CN108878446A - Flexible display panels and display device - Google Patents
Flexible display panels and display device Download PDFInfo
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- CN108878446A CN108878446A CN201810666938.5A CN201810666938A CN108878446A CN 108878446 A CN108878446 A CN 108878446A CN 201810666938 A CN201810666938 A CN 201810666938A CN 108878446 A CN108878446 A CN 108878446A
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- 230000003071 parasitic effect Effects 0.000 claims abstract description 22
- 238000009413 insulation Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 19
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 17
- 239000011737 fluorine Substances 0.000 claims description 17
- 229910052731 fluorine Inorganic materials 0.000 claims description 17
- 239000004642 Polyimide Substances 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 12
- 229920001721 polyimide Polymers 0.000 claims description 12
- -1 siloxanes Chemical class 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 3
- 229920001400 block copolymer Polymers 0.000 claims description 3
- 150000004985 diamines Chemical class 0.000 claims description 3
- 239000003989 dielectric material Substances 0.000 claims description 3
- 150000002170 ethers Chemical class 0.000 claims description 3
- 125000000524 functional group Chemical group 0.000 claims description 3
- 238000004377 microelectronic Methods 0.000 claims description 3
- 230000010287 polarization Effects 0.000 claims description 3
- 229920000090 poly(aryl ether) Polymers 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1255—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention provides a kind of flexible display panels, including flexible base board, electrode layer and insulating layer, the electrode layer stackup is set on the flexible base board, the insulation layer stackup is set to the flexible base board backwards to the electrode layer side, the flexible base board has the first relative dielectric constant, the insulating layer has the second relative dielectric constant, second relative dielectric constant is lower than first relative dielectric constant, the insulating layer is for contacting conductive plate, so that the parasitic capacitance between the electrode layer and the conductive plate reduces.For the present invention by setting insulating layer, the second relative dielectric constant of insulating layer is lower than the first relative dielectric constant of flexible base board, can reduce the parasitic capacitance between electrode layer and conductive plate, promotes display quality.The present invention also provides another flexible display panels and display devices.
Description
Technical field
The invention belongs to field of display technology more particularly to a kind of flexible display panels and display device.
Background technique
Flexible Displays are just received more and more attention as a kind of emerging display form.It is aobvious in active array type
Show in device (OLED), since it does not have visual angle limitation, is easily manufactured flexible display compared to liquid crystal display (LCD).And it passes
The LCD of system, the technology to need to rely on similar to polymer wall (polymer wall), to reach the purpose of Flexible Displays.
In the flexible OLED and flexibility LCD being surging forward, for its flexible characteristic, and optical birefringence is reduced
Effect etc., often thickness is very low for flexible base board, and when being used as flexible base board for example, by using polyimides (PI), thickness is about 10um.
In the structure of flexible OLED, the structure on flexible base board is anode metal, and in flexible LCD structure, on flexible base board
Structure is the conductive films such as ITO, when display panel is installed in display, the other side of flexible base board often with metal
The contact of the conductive structures such as plate, forms biggish parasitic capacitance, can divide in this way between anode metal or ITO conductive film and metal plate
Stream part is supplied to anode metal or the electric current of ITO, causes the storage capacitance of display panel to reduce, extends the charging time of TFT,
Or influence the electric current that luminescent layer is flowed into from anode metal.Therefore, because the presence of parasitic capacitance, causes display quality decline.
Summary of the invention
The object of the present invention is to provide a kind of flexible display panels, reduce parasitic capacitance, promote display quality.
To achieve the purpose of the present invention, the present invention provides the following technical solutions：
In a first aspect, the embodiment of the present invention provides a kind of flexible display panels, including flexible base board, electrode layer and insulation
Layer, the electrode layer stackup are set on the flexible base board, and the insulation layer stackup is set to the flexible base board backwards to the electricity
Pole layer side, the flexible base board have the first relative dielectric constant, and the insulating layer has the second relative dielectric constant, described
Second relative dielectric constant is lower than first relative dielectric constant, and the insulating layer is for contacting conductive plate, so that the electricity
Parasitic capacitance between pole layer and the conductive plate reduces.
In a kind of embodiment, the material of the insulating layer is identical as the flexible base board, mixed with fluorine member in the insulating layer
Element, the fluorine element for reducing the insulating layer electronic polarization effect so that second relative dielectric constant reduce.
Wherein, the flexible base board is polyimides, and the insulating layer is to react shape with fluorinated diamine using fluorine-containing dianhydride
At fluorine doped polyimides.
In a kind of embodiment, the material of the insulating layer is polyaryl ether class material, receives sky microelectronics dielectric material, fluorine doped
Any one of silica, poly- Freon C318, siloxanes and polytetrafluoroethylene (PTFE), second relative dielectric constant is not more than
3。
A kind of flexible base in embodiment, doped with nanometer level microporous or particle in the flexible base board, after doping
Plate has third relative dielectric constant, and the third relative dielectric constant is lower than first relative dielectric constant.
In a kind of embodiment, the insulating layer coats surface and four sides of the flexible base board backwards to the electrode layer
Face.
Second aspect, the embodiment of the present invention provides a kind of flexible display panels, including flexible base board and electrode layer, described soft
Property substrate in doped with nanometer level microporous or particle, the flexible base board has the first relative dielectric constant, described after doping
Flexible base board has third relative dielectric constant, and the third relative dielectric constant is lower than first relative dielectric constant.
Wherein, described nanometer level microporous by the thermally labile function for the block copolymer being entrained in the flexible base board
Group is decomposed to form.
Wherein, the material of the nanometer particle has the 4th relative dielectric constant, and the 4th relative dielectric constant is low
In first relative dielectric constant.
The third aspect, the embodiment of the present invention also provide a kind of display device, including conductive plate and first aspect and second party
Any flexible display panels in face, the conductive plate are set to the flexible base board of the flexible display panels backwards to electrode layer
Side.
Beneficial effects of the present invention：
A kind of flexible display panels provided by the invention, by the way that insulating layer, the second relative dielectric constant of insulating layer is arranged
Lower than the first relative dielectric constant of flexible base board, the parasitic capacitance between electrode layer and conductive plate can be reduced, promotes display
Quality.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram of the flexible display panels of embodiment；
Fig. 2 is the structural schematic diagram of the flexible display panels of another embodiment；
Fig. 3 is the structural schematic diagram of the flexible display panels of another embodiment；
Fig. 4 is the structural schematic diagram of the flexible display panels of another embodiment；
Fig. 5 is the structural schematic diagram of the flexible display panels of another embodiment.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1 to Fig. 5 is please referred to, the embodiment of the present invention provides a kind of display device, including conductive plate 40 and the present invention are implemented
The flexible display panels that example provides, the conductive plate 40 are set to the flexible base board 10 of the flexible display panels backwards to electrode layer 20
Side.Display device can be OLED or LCD display device, such as display, television set, notebook computer, intelligent hand
Machine etc., since flexible display panels of the invention are in flexibility, display device may be flexible display apparatus, flexible
It has been shown that, provides better visual experience.
Referring to FIG. 1, the embodiment of the present invention provides a kind of flexible display panels, including flexible base board 10,20 and of electrode layer
Insulating layer 30, the stacking of electrode layer 20 are set on the flexible base board 10, and the stacking of insulating layer 30 is set to the flexible base
Plate 10 has the first relative dielectric constant ε backwards to 20 side of electrode layer, the flexible base board 101, the insulating layer has
Second relative dielectric constant ε2, the second relative dielectric constant ε2Lower than the first relative dielectric constant ε1, the insulating layer
30 for contacting conductive plate 40, so that the parasitic capacitance between the electrode layer 20 and the conductive plate 40 reduces.
After display panel is installed to display device, conductive plate is easily equipped with backwards to 20 side of electrode layer in flexible base board 10
40, the present invention passes through setting insulating layer 30, the second relative dielectric constant ε of insulating layer 202Lower than the first phase of flexible base board 10
To permittivity ε1, the parasitic capacitance between electrode layer 20 and conductive plate 40 can be reduced, display quality is promoted.
The realization principle of the embodiment of the present invention：The all flexible base boards of the medium being located between electrode layer 20 and conductive plate 40
10, parasitic capacitance C1, all insulating layers 30 of the medium being located between electrode layer 20 and conductive plate 40, parasitic capacitance is
C2, then when the medium between electrode layer 20 and conductive plate 40 is the lamination of flexible base board 10 and insulating layer 30, series connection is constituted
Capacitor group, total parasitic capacitance is C, the then calculation formula according to concatenated capacitor：
It can be obtained after abbreviation：
In addition, according to the capacitance equation of plane-parallel capacitor：
Due to flexible base board 10, once it is determined that, the distance d between the area S and two plates of opposite plate is fixed value, phase
Dielectric constant is also determined, i.e. C1 is definite value, to reduce total capacitance C, and it is small as far as possible and at least smaller than C1 to be arranged C2, this
The total parasitic capacitance C of sample will be smaller than being not provided with the parasitic capacitance C1 of insulating layer 30, to reduce parasitic capacitance, can be improved aobvious
Show quality.
For example, with flexible base board 10 with a thickness of 10 μm, the first relative dielectric constant ε1It is 4, chooses a kind of insulating layer
30 with a thickness of 10 μm, the second relative dielectric constant ε2It is 2, total parasitic capacitance C may make to be reduced to former parasitic capacitance C11/
3。
The flexible base board 10 is polyimides, polyethylene terephthalate, polycarbonate and ultrathin flexible glass
Any one.The thickness range of flexible base board 10 is 5~15 μm, preferably 5~10 μm.
When display panel is OLED, electrode layer 20 is anode, and anode is metal material, is used for luminescent layer (in figure not
Show) electric current is provided.
When display panel is LCD, electrode layer 20 is ITO conductive film, which is provided with the structures such as TFT, for controlling liquid
The deflection of brilliant molecule.
In a kind of embodiment (embodiment 1), referring to FIG. 1, the material of the insulating layer 30 can be polyaryl ether class material
Material is resistant to a kind of business of 450 DEG C of high temperature, relative dielectric constant 2.8 or Dow Chemical (DOW Chemical) exploitation
The advanced low-k materials of change：Receive sky microelectronics dielectric material or fluorine doped silica (SiCOF), poly- Freon C318
(PFCB), any one of siloxanes and polytetrafluoroethylene (PTFE) (Teflon), using above-mentioned material, so that the described second opposite dielectric
Constant ε2No more than 3, and the first relative dielectric constant ε of flexible base board 101It is 4 or so, thus it is guaranteed that the second opposite dielectric is normal
Number ε2Less than the first relative dielectric constant ε1。
In a kind of embodiment (embodiment 2), referring to FIG. 2, the material of the insulating layer 30 and 10 phase of flexible base board
Together, in the insulating layer 30 mixed with fluorine element, the fluorine element for reducing the insulating layer 30 electronic polarization effect so that
The second relative dielectric constant ε2It reduces.Specifically, flexible base board 10 is polyimides, the material of insulating layer 30 is selected
For polyimides, fluorine element is first mixed on insulating layer 30, specifically reacts to be formed with fluorinated diamine using fluorine-containing dianhydride, is made
Insulating layer 30 be fluorine doped polyimides, then be coated with polyimides on the polyimides of fluorine doped.In the present embodiment, due to exhausted
The material of edge layer 30 is identical as flexible base board 10, is conducive to the simplification of processing procedure, in addition, being conducive to increase flexible base board 10 and insulation
Adhesive force between layer 30, structure is more stable, will not peel off.
In a kind of embodiment (embodiment 3), referring to FIG. 3, it is essentially identical with embodiment 1 or embodiment 2, unlike,
Doped with nanometer level microporous or particle 50 in the flexible base board 10, the flexible base board 10 after doping has third phase to Jie
Electric constant ε3, the third phase is to permittivity ε3Lower than the first relative dielectric constant ε1.By dopen Nano grade micropore or
Particle 50, so that the third phase of the flexible base board 10 after doping is to permittivity ε3Than the first phase of undoped flexible base board 10
To permittivity ε1Lower, according to the series connection formula of capacitor, the total capacitance C after doping is also to be than original flexible base board 10
Medium C1It is lower, so also it is able to achieve the effect for reducing parasitic capacitance.
In a kind of embodiment (embodiment 4), referring to FIG. 4, it is essentially identical with embodiment 1, embodiment 2, embodiment 3, no
With the insulating layer 30 coats the flexible base board 10 backwards to the surface and surrounding side of the electrode layer 20.Specifically,
Insulating layer 30 be additionally provided with cladding flexible base board 10 surrounding side extension 31, extension 31 alienate oneself 30 surface of edge layer towards electricity
Pole 20 direction of layer extend, and insulating layer 30 and extension 31 are enclosed a cavity jointly, and flexible base board 10 is contained in the container,
That is in addition to the surface opposite with electrode layer 20, other surfaces are coated by insulating layer 31 flexible base board 10.The thickness of extension 31
No more than insulating layer 30 perpendicular to the thickness on 10 direction of flexible base board, this is because the position for generating parasitic capacitance is mainly
The side backwards to electrode layer 20 of flexible base board 10, and in the position of the surrounding side of flexible base board 10, conductive plate 40 is general not
It can be in the position, therefore, the more thinner of extension 31 is set, also can satisfy the work for reducing whole parasitic capacitance
With, and material can be saved, reduce cost.
Referring to FIG. 5, an embodiment of the present invention (embodiment 5) also provides a kind of flexible display panels, with 3 base of embodiment
This is identical, unlike, insulating layer 30 is not provided in the present embodiment, i.e. the flexible display panels of the present embodiment include flexible base board
10 and electrode layer 20, doped with nanometer level microporous or particle 50 in the flexible base board 10, the flexible base board 10 has first
Relative dielectric constant ε1, the flexible base board 10 after doping is with third phase to permittivity ε3, the third phase is normal to dielectric
Number ε3Lower than the first relative dielectric constant ε1。
By dopen Nano grade micropore or particle 50 in setting flexible base board 10, the opposite dielectric for reducing flexible base board 10 is normal
Number promotes display quality to reduce the parasitic capacitance between electrode layer 20 and conductive plate 40.
Optionally, the heat of described nanometer level microporous 50 block copolymer by being entrained in the flexible base board 10 is unstable
To determine functional group to be decomposed to form, concrete technology, which can be used, to be added thermally labile group and is annealed in flexible base board 10,
So that thermally labile functional group decomposes and forms nanometer level microporous 50.
Optionally, the prior art, the nanometer particle can be used in the material of the nanometer particle 50 and doping process
50 material has the 4th relative dielectric constant ε4, the 4th relative dielectric constant ε4Lower than first relative dielectric constant
ε1。
Above disclosed is only a preferred embodiment of the present invention, cannot limit the power of the present invention with this certainly
Sharp range, those skilled in the art can understand all or part of the processes for realizing the above embodiment, and weighs according to the present invention
Benefit requires made equivalent variations, still belongs to the scope covered by the invention.
Claims (10)
1. a kind of flexible display panels, which is characterized in that including flexible base board, electrode layer and insulating layer, the electrode layer stackup
On the flexible base board, the insulation layer stackup is set to the flexible base board backwards to the electrode layer side, the flexibility
Substrate has the first relative dielectric constant, and the insulating layer has the second relative dielectric constant, second relative dielectric constant
Lower than first relative dielectric constant, the insulating layer is for contacting conductive plate, so that the electrode layer and the conductive plate
Between parasitic capacitance reduce.
2. flexible display panels as described in claim 1, which is characterized in that the material of the insulating layer and the flexible base board
It is identical, mixed with fluorine element in the insulating layer, the fluorine element for reducing the insulating layer electronic polarization effect so that institute
State the reduction of the second relative dielectric constant.
3. flexible display panels as claimed in claim 2, which is characterized in that the flexible base board is polyimides, described exhausted
Edge layer is that the fluorine doped polyimides to be formed is reacted with fluorinated diamine using fluorine-containing dianhydride.
4. flexible display panels as described in claim 1, which is characterized in that the material of the insulating layer is polyaryl ether class material
Expect, receive sky microelectronics dielectric material, fluorine doped silica, poly- Freon C318, siloxanes and polytetrafluoroethylene (PTFE) any one,
Second relative dielectric constant is not more than 3.
5. flexible display panels as described in claim 1, which is characterized in that doped with nanometer level microporous in the flexible base board
Or particle, the flexible base board after doping have third relative dielectric constant, the third relative dielectric constant is lower than described
First relative dielectric constant.
6. flexible display panels as claimed in claim 1 to 5, which is characterized in that the insulating layer coats the flexibility
Substrate is backwards to the surface and surrounding side of the electrode layer.
7. a kind of flexible display panels, which is characterized in that including flexible base board and electrode layer, doped with receiving in the flexible base board
Meter level micropore or particle, the flexible base board have the first relative dielectric constant, and the flexible base board after doping has third
Relative dielectric constant, the third relative dielectric constant are lower than first relative dielectric constant.
8. flexible display panels as claimed in claim 7, which is characterized in that described nanometer level microporous described soft by being entrained in
The thermally labile functional group of block copolymer in property substrate is decomposed to form.
9. liquid-supplying system as claimed in claim 7, which is characterized in that the material of the nanometer particle has the 4th opposite Jie
Electric constant, the 4th relative dielectric constant are lower than first relative dielectric constant.
10. a kind of display device, which is characterized in that including conductive plate and Flexible Displays face as described in any one of claim 1 to 9
Plate, the conductive plate are set to the flexible base board of the flexible display panels backwards to the side of electrode layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810666938.5A CN108878446A (en) | 2018-06-26 | 2018-06-26 | Flexible display panels and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810666938.5A CN108878446A (en) | 2018-06-26 | 2018-06-26 | Flexible display panels and display device |
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| CN113031174A (en) * | 2021-04-08 | 2021-06-25 | 索尔思光电（成都）有限公司 | TO-CAN module, transmitting assembly and optical module |
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| CN113031174A (en) * | 2021-04-08 | 2021-06-25 | 索尔思光电（成都）有限公司 | TO-CAN module, transmitting assembly and optical module |
| WO2023168737A1 (en) * | 2022-03-10 | 2023-09-14 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel |
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