CN111400989A - Laser packaging path obtaining method, laser packaging method and laser packaging system - Google Patents
Laser packaging path obtaining method, laser packaging method and laser packaging system Download PDFInfo
- Publication number
- CN111400989A CN111400989A CN201811642633.7A CN201811642633A CN111400989A CN 111400989 A CN111400989 A CN 111400989A CN 201811642633 A CN201811642633 A CN 201811642633A CN 111400989 A CN111400989 A CN 111400989A
- Authority
- CN
- China
- Prior art keywords
- packaging
- laser
- galvanometer
- packaging unit
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a laser packaging path obtaining method, a laser packaging method and a laser packaging system. The laser packaging path planning method can be used for packaging a plurality of units to be packaged on the large substrate under the condition of a small galvanometer view field, the number of the laser galvanometers can be flexibly configured, the galvanometers are effectively distributed, the reduction of the number of the galvanometers is facilitated, the equipment cost is reduced, meanwhile, the movement path of the galvanometers and the substrate carrier is optimized, the moving times and the moving distance of the galvanometers and the moving distance of the substrate are reduced, the production time is saved, and therefore the packaging efficiency is greatly improved.
Description
Technical Field
The invention relates to the technical field of O L ED packaging, in particular to a laser packaging path obtaining method, a laser packaging method and a laser packaging system.
Background
In recent years, because of the excellent characteristics of self-luminescence, simple structure, ultra-light and thinness, fast response speed, high color contrast, wide viewing angle, low power consumption, flexible display and the like, an O L ED (Organic light Emitting Diode) has been widely applied in the field of flat panel display and illumination, and is developed very rapidly.
The packaging technology of the currently known O L ED device mainly comprises three types, namely UV glue packaging, film packaging and laser packaging, wherein the laser packaging can be a most advanced packaging mode without an adsorbent or a desiccant and has a good effect of blocking water vapor and oxygen, and the basic principle of the packaging technology is that in the packaging process, a light beam generated by a laser is focused on a region to be packaged through a light path system consisting of a reflector, a lens or an optical fiber to form a heat action region, packaging welding flux in the heat action region is softened and melted to enable an upper glass substrate and a lower glass substrate to be bonded together to form airtight sealing, and laser packaging generally adopts a laser galvanometer to carry out laser scanning on a plurality of packaging units (units to be packaged) on the substrates.
In the prior art, the configuration of the number of the vibrating mirrors is fixed, and the selection is not flexible enough. Especially, under the condition that the packaging visual field of the large substrate, the small packaging units and the galvanometer is smaller, the number of the galvanometers is relatively fixed and can be selected only from 1 and n, wherein n is determined by the number of the packaging units in one row in the substrate and the number of the packaging units in one row in the packaging visual field of the galvanometer. When 1 galvanometer is configured, the packaging efficiency is too low; when n galvanometers are configured, the equipment cost is too high.
Therefore, it is necessary to develop a laser package path planning method that can arbitrarily select and configure the number of mirrors between [1, n ] according to the requirement.
Disclosure of Invention
The invention aims to provide a laser packaging path obtaining method, a laser packaging method and a laser packaging system, and aims to solve the problem of considering both the vibrating mirror packaging efficiency and the equipment cost in laser packaging.
In order to solve the above technical problem, the present invention provides a method for obtaining a laser package path, including:
calculating a first topological structure of each packaging unit on the substrate;
adjusting the first topological structure according to parameters of a galvanometer adopted by laser packaging to obtain a second topological structure of each packaging unit;
grouping all the packaging units according to the second topological structure to obtain a plurality of packaging unit groups; and
and planning a galvanometer adopted by each packaging unit group for carrying out laser packaging and a sequence of carrying out laser packaging so as to obtain a packaging path for carrying out laser packaging on each packaging unit on the substrate.
Optionally, in the method for obtaining a laser encapsulation path, grouping all the encapsulation units includes:
dividing all the packaging units according to the second topological structure to form a plurality of packaging unit rows;
and dividing the packaging units in the plurality of packaging unit rows according to the field size of a galvanometer adopted by laser packaging to obtain a plurality of packaging unit groups and form one or more packaging unit group rows.
Optionally, in the method for obtaining a laser packaging path, after planning a galvanometer used by each packaging unit group for performing laser packaging and a sequence of performing laser packaging, the method further includes: and planning the sequence of laser packaging of each packaging unit in each packaging unit group.
Optionally, in the method for obtaining a laser encapsulation path, the step of planning a galvanometer used by each encapsulation unit group for laser encapsulation and the step of performing laser encapsulation includes:
s41: obtaining the central position of each packaging unit group of all unassigned galvanometers on the substrateWherein the smallest Y coordinate is denoted as Ymin；
S42: acquiring Y coordinate of the center position of each packaging unit group row, and identifying Y coordinate thereinminMarking the equal packaging unit group lines as first packaging unit group lines, and moving the first packaging unit group lines to the position of the galvanometer operation in a simulation mode;
s43: acquiring an X coordinate of the center position of each packaging unit group in the first packaging unit group row, wherein the maximum X coordinate is recorded as Xmax；
S44: selecting any one packaging unit from the first packaging unit group line as a current packaging unit group, and judging whether an X coordinate of the central position of the current packaging unit group is in the motion range of the vibrating mirror I, wherein i is more than or equal to 1 and less than or equal to n, n represents the number of adopted vibrating mirrors, and n is an integer more than or equal to 2;
s45: if the X coordinate of the central position of the current packaging unit group is within the motion range of the No. i galvanometer, the central position of the field of view of the No. i galvanometer is equal to the central position of the current packaging unit group, and the number of packaging units which can be packaged in the No. i galvanometer is equal to the number of packaging units in the current packaging unit group; if the X coordinate of the central position of the current packaging unit group is not in the movement range of the i-shaped galvanometer, the central position of the view field of the i-shaped galvanometer is equal to the minimum X coordinate of the movement range of the i-shaped galvanometerminThe sum of the safety distance and the number of the packaging units which can be packaged in the No. i galvanometer is zero;
s46: judging whether all the galvanometers are circulated or not;
s47: if not all mirrors have been cycled, return to S44; if all the galvanometers are circulated, judging whether each packaging unit group in the first packaging unit group row finishes the laser packaging path planning or not;
s48: if not, returning to S43; if all the packaging unit groups in the first packaging unit group row are circulated, judging whether all the packaging unit groups complete laser packaging path planning or not;
s49: if not all the packaging unit groups have been circulated, returning to S41; if all the packaging unit groups have been circulated, the process is finished.
Optionally, in the method for obtaining a laser encapsulation path, planning a sequence of laser encapsulation of each encapsulation unit in each encapsulation unit group includes: and performing 'S' -shaped path planning from bottom to top on a plurality of packaging units in each packaging unit group.
Optionally, in the method for obtaining a laser package path, substrate parameters are obtained before calculating the first topology of each package unit on the substrate, and the first topology of the package unit is calculated according to the substrate parameters.
Optionally, in the method for obtaining a laser package path, the substrate parameters include a substrate size, a number of package units, a package unit size, and a package unit center position coordinate.
Optionally, in the method for obtaining the laser package path, the galvanometer parameters include a galvanometer field size, a galvanometer movement range, a galvanometer safety distance, galvanometer translation parameters, and galvanometer magnification.
Optionally, in the method for obtaining the laser package path, the safe distance of the galvanometer is 0.270m to 0.280 m.
The invention also provides a laser packaging method, which comprises the following steps:
obtaining a packaging path of each packaging unit on the substrate for laser packaging by using the laser packaging path obtaining method; and
and moving the galvanometer and the substrate carrying platform according to the packaging path to carry out laser packaging on each packaging unit on the substrate.
The present invention also provides a laser packaging system, including: the controller is used for acquiring a packaging path for laser packaging of each packaging unit on the substrate according to the laser packaging path acquisition method and providing the packaging path for the actuator; and the actuator is used for carrying out laser packaging on each packaging unit on the substrate according to the packaging path.
Optionally, in the laser packaging system, the actuator includes: the laser device comprises a laser device, a vibrating mirror, a portal frame, a substrate carrying table and a guide rail, wherein the vibrating mirror is arranged on the portal frame, laser emitted by the laser device is projected onto a packaging unit located on the substrate through the vibrating mirror, the substrate is located on the substrate carrying table, the substrate carrying table is located on the guide rail, and the substrate carrying table can drive the substrate to move together on the guide rail along the direction of the guide rail.
Optionally, in the laser packaging system, the laser packaging system is a multi-galvanometer laser packaging system, and the gantry is provided with a plurality of galvanometers, and a certain safety distance is provided between the galvanometers.
Optionally, in the laser packaging system, the direction that the galvanometer is set up along the portal frame is determined as the X direction, and the direction perpendicular to the X direction is determined as the Y direction, wherein, a plurality of the Y coordinates of the galvanometer are consistent, and the galvanometer can move simultaneously in the X direction, the guide rail is laid along the Y direction.
In the laser packaging path obtaining method, the laser packaging method and the laser packaging system provided by the invention, a first topological structure of each packaging unit on a substrate is calculated; adjusting the first topological structure according to parameters of a galvanometer adopted by laser packaging to obtain a second topological structure of each packaging unit; grouping all the packaging units according to the second topological structure to obtain a plurality of packaging unit groups; and planning the galvanometer adopted by each packaging unit group for carrying out laser packaging and the sequence of carrying out laser packaging so as to obtain a packaging path for carrying out laser packaging on each packaging unit on the substrate, so that a plurality of units to be packaged on a large substrate can be packaged under the condition of a small laser galvanometer view field, the number of the galvanometers can be flexibly configured, the galvanometers are effectively distributed, the number of the galvanometers is favorably reduced, the equipment cost is reduced, the motion path of the galvanometers and a substrate carrier is optimized, the moving times and the moving distance of the galvanometers and the moving distance of the substrate are reduced, the production time is saved, and the packaging efficiency is greatly improved.
Drawings
Fig. 1 is a schematic flow chart of a laser package path acquisition method according to an embodiment of the present invention;
FIG. 2 is a diagram illustrating an embodiment of the present invention after grouping encapsulation units;
fig. 3 is a schematic flow chart illustrating a sequence of planning a galvanometer used by each package unit group for performing laser package and performing laser package according to an embodiment of the present invention;
FIG. 4 is a diagram illustrating the relationship between the galvanometer and the package unit group according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a galvanometer first simulated movement package of an embodiment of the present invention;
FIG. 6 is a schematic diagram of a second simulated movement package of a galvanometer in accordance with embodiments of the present invention;
FIG. 7 is a schematic diagram of a third exemplary package for a galvanometer according to embodiments of the present invention;
fig. 8 is a schematic flowchart illustrating a procedure for planning a laser packaging sequence of each packaging unit in each packaging unit group according to an embodiment of the present invention;
FIG. 9 is a schematic flow chart of a laser packaging method according to an embodiment of the present invention;
FIG. 10 is a schematic structural diagram of a laser packaging system according to an embodiment of the present invention;
FIG. 11 is a schematic structural diagram of an actuator in a laser packaging system according to an embodiment of the present invention;
wherein the content of the first and second substances,
100-laser packaging system; 110-a controller; 120-an actuator; 121-galvanometer; 122-a gantry; 123-a substrate; 124-a substrate stage; 125-a guide rail; 126-substrate interface.
Detailed Description
The core idea of the invention is to provide a laser packaging path obtaining method, a laser packaging method and a laser packaging system, the number of the vibrating mirrors can be randomly selected and configured between [1, n ] according to requirements, and both the packaging efficiency of the vibrating mirrors and the equipment cost can be taken into consideration in laser packaging.
To make the objects, advantages and features of the present invention more apparent, the laser packaging path obtaining method, the laser packaging method and the laser packaging system according to the present invention are further described in detail with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention. Further, the structures illustrated in the drawings are often part of actual structures. In particular, the drawings may have different emphasis points and may sometimes be scaled differently.
First, referring to fig. 1, the present embodiment provides a method for obtaining a laser package path, where the method includes:
step S1: calculating a first topological structure of each packaging unit on the substrate;
step S2: adjusting the first topological structure according to parameters of a galvanometer adopted by laser packaging to obtain a second topological structure of each packaging unit;
step S3: grouping all the encapsulation units according to the second topology structure to obtain a plurality of encapsulation unit groups, please refer to fig. 2; and
step S4: and planning a galvanometer adopted by each packaging unit group for carrying out laser packaging and a sequence of carrying out laser packaging so as to obtain a packaging path for carrying out laser packaging on each packaging unit on the substrate.
The laser packaging path is obtained through the steps, therefore, each packaging unit on the substrate firstly adjusts the topological structure according to various parameters until the packaging can be clearly and completely prepared in the field of view of the galvanometer, then the packaging units are grouped according to the adjusted topological structure, and the galvanometers adopted by each packaging unit group and the sequence of laser packaging are planned, so that the repeated movement of the galvanometers or the substrate can be reduced, the packaging tasks of the packaging units with the maximum number can be completed at a time, and according to the laser packaging path, when each packaging unit on the substrate is packaged, the packaging tasks can be completed efficiently, and the number of the galvanometers can be freely configured, so that the equipment cost is saved.
Further, in executing step S1: before calculating the first topological structure of each packaging unit on the substrate, obtaining substrate parameters, and further calculating the first topological structure of the nominal position of the packaging unit according to the substrate parameters. The substrate parameters comprise substrate size, the number of packaging units, packaging unit size and packaging unit center position coordinates.
Next, step S2 is executed: and adjusting the first topological structure according to parameters of a galvanometer adopted by laser packaging to obtain a second topological structure of each packaging unit, so that the packaging units can be clearly and completely simulated and packaged in the view field of the galvanometer. Preferably, the galvanometer parameters include galvanometer view field size, galvanometer movement range, galvanometer safety distance, galvanometer translation parameters and galvanometer multiplying power. Preferably, the safe distance of the galvanometer is 0.270-0.280 m. Therefore, under the condition of acquiring all parameters, the topological structure can be adjusted more accurately and clearly, and the laser packaging path is obtained for the next step. Furthermore, the first topological structure is adjusted to obtain a second topological structure of each packaging unit according to parameters such as translation of the actual position and the nominal position of each packaging unit on the substrate, and X-direction and/or Y-direction scaling factor.
Preferably, step S3: grouping all of the encapsulation units comprises:
step S31: dividing all the packaging units according to the second topological structure to form a plurality of packaging unit rows;
step S32: and dividing the packaging units in the plurality of packaging unit rows according to the field size of a galvanometer adopted by laser packaging to obtain a plurality of packaging unit groups and form one or more packaging unit group rows.
Therefore, all the packaging units are divided into lines, the dividing direction is the same as the arrangement direction of the galvanometers, the galvanometers can be packaged on each packaging unit line in the process of moving transversely, each packaging unit line is divided into a plurality of packaging unit groups according to the size of a view field of the galvanometers, one or more packaging units falling into the view field of one galvanometer are one packaging unit group, each packaging unit group is used as the minimum unit for planning a laser packaging path in the next step, the galvanometers can be distributed to the packaging units clearly and simply, and the packaging sequence is planned, so that the packaging unit is simple and convenient.
Referring to fig. 3, preferably, step S4: the step of planning the sequence of the galvanometer adopted by each packaging unit group for carrying out laser packaging and the laser packaging comprises the following steps:
s41: acquiring Y coordinates of the central positions of all the packaging unit groups which are not distributed with the galvanometers on the substrate, wherein the minimum Y coordinate is recorded as Ymin。
S42: acquiring Y coordinate of the center position of each packaging unit group row, and identifying Y coordinate thereinminAnd marking the equal packaging unit group rows as first packaging unit group rows, and moving the first packaging unit group rows to the position of the galvanometer operation in a simulation mode.
S43: in the first packaging unit group line, obtaining an X coordinate of the central position of each packaging unit group which is not distributed, wherein the X coordinate which meets the requirement of safe distance (if a galvanometer is arranged at the right side) and has the maximum coordinate is recorded as the X coordinatemax。
S44: setting a center position to X in the first packaging unit group rowmaxAnd the packaging unit group is marked as a current packaging unit group, and whether the X coordinate of the central position of the current packaging unit group is in the motion range of the vibrating mirror with the number of i or more, wherein i is more than or equal to 1 and less than or equal to n, n represents the number of the adopted vibrating mirrors, and n is an integer more than or equal to 2.
S45: if the X coordinate of the central position of the current packaging unit group is within the motion range of the No. i galvanometer, the central position of the field of view of the No. i galvanometer is equal to the central position of the current packaging unit group, and the number of packaging units which can be packaged in the No. i galvanometer is equal to the number of packaging units in the current packaging unit group; if the X coordinate of the central position of the current packaging unit group is not in the movement range of the i-shaped galvanometer, the central position of the view field of the i-shaped galvanometer is equal to the minimum X coordinate of the movement range of the i-shaped galvanometerminAnd the sum of the safety distances is zero, and the number of the packaging units which can be packaged in the I-type galvanometer is zero.
S46: judging whether all the galvanometers are circulated or not; for example, if 3 galvanometers are configured in the laser package, whether the 3 galvanometers are all allocated is judged, the situation that the rest galvanometers are not allocated is avoided, equipment is fully utilized, and production efficiency is improved.
S47: if not all mirrors have been cycled, return to S44; if all the galvanometers are circulated, judging whether each packaging unit group in the first packaging unit group row finishes the laser packaging path planning or not; that is, it is determined whether there are any package units that have not been subjected to the simulated packaging in the package unit row group that performs the packaging operation.
S48: if not, returning to S43; if all the packaging unit groups in the first packaging unit group row are circulated, judging whether all the packaging unit groups complete laser packaging path planning or not; namely, whether the packaging units which are not packaged in a simulation mode exist on the whole substrate is judged.
S49: if not all the packaging unit groups have been circulated, returning to S41; if all the packaging unit groups have been circulated, the process is finished.
And planning the sequence of the galvanometers adopted by the packaging unit groups for laser packaging and the laser packaging, firstly distributing the galvanometers to the packaging unit group with the largest X coordinate in each packaging unit group row, packaging the galvanometers in actual operation if the X coordinate of the center of the packaging unit group is in the motion range of the galvanometer I, and moving the galvanometers and the substrate until all the packaging units are packaged.
Preferably, referring to fig. 4 to 7, in this embodiment, a case that there are 12 packaging unit groups in each packaging unit group line and there are 4 packaging units in each packaging unit group is enumerated, and when a laser packaging path is planned for each packaging unit group line, each galvanometer simulates a movement from right to left, and a plurality of galvanometers are required to move positions to package for multiple times. In this embodiment, a case where the n-5 galvanometers in the first encapsulating unit group row are simultaneously moved 3 times to operate all the encapsulating unit groups in the encapsulating unit group row is described. The method comprises the following specific steps: fig. 5 shows that all galvanometers start to perform the first analog movement, and in the movement range of the galvanometer i, the number 1 represents the position where the galvanometer lens of the galvanometer i moves for the first time to perform the packaging operation in an analog manner, and the packaging conditions of the 5 galvanometers are judged according to the steps as follows: non-packaging, packaging; fig. 6 shows the case where all galvanometers start the second analog movement, and in the movement range of the galvanometer i, the number 2 represents the position where the galvanometer lens of the galvanometer i moves for the 2 nd time to perform the packaging operation in an analog manner, and the packaging conditions of 5 galvanometers are judged according to the steps as follows: packaging, encapsulating; fig. 7 shows the case where all galvanometers start the third analog movement, and in the movement range of the galvanometer i, the number 3 represents the position where the galvanometer lens of the galvanometer i moves 3 times for analog packaging operation, and the packaging condition of 5 galvanometers is judged according to the steps as follows: package, unpackaged. And after the 3 times of simulation movement, the 5 galvanometers perform simulation packaging on all the 12 packaging unit groups in the packaging unit group row, and the rest packaging unit groups on the substrate are also subjected to packaging planning in sequence according to the laser packaging method.
Referring to fig. 8, preferably, in step S4: after planning the sequence of the galvanometer adopted by each packaging unit group for laser packaging and the laser packaging, the method further comprises the following steps: step S5: and planning the sequence of laser packaging of each packaging unit in each packaging unit group. Therefore, when the galvanometer carries out laser packaging on each packaging unit in each packaging unit group in a planned mode, the laser packaging sequence is clear, and the packaging efficiency and the packaging effect are further improved. Specifically, step S5: the step of planning the laser packaging sequence of each packaging unit in each packaging unit group comprises the following steps: and performing 'S' -shaped path planning from bottom to top on a plurality of packaging units in each packaging unit group. Here, the laser packaging is performed on each packaging unit along the direction of arrow 1, and then the laser packaging is performed on each packaging unit along the direction of arrow 2. The S-shaped packaging path can reduce the moving distance of the laser scanning unit in the galvanometer, avoid repeated movement, reduce the use loss of the galvanometer, prolong the service life of the galvanometer and save time and equipment cost.
Referring to fig. 9, the present invention further provides a laser packaging method, including:
using the above-mentioned laser package path obtaining method steps S1 to S5, obtaining the package path of each package unit on the substrate for laser package; and
step S6: and moving the galvanometer and the substrate carrying platform according to the packaging path to carry out laser packaging on each packaging unit on the substrate.
Performing laser packaging operation on the packaging units, specifically, when the packaging unit groups in the first packaging unit group row are packaged, a substrate carrier drives a substrate to move in a Y coordinate direction, moves a Y coordinate position of the center of the first packaging unit group row on the substrate to a position right below a galvanometer, namely, coincides with a central Y coordinate position of n galvanometers, then the substrate is kept still, X coordinate positions of the n galvanometers are respectively moved to planned positions of the galvanometers in fig. 5 to 7, and laser scanning is performed on the current packaging unit group in the first packaging unit group row to complete a packaging task; and simultaneously moving a vibrating lens in the vibrating mirror to sequentially carry out secondary packaging, tertiary packaging and the like until all the packaging unit groups in the first packaging unit group line are scanned. And then, driving the substrate to move by the substrate carrying platform, moving the Y-coordinate position of the center of the upper packaging unit group line and the lower packaging unit group line of the substrate to be under the galvanometer, and then carrying out laser scanning according to the same operation as the first packaging unit group line until all the packaging unit group lines on the whole substrate are scanned completely. When the last packaging unit group is packaged, the distance between the position of the substrate and the substrate cross interface is short, so that the product cross distance is shortened, time consumption for product cross connection is reduced, and the production speed and efficiency are improved.
Referring to fig. 10, the present invention further provides a laser packaging system 100, wherein the laser packaging system 100 includes: the controller 110 is configured to obtain a packaging path for performing laser packaging on each packaging unit on the substrate according to the laser packaging path obtaining method, and provide the packaging path for the actuator 120; the actuator 120 is used for performing laser packaging on each packaging unit on the substrate according to the packaging path.
Referring to fig. 11, preferably, the actuator 120 includes: the packaging structure comprises a laser (not shown in the figure), a vibrating mirror 121, a gantry 122, a substrate 123, a substrate stage 124 and a guide rail 125, wherein the vibrating mirror 121 is arranged on the gantry 122, the laser emitted by the laser is projected onto a packaging unit located on the substrate 123 through the vibrating mirror 121, the substrate 123 is located on the substrate stage 124, the substrate stage 124 is located on the guide rail 125, and the substrate stage 124 can drive the substrate 123 to move together on the guide rail 125 along the direction of the guide rail 125. In this embodiment, the substrate interface 126, so that the packaging system 100 controls the actuator 120 to perform specific operations according to the laser packaging path of each packaging unit acquired by the controller 100, can reduce the repetitive motion of the galvanometer or the substrate, and can complete the packaging tasks of the packaging units with the maximum number at a time.
In this embodiment, the laser packaging system 100 is a multi-galvanometer laser packaging system, and the gantry 122 is provided with a plurality of galvanometers 121, and a certain safety distance is provided between the plurality of galvanometers 121. Therefore, the condition that the vibrating mirrors 121 collide or rub with each other in the laser packaging process is avoided, and the packaging efficiency is ensured while the product quality is ensured.
In this embodiment, the direction in which the galvanometers 121 are arranged along the gantry 122 is defined as an X direction, and a direction perpendicular to the X direction is defined as a Y direction, wherein Y coordinates of the plurality of galvanometers 121 coincide, the galvanometers 121 can move simultaneously in the X direction, and the guide rails are laid along the Y direction. Therefore, the substrate stage 124 drives the substrate 123 to move in the direction of the guide rail 125, and the galvanometer 121 moves in the direction perpendicular to the guide rail 125, that is, the laser packaging system 100 can perform laser packaging on a plane having multiple configurations in the X direction and the Y direction.
In summary, the laser package path obtaining method, the laser package method and the laser package system provided by the present invention have the following advantages:
the repeated movement of the galvanometer or the substrate is reduced, the packaging tasks of the packaging units with the maximum number are completed at a time, and the packaging tasks can be completed efficiently when the packaging units on the substrate are packaged according to the laser packaging path.
Furthermore, the number of the galvanometers can be freely configured, and the number of the galvanometers is not limited to one galvanometer or n galvanometers, but can be randomly configured between [1, n ] according to actual operation requirements, so that the equipment cost is saved.
Furthermore, after the laser packaging task is completed, the distance between the position of the substrate and the substrate cross interface is very short, so that the time consumed for product cross connection can be saved, the accidental risk during product cross connection is avoided, and the production efficiency is improved.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (14)
1. A laser package path acquisition method is characterized by comprising the following steps:
calculating a first topological structure of each packaging unit on the substrate;
adjusting the first topological structure according to parameters of a galvanometer adopted by laser packaging to obtain a second topological structure of each packaging unit;
grouping all the packaging units according to the second topological structure to obtain a plurality of packaging unit groups; and
and planning a galvanometer adopted by each packaging unit group for carrying out laser packaging and a sequence of carrying out laser packaging so as to obtain a packaging path for carrying out laser packaging on each packaging unit on the substrate.
2. The laser package path acquisition method of claim 1, wherein grouping all of the package units comprises:
dividing all the packaging units according to the second topological structure to form a plurality of packaging unit rows;
and dividing the packaging units in the plurality of packaging unit rows according to the field size of a galvanometer adopted by laser packaging to obtain a plurality of packaging unit groups and form one or more packaging unit group rows.
3. The method for obtaining the laser packaging path according to claim 2, further comprising, after planning a galvanometer used for performing laser packaging by each packaging unit group and a sequence of performing laser packaging: and planning the sequence of laser packaging of each packaging unit in each packaging unit group.
4. The method for obtaining the laser packaging path according to claim 3, wherein the step of planning the galvanometer used for performing the laser packaging by each packaging unit group and the step of performing the laser packaging comprises:
s41: acquiring Y coordinates of the central positions of all the packaging unit groups which are not distributed with the galvanometers on the substrate, wherein the minimum Y coordinate is recorded as Ymin；
S42: acquiring Y coordinate of the center position of each packaging unit group row, and identifying Y coordinate thereinminMarking the equal packaging unit group lines as first packaging unit group lines, and moving the first packaging unit group lines to the position of the galvanometer operation in a simulation mode;
s43: acquiring an X coordinate of the center position of each packaging unit group in the first packaging unit group row, wherein the maximum X coordinate is recorded as Xmax；
S44: selecting any one packaging unit from the first packaging unit group line as a current packaging unit group, and judging whether an X coordinate of the central position of the current packaging unit group is in the motion range of the vibrating mirror I, wherein i is more than or equal to 1 and less than or equal to n, n represents the number of adopted vibrating mirrors, and n is an integer more than or equal to 2;
s45: if the X coordinate of the central position of the current packaging unit group is within the motion range of the No. i galvanometer, the central position of the field of view of the No. i galvanometer is equal to the central position of the current packaging unit group, and the number of packaging units which can be packaged in the No. i galvanometer is equal to the number of packaging units in the current packaging unit group; if the X coordinate of the central position of the current packaging unit group is not in the movement range of the i-shaped galvanometer, the central position of the view field of the i-shaped galvanometer is equal to the minimum X coordinate of the movement range of the i-shaped galvanometerminThe sum of the safety distance and the number of the packaging units which can be packaged in the No. i galvanometer is zero;
s46: judging whether all the galvanometers are circulated or not;
s47: if not all mirrors have been cycled, return to S44; if all the galvanometers are circulated, judging whether each packaging unit group in the first packaging unit group row finishes the laser packaging path planning or not;
s48: if not, returning to S43; if all the packaging unit groups in the first packaging unit group row are circulated, judging whether all the packaging unit groups complete laser packaging path planning or not;
s49: if not all the packaging unit groups have been circulated, returning to S41; if all the packaging unit groups have been circulated, the process is finished.
5. The method according to claim 3, wherein planning a sequence of laser packaging of each of the packaging units in each of the packaging unit groups comprises: and performing 'S' -shaped path planning from bottom to top on a plurality of packaging units in each packaging unit group.
6. The laser package path obtaining method of claim 1, wherein substrate parameters are obtained before the first topology of each package unit on the substrate is calculated, and the first topology of the package unit is calculated according to the substrate parameters.
7. The laser package path acquisition method as claimed in claim 6, wherein the substrate parameters include a substrate size, a number of package units, a package unit size, and package unit center position coordinates.
8. The laser package path acquisition method of claim 1, wherein the galvanometer parameters include galvanometer field size, galvanometer range of motion, galvanometer safe distance, galvanometer translation parameters, and galvanometer magnification.
9. The laser package path acquisition method of claim 8, wherein the galvanometer safety distance is between 0.270m and 0.280 m.
10. A laser packaging method, comprising:
acquiring a packaging path of each packaging unit on a substrate for laser packaging by using the laser packaging path acquisition method as claimed in any one of claims 1 to 9; and
and moving the galvanometer and the substrate carrying platform according to the packaging path to carry out laser packaging on each packaging unit on the substrate.
11. A laser packaging system, comprising: a controller and an actuator, wherein the controller is used for acquiring the packaging path of each packaging unit on the substrate for laser packaging according to the laser packaging path acquisition method of any one of claims 1 to 9, and providing the packaging path to the actuator; and the actuator is used for carrying out laser packaging on each packaging unit on the substrate according to the packaging path.
12. The laser packaging system of claim 11, wherein the actuator comprises: the laser device comprises a laser device, a vibrating mirror, a portal frame, a substrate carrying table and a guide rail, wherein the vibrating mirror is arranged on the portal frame, laser emitted by the laser device is projected onto a packaging unit located on the substrate through the vibrating mirror, the substrate is located on the substrate carrying table, the substrate carrying table is located on the guide rail, and the substrate carrying table can drive the substrate to move together on the guide rail along the direction of the guide rail.
13. The laser packaging system of claim 12, wherein the laser packaging system is a multi-galvanometer laser packaging system, and a plurality of galvanometers are arranged on the gantry and have a certain safety distance therebetween.
14. The laser packaging system of claim 13, wherein the galvanometer is oriented in an X direction along the gantry, and a Y direction perpendicular to the X direction, wherein a plurality of the galvanometers have identical Y coordinates and are capable of simultaneous movement in the X direction, and wherein the guide track is laid along the Y direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811642633.7A CN111400989B (en) | 2018-12-29 | 2018-12-29 | Laser packaging path obtaining method, laser packaging method and laser packaging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811642633.7A CN111400989B (en) | 2018-12-29 | 2018-12-29 | Laser packaging path obtaining method, laser packaging method and laser packaging system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111400989A true CN111400989A (en) | 2020-07-10 |
| CN111400989B CN111400989B (en) | 2022-06-17 |
Family
ID=71435817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811642633.7A Active CN111400989B (en) | 2018-12-29 | 2018-12-29 | Laser packaging path obtaining method, laser packaging method and laser packaging system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111400989B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090086325A1 (en) * | 2007-09-28 | 2009-04-02 | Anping Liu | Method and apparatus for frit sealing with a variable laser beam |
| CN105336876A (en) * | 2014-07-29 | 2016-02-17 | 上海微电子装备有限公司 | Packaging system and packing method for sealed glass packaging body through laser |
| CN106997929A (en) * | 2016-01-22 | 2017-08-01 | 上海微电子装备有限公司 | A kind of plesiochronous package system of double-sided laser and method for packing |
| CN107565061A (en) * | 2016-06-30 | 2018-01-09 | 上海微电子装备（集团）股份有限公司 | Laser package system and method for packing |
| CN107785286A (en) * | 2016-08-30 | 2018-03-09 | 上海微电子装备（集团）股份有限公司 | Laser package method |
-
2018
- 2018-12-29 CN CN201811642633.7A patent/CN111400989B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090086325A1 (en) * | 2007-09-28 | 2009-04-02 | Anping Liu | Method and apparatus for frit sealing with a variable laser beam |
| CN105336876A (en) * | 2014-07-29 | 2016-02-17 | 上海微电子装备有限公司 | Packaging system and packing method for sealed glass packaging body through laser |
| CN106997929A (en) * | 2016-01-22 | 2017-08-01 | 上海微电子装备有限公司 | A kind of plesiochronous package system of double-sided laser and method for packing |
| CN107565061A (en) * | 2016-06-30 | 2018-01-09 | 上海微电子装备（集团）股份有限公司 | Laser package system and method for packing |
| CN107785286A (en) * | 2016-08-30 | 2018-03-09 | 上海微电子装备（集团）股份有限公司 | Laser package method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111400989B (en) | 2022-06-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105620050B (en) | High-precision galvanometer error self-correcting apparatus and method based on machine vision | |
| CN111933760B (en) | Miniature LED pixel repairing equipment and miniature LED pixel repairing method | |
| EP2267534A1 (en) | Illumination system | |
| EP1449636B1 (en) | Photo-fabrication apparatus | |
| FI20030883A0 (en) | A method for controlling welding of a three-dimensional structure | |
| CN203437812U (en) | Three-dimensional galvanometer laser etching machine | |
| CN104460237B (en) | Position measuring apparatus, alignment apparatus, pattern drawing apparatus, and position measuring method | |
| KR102229320B1 (en) | Modular laser apparatus | |
| TWI802665B (en) | Laser transfer device and laser transfer method | |
| CN106457470B (en) | Laser processing and laser processing device | |
| CN106041315A (en) | Equipment for precisely carving light guide plate by using laser | |
| CN108873622A (en) | Sided exposure machine and double-faced exposure method | |
| CN111400989B (en) | Laser packaging path obtaining method, laser packaging method and laser packaging system | |
| CN116013189A (en) | Brightness correction process and device for Mini LED/Micro LED screen | |
| CN1677245A (en) | Laser drawing device, method thereof and method for preparing optical mask | |
| JP2010234420A (en) | Laser beam machining apparatus and laser beam machining method | |
| CN114132048A (en) | Method for exposing screen printing plate by utilizing laser direct imaging equipment and related equipment | |
| JP6420683B2 (en) | On-the-fly path generation apparatus and method | |
| CN104076621B (en) | Describing device and discharge drawing method | |
| CN111983896A (en) | High-precision alignment method for 3D exposure machine | |
| CN101082781B (en) | Tracing system and method, exposure parameter calculating device and method, substrate manufacturing method | |
| CN113156607B (en) | Method for assembling prism, device for assembling prism and equipment for assembling prism | |
| CN206557525U (en) | A kind of two-sided write-through exposure machine system | |
| JP2009172629A (en) | Marking apparatus and marking method | |
| CN113325671B (en) | Device and method for laser direct imaging on uneven surface of workpiece |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |