arranged in a plurality of groups double-deck coating structural layer on MPI substrate FPC antenna surface, double-deck coating structural layer includes stratum basale and the superficial layer that sets gradually from inside to outside, stratum basale and superficial layer cycle alternate arrangement are in MPI substrate FPC antenna surface, and the stratum basale combines together through the functional group coupling between the superficial layer, and the stratum basale comprises macromolecular material, and the superficial layer comprises fluorinated siloxane material, possesses at least one kind in the macromolecular material and can react or the crosslinked group with the functional group on the fluorinated siloxane material.
2. The structure of claim 1, wherein the molecular chain of the polymer material has at least one hydrophilic group capable of reacting with or crosslinking with a functional group on a fluorinated siloxane material.
3. The structure of claim 1, wherein the molecular chain of the polymer material further comprises at least one functional group, and the stoichiometric ratio of the functional group or group can react with or crosslink with the functional group or group on the fluorinated siloxane material.
4. The structure of claim 2, wherein the hydrophilic group comprises one or more of a hydroxyl group and an amino group, and the fluorinated silicone material is a silicone material with low surface energy and containing a carboxyl functional group and a fluorinated group.
5. The structure of claim 3, wherein the molecular chain of the polymer material contains one or more of phenol and acid anhydride, and the fluorinated siloxane material is a siloxane material with low surface energy and containing an epoxy group and a fluorinated group.
6. The structure of claim 1, wherein the dielectric constant r of the substrate layer and the surface layer is not greater than 3.
7. The structure of claim 1, wherein the thickness of the substrate layer and the surface layer after being combined with each other is 0.3-5 um.
8. The method for preparing a structure for improving the performance of an MPI substrate FPC antenna according to any one of claims 1-7, comprising the steps of:
firstly coating a high polymer material on the surface of an MPI base material FPC antenna, and keeping the high polymer material in an uncured flow state before coating a fluorinated siloxane material;
step (2), coating fluorinated siloxane material, and curing to obtain a first group of complete and firm double-layer coating structure;
and (3) sequentially coating the first group of double-layer coating structures according to the step (1) and the step (2), and periodically arranging a plurality of groups of double-layer coating structure layers on the surface of the MPI base material FPC antenna.
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Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1993498A (en) * | 2004-08-05 | 2007-07-04 | 株式会社钟化 | Solution, material for plating, insulating sheet, laminate and printed wiring board |
| CN101107291A (en) * | 2005-01-21 | 2008-01-16 | 三菱瓦斯化学株式会社 | Polyimide resin, polyimide film, and polyimide laminate |
| CN101208195A (en) * | 2005-04-19 | 2008-06-25 | 株式会社钟化 | Fiber-resin composite material, multilayer body, printed wiring board, and method for manufacturing printed wiring board |
| CN101573421A (en) * | 2006-09-01 | 2009-11-04 | 莫门蒂夫性能材料股份有限公司 | Laminates utilizing pressure sensitive adhesive composition and conventional silicone liners |
| CN103694892A (en) * | 2013-12-05 | 2014-04-02 | 深圳市冠恒新材料科技有限公司 | Fluorine-containing polysiloxane release agent and preparation method thereof |
| CN103865066A (en) * | 2014-03-06 | 2014-06-18 | 中国科学院上海有机化学研究所 | Low-dielectric-constant polymer containing hexafluoro-cyclobutyl ether and organic siloxane as well as preparation and application of low-dielectric-constant polymer |
| JP2016048736A (en) * | 2014-08-27 | 2016-04-07 | 住友電工プリントサーキット株式会社 | Coverlay, flexible printed wiring board and led module |
| CN105612055A (en) * | 2013-10-11 | 2016-05-25 | 住友电工印刷电路株式会社 | Fluorine resin base material, printed wiring board, and circuit module |
| CN106459680A (en) * | 2014-06-13 | 2017-02-22 | 富士胶片株式会社 | Layered body for temporary bonding, method for manufacturing layered body for temporary bonding, and layered body provided with device wafer |
| CN108878446A (en) * | 2018-06-26 | 2018-11-23 | 深圳市华星光电技术有限公司 | Flexible display panels and display device |
| CN109627764A (en) * | 2018-12-17 | 2019-04-16 | 无锡创彩光学材料有限公司 | Low dielectric Kapton of a kind of high bonding and preparation method thereof |
| CN209357756U (en) * | 2019-03-11 | 2019-09-06 | 广东聚华印刷显示技术有限公司 | Flexible base board, flexible Organic Light Emitting Diode and display device |
-
2020
- 2020-04-22 CN CN202010322201.9A patent/CN111405751B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1993498A (en) * | 2004-08-05 | 2007-07-04 | 株式会社钟化 | Solution, material for plating, insulating sheet, laminate and printed wiring board |
| CN101107291A (en) * | 2005-01-21 | 2008-01-16 | 三菱瓦斯化学株式会社 | Polyimide resin, polyimide film, and polyimide laminate |
| CN101208195A (en) * | 2005-04-19 | 2008-06-25 | 株式会社钟化 | Fiber-resin composite material, multilayer body, printed wiring board, and method for manufacturing printed wiring board |
| CN101573421A (en) * | 2006-09-01 | 2009-11-04 | 莫门蒂夫性能材料股份有限公司 | Laminates utilizing pressure sensitive adhesive composition and conventional silicone liners |
| CN105612055A (en) * | 2013-10-11 | 2016-05-25 | 住友电工印刷电路株式会社 | Fluorine resin base material, printed wiring board, and circuit module |
| CN103694892A (en) * | 2013-12-05 | 2014-04-02 | 深圳市冠恒新材料科技有限公司 | Fluorine-containing polysiloxane release agent and preparation method thereof |
| CN103865066A (en) * | 2014-03-06 | 2014-06-18 | 中国科学院上海有机化学研究所 | Low-dielectric-constant polymer containing hexafluoro-cyclobutyl ether and organic siloxane as well as preparation and application of low-dielectric-constant polymer |
| CN106459680A (en) * | 2014-06-13 | 2017-02-22 | 富士胶片株式会社 | Layered body for temporary bonding, method for manufacturing layered body for temporary bonding, and layered body provided with device wafer |
| JP2016048736A (en) * | 2014-08-27 | 2016-04-07 | 住友電工プリントサーキット株式会社 | Coverlay, flexible printed wiring board and led module |
| CN108878446A (en) * | 2018-06-26 | 2018-11-23 | 深圳市华星光电技术有限公司 | Flexible display panels and display device |
| CN109627764A (en) * | 2018-12-17 | 2019-04-16 | 无锡创彩光学材料有限公司 | Low dielectric Kapton of a kind of high bonding and preparation method thereof |
| CN209357756U (en) * | 2019-03-11 | 2019-09-06 | 广东聚华印刷显示技术有限公司 | Flexible base board, flexible Organic Light Emitting Diode and display device |
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