CN210202180U - PCB and electronic equipment - Google Patents
PCB and electronic equipment Download PDFInfo
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- CN210202180U CN210202180U CN201920447848.7U CN201920447848U CN210202180U CN 210202180 U CN210202180 U CN 210202180U CN 201920447848 U CN201920447848 U CN 201920447848U CN 210202180 U CN210202180 U CN 210202180U
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- pad
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- disc
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Abstract
The utility model provides a PCB board and electronic equipment, a serial communication port, including plate body and patch element's pad structure, wherein, patch element's pad structure includes: the device comprises a first bonding pad, a second bonding pad, a first sampling disc and a second sampling disc; the first pad reaches the second pad set up in on the plate body, first sampling dish set up in first pad below, the second sampling dish sets up in second pad below, first pad the second pad first sampling dish reaches no electrical connection between the second sampling dish. Based on the utility model discloses, through being transformed into 4pin pad encapsulation with 2pin pad encapsulation, set to two main pads and two sampling dishes, two main pads are used for connecting power return circuit, and two sampling dishes are used for connecting and enlarge the return circuit, and when chip resistor set up in this 4pin pad structural time, can effectively reduce the soldering tin resistance to the influence of precision at amplifier circuit, simultaneously, guarantee power return circuit's current-carrying capacity.
Description
Technical Field
The utility model relates to an electron field, in particular to PCB board and electronic equipment.
Background
In the manufacturing process of electronic products, the design of a PCB (Printed Circuit Board) and the assembly of electronic components are two important links, which are directly related to the performance of the products. In the design of the PCB, pads corresponding to each component are required to be disposed on the PCB according to a pre-drawn circuit schematic diagram, so that each component is subsequently soldered to the corresponding pad to complete the assembly.
Most types of two-pin chip resistors are on the market; because the resistance can not guarantee that welding impedance is consistent when the paster, when welding impedance account for sampling resistance value proportion is great, welding impedance is not negligible and the result influence to the operational amplifier output is very big.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a PCB board and electronic equipment can effectively reduce the soldering tin resistance and to the influence of precision at amplifier circuit, simultaneously, guarantees the current-carrying capacity of power return circuit.
The utility model provides a PCB board, including plate body and patch element's pad structure, wherein, patch element's pad structure includes: the device comprises a first bonding pad, a second bonding pad, a first sampling disc and a second sampling disc;
the first pad reaches the second pad set up in on the plate body, first sampling dish set up in first pad below, the second sampling dish sets up in second pad below, first pad the second pad first sampling dish reaches no electrical connection between the second sampling dish.
Preferably, the first pad, the second pad, the first sampling disk and the second sampling disk are all rectangular.
Preferably, the first pad and the second pad have the same area, and the first sampling disk and the second sampling disk have the same area.
Preferably, the area of the first pad is larger than that of the first sampling disk, and the area of the second pad is larger than that of the second sampling disk.
Preferably, first pad with parallel and level setting about the second pad, first sampling dish with parallel and level setting about the first pad, second sampling dish with parallel and level setting about the second pad.
Preferably, the first pad with be equipped with white oil on the first sampling dish and keep apart, the second pad with be equipped with white oil on the second sampling dish and keep apart.
Preferably, the method further comprises the following steps: and one end of the first bonding pad and one end of the second bonding pad are respectively connected with the power loop.
Preferably, the method further comprises the following steps: and one end of the first sampling disc and one end of the second sampling disc are respectively connected with the amplifying circuit.
A second embodiment of the present invention provides an electronic device, including a PCB board as described above.
Based on the utility model discloses a PCB board and electronic equipment is transformed into 4pin pad encapsulation through encapsulating 2pin pad, sets to two main pads and two sampling dishes, and two main pads are used for connecting the power return circuit, and two sampling dishes are used for connecting the enlarged return circuit, and when chip resistor set up structural in this 4pin pad, can effectively reduce the soldering tin resistance to the influence of amplifier circuit to the precision, simultaneously, guarantees the current-carrying capacity in power return circuit.
Drawings
Fig. 1 is a schematic diagram of a pad structure of the present invention;
fig. 2 is an equivalent circuit schematic diagram of the present invention.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings.
The utility model discloses a PCB board and electronic equipment is transformed into 4pin pad encapsulation through encapsulating 2pin pad, sets to two main pads and two sampling dishes, and two main pads are used for connecting power return circuits, and two sampling dishes are used for connecting the enlarged return circuit, and when chip resistor set up in this 4pin pad structural time, can effectively reduce the soldering tin resistance to the influence of precision at amplifier circuit, simultaneously, guarantee power return circuit's current-carrying capacity.
Referring to fig. 1, a first embodiment of the present invention provides a PCB board, including a board body and a pad structure of a patch element, wherein the pad structure of the patch element includes: the device comprises a first bonding pad 1, a second bonding pad 2, a first sampling disc 3 and a second sampling disc 4;
Referring to fig. 2, in the equivalent circuit of the patch sampling resistor, R '1 and R' 2 are welding impedances from the device pad to two ends of the resistor, and the impedances are uncertain; r '4 and R' 5 are impedances from two ends of the resistor to the input end of the operational amplifier; r1 and R2 are lead resistances at two ends of the sampling resistor, and R0 is a body resistance of the sampling resistor.
When the existing 2pin pad structure is adopted for connection, a voltage sampling point is on a PCB pad and is equivalent to a node ② in fig. 2, and when R0+ R1+ R2 cannot be far larger than R '1 + R' 2, welding impedance cannot be ignored, and the problem of inaccurate sampling exists when the scheme is continuously adopted.
VOUT ═ a × I (R0+ R1+ R2+ R '1 + R' 2), and the sampling error Δ V ═ a × I (R '1 + R' 2), the larger the operational amplifier gain a and the loop current I are, the further the conventional connection error is amplified, and the accuracy of sampling is greatly reduced.
When the 4pin pad structure connection method is adopted, the sampling point is equivalent to a node ① in fig. 2, and the welding resistances R '4 and R' 5 are far smaller than (R0+ R1+ R2), so that the welding resistance can be ignored, at the moment, the operational amplifier output VOUT is A I (R0+ R1+ R2), compared with the existing 2pin pad structure connection method, the sampling accuracy is greatly improved, and the method plays an important role in precise control.
Preferably, the first pad 1, the second pad 2, the first sampling disk 3 and the second sampling disk 4 are all rectangular.
Wherein, set up to the subsides of the paster components and parts (like chip resistor) of being convenient for the rectangle structure, and guarantee and the paster components and parts contact area within a definite time, of course, the shape of pad and sampling dish also can be the fillet rectangle, does not do specifically to restrict here, and the rectangle is a preferred scheme, and other similar structures are all in the utility model discloses a protection scope.
Preferably, the first pad 1 and the second pad 2 have the same area, and the first sampling disk 3 and the second sampling disk 4 have the same area.
The areas of the bonding pad and the sampling disc can be adjusted according to the current-carrying condition, so that the current-carrying capacity and the welding strength are both considered. For example: when the current is larger, the proportion of the first bonding pad 1 to the second bonding pad 2 can be adjusted to be larger, the proportion of the first sampling disc 3 to the second sampling disc 4 can be adjusted to be smaller, and the sum of the areas of the first sampling disc and the second sampling disc remains unchanged.
Preferably, the area of the first pad 1 is larger than the area of the first sampling disc 3 and the area of the second pad 2 is larger than the area of the second sampling disc 4.
Wherein, chip resistor sets up this pad structurally, and the area of pad is greater than the area of sampling dish, because first, second pad is used for linking to each other with power return circuit, needs great current-carrying capacity, then the great that the pad area set up, first, second sampling dish is used for linking to each other with the circuit of enlargiing, and when the sampling dish area was great, soldering tin impedance on the sampling dish was also great relatively, and through enlargiing the back in the circuit of enlargiing, then sampling components and parts (like sampling resistor) on the sampling dish will lose its accuracy of sampling.
Preferably, first pad 1 with second pad 2 is parallel and level from top to bottom set up, first sampling dish 3 with first pad 1 is parallel and level setting about, second sampling dish 4 with second pad 2 is parallel and level setting about.
Preferably, the first pad 1 is isolated from the first sampling disc 3 by white oil, and the second pad 2 is isolated from the second sampling disc 4 by white oil.
Wherein, adopt white oil to keep apart and can effectively avoid the contact between the pad, avoid having electrical connection between pad and the sampling dish, and make to have the inaccurate condition of sampling after sampling components and parts such as sampling resistance carry out the fortune and put.
Preferably, the method further comprises the following steps: and one end of the first bonding pad 1 and one end of the second bonding pad 2 are respectively connected with the power loop.
Preferably, the method further comprises the following steps: and one end of the first sampling disc 3 and one end of the second sampling disc 4 are respectively connected with the amplifying circuit.
A second embodiment of the present invention provides an electronic device, including a PCB board as described above.
Based on the utility model discloses an electronic equipment is through being transformed into 4pin pad encapsulation with 2pin pad encapsulation, sets to two main pads and two sampling dishes, and two main pads are used for connecting power return circuits, and two sampling dishes are used for connecting and enlarge the return circuit, and when chip resistor set up in this 4pin pad structural time, can effectively reduce the soldering tin resistance to the influence of precision at amplifier circuit, simultaneously, guarantee power return circuit's current-carrying capacity.
Above only the utility model discloses an it is preferred embodiment, the utility model discloses a scope of protection not only limits in above-mentioned embodiment, and the all belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection.
Claims (9)
1. The PCB board is characterized by comprising a board body and a pad structure of a patch element, wherein the pad structure of the patch element comprises: the device comprises a first bonding pad, a second bonding pad, a first sampling disc and a second sampling disc;
the first pad reaches the second pad set up in on the plate body, first sampling dish set up in first pad below, the second sampling dish sets up in second pad below, first pad the second pad first sampling dish reaches no electrical connection between the second sampling dish.
2. A PCB board according to claim 1, wherein: the first bonding pad, the second bonding pad, the first sampling disc and the second sampling disc are all rectangular.
3. A PCB board according to claim 1, wherein: the first pad and the second pad have the same area, and the first sampling disc and the second sampling disc have the same area.
4. A PCB board according to claim 3, wherein: the area of the first pad is larger than that of the first sampling disc, and the area of the second pad is larger than that of the second sampling disc.
5. A PCB board according to claim 1, wherein: first pad with parallel and level setting about the second pad, first sampling dish with parallel and level setting about the first pad, second sampling dish with parallel and level setting about the second pad.
6. A PCB board according to claim 1, wherein: the first pad with be equipped with the white oil on the first sampling dish and keep apart, the second pad with be equipped with the white oil on the second sampling dish and keep apart.
7. A PCB board according to claim 1, wherein: further comprising: and one end of the first bonding pad and one end of the second bonding pad are respectively connected with the power loop.
8. A PCB board according to claim 1, wherein: further comprising: and one end of the first sampling disc and one end of the second sampling disc are respectively connected with the amplifying circuit.
9. An electronic device, comprising: a PCB board as claimed in any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920447848.7U CN210202180U (en) | 2019-04-03 | 2019-04-03 | PCB and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920447848.7U CN210202180U (en) | 2019-04-03 | 2019-04-03 | PCB and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210202180U true CN210202180U (en) | 2020-03-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920447848.7U Active CN210202180U (en) | 2019-04-03 | 2019-04-03 | PCB and electronic equipment |
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| CN (1) | CN210202180U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115529724A (en) * | 2022-03-28 | 2022-12-27 | 荣耀终端有限公司 | Circuit board structure, chip system and electronic equipment |
-
2019
- 2019-04-03 CN CN201920447848.7U patent/CN210202180U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115529724A (en) * | 2022-03-28 | 2022-12-27 | 荣耀终端有限公司 | Circuit board structure, chip system and electronic equipment |
| CN115529724B (en) * | 2022-03-28 | 2023-08-08 | 荣耀终端有限公司 | Circuit board structure, chip system and electronic equipment |
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