CN111373509B - 支撑片及保护膜形成用复合片 - Google Patents

支撑片及保护膜形成用复合片 Download PDF

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Publication number
CN111373509B
CN111373509B CN201880075847.2A CN201880075847A CN111373509B CN 111373509 B CN111373509 B CN 111373509B CN 201880075847 A CN201880075847 A CN 201880075847A CN 111373509 B CN111373509 B CN 111373509B
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CN
China
Prior art keywords
protective film
forming
adhesive layer
meth
film
Prior art date
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Active
Application number
CN201880075847.2A
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English (en)
Chinese (zh)
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CN111373509A (zh
Inventor
佐伯尚哉
古野健太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
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Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of CN111373509A publication Critical patent/CN111373509A/zh
Application granted granted Critical
Publication of CN111373509B publication Critical patent/CN111373509B/zh
Active legal-status Critical Current
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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/20Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
CN201880075847.2A 2018-03-30 2018-03-30 支撑片及保护膜形成用复合片 Active CN111373509B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/013569 WO2019186992A1 (ja) 2018-03-30 2018-03-30 支持シート及び保護膜形成用複合シート

Publications (2)

Publication Number Publication Date
CN111373509A CN111373509A (zh) 2020-07-03
CN111373509B true CN111373509B (zh) 2024-01-30

Family

ID=64899589

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880075847.2A Active CN111373509B (zh) 2018-03-30 2018-03-30 支撑片及保护膜形成用复合片

Country Status (5)

Country Link
JP (1) JP6445747B1 (ko)
KR (1) KR102388900B1 (ko)
CN (1) CN111373509B (ko)
TW (1) TWI788543B (ko)
WO (1) WO2019186992A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019240083A1 (ja) * 2018-06-12 2019-12-19 積水化学工業株式会社 樹脂材料及び多層プリント配線板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1450971A (zh) * 2000-09-04 2003-10-22 旭化成株式会社 粘合包封薄膜
JP2010042665A (ja) * 2008-07-15 2010-02-25 San Totsukusu Kk 基材フィルム
JP2016188344A (ja) * 2015-03-30 2016-11-04 リンテック株式会社 剥離フィルム、粘着シート、及び剥離フィルムの製造方法
JP6298226B1 (ja) * 2017-03-30 2018-03-20 リンテック株式会社 保護膜形成用複合シート

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5432853B2 (ko) 1971-10-11 1979-10-17
JP4517572B2 (ja) 2002-11-15 2010-08-04 Dic株式会社 反射・遮光粘着テープ
JP5432853B2 (ja) * 2010-07-30 2014-03-05 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム及びその製造方法並びに半導体装置の製造方法
CN104755259A (zh) * 2012-10-22 2015-07-01 三菱丽阳株式会社 层积结构体以及其制造方法、制品
JP2015196313A (ja) 2014-03-31 2015-11-09 ソニー株式会社 保護フィルム、積層体、表示装置および被着体
CN108174616B (zh) * 2015-10-05 2022-03-29 琳得科株式会社 半导体加工用片

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1450971A (zh) * 2000-09-04 2003-10-22 旭化成株式会社 粘合包封薄膜
JP2010042665A (ja) * 2008-07-15 2010-02-25 San Totsukusu Kk 基材フィルム
JP2016188344A (ja) * 2015-03-30 2016-11-04 リンテック株式会社 剥離フィルム、粘着シート、及び剥離フィルムの製造方法
JP6298226B1 (ja) * 2017-03-30 2018-03-20 リンテック株式会社 保護膜形成用複合シート

Also Published As

Publication number Publication date
KR20200138148A (ko) 2020-12-09
CN111373509A (zh) 2020-07-03
WO2019186992A1 (ja) 2019-10-03
JP6445747B1 (ja) 2018-12-26
KR102388900B1 (ko) 2022-04-20
TW202003251A (zh) 2020-01-16
JPWO2019186992A1 (ja) 2020-04-30
TWI788543B (zh) 2023-01-01

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