CN111371415A - Intelligent frequency discrimination linearizer of 6GHz-18GHz ultra-wideband solid-state power amplifier - Google Patents

Abstract

The invention discloses an intelligent frequency discrimination linearizer for a 6GHz-18GHz ultra-wideband solid-state power amplifier, which includes a two-way power division module, a frequency division module, a detection module, an electrical modulation attenuation module and a single-chip control module. The two-way power division module is used for Obtain the radio frequency signal and transmit the radio frequency signal to the frequency division module and the detection module respectively, the frequency division module reduces the frequency of the radio frequency signal by a certain multiple and transmits it to the single-chip control module, and the single-chip control module receives the radio frequency signal and detects the frequency of the signal. Frequency information, the detection module is used to transmit the radio frequency signal to the ESC attenuation module, and the power information of the detected radio frequency signal is transmitted to the single chip control module, and the single chip control module outputs the corresponding ESC through the frequency information and power information of the radio frequency signal. The voltage is applied to the ESC attenuation module, and the ESC attenuation module receives the ESC voltage and releases the radio frequency signal according to the preset attenuation amount. The problem of amplifier gain linearity is solved, and the efficiency of the amplifier is guaranteed.

Description

6GHz-18GHz Ultra-Broadband Solid State Power Amplifier Intelligent Frequency Discrimination Linearizer

technical field

The invention belongs to the technical field of amplifiers, and relates to a 6GHz-18GHz ultra-wideband solid-state power amplifier intelligent frequency discrimination linearizer.

Background technique

At present, in order to solve the linearity problem of solid-state power amplifiers, the most commonly used method is power back-off technology, that is, using high-power solid-state radio frequency amplifiers to reduce power. Generally speaking, when the small signal is used, the solid-state power amplifier will work in the linear amplification region. As the power increases, the amplifier gradually enters the saturation compression region, and the power gain begins to decrease. In order to ensure the gain linearity of the amplifier, the amplifier adopts a reduced power use. , so as to ensure the linearity of the amplifier.

In the prior art, the power backoff technology is simple and easy to implement, but high-power amplifiers can only be used with low power in order to ensure linearity, and the efficiency is greatly reduced, which cannot meet the requirements of 6-18GHz ultra-wideband high-power solid-state power amplifiers to improve gain linearity. .

SUMMARY OF THE INVENTION

The purpose of the invention is to provide a 6GHz-18GHz ultra-wideband solid-state power amplifier intelligent frequency discrimination linearizer, which solves the problem that the power back-off technology is simple and easy to implement, but the high-power amplifier can only be used with low power in order to ensure linearity, and the efficiency is greatly reduced , can not meet the 6 ~ 18GHz ultra-wideband high-power solid-state power amplifier to improve the gain linearity requirements of the problem.

The technical scheme adopted in the present invention is as follows:

6GHz-18GHz ultra-wideband solid-state power amplifier intelligent frequency discrimination linearizer, including two-way power division module, frequency division module, detection module, ESC attenuation module and single-chip control module, the two-way power division module is used to obtain radio frequency signals and The radio frequency signal is transmitted to the frequency division module and the detection module respectively, the frequency division module reduces the frequency of the radio frequency signal by a certain multiple and transmits it to the single-chip control module, and the single-chip control module receives the radio frequency signal and detects the frequency information of the signal, so The detection module is used to transmit the radio frequency signal to the ESC attenuation module, and transmit the power information of the detected radio frequency signal to the single-chip control module, and the single-chip control module outputs the corresponding ESC voltage to the power supply through the frequency information and power information of the radio frequency signal. The ESC attenuation module receives the ESC voltage and correspondingly releases the radio frequency signal according to the preset attenuation amount.

Further, the two-way power division module includes a first metal cavity, a dielectric plate, two-way microstrip lines and two isolation resistors, and the two-way microstrip lines are printed on the dielectric plate by circuit printing technology to The dielectric plate is sintered on the first metal cavity, one end of the two microstrip lines is used as a radio frequency input port, and the other end is used as two radio frequency output ports, and the two ends of the two isolation resistors are respectively welded with the two microstrip lines. .

Further, the frequency dividing module includes 2 times of the first level of frequency division, 8 times of the second level of frequency division and 8 times of the third level of frequency division, the first level of frequency division of 2 times and the second level of frequency division. Gold wire bonding is used for connection between the frequency 8 times through a microstrip line, and gold wire bonding is used between the second-level frequency division 8 times and the third-level frequency division 8 times through a microstrip line.

Further, the detector module uses a detector die for sintering in the cavity, and micro-assembly is used to connect the radio frequency input and output pads on the detector die to the microstrip line by gold wire bonding.

Further, the ESC attenuation module includes a second metal cavity, a PCB board and an ESC attenuation chip, the PCB is sintered in the second metal cavity, and the RF input and output ports of the ESC attenuation chip are micro-assembled. Use gold wire to connect with the microstrip line on the PCB.

Further, the single-chip microcomputer control module adopts STM32 single-chip microcomputer chip.

To sum up, due to the adoption of the above-mentioned technical solutions, the beneficial effects of the present invention are:

Compared with the power back-off technology, the present invention detects the power information of the input radio frequency signal, releases the preset attenuation correspondingly by controlling the ESC attenuator, and compensates the gain compression when the amplifier tends to be saturated. The problem of amplifier gain linearity is solved. In an ideal state, the amplifier can always be in a gain linear state within the rated power range. At the same time, the present invention does not need to reduce power to ensure the efficiency of the amplifier. For high-power amplifiers, a large number of amplifier chips can be saved. , plays the role of reducing cost, and at the same time, the present invention adds frequency discrimination technology to detect the frequency information of the input radio frequency signal. For ultra-wideband amplifiers, it can solve the problem of poor consistency due to too wide frequency range. Adjusting the attenuation accordingly can ensure the gain linearity of the UWB amplifier in the entire frequency band.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore do not It should be regarded as a limitation of the scope. For those of ordinary skill in the art, other related drawings can also be obtained from these drawings without creative efforts, wherein:

Fig. 1 is the principle block diagram of the present invention;

Fig. 2 is the program flow chart of the one-chip computer control module of the present invention;

3 is a schematic diagram of the power division structure formed by the dielectric plate and the microstrip line of the two-way power division module of the present invention;

4 is a schematic structural diagram of an ESC attenuation module of the present invention;

Marked in the figure: 100-dielectric board, 101-two-way microstrip line, 102-isolation resistor, 200-metal cavity, 201-PCB board, 202-ESC attenuation chip.

Detailed ways

In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention, that is, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. The components of the embodiments of the invention generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations.

Thus, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present invention.

It should be noted that relational terms such as the terms "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any relationship between these entities or operations. any such actual relationship or sequence exists. Moreover, the terms "comprising", "comprising" or any other variation thereof are intended to encompass non-exclusive inclusion such that a process, method, article or device comprising a list of elements includes not only those elements, but also includes not explicitly listed or other elements inherent to such a process, method, article or apparatus. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in a process, method, article or apparatus that includes the element.

Example 1

As shown in FIG. 1 , the 6GHz-18GHz ultra-wideband solid-state power amplifier intelligent frequency discrimination linearizer provided by the preferred embodiment of the present invention includes two-way power division modules, frequency division modules, detection modules, ESC attenuation modules and single-chip control modules. The two-way power division module is used to obtain the radio frequency signal and transmit the radio frequency signal to the frequency division module and the detection module respectively. The frequency division module reduces the frequency of the radio frequency signal by a certain multiple and transmits it to the single-chip control module. The single-chip control module receives the radio frequency signal and detects the frequency information of the signal. The detection module is used to transmit the radio frequency signal to the ESC attenuation module, and the power information of the detected radio frequency signal is transmitted to the single-chip control module, and the single-chip control module passes the radio frequency signal. The frequency information and power information of the ESC output the corresponding ESC voltage to the ESC attenuation module, and the ESC attenuation module receives the ESC voltage and releases the radio frequency signal according to the preset attenuation amount.

The working principle of the present invention is as follows: the radio frequency signals sent by the signal source are acquired through two power division modules, and the two power division modules transmit the acquired radio frequency signals to the frequency division module and the detection module respectively, and the frequency division module divides the radio frequency signals according to The frequency reduction processing is performed by a certain multiple so that the single-chip control module can receive the frequency-reduced radio frequency signal. The detection module receives the radio frequency signal to detect the power information of the radio frequency signal and converts it into a voltage signal and transmits it to the single-chip control module. At the same time, the wave building module Transmit the received RF signal to the ESC attenuation module. As shown in Figure 2, the single-chip control module receives the radio frequency signal transmitted by the frequency division module for processing, collects the frequency information of the radio frequency signal, and queries the corresponding relationship table obtained by the pre-test according to the frequency information and power information of the radio frequency signal to calculate the attenuation release amount. The obtained attenuation release amount is converted into a voltage regulation voltage through the DAC and transmitted to the ESC attenuation module. The ESC attenuation module is used to adjust the gain of the amplifier. The ESC attenuation module will set a certain amount of attenuation in advance. When the amplifier itself works in the linear region, the attenuation will not be released. As the input signal increases, the amplifier begins to enter the saturation compression region. When the ESC attenuation module is controlled by the microcontroller to release the attenuation and compensate the gain compression, so that the power amplifier can always work in the gain linear region.

Example 2

On the basis of Embodiment 1, a specific implementation method is provided, a 6GHz-18GHz ultra-wideband solid-state power amplifier intelligent frequency discrimination linearizer, as shown in FIG. 3 , the two-way power division module includes a first metal cavity , a dielectric board 100, two microstrip lines 101 and two isolation resistors 102, the two microstrip lines 101 are printed on the dielectric board 100 by circuit printing technology, and the dielectric board 100 is sintered in the first metal cavity Physically, one end of the two microstrip lines 101 is used as a radio frequency input port, and the other end is used as two radio frequency output ports. The material of the dielectric board 100 is Rogers 5880, the thickness of the circuit board formed by the dielectric board 100 and the two-way microstrip line 101 is 0.254 mm, and the sintered part needs to be plated with gold.

Wherein, the frequency division module includes the first-level frequency division by 2 times, the second-level frequency division by 8 times, and the third-level frequency division by 8 times, and the first-level frequency division by 2 times and the second-level frequency division by 2 times. Gold wire bonding is used for connection between 8 times through a microstrip line, and gold wire bonding is used between the second-level frequency division by 8 times and the third-level frequency division by 8 times through a microstrip line.

In addition, the detector module is sintered in the cavity by using the detector die, and the radio frequency input and output pads on the detector die and the microstrip line are connected by gold wire bonding by using micro-assembly. The cavity is machined from aluminum, and the detector chips, microstrip lines and the sintered parts of the cavity need to be gold-plated.

Specifically, as shown in FIG. 4 , the ESC attenuation module includes a second metal cavity 200 , a PCB board 201 and an ESC attenuation chip 202 , and the PCB is arranged in the second metal cavity 200 . The radio frequency input and output ports of the attenuation chip 202 are connected to the microstrip line on the PCB by using a gold wire through micro-assembly. The second metal cavity 200 is machined from an aluminum material, and the sintered parts of the ESC attenuation chip 202 , the microstrip line and the second metal cavity 200 need to be plated with gold.

Preferably, the single-chip microcomputer control module adopts STM32 single-chip microcomputer chip.

During implementation, the Wilkinson equalization technology is used inside the two-way centimeter module, and two isolation resistors 102 are used for isolation between the two-way microstrip lines 101 after separation, one with a resistance of 90 ohms and the other with a resistance of 180 ohms. The single-chip control module adopts STM32 single-chip microcomputer chip. The first-stage frequency division is 2 times, the second-stage frequency division is 8 times, and the third-stage frequency division is 8 times. The total frequency division is 128 times, so that 18GHz is about 140MHz after frequency division. The frequency discrimination range of the STM32 microcontroller chip is from 0 to 180MHz, so the frequency of the signal after frequency division can be detected by the STM32 microcontroller chip module.

In addition, the power supply of each module and the transmission of voltage signals between modules need to be filtered, otherwise the acquisition will be unstable and power jitter will occur. Distribute 10nF, 100nF, 1uF, 10uF capacitors in order from small to large on the respective power supply boards near the power supply pins for filtering.

The above are only preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Any modifications, equivalent replacements and improvements made by any person skilled in the art within the spirit and principles of the present invention, etc. , should be included within the protection scope of the present invention.

Claims (6)

The 1.6GHz-18GHz ultra-wideband solid-state power amplifier intelligent frequency discrimination linearizer is characterized in that it includes two-way power division modules, frequency division modules, detection modules, ESC attenuation modules and single-chip control modules, and the two-way power division modules are used for In order to obtain the radio frequency signal and transmit the radio frequency signal to the frequency division module and the detection module respectively, the frequency division module reduces the frequency of the radio frequency signal by a certain multiple and transmits it to the single-chip control module, and the single-chip control module receives the radio frequency signal and detects the signal. The detection module is used to transmit the radio frequency signal to the ESC attenuation module, and the power information of the detected radio frequency signal is transmitted to the single-chip control module, and the single-chip control module outputs the corresponding frequency information and power information through the radio frequency signal. The ESC voltage is sent to the ESC attenuation module, and the ESC attenuation module receives the ESC voltage and releases the radio frequency signal correspondingly according to the preset attenuation amount. 2. The 6GHz-18GHz ultra-wideband solid-state power amplifier intelligent frequency discrimination linearizer according to claim 1, wherein the two-way power division module comprises a first metal cavity, a dielectric plate, two-way microstrip lines and Two isolation resistors, the two-way microstrip lines are printed on the dielectric board through circuit printing technology, and the dielectric board is sintered on the first metal cavity, one end of the two-way microstrip line is used as the radio frequency input port, and the other end is used as the radio frequency input port. As two radio frequency output ports, two ends of the two isolation resistors are respectively welded with two microstrip lines. 3. 6GHz-18GHz ultra-wideband solid-state power amplifier intelligent frequency discrimination linearizer according to claim 1, is characterized in that: described frequency dividing module comprises the first-level frequency division 2 times, the second-level frequency division 8 times that are set successively Times and the third level of frequency division are 8 times, the first level of frequency division of 2 times and the second level of frequency division of 8 times are connected by gold wire bonding through microstrip lines, and the second level of frequency division of 8 times and The third-level frequency division is 8 times by gold wire bonding connection through microstrip line. 4. The 6GHz-18GHz ultra-wideband solid-state power amplifier intelligent frequency discrimination linearizer according to claim 1, characterized in that: the detector module adopts a detector die to perform in-cavity sintering, and micro-assembly is used to sinter the detector on the detector die. The RF input and output pads and the microstrip line are connected by gold wire bonding. 5. The 6GHz-18GHz ultra-wideband solid-state power amplifier intelligent frequency discrimination linearizer according to claim 1, wherein the ESC attenuation module comprises a second metal cavity, a PCB board and an ESC attenuation chip, and the ESC attenuation module The PCB is sintered in the second metal cavity, and the radio frequency input and output ports of the ESC attenuator chip are connected to the microstrip line on the PCB by using a gold wire through micro-assembly. 6 . The 6GHz-18GHz ultra-wideband solid-state power amplifier intelligent frequency discrimination linearizer according to claim 1 , wherein the single-chip microcomputer control module adopts an STM32 single-chip microcomputer chip. 7 .

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