CN111377515B - Method for decomposing hydrogen peroxide and apparatus using the same - Google Patents
Method for decomposing hydrogen peroxide and apparatus using the same Download PDFInfo
- Publication number
- CN111377515B CN111377515B CN201911368807.XA CN201911368807A CN111377515B CN 111377515 B CN111377515 B CN 111377515B CN 201911368807 A CN201911368807 A CN 201911368807A CN 111377515 B CN111377515 B CN 111377515B
- Authority
- CN
- China
- Prior art keywords
- hydrogen peroxide
- waste liquid
- sulfuric acid
- decomposing
- decomposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/72—Treatment of water, waste water, or sewage by oxidation
- C02F1/725—Treatment of water, waste water, or sewage by oxidation by catalytic oxidation
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B17/00—Sulfur; Compounds thereof
- C01B17/69—Sulfur trioxide; Sulfuric acid
- C01B17/90—Separation; Purification
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/22—Treatment of water, waste water, or sewage by freezing
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/58—Treatment of water, waste water, or sewage by removing specified dissolved compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2101/00—Nature of the contaminant
- C02F2101/10—Inorganic compounds
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
- C02F2103/34—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32
- C02F2103/346—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32 from semiconductor processing, e.g. waste water from polishing of wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W10/00—Technologies for wastewater treatment
- Y02W10/30—Wastewater or sewage treatment systems using renewable energies
- Y02W10/37—Wastewater or sewage treatment systems using renewable energies using solar energy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Removal Of Specific Substances (AREA)
- Catalysts (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
Abstract
The purpose of the present invention is to economically and efficiently treat hydrogen peroxide in a waste liquid containing sulfuric acid and hydrogen peroxide. The present disclosure includes: adding a vanadium sulfate solution into the waste liquid and stirring; standing for a prescribed time after the waste liquid reaches the peak temperature; and a method for decomposing hydrogen peroxide in a waste liquid containing sulfuric acid and hydrogen peroxide, wherein the method comprises a step of cooling after standing. Also, disclosed is an apparatus for decomposing hydrogen peroxide in a waste liquid containing sulfuric acid and hydrogen peroxide, which has one or more decomposition tanks in which decomposition reactions are performed, the decomposition tanks including: an input opening for inputting waste liquid and/or vanadium sulfate into the decomposing tank; a stirring mechanism for stirring the waste liquid in the decomposition reaction in the decomposition tank; an exhaust opening portion for exhausting oxygen generated by the decomposition reaction; a thermometer for measuring a peak temperature of the waste liquid in the decomposition reaction; and a cooling mechanism for cooling the waste liquid after the decomposition reaction.
Description
Technical Field
The present invention relates to a method for decomposing hydrogen peroxide in a waste liquid containing sulfuric acid and hydrogen peroxide discharged from a semiconductor manufacturing process or the like, and an apparatus using the method.
Background
In a wafer cleaning process in a semiconductor manufacturing process, a sulfuric acid-hydrogen peroxide mixture (SPM, sulfuric acid Hydrogen Peroxide Mixture) containing sulfuric acid and hydrogen peroxide is used as a cleaning liquid. In this process, after using the sulfuric acid hydrogen peroxide mixture, the oxidizing ability is recovered by adding hydrogen peroxide to the sulfuric acid hydrogen peroxide mixture, and then used again as a cleaning liquid. However, during repeated use, the water content derived from hydrogen peroxide increases, the sulfuric acid concentration in the sulfuric acid hydrogen peroxide mixture decreases, and the cleaning power becomes weak, so that it is necessary to replace an appropriate liquid. The sulfuric acid hydrogen peroxide mixture waste liquid discharged when the liquid is replaced contains hydrogen peroxide, and cannot be delivered as industrial waste when the concentration exceeds a predetermined concentration (patent document 1).
As a method for decomposing hydrogen peroxide in a sulfuric acid waste liquid containing the hydrogen peroxide, there has been proposed a method of thermally decomposing hydrogen peroxide using a large scale apparatus (patent document 1), and particularly decomposing hydrogen peroxide of low concentration using a metal vanadium or a vanadium compound as a catalyst (patent document 2).
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2013-208602
Patent document 2: JP 2002-001358A
Disclosure of Invention
However, when vanadium sulfate is used as a catalyst to decompose hydrogen peroxide in a sulfuric acid waste liquid, the present inventors have made a check as to whether or not hydrogen peroxide in the sulfuric acid waste liquid is decomposed to a predetermined concentration, and have had to use an expensive concentration meter resistant to sulfuric acid, and have faced the problems of cost and troublesome handling.
That is, the present invention aims to economically and efficiently treat hydrogen peroxide in a waste liquid containing sulfuric acid and hydrogen peroxide.
In earnest researches for solving the above problems, the present inventors found that the process of stirring a waste liquid by including the steps of adding a vanadium sulfate solution to the waste liquid; standing for a prescribed time after the waste liquid reaches the peak temperature; and a step of cooling after standing to economically and efficiently treat hydrogen peroxide in a waste liquid containing sulfuric acid and hydrogen peroxide, and further studies have been conducted to complete the present invention.
Namely, the present invention relates to the following.
1. A method for decomposing hydrogen peroxide in a waste stream comprising sulfuric acid and hydrogen peroxide, comprising: adding a vanadium sulfate solution into the waste liquid and stirring; standing for a prescribed time after the waste liquid reaches the peak temperature; and a step of cooling after standing.
2. The method for decomposing hydrogen peroxide according to claim 1, wherein the waste liquid is a sulfuric acid hydrogen peroxide mixture waste liquid for cleaning a semiconductor wafer.
3. The method for decomposing hydrogen peroxide according to 1 or 2, wherein the hydrogen peroxide in the waste liquid is 1.6 to 10.0% by weight.
4. The method for decomposing hydrogen peroxide according to any one of claims 1 to 3, wherein the waste liquid is divided into a capacity of 40L.
5. The method for decomposing hydrogen peroxide according to any one of 1 to 4, wherein 0.05g to 0.25g of a vanadium sulfate solution is added to 1L of the waste liquid.
6. The method for decomposing hydrogen peroxide as claimed in any one of claims 1 to 5, which has a peak temperature of 40 ℃ to 130 ℃.
7. The method for decomposing hydrogen peroxide according to any one of claims 1 to 6, stirring is performed by bubbling.
8. The method for decomposing hydrogen peroxide according to any one of claims 1 to 7, wherein a standing time after reaching a peak temperature is 5 minutes or more with respect to the decomposition of 1.6 to 10.0 weight percent of hydrogen peroxide in the waste liquid.
9. A method for regenerating a waste liquid containing sulfuric acid and hydrogen peroxide into industrial sulfuric acid by using the method for decomposing hydrogen peroxide according to any one of claims 1 to 8.
10. An apparatus for decomposing hydrogen peroxide in a waste liquid containing sulfuric acid and hydrogen peroxide, comprising one or more decomposing tanks in which decomposition reactions are performed, the decomposing tank comprising:
an input opening for inputting waste liquid and/or vanadium sulfate into the decomposing tank;
a stirring mechanism for stirring the waste liquid in the decomposition reaction in the decomposition tank;
an exhaust opening portion for exhausting oxygen generated by the decomposition reaction;
a thermometer for measuring a peak temperature of the waste liquid in the decomposition reaction; and
and the cooling mechanism is used for cooling the waste liquid after the decomposition reaction.
11. The apparatus for decomposing hydrogen peroxide in a waste liquid containing sulfuric acid and hydrogen peroxide according to claim 10, wherein the amount of the waste liquid fed into the decomposing tank is 80% or less of the capacity of the decomposing tank.
12. The apparatus for decomposing hydrogen peroxide in a waste liquid containing sulfuric acid and hydrogen peroxide according to 10 or 11, wherein the cooling means externally cools with cold water.
13. The apparatus for decomposing hydrogen peroxide in a waste liquid containing sulfuric acid and hydrogen peroxide according to any one of claims 10 to 12, which is an automated apparatus.
The method of the present invention does not require a large-scale apparatus and does not require an expensive hydrogen peroxide concentration meter and a time-consuming concentration measurement using the same, and thus can economically and effectively decompose hydrogen peroxide in a waste liquid containing sulfuric acid and hydrogen peroxide.
In addition, the method of the present invention can treat the waste liquid in a raw liquid state without neutralizing or diluting the waste liquid, and thus can suppress the amount of the solution generated after the treatment.
In addition, according to the method of the present invention, the waste liquid is divided into a predetermined amount and treated by using a plurality of decomposing tanks, so that the waste liquid can be safely treated even if the concentration of hydrogen peroxide is high.
Further, the above-described method can be automatically performed by the apparatus of the present invention, and a continuous hydrogen peroxide decomposition process can be simply and accurately performed.
Drawings
Fig. 1 shows the structure of a decomposition tank of the hydrogen peroxide decomposition device according to the present invention.
Description of the reference numerals
1: hydrogen peroxide decomposition device
2: decomposing tank
3: opening for input
4: stirring mechanism
5: opening for discharging
6: thermometer
7: cooling mechanism
Detailed Description
Hereinafter, the present invention will be described in detail based on preferred embodiments thereof.
The present invention relates to a method for decomposing hydrogen peroxide in a waste liquid comprising sulfuric acid and hydrogen peroxide, said method comprising: adding a vanadium sulfate solution into the waste liquid and stirring; standing for a prescribed time after the waste liquid reaches the peak temperature; and a step of cooling after standing.
The present invention also relates to an apparatus for decomposing hydrogen peroxide in a waste liquid containing sulfuric acid and hydrogen peroxide, which is used in the above-described method.
The above-mentioned apparatus has one or more decomposition tanks in which decomposition reaction is carried out. And, the decomposition tank includes: an input opening for inputting waste liquid and/or vanadium sulfate into the decomposing tank; a stirring mechanism for stirring the waste liquid in the decomposition reaction in the decomposition tank; an exhaust opening portion for exhausting oxygen generated by the decomposition reaction; a thermometer for measuring a peak temperature of the waste liquid in the decomposition reaction; and a cooling mechanism for cooling the waste liquid after the decomposition reaction.
The decomposition reaction of hydrogen peroxide performed in the decomposition tank of the present invention by bringing the waste liquid into contact with vanadium sulfate is as follows:
H 2 O 2 →H 2 O+(1/2)O 2 (1)
In the reaction of formula 1, vanadium sulfate is used as a catalyst for the decomposition reaction of hydrogen peroxide, and vanadium sulfate itself does not react. The reaction is exothermic.
In the present invention, the waste liquid and the vanadium sulfate solution are sequentially fed from the feeding opening to the decomposing tank, and stirred by the stirring mechanism.
The waste liquid used in the present invention contains sulfuric acid and hydrogen peroxide. The concentration of sulfuric acid is not particularly limited, and is, for example, about 70 weight percent. The concentration of hydrogen peroxide is not particularly limited, but is preferably 10.0 wt% or less, more preferably 7.0 wt% or less, further preferably 1.6 to 10.0 wt%, particularly preferably 1.6 to 7.0 wt%. The waste liquid may contain components other than sulfuric acid and hydrogen peroxide.
The type of the waste liquid is not particularly limited as long as the waste liquid contains sulfuric acid and hydrogen peroxide, and examples thereof include sulfuric acid and hydrogen peroxide mixture waste liquid for cleaning a semiconductor wafer, chemical polishing liquid, and the like, and as the waste liquid treated by the method of the present invention, sulfuric acid hydrogen peroxide mixture waste liquid for cleaning a semiconductor wafer is preferable.
In the case where the waste liquid is a waste liquid of a sulfuric acid hydrogen peroxide mixture for cleaning a semiconductor wafer, the amount of the waste liquid produced per day is not particularly limited, for example, 1000L to 4000L.
In the case of treating a large amount of waste liquid with one decomposing tank, particularly when the concentration of hydrogen peroxide in the waste liquid is high, a severe decomposition reaction proceeds, and a hazard may occur in the waste liquid treatment operation. Therefore, from the viewpoint of safe treatment, it is preferable to divide the waste liquid into a predetermined amount and decompose hydrogen peroxide in the treated waste liquid using a plurality of decomposition tanks, but the amount is not particularly limited, and may be divided into a capacity of 40L, for example. By dividing the waste liquid into a predetermined amount and treating it, the waste liquid can be safely treated even if the concentration of hydrogen peroxide is high. Also, since the decomposition reactions in the respective decomposition tanks are independent of each other, even if a hazard occurs in one decomposition tank, the other decomposition tanks are not affected, and the hazard accompanying the waste liquid treatment operation can be minimized.
The solvent of the vanadium sulfate solution used in the present invention is not particularly limited as long as hydrogen peroxide in the waste liquid can be decomposed.
The amount of the vanadium sulfate solution to be used is not particularly limited, but is preferably 0.05g to 0.25g relative to 1L of the waste liquid. If the amount is more than 0.25g, the decomposition of hydrogen peroxide is excessively promoted, and there is a possibility that a hazard may occur in the waste liquid treatment operation. On the other hand, if the amount is less than 0.05g, the decomposition reaction of hydrogen peroxide cannot proceed sufficiently.
The material of the decomposition tank used in the present invention is not particularly limited as long as it has strong acid resistance, and examples thereof include resin-lined metal, glass-lined metal, and fluororesin, and glass-lined metal is preferable.
The shape of the decomposition tank is not particularly limited as long as it does not interfere with decomposition of hydrogen peroxide in the waste liquid containing sulfuric acid and hydrogen peroxide, and examples thereof include a cylindrical shape and a box shape. From the viewpoint of easy stirring, a cylindrical shape is preferable.
The size of the decomposition tank is not particularly limited as long as the hydrogen peroxide in the waste liquid containing sulfuric acid and hydrogen peroxide can be decomposed safely, and for example, phi 300mm×700mm is converted to about 50L in capacity. The amount of waste liquid fed into the decomposing tank is not particularly limited as long as the treatment can be safely performed, and it is preferably 80% or less of the capacity of the decomposing tank, for example, 40L.
The openings for charging the waste liquid and the vanadium sulfate solution may be the same or different. The input opening can be opened and closed.
The stirring mechanism used in the present invention is not particularly limited as long as the waste liquid can be brought into effective contact with vanadium sulfate to promote the decomposition reaction of hydrogen peroxide in the waste liquid, and examples thereof include a stirrer, bubbling, and the like. Since sulfuric acid is contained in the waste liquid, in the case of using a stirring mechanism for metals, dissolution or corrosion of metals due to sulfuric acid may occur. Therefore, bubbling is preferable from the viewpoint of not using metal.
In the case of using bubbling as the stirring means, the circulation rate of air is not particularly limited as long as the waste liquid is brought into effective contact with vanadium sulfate to promote the decomposition reaction of hydrogen peroxide in the waste liquid and the decomposition reaction can be safely performed. Further, if bubbling is continuously performed, a decomposition reaction may be strongly generated, and thus, it is preferable to perform the bubbling intermittently.
Oxygen generated by the decomposition reaction is discharged through the discharge opening. The discharge opening for discharging oxygen may be the same as or different from the discharge opening for charging the waste liquid and/or the vanadium sulfate solution.
In the present invention, the peak temperature of the waste liquid in the decomposition reaction is measured by a thermometer, and then the waste liquid is allowed to stand for a predetermined time.
The peak temperature of the waste liquid measured in the present invention means the highest temperature of the waste liquid heated by the heat generated by the decomposition reaction of hydrogen peroxide, and when the temperature of the waste liquid starts to decrease, the temperature before the start of the decrease is regarded as the highest temperature of the waste liquid.
The mechanism for measuring the temperature of the waste liquid used in the present invention is not particularly limited, but a thermocouple sensor coated with a fluororesin or the like is preferable.
The peak temperature depends on the concentration of hydrogen peroxide in the waste liquid, for example, 40-130 ℃ relative to 2.0-8.0 weight percent hydrogen peroxide. The peak temperature is preferably 80℃or less from the viewpoint of safely conducting the decomposition reaction.
Even in the standing step, the decomposition reaction of hydrogen peroxide continues. Depending on the experimentally known relationship between peak temperature and the rest time taken to reduce the hydrogen peroxide to the prescribed concentration, the hydrogen peroxide may be reduced to the prescribed concentration by rest alone. The above steps eliminate the need for a high valence concentration meter for continuously measuring the hydrogen peroxide concentration in the waste liquid, so that the decomposition reaction of hydrogen peroxide can be suppressed economically and effectively.
In one embodiment, the standing time is 5 minutes or more with respect to the concentration of hydrogen peroxide in the waste liquid of 1.6 to 10.0 weight percent.
In the present invention, after standing, cooling is performed by a cooling mechanism.
The cooling used in the present invention is performed after standing, and its main function is to completely terminate the decomposition reaction and reduce the temperature of the waste liquid to a safe temperature. The decomposition reaction is still proceeding during the standing, and if the cooling is performed during the standing, the cooling is not performed during the standing, but started after the standing because the decomposition reaction may be terminated and cannot be allowed to proceed to the predetermined hydrogen peroxide concentration.
The cooling mechanism used in the present invention is not particularly limited as long as it can reduce the waste liquid that has terminated the decomposition reaction of hydrogen peroxide to a safe temperature without changing the composition of the waste liquid, and it is preferable to externally cool the waste liquid with cold water. Further, in the case of external cooling by cold water, the decomposition tank may have a two-tank structure so that the cooling water may pass through the exterior of the decomposition tank. Further, a glass liner or the like is preferably used inside the decomposition tank, because the cooling efficiency can be improved.
The concentration of hydrogen peroxide in the liquid obtained by the method of the present invention is preferably 0.5% by weight or less, and particularly preferably 0.1% by weight or less.
The present invention further relates to a method for regenerating a waste liquid containing sulfuric acid and hydrogen peroxide into sulfuric acid using the method of the present invention.
In one embodiment, the method of the present invention may be performed using the automated apparatus of the present invention.
Examples
Next, the etching liquid composition of the present invention will be described in more detail by the following examples and comparative examples, but the present invention is not limited thereto.
A waste liquid (70 weight percent sulfuric acid, 7 weight percent hydrogen peroxide or less) containing sulfuric acid and hydrogen peroxide, which was discharged from a wafer cleaning process for semiconductor manufacturing, was treated at 2800L/day, and a hydrogen peroxide decomposition apparatus (manufactured by kanto engineering company) having the structure of fig. 1 was prepared. The hydrogen peroxide decomposing apparatus was housed in a PVC resin tank, and the outer diameter thereof was about D1200mm by W3000mm by H2000mm, and the capacity of each decomposing tank was 23L.
The treatment of 1 batch of 1 decomposition tank was set to 1 hour, and all 6 tanks were set to automatic continuous operation. The automatic processing flow of 1 batch of 1 decomposer is as follows. When the automatic operation of the apparatus was started, waste liquid was fed from the waste water treatment tank, and 3g of vanadium sulfate was fed from the decomposer tank. Bubbling was intermittently performed in the decomposition tank, and after 40 ℃ was measured, the bubbling was completely stopped. And after measuring the peak temperature, the decomposition tank was left to stand for 15 minutes. After standing, cold water was circulated, and the outside of the decomposition tank was cooled to a liquid temperature in the decomposition tank of 35 ℃. After cooling, the waste liquid containing the decomposed vanadium sulfate is discharged from the decomposition tank and stored in a storage tank. And, cooling water is additionally discharged. The concentration of hydrogen peroxide in the decomposed waste liquid is 0.1 wt% or less.
The above operation was performed in all 6 tanks, and the treatment of about 3000L was completed in 24 hours.
Claims (9)
1. A method for decomposing hydrogen peroxide in a waste stream comprising sulfuric acid and hydrogen peroxide, comprising:
adding a vanadium sulfate solution into the waste liquid and stirring;
standing for a predetermined time after the waste liquid reaches the peak temperature, and reducing the hydrogen peroxide to a predetermined concentration; and
and (3) after standing, cooling.
2. The method for decomposing hydrogen peroxide in a waste liquid containing sulfuric acid and hydrogen peroxide according to claim 1, wherein the waste liquid is a sulfuric acid hydrogen peroxide mixture waste liquid for cleaning semiconductor wafers.
3. The method for decomposing hydrogen peroxide in a waste liquid containing sulfuric acid and hydrogen peroxide according to claim 1 or 2, wherein the hydrogen peroxide in the waste liquid is 1.6 to 10.0 weight percent.
4. The method for decomposing hydrogen peroxide in a waste liquid containing sulfuric acid and hydrogen peroxide according to claim 1 or 2, wherein the waste liquid is divided into a capacity of 40L.
5. The method for decomposing hydrogen peroxide in a waste liquid containing sulfuric acid and hydrogen peroxide according to claim 1 or 2, wherein 0.05g to 0.25g of a vanadium sulfate solution is added to 1L of the waste liquid.
6. The method for decomposing hydrogen peroxide in a waste liquid containing sulfuric acid and hydrogen peroxide according to claim 1 or 2, wherein the peak temperature is 40 ℃ to 130 ℃.
7. The method for decomposing hydrogen peroxide in a waste liquid containing sulfuric acid and hydrogen peroxide according to claim 1 or 2, wherein the stirring is performed by bubbling.
8. The method for decomposing hydrogen peroxide in a waste liquid containing sulfuric acid and hydrogen peroxide according to claim 1 or 2, wherein the standing time after reaching the peak temperature is 5 minutes or more with respect to the decomposition of 1.6 to 10.0 weight percent of hydrogen peroxide in the waste liquid.
9. A method for regenerating a waste liquid containing sulfuric acid and hydrogen peroxide into industrial sulfuric acid, characterized in that the waste liquid containing sulfuric acid and hydrogen peroxide is regenerated into industrial sulfuric acid by using the method for decomposing hydrogen peroxide in a waste liquid containing sulfuric acid and hydrogen peroxide as claimed in any one of claims 1 to 8.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018248406A JP7219088B2 (en) | 2018-12-28 | 2018-12-28 | Method for decomposing hydrogen peroxide and apparatus for use in said method |
| JP2018-248406 | 2018-12-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111377515A CN111377515A (en) | 2020-07-07 |
| CN111377515B true CN111377515B (en) | 2023-06-27 |
Family
ID=71217037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911368807.XA Active CN111377515B (en) | 2018-12-28 | 2019-12-26 | Method for decomposing hydrogen peroxide and apparatus using the same |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7219088B2 (en) |
| KR (1) | KR20200083322A (en) |
| CN (1) | CN111377515B (en) |
| TW (1) | TW202035279A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113336198B (en) * | 2021-08-05 | 2021-10-15 | 清大国华环境集团股份有限公司 | Method and system for recycling waste sulfuric acid in integrated circuit industry |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1223971A (en) * | 1997-12-01 | 1999-07-28 | 索尼株式会社 | Method for utilizing sulfuric acid/peroxide liquid mixture |
| JPH11319849A (en) * | 1998-05-15 | 1999-11-24 | Sony Corp | Mixed medicinal liquid treating apparatus for treating chemical liquid containing sulfuric acid and peroxide |
| JP2002001358A (en) * | 2000-06-20 | 2002-01-08 | Mitsubishi Gas Chem Co Inc | Hydrogen peroxide decomposing method for chemical polishing waste liquid |
| CN105293449A (en) * | 2015-10-30 | 2016-02-03 | 上海新阳半导体材料股份有限公司 | Method for recycling sulfuric acid from waste acid obtained through semiconductor cleaning process |
| CN108793095A (en) * | 2018-09-26 | 2018-11-13 | 高频美特利环境科技（北京）有限公司 | Solution impurity-removing method and solution impurity removed system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5954530B2 (en) | 2012-03-30 | 2016-07-20 | 栗田工業株式会社 | Sulfuric acid waste liquid treatment apparatus and sulfuric acid waste liquid treatment method |
-
2018
- 2018-12-28 JP JP2018248406A patent/JP7219088B2/en active Active
-
2019
- 2019-12-26 TW TW108147802A patent/TW202035279A/en unknown
- 2019-12-26 CN CN201911368807.XA patent/CN111377515B/en active Active
- 2019-12-27 KR KR1020190176382A patent/KR20200083322A/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1223971A (en) * | 1997-12-01 | 1999-07-28 | 索尼株式会社 | Method for utilizing sulfuric acid/peroxide liquid mixture |
| JPH11319849A (en) * | 1998-05-15 | 1999-11-24 | Sony Corp | Mixed medicinal liquid treating apparatus for treating chemical liquid containing sulfuric acid and peroxide |
| JP2002001358A (en) * | 2000-06-20 | 2002-01-08 | Mitsubishi Gas Chem Co Inc | Hydrogen peroxide decomposing method for chemical polishing waste liquid |
| CN105293449A (en) * | 2015-10-30 | 2016-02-03 | 上海新阳半导体材料股份有限公司 | Method for recycling sulfuric acid from waste acid obtained through semiconductor cleaning process |
| CN108793095A (en) * | 2018-09-26 | 2018-11-13 | 高频美特利环境科技（北京）有限公司 | Solution impurity-removing method and solution impurity removed system |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202035279A (en) | 2020-10-01 |
| JP7219088B2 (en) | 2023-02-07 |
| JP2020104086A (en) | 2020-07-09 |
| CN111377515A (en) | 2020-07-07 |
| KR20200083322A (en) | 2020-07-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5696406B2 (en) | Copper etching waste treatment method | |
| US9278860B2 (en) | Method and apparatus for recycling waste sulfuric acid | |
| CN111377515B (en) | Method for decomposing hydrogen peroxide and apparatus using the same | |
| US5989509A (en) | Method for extracting antimony from elemental phosphorous | |
| KR101278231B1 (en) | Method and system for suppressing adhesion of radioactive substance | |
| KR101388084B1 (en) | Method for obtaining purified sulfuric acid from waste sulfuric acid | |
| KR101641959B1 (en) | Removing method of hydrogen peroxide from sulfuric acid-hydrogen peroxide solution and treatment agent thereof | |
| WO2005092786A1 (en) | Method of purifying hydrofluoric acid and purification apparatus | |
| CN115611403A (en) | Device and method for removing hydrogen peroxide in waste sulfuric acid | |
| CN112533873A (en) | Method for producing tungsten hexafluoride | |
| TWI630170B (en) | Processing method of hydrogen peroxide aqueous solution | |
| JP5560136B2 (en) | Method for producing bis (fluorosulfonyl) imide | |
| US20210002136A1 (en) | Method of removing hydrogen peroxide from sulfuric acid | |
| CN108483411A (en) | The processing unit and its processing method of hydrogen peroxide in a kind of removing sulfuric acid waste | |
| CN106756044A (en) | The method that chromium is reclaimed from useless chromium-based catalysts | |
| EP3384975A1 (en) | Method for treating exhaust gas containing elemental fluorine | |
| CN1311756A (en) | Process for removing arsenic from elemental phosphorus | |
| CN111330651B (en) | Waste ionic liquid catalyst treatment method and device | |
| JP6881551B2 (en) | Method for suppressing decrease in oxidizing agent concentration in sulfuric acid solution containing persulfuric acid component | |
| TWI845209B (en) | System for recycling a waste sulfuric acid contained hydrogen peroxide | |
| JP2001225085A (en) | Method for decomposing and removing ammonia nitrogen | |
| CN113336198B (en) | Method and system for recycling waste sulfuric acid in integrated circuit industry | |
| JP2010099542A (en) | Method for decomposing away ammonia nitrogen and apparatus for the same | |
| JP5776357B2 (en) | Method for treating waste water containing hydrazine and chelating organic compound | |
| JP2006253447A (en) | Method and device for manufacturing semiconductor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |