CN111381646A - Heat dissipation system for vehicle-mounted server, vehicle-mounted server and automatic driving automobile - Google Patents
Heat dissipation system for vehicle-mounted server, vehicle-mounted server and automatic driving automobile Download PDFInfo
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- CN111381646A CN111381646A CN201811639974.9A CN201811639974A CN111381646A CN 111381646 A CN111381646 A CN 111381646A CN 201811639974 A CN201811639974 A CN 201811639974A CN 111381646 A CN111381646 A CN 111381646A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
Abstract
The invention discloses a heat dissipation system for a vehicle-mounted server, the vehicle-mounted server and an automatic driving automobile, and relates to the technical field of automatic driving, wherein the heat dissipation system comprises: the first fan set is arranged at the air inlet of the chassis shell; the first fan group and the second fan group enable high-pressure air flow from the air inlet to the air outlet to be formed between the air inlet and the air outlet; a heat dissipation unit disposed in the chassis housing, comprising: a heat conducting mechanism, a heat pipe and a radiator; the heat conducting mechanism comprises a heat pipe seat and a heat pipe cover which clamp one end of a heat pipe, the heat pipe cover is provided with a body and fin parts which extend along the direction vertical to the body, gaps are arranged among the fin parts of the heat pipe cover, the flow direction of high-pressure air flow is parallel to the plane where the gaps among the fin parts are located, and the other end of the heat pipe is connected with the radiator. The radiating capacity of electronic components in the vehicle-mounted server can be further improved.
Description
Technical Field
The invention relates to the technical field of automatic driving, in particular to a heat dissipation system for a vehicle-mounted server, the vehicle-mounted server and an automatic driving automobile.
Background
At present, in order to realize the automatic driving of the vehicle, an on-board server is usually arranged in the automatic driving vehicle, and the on-board server is electrically connected with an image acquisition device arranged on the automatic driving vehicle and a control system of the automatic driving vehicle. The vehicle-mounted server is used for calculating and analyzing timely road surface images or videos acquired by the image acquisition equipment, and then making decisions to control the automatic driving vehicle, and finally realizing safe and reliable automatic driving.
Disclosure of Invention
For the vehicle-mounted server, because the technology related to automatic driving is complex, the vehicle-mounted computer server required to be arranged has very powerful functions, not only has strong computing capability and high processing efficiency, but also has more huge number of electronic components possibly arranged in the vehicle-mounted computer server compared with the common computer server. A large amount of electronic components can produce a large amount of heats when high-speed operation, and then make electronic components itself and the inside temperature of on-vehicle server all rise by a wide margin, especially for electronic components, for example CPU, GPU etc. its self can produce a large amount of heats and cause self temperature to rise sharply, later can cause its operating speed's decline, can lead to this electronic components's malfunction or damage even, consequently, to the heat dissipation of this kind of electronic components seem to be especially important.
Generally, this type of electronic component is radiated through a heat pipe in the prior art, specifically, the tail end of one end of the heat pipe is tightly attached to the electronic component or attached to the electronic component through heat conducting silicone grease, the other end of the heat pipe is provided with different types of radiating fins, and the radiating fins are blown by a fan. The heat dissipation capacity of the mode can meet the requirements of electronic components under common conditions, but for an automatic driving vehicle, the automatic driving vehicle can often run in outdoor sunlight in summer high-temperature weather, and the temperature of the whole vehicle can be rapidly increased under the condition of sun exposure. In addition, in the running process of the automatic driving vehicle, the GPU in the electronic components achieves automatic running of the vehicle in order to meet the algorithm processing of the automatic driving vehicle on the collected road surface image video, and the automatic driving vehicle is basically always in a working state of full load, so that the heat dissipation amount and the temperature rise speed are extremely high. Based on the above two conditions, further optimization is needed to improve and control the heat dissipation capability of the electronic components, so as to meet the current higher heat dissipation requirements.
In order to overcome the above defects in the prior art, embodiments of the present invention provide a heat dissipation system for a vehicle-mounted server, and an autonomous vehicle, which can further improve the ability of a heat dissipation unit to dissipate heat of a heat-generating component in the vehicle-mounted server.
The specific technical scheme of the embodiment of the invention is as follows:
a heat dissipation system for an onboard server, the heat dissipation system comprising:
the first fan set is arranged at the air inlet of the chassis shell; the first fan group and the second fan group enable high-pressure air flow from the air inlet to the air outlet to be formed between the air inlet and the air outlet;
a heat dissipating unit disposed in the chassis housing, the heat dissipating unit comprising: a heat conducting mechanism, a heat pipe and a radiator; the heat conducting mechanism comprises a heat pipe seat and a heat pipe cover which clamp one end of the heat pipe, the heat pipe cover is provided with a body and fin parts which extend along the direction vertical to the body, gaps are formed among the fin parts of the heat pipe cover, the flow direction of the high-pressure air flow is parallel to the plane where the gaps among the fin parts are located, and the other end of the heat pipe is connected with the radiator to transfer heat to the radiator.
Preferably, the heat sink is disposed at an air inlet end of the second fan group.
Preferably, the heat sink includes a plurality of heat dissipation fins, the heat dissipation fins extend in a horizontal direction and are arranged in a vertical direction, and a flow direction of the high-pressure wind flow is parallel to a plane where a gap between adjacent heat dissipation fins is located.
Preferably, the plurality of heat dissipation fins are provided with openings in the vertical direction, and the other ends of the heat pipes are inserted into the openings of the heat dissipation fins and are closely attached to or welded with the heat dissipation fins.
Preferably, one end of the heat pipe extends in the same direction as the flow direction of the high-pressure wind flow.
Preferably, a bending section is arranged between one end and the other end of the heat pipe, the bending section of the heat pipe at least comprises a first bending part nearest to one end of the heat pipe and a second bending part nearest to the radiator, and the first bending part abuts against the heat pipe cover.
Preferably, the other end of the heat pipe is inserted into the opening hole from top to bottom, and the end of the other end of the heat pipe faces downward.
Preferably, from one end of the heat pipe to the other end of the heat pipe, the first bending portion extends the heat pipe upwards, and the second bending portion extends the heat pipe downwards.
Preferably, the wind pressure of the outlet wind generated by the second fan set is greater than the wind pressure of the inlet wind generated by the first fan set.
An in-vehicle server, the in-vehicle server comprising: a chassis housing having an air inlet and an air outlet; the heat dissipation system is arranged in the chassis shell, and the high-pressure air flow is parallel to the horizontal direction; a plurality of circuit boards arranged in the vertical direction and extending in the horizontal direction in the chassis housing; the circuit board is provided with heating elements and heat dissipation units, and the heat dissipation units are arranged on the circuit board and used for dissipating heat of the heating elements.
Preferably, the heating element is a GPU chip or a CPU chip.
An autonomous vehicle, the autonomous vehicle comprising: the in-vehicle server as described above.
The technical scheme of the invention has the following remarkable beneficial effects:
in order to further promote the ability that radiating unit dispels the heat to heating element device among the vehicle server, set up first fan group and second fan group relatively in this application, form the high pressure wind current by the air intake to the air outlet direction between air intake and the air outlet, simultaneously, the heat pipe cap has the fin portion that extends along the perpendicular to body direction, the flow direction of high pressure wind current and the plane that the clearance place between the fin portion is parallel, so, on the one hand, can reduce the resistance of fin portion to high pressure wind current, make high pressure wind current keep high-speed flow, in addition, high pressure wind current can pass the clearance between the fin portion, because high pressure wind current's speed is higher, heat convection intensity is big more, consequently, can effectively improve heat convection intensity between heat radiation fin and the air through above-mentioned mode.
Specific embodiments of the present invention are disclosed in detail with reference to the following description and drawings, indicating the manner in which the principles of the invention may be employed. It should be understood that the embodiments of the invention are not so limited in scope. The embodiments of the invention include many variations, modifications and equivalents within the spirit and scope of the appended claims. Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments, in combination with or instead of the features of the other embodiments.
Drawings
The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way. In addition, the shapes, the proportional sizes, and the like of the respective members in the drawings are merely schematic for facilitating the understanding of the present invention, and do not specifically limit the shapes, the proportional sizes, and the like of the respective members of the present invention. Those skilled in the art, having the benefit of the teachings of this invention, may choose from the various possible shapes and proportional sizes to implement the invention as a matter of case.
FIG. 1 is a schematic perspective view of the inside of a housing of a vehicle-mounted server enclosure according to an embodiment of the present application;
fig. 2 is a cross-sectional view of a heat conducting mechanism and a heat pipe in a heat dissipation system according to an embodiment of the disclosure.
Reference numerals of the above figures:
1. a chassis; 11. an air inlet; 12. an air outlet; 2. a heat generating element; 3. a heat pipe; 31. a first bending portion; 32. a second bending portion; 4. a heat sink; 5. a heat conducting mechanism; 51. a heat pipe base; 511. a first groove; 52. a heat pipe cover; 521. a body; 5210. a second groove; 522. a fin portion; 6. a first fan set; 7. a second fan set.
Detailed Description
The details of the present invention can be more clearly understood in conjunction with the accompanying drawings and the description of the embodiments of the present invention. However, the specific embodiments of the present invention described herein are for the purpose of illustration only and are not to be construed as limiting the invention in any way. Any possible variations based on the present invention may be conceived by the skilled person in the light of the teachings of the present invention, and these should be considered to fall within the scope of the present invention. It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, mechanical or electrical connections, communications between two elements, direct connections, indirect connections through intermediaries, and the like. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In order to further improve the ability of a heat dissipation unit to dissipate heat of a heat-generating component in a vehicle-mounted server, a heat dissipation system for a vehicle-mounted server is provided in the present application, fig. 1 is a schematic perspective view of an inside of a chassis housing of a vehicle-mounted server in an embodiment of the present application, and fig. 2 is a cross-sectional view of a heat conduction mechanism and a heat pipe in the heat dissipation system in the embodiment of the present application, and as shown in fig. 1 to fig. 2, the vehicle-mounted server may include: a casing of the case 1 with an air inlet 11 and an air outlet 12; the heat dissipation system is installed in the housing of the chassis 1, wherein the heat dissipation system may include a first fan set 6 installed at the air inlet 11 of the housing of the chassis 1; the second fan set 7 is installed at an air outlet 12 of the shell of the case 1, the air inlet 11 and the air outlet 12 are arranged oppositely, and the first fan set 6 and the second fan set 7 enable high-pressure air flow from the air inlet 11 to the air outlet 12 to be formed between the air inlet 11 and the air outlet 12 and parallel to the horizontal direction; the heat dissipation unit that sets up in quick-witted case 1 shell, the heat dissipation unit includes: the heat conduction mechanism 5 comprises a heat pipe seat 51 and a heat pipe cover 52 which clamp one end of the heat pipe 3, the heat pipe cover 52 is provided with a body 521 and fin parts 522 which extend along the direction vertical to the body 521, gaps are formed among the fin parts 522 of the heat pipe cover 52, the flow direction of high-pressure air flow is parallel to the plane where the gaps among the fin parts 522 are located, and the other end of the heat pipe 3 is connected with the radiator 4 to transfer heat to the radiator 4; a plurality of circuit boards which are arranged in the vertical direction and extend in the horizontal direction and are arranged in the shell of the case 1; a circuit board is provided with a heating element and a heat dissipation unit for dissipating heat from the heating element, and the heat sinks 4 of the plurality of heat dissipation units are arranged in a straight line along the air outlet 12.
Because various heating components 2 are arranged on a circuit board in the vehicle-mounted server, the heating components 2 generate a large amount of heat during operation, and in order to avoid damage or efficiency reduction of the heating components 2 due to high temperature, the heat generated by the heating components 2 needs to be quickly and efficiently conducted to the radiator 4 by the heat pipe 3, so that the heat is dissipated to the air through the radiator 4. Because the cross section of the heat pipe 3 is circular, in order to enable the heat of the heating element 2 to be efficiently transferred to one end of the heat pipe 3, the heat pipe seat 51 and the heat pipe cover 52 are adopted and attached to the heating element 2 through the heat pipe seat 51, so that the contact area between the heating element 2 and the heat pipe seat 51 is increased, and the heat of the heating element 2 is firstly transferred to the heat pipe seat 51. Then, the heat pipe 3 is clamped by the heat pipe seat 51 and the heat pipe cover 52, and the contact area between the heat pipe 3 and the heat pipe seat 51 and the heat pipe cover 52 is ensured, so that the heat of the heat pipe seat 51 is quickly and efficiently transferred to the heat pipe 3, and finally transferred to the radiator 4 through the heat pipe 3.
In order to further improve the heat dissipation capability of the heat dissipation unit for dissipating heat of the heat generating component 2 in the vehicle-mounted server, in the present application, the first fan set 6 and the second fan set 7 are disposed oppositely, a high-pressure wind flow from the air inlet 11 to the air outlet 12 is formed between the air inlet 11 and the air outlet 12, meanwhile, the heat pipe cover 52 has the fin portion 522 extending in the direction perpendicular to the body 521, and the flow direction of the high-pressure wind flow is parallel to the plane where the gap between the fin portions 522 is located.
As shown in fig. 1, the casing 1 of the vehicle-mounted server has an air inlet 11 and an air outlet 12 on two sides along the horizontal direction, and the air inlet 11 and the air outlet 12 are disposed opposite to each other. The first fan set 6 is mounted at the air inlet 11 of the housing of the chassis 1, and is arranged along a straight line. The second fan set 7 is installed at the air outlet 12 of the housing of the chassis 1, and is arranged along a straight line. Through the way that the air inlet 11 and the air outlet 12 are arranged oppositely, the first fan set 6 and the second fan set 7 enable a high-pressure air flow which is basically linear and is from the air inlet 11 to the air outlet 12 to be formed between the air inlet 11 and the air outlet 12.
In a preferred embodiment, the wind pressure of the outlet wind generated by the second fan set is greater than the wind pressure of the inlet wind generated by the first fan set. Through the mode, the air pressure of air inlet is small, the air pressure of air outlet is large, the phenomenon that partial air volume of the first fan set is reflected back is avoided, and therefore the situation that the air volume in the whole case shell is insufficient is avoided.
As shown in fig. 1, the heat pipe cover 52 may include a body 521 opened with a second groove 5210 and a fin portion 522 extending upward in a direction perpendicular to the body 521 for dissipating heat. The second groove 5210 is located on the lower end surface of the body 521, and the fin portion 522 is located on the upper end surface of the body 521. The fin portions 522 of the heat pipe cover 52 have gaps therebetween, and the flow direction of the high-pressure wind flow is parallel to the plane in which the gaps between the fin portions 522 are located so that the high-pressure wind flow passes through the gaps between the fin portions 522 in a straight line.
As shown in fig. 1, in one heat radiating unit, a plurality of heat pipes 3 may be employed, so that heat transfer between the heat conducting mechanism 5 and the heat sink 4 can be accelerated. The diameter of the heat pipe 3 used may be selected to be between 6mm and 10mm, including 6mm and 10mm, and preferably, may be selected to be between 6mm and 8mm, including 6mm and 8mm, so that the heat pipe seat 51 and the heat pipe cover 52 may facilitate sandwiching the heat pipe 3, without making the thicknesses of the heat pipe seat 51 and the heat pipe cover 52 too large, and may also facilitate sandwiching a plurality of heat pipes 3 between the heat pipe seat 51 and the heat pipe cover 52.
As shown in fig. 2, the lower end surface of the heat pipe base 51 abuts against the heating element 2 on the circuit board in the in-vehicle server, and in order to increase the degree of contact therebetween to enhance heat conduction, a heat conductive silicone grease may be applied or filled between the lower end surface of the heat pipe base 51 and the heating element 2. The heat pipe base 51 is provided with a first groove 511, the heat pipe cover 52 is provided with a second groove 5210, one end of the heat pipe 3 is clamped by the first groove 511 and the second groove 5210, and in order to improve the contact degree between the heat pipe 3 and the heat pipe cover 52 and the heat pipe base 51, heat-conducting silicone grease can be coated or filled between the heat pipe 3 and the heat pipe cover 52 and between the heat pipe base 51 to enhance the heat conduction between the heat pipe 3 and the heat pipe cover 52 and between the heat pipe base 51. The heat pipe base 51 and the heat pipe cover 52 can be fixedly connected together by means of screws, bolts and the like, and the length of the heat pipe cover 52 in the direction of high-pressure wind flow is far longer than that of the heat pipe base 51 because certain heat dissipation is required to be performed through the heat pipe cover 52.
As shown in fig. 1, the heat sink 4 is disposed at the air outlet 12, and may be disposed at an air inlet end of the second fan set 7. The heat sink 4 may include a plurality of heat dissipating fins extending in a horizontal direction and arranged in a vertical direction, and a flow direction of the high pressure wind flow is parallel to a plane in which a gap between adjacent heat dissipating fins is located. Through the mode, high-pressure air flow can pass through the gaps between the radiating fins, so that the heat convection strength between the radiating fins and the heat pipe 3 is improved, and meanwhile, the resistance to the high-pressure air flow can be reduced.
As shown in fig. 1, the extending direction of one end of the heat pipe 3 is the same as the flow direction of the high-pressure wind flow, so that not only can the resistance to the high-pressure wind flow be reduced, but also the bending degree of the heat pipe 3 can be simplified, and the heat pipe 3 can extend to the heat sink 4 conveniently. The plurality of radiating fins are provided with openings along the vertical direction, and the other ends of the heat pipes 3 are inserted into the openings of the radiating fins and are tightly attached to or welded with the radiating fins. Specifically, the other end of the heat pipe 3 is inserted into the opening from top to bottom, and the end of the other end of the heat pipe 3 faces downward.
As shown in fig. 1, a bent segment is provided between one end and the other end of the heat pipe 3. The bending section of the heat pipe 3 comprises a plurality of bending portions, and the bending section of the heat pipe 3 at least comprises a first bending portion 31 nearest to one end of the heat pipe 3 and a second bending portion 32 nearest to the heat sink 4. Wherein the first bend 31 abuts against the heat pipe cover 52. From one end of the heat pipe 3 to the other end of the heat pipe 3, the first bent portion 31 extends the heat pipe 3 upward, and the second bent portion 32 extends the heat pipe 3 downward.
Because the heights of the first bending part 31 and the second bending part 32 are higher than the contact end of the heat pipe 3 with the heat pipe seat 51 and the heat pipe cover 52, the working medium in the heat pipe 3 needs to ascend through the first bending part 31 as soon as possible after absorbing heat at one end of the heat pipe 3 and being converted into a gas state, and then reaches the other end of the heat pipe 3 through the second bending part 32 to release heat and be converted into a liquid state. If the first bending portion 31 is far from the heat pipe cover 52, the gaseous working medium may not reach the first bending portion 31, the portion may be changed into a liquid state under the influence of temperature, and the liquid working medium cannot rise to the gaseous working medium through the first bending portion due to gravity and finally reaches the other end of the heat pipe 3, so that the heat transfer power of the heat pipe 3 is reduced, and the heat pipe 3 is not favorable for heat dissipation of the heat pipe 3 to the heating element 2.
In a possible embodiment, the heat generating component 2 on the circuit board may be a GPU chip or a CPU chip. Since the two chips instantaneously generate a large amount of heat when operating at a high speed, the temperature thereof is rapidly increased, and the operating speed of the two chips has a certain requirement on the temperature, the two chips must be cooled in cooperation with a heat dissipation unit. Meanwhile, a heat dissipation unit can be separately configured for each circuit board with a GPU chip or a CPU chip, and the heat sinks 4 in the heat dissipation unit are linearly arranged along the air outlet 12. Through the mode, when the circuit board with the heat dissipation unit needs to be replaced, the circuit board can be directly taken out together with the heat dissipation unit connected with the circuit board, so that the flexible disassembly and assembly and the maintenance are facilitated.
Also presented in this application is an autonomous vehicle that may include: an in-vehicle server as in any above.
The "automatic driving automobile" referred to in the present application refers to a vehicle that has a manned (such as a family car, a bus, etc.) and a cargo (such as a general truck, a van, a closed truck, a tank truck, a flat truck, a container van, a dump truck, a truck with a special structure, etc.) or a special rescue function (such as a fire truck, an ambulance, etc.) realized by using an automatic driving technology.
The above embodiments in the present specification are all described in a progressive manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment is described with emphasis on being different from other embodiments. All articles and references disclosed, including patent applications and publications, are hereby incorporated by reference for all purposes. The term "consisting essentially of …" describing a combination shall include the identified element, ingredient, component or step as well as other elements, ingredients, components or steps that do not materially affect the basic novel characteristics of the combination. The use of the terms "comprising" or "including" to describe combinations of elements, components, or steps herein also contemplates embodiments that consist essentially of such elements, components, or steps. By using the term "may" herein, it is intended to indicate that any of the described attributes that "may" include are optional. A plurality of elements, components, parts or steps can be provided by a single integrated element, component, part or step. Alternatively, a single integrated element, component, part or step may be divided into separate plural elements, components, parts or steps. The disclosure of "a" or "an" to describe an element, ingredient, component or step is not intended to foreclose other elements, ingredients, components or steps.
The above embodiments are only a few embodiments of the present invention, and the embodiments of the present invention are described above, but the present invention is only used for the understanding of the present invention, and is not limited to the embodiments. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (12)
1. A heat dissipation system for an in-vehicle server, the heat dissipation system comprising:
the first fan set is arranged at the air inlet of the chassis shell; the first fan group and the second fan group enable high-pressure air flow from the air inlet to the air outlet to be formed between the air inlet and the air outlet;
a heat dissipating unit disposed in the chassis housing, the heat dissipating unit comprising: a heat conducting mechanism, a heat pipe and a radiator; the heat conducting mechanism comprises a heat pipe seat and a heat pipe cover which clamp one end of the heat pipe, the heat pipe cover is provided with a body and fin parts which extend along the direction vertical to the body, gaps are formed among the fin parts of the heat pipe cover, the flow direction of the high-pressure air flow is parallel to the plane where the gaps among the fin parts are located, and the other end of the heat pipe is connected with the radiator to transfer heat to the radiator.
2. The heat dissipation system for in-vehicle servers, according to claim 1, wherein the heat sink is disposed at an air intake end of the second fan group.
3. The heat dissipation system for the on-board server according to claim 2, wherein the heat sink includes a plurality of heat dissipation fins extending in a horizontal direction and arranged in a vertical direction, and a flow direction of the high-pressure wind flow is parallel to a plane in which a gap between adjacent heat dissipation fins is located.
4. The heat dissipation system for the vehicle-mounted server as claimed in claim 3, wherein a plurality of the heat dissipation fins are opened with openings in a vertical direction, and the other ends of the heat pipes are inserted into the openings of the heat dissipation fins and are closely attached to or welded to the heat dissipation fins.
5. The heat dissipation system for the on-board server according to claim 4, wherein one end of the heat pipe extends in the same direction as a flow direction of the high-pressure wind flow.
6. The heat dissipation system for the onboard server as recited in claim 5, wherein a bent section is provided between one end and the other end of the heat pipe, the bent section of the heat pipe includes at least a first bent portion nearest to one end of the heat pipe and a second bent portion nearest to the heat sink, and the first bent portion abuts against a heat pipe cover.
7. The heat dissipation system for the in-vehicle server according to claim 6, wherein the other end of the heat pipe is inserted into the opening from top to bottom, and a terminal of the other end of the heat pipe faces downward.
8. The heat dissipation system for the in-vehicle server according to claim 6, wherein the first bent portion extends the heat pipe upward and the second bent portion extends the heat pipe downward from one end of the heat pipe to the other end of the heat pipe.
9. The heat dissipation system for in-vehicle servers as defined in claim 1, wherein a wind pressure of outlet wind generated by the second fan set is greater than a wind pressure of inlet wind generated by the first fan set.
10. An in-vehicle server, characterized in that the in-vehicle server comprises: a chassis housing having an air inlet and an air outlet; the heat dissipation system for on-board servers as claimed in any one of claims 1 to 9 installed in the chassis housing, the high-pressure wind flow being parallel to a horizontal direction; a plurality of circuit boards arranged in the vertical direction and extending in the horizontal direction in the chassis housing; the circuit board is provided with heating elements and radiating units for radiating the heating elements, and the radiators of the radiating units are linearly arranged along the air outlet.
11. The vehicle-mounted server of claim 10, wherein the heat generating component is a GPU chip or a CPU chip.
12. An autonomous vehicle, comprising: the on-board server of any one of claims 10 to 11.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811639974.9A CN111381646A (en) | 2018-12-29 | 2018-12-29 | Heat dissipation system for vehicle-mounted server, vehicle-mounted server and automatic driving automobile |
| PCT/CN2019/077043 WO2020133687A1 (en) | 2018-12-29 | 2019-03-05 | Heat dissipation system for vehicle-mounted server, vehicle-mounted server, and autonomous vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811639974.9A CN111381646A (en) | 2018-12-29 | 2018-12-29 | Heat dissipation system for vehicle-mounted server, vehicle-mounted server and automatic driving automobile |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111381646A true CN111381646A (en) | 2020-07-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811639974.9A Pending CN111381646A (en) | 2018-12-29 | 2018-12-29 | Heat dissipation system for vehicle-mounted server, vehicle-mounted server and automatic driving automobile |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111381646A (en) |
| WO (1) | WO2020133687A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115174781A (en) * | 2022-07-05 | 2022-10-11 | 浙江腾视智驾科技有限公司 | Inside and outside passenger flow monitoring and analyzing system based on vehicle look-around system |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3408424B2 (en) * | 1998-07-28 | 2003-05-19 | 日本電気株式会社 | Electronic equipment cooling structure |
| CN2636306Y (en) * | 2003-05-23 | 2004-08-25 | 宝陆科技有限公司 | Heat sink for extended card |
| CN107765795A (en) * | 2017-11-08 | 2018-03-06 | 北京图森未来科技有限公司 | A kind of computer server |
-
2018
- 2018-12-29 CN CN201811639974.9A patent/CN111381646A/en active Pending
-
2019
- 2019-03-05 WO PCT/CN2019/077043 patent/WO2020133687A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115174781A (en) * | 2022-07-05 | 2022-10-11 | 浙江腾视智驾科技有限公司 | Inside and outside passenger flow monitoring and analyzing system based on vehicle look-around system |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020133687A1 (en) | 2020-07-02 |
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