CN218827094U - System-level constant current source device packaging structure - Google Patents
System-level constant current source device packaging structure Download PDFInfo
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- CN218827094U CN218827094U CN202222615530.XU CN202222615530U CN218827094U CN 218827094 U CN218827094 U CN 218827094U CN 202222615530 U CN202222615530 U CN 202222615530U CN 218827094 U CN218827094 U CN 218827094U
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Abstract
A system-level constant current source device packaging structure: the integrated circuit comprises an integrated circuit lead frame, a CPU chip U1, a voltage reference chip U2, a resistor R1, a diode chip D1, a triode chip Q1/Q2 and a metal connecting lead, wherein the metal connecting lead and the triode chip Q1/Q2 are respectively arranged in a plastic package of an SOP device through layout, so that the size of a circuit board can be effectively saved, the design is greatly simplified, the integration level is high, the cost is low, and the performance is stable.
Description
Technical Field
The technology relates to the fields of electronics, internet of things, illumination, intelligent control and the like, in particular to a system-level constant current source device packaging structure.
Background
In traditional voltage control field, need use continuously adjustable control voltage, need the electric current invariant simultaneously, satisfy different load needs, but the constant current characteristic of maintenance that general circuit can not be fine simultaneously receives the interference of load easily, and the area load ability is relatively poor, owing to adopt the separator, and is bulky, and processing cost is higher, and the batch uniformity is relatively poor, is difficult for the design.
Disclosure of Invention
Therefore, the invention combines the characteristics of the mirror image constant current source with the characteristics of the lead wire bracket of the integrated circuit and the characteristics of the packaging size of the chip such as a resistor, a triode, a voltage reference, an operational amplifier and the like, adopts a brand-new bracket circuit board process, and adopts a process technology of plastically packaging the traditional mirror image constant current source and peripheral devices thereof in the integrated circuit device to manufacture a brand-new system-level constant current source device.
The utility model discloses the physical structure chart is seen in figure 1 (a system level constant current source device packaging structure sketch map), and encapsulation flow chart is seen in figure 2 (a system level constant current source device packaging flow chart), and the application schematic diagram is seen in figure 3 (a system level constant current source device application circuit schematic diagram), and the material integrated circuit lead frame that involves is seen in figure 4 (SOP 8 lead frame picture), the utility model relates to a specific integrated circuit lead frame, CPU chip U1, voltage reference chip U2, resistance R1, diode chip D1, triode chip Q1Q 2, metal connection lead wire, plastic-sealed body, through certain arrangement overall arrangement, then carry out the component welding, the solid brilliant bonding wire of semiconductor chip, technologies such as mould pressing, cutting shaping, test finally form a brand-new system level constant current source device.
Further described is: a system-level constant current source device packaging structure includes: the circuit comprises an integrated circuit lead frame, a CPU chip U1, a voltage reference chip U2, a resistor R1, a diode chip D1, a triode chip Q2, a metal connecting lead and a plastic package body; the resistor R1 is connected to pins 2 and 3 of an integrated circuit lead frame in a welding mode, the cathode of the diode chip D1 is welded to pin 7 of the integrated circuit lead frame, the anode of the diode chip D1 is connected to pin 8 of the integrated circuit lead frame through a metal lead, the collector of the triode chip Q1 is welded to pin 8 of the integrated circuit lead frame, the emitter of the Q1 is connected to pin 1 of the integrated circuit lead frame through a metal lead, the base of the Q1 is connected to the middle base island 107 of the integrated circuit lead frame through a metal lead, the collector of the triode chip Q2 is welded to the middle base island 107 of the integrated circuit lead frame, the emitter of the Q2 is connected to pin 5 of the integrated circuit lead frame through a metal lead, the base of the Q2 is connected to the middle base island 107 of the integrated circuit lead frame through a metal lead, the voltage reference chip U2 is bonded to the base island 107 of the lead frame, the KR electrode of the voltage reference chip U2 is connected to pin 4 of the lead frame through a metal connecting lead, and the A electrode of the 5 of the lead frame through a metal connecting lead; the pin 8 of the CPU chip U1 is connected to the pin 4 of the lead frame through metal, the pins 2 and 3 of the CPU chip U1 are respectively connected to the pin 6 of the lead frame through metal, and the pin 1 of the CPU chip U1 is connected to the pin 7 of the lead frame through metal; the plastic package body is used for plastic packaging all the components except the exposed parts of the lead-out pins of the integrated circuit lead frame.
The system-level constant current source device is characterized in that: the typical circuit has the functional characteristics that when the circuit load is an adjustable potentiometer, a continuously adjustable voltage value can be output, the current is always kept unchanged, the typical constant current characteristic is a constant current effect of 100uA, the constant current value can be set through a peripheral device to meet different requirements, the continuously adjustable voltage is continuously adjustable within a certain range lower than the power supply voltage of the device, a certain interval range can also be set to be adjustable, and the built-in operational amplifier following circuit can provide the load carrying capacity of more than 20 mA.
The integrated circuit lead frame is characterized in that: typical integrated circuit lead frames are: SOP8, DIP8, etc. or an integrated circuit lead frame structure having a function of a printed wiring board or a printed wiring board having a lead frame structure; the lead pins of the integrated circuit lead frame have the functions of bearing and welding electronic components, and the base island of the integrated circuit lead frame has the functions of bonding wires and placing electrodes of electronic components besides chip binding.
The size between the lead pins of the integrated circuit lead frame or between the lead pins and the base islands of the integrated circuit lead frame can bear the placement of elements such as chips, passive devices and the like required by the system, the control CPU chip is an integrated operational amplifier chip or other control chips with similar functions, the voltage reference chip U2 can be a voltage reference or a voltage stabilizing diode, a resistance element and a triode, and the position of the voltage reference chip U2 can be internally provided with a fixed position according to the requirement.
The related chips and electronic components are welded or bonded and fixed with the pin terminals or the base islands of the integrated circuit lead frame through solder paste or other conductive adhesives.
Drawings
Fig. 1 is a schematic diagram of a system-level constant current source device package structure according to the present application.
Fig. 2 is a flowchart of a system-level constant current source device package according to the present application.
Fig. 3 is a schematic diagram of an applied circuit of a system-level constant current source according to the present application.
Fig. 4 is a diagram of an SOP8 lead frame according to an embodiment of the present application.
Detailed description of the preferred embodiments
The case selects typical integrated circuit lead frames such as: the SOP8 may fully meet the device placement requirements required by the present invention, the device package structure comprising: the device comprises an SOP8 integrated circuit lead frame 105, a CPU chip U1 (104), a voltage reference chip U2, a resistor R1 (101), a diode chip D1, a triode chip Q1/Q2, a metal connecting lead 103 and a plastic package body 106; the resistor R1 is connected to pins 2 and 3 of an SOP8 integrated circuit lead frame in a welding mode, the cathode of the diode chip D1 is connected to pins 7 of the SOP8 integrated circuit lead frame in a welding mode, the anode of the diode chip D1 is connected to pins 8 of the SOP8 integrated circuit lead frame in a welding mode through a metal lead, the collector of the triode chip Q1 is connected to pins 8 of the SOP8 integrated circuit lead frame in a welding mode, the emitter of Q1 is connected to pins 1 of the integrated circuit lead frame in a welding mode through a metal lead, the base of Q1 is connected to the middle base island 107 of the SOP8 integrated circuit lead frame in a welding mode through a metal lead, the collector of the triode chip Q2 is connected to the middle base island 107 of the SOP8 integrated circuit lead frame in a welding mode, the emitter of Q2 is connected to pins 5 of the SOP8 integrated circuit lead frame in a welding mode, the base of Q2 is connected to the middle base island 107 of the SOP8 integrated circuit lead frame in a welding mode through a metal lead, the KR pole of the base is connected to pins 4 of the lead frame in a welding mode; the pin 8 of the CPU chip U1 is connected to the pin 4 of the lead frame through metal, the pins 2 and 3 of the CPU chip U1 are respectively connected to the pin 6 of the lead frame through metal, and the pin 1 of the CPU chip U1 is connected to the pin 7 of the lead frame through metal; the plastic package body is used for plastic packaging all the components except the exposed parts of the lead-out pins of the integrated circuit lead frame.
When the circuit load is an adjustable potentiometer (typically 100K potentiometer), a continuously adjustable voltage value (0-10V output) can be output, the current is always kept constant (100 uA) constant current effect, the output range can be adjusted by setting the resistor R1, R1 is set when the power supply voltage is 24V, the 100K potentiometer can be adjusted to enable the output voltage to be continuously adjustable in the range of 0-20V, the built-in operational amplifier follower circuit can provide the load capacity above 20mA, other control signals such as 0-10V signals can be accessed when the input end is not connected with the potentiometer for use, the circuits are not interfered with each other due to the effect of an internal diode, the characteristics of high-impedance input and low-load output can be achieved due to the emitter following effect of the internal operational amplifier, and the load and anti-interference capacity of the circuit are ensured.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or modifications within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (1)
1. The utility model provides a system level constant current source device packaging structure which characterized in that: the constant current source device packaging structure includes: the circuit comprises an integrated circuit lead frame, a CPU chip U1, a voltage reference chip U2, a resistor R1, a diode chip D1, a triode chip Q1/Q2, a metal connecting lead and a plastic package body; the resistor R1 is connected to pins 2 and 3 of an integrated circuit lead frame in a welding mode, the cathode of the diode chip D1 is welded to pin 7 of the integrated circuit lead frame, the anode of the diode chip D1 is connected to pin 8 of the integrated circuit lead frame through a metal lead, the collector of the triode chip Q1 is welded to pin 8 of the integrated circuit lead frame, the emitter of the Q1 is connected to pin 1 of the integrated circuit lead frame through a metal lead, the base of the Q1 is connected to the middle base island 107 of the integrated circuit lead frame through a metal lead, the collector of the triode chip Q2 is welded to the middle base island 107 of the integrated circuit lead frame, the emitter of the Q2 is connected to pin 5 of the integrated circuit lead frame through a metal lead, the base of the Q2 is connected to the middle base island 107 of the integrated circuit lead frame through a metal lead, the reference device U2 is adhered to the base island 107 of the lead frame, the KR electrode of the reference device U2 is connected to pin 4 of the lead frame through a metal connecting lead, and the A electrode of the pin A is connected to pin 5 of the lead frame through a metal connecting lead; the 8 pins of the CPU chip U1 are connected to the 4 pins of the lead frame through metals, the 2 pins and the 3 pins of the CPU chip U1 are respectively connected to the 6 pins of the lead frame through metals, and the 1 pin of the CPU chip U1 is connected to the 7 pins of the lead frame through metals; the plastic package body is used for plastic packaging all the components except the exposed parts of the lead-out pins of the integrated circuit lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222615530.XU CN218827094U (en) | 2022-10-02 | 2022-10-02 | System-level constant current source device packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222615530.XU CN218827094U (en) | 2022-10-02 | 2022-10-02 | System-level constant current source device packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218827094U true CN218827094U (en) | 2023-04-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202222615530.XU Active CN218827094U (en) | 2022-10-02 | 2022-10-02 | System-level constant current source device packaging structure |
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| CN (1) | CN218827094U (en) |
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2022
- 2022-10-02 CN CN202222615530.XU patent/CN218827094U/en active Active
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