CN111366268A - Low-cost multichannel semiconductor absorption type temperature measurement system and sensing probe preparation process - Google Patents
Low-cost multichannel semiconductor absorption type temperature measurement system and sensing probe preparation process Download PDFInfo
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- CN111366268A CN111366268A CN202010317671.6A CN202010317671A CN111366268A CN 111366268 A CN111366268 A CN 111366268A CN 202010317671 A CN202010317671 A CN 202010317671A CN 111366268 A CN111366268 A CN 111366268A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
- G01K11/32—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in transmittance, scattering or luminescence in optical fibres
- G01K11/3206—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in transmittance, scattering or luminescence in optical fibres at discrete locations in the fibre, e.g. using Bragg scattering
Abstract
The invention belongs to the field of optical fiber temperature measurement, relates to a low-cost multichannel semiconductor absorption type temperature measurement system and a sensing probe preparation process, and solves the problems of high cost, small temperature measurement range, short service life of a light source and the like of the traditional semiconductor absorption type temperature measurement system; the light source module comprises n halogen tungsten lamp light sources; the optical fiber coupling module is used for respectively coupling the n paths of optical signals output by the light source module to the corresponding temperature measurement modules; the temperature measurement module is used for collecting optical signals absorbed by an environment to be measured, and the spectrum light splitting module is used for converting the optical signals output by each path of temperature measurement module into corresponding absorption spectrum curves; the control circuit board is used for controlling the on-off of each path of halogen tungsten lamp light source according to a set time sequence and synchronously acquiring an absorption spectrum curve corresponding to each path of halogen tungsten lamp light source according to the on-off time sequence of each path of halogen tungsten lamp light source. Compared with the prior art, the temperature measuring device has lower cost and can realize a larger temperature measuring range.
Description
Technical Field
The invention belongs to the field of optical fiber temperature measurement, and particularly relates to a low-cost multichannel semiconductor absorption type temperature measurement system and a sensing probe manufacturing process.
Background
In a transformer winding temperature measuring device in the power industry, the optical fiber temperature measuring device gradually replaces the traditional platinum resistance type temperature measuring device with the unique advantages of high precision, strong anti-interference capability, small installation size and the like. The optical fiber temperature measurement is divided into two types of fluorescence optical fiber temperature measurement and semiconductor spectral absorption temperature measurement in principle, the former is widely applied, but due to the limitation of fluorescent materials and the principle of self intensity demodulation, the temperature measurement system cannot make a major breakthrough in the aspects of temperature measurement range, consistency among channels and interchangeability. The semiconductor spectrum absorption type temperature measuring system can well make up for the defects due to the specific temperature measuring principle, but related products on the market at present have the following problems and are difficult to meet the increasing market demand:
(1) because the absorption spectrum of semiconductor gallium arsenide at normal temperature is in the near-infrared spectrum band, a light emitting diode (LED/LD) with the central wavelength in the near-infrared spectrum band is usually selected by the traditional semiconductor temperature measuring system, but the laser tube in the spectrum band is usually higher in price. In addition, the temperature measurement range is proportional to the spectrum band of the light source, i.e. the wider the spectral range of the light source, the larger the temperature measurement range. However, the spectral range of the LED is usually small, the LED spectrum range is usually tens of nanometers, and the LD is less than ten nanometers.
(2) The semiconductor spectrum absorption type optical fiber sensing temperature measurement is analyzed in a working mode, light emitted by a light source reaches a sensing probe through optical fiber transmission, an absorbed spectrum signal returns in a primary path, and the spectrum signal reaches a detector through another optical fiber.
(3) The traditional light splitting module mostly adopts a structure form that a collimation system and a focusing system are independent respectively, and mostly adopts a reflection type light path, so that the size is larger, the cost is higher, astigmatism is difficult to correct, and the spectral resolution is lower.
(4) The traditional semiconductor gallium arsenide probe is manufactured by only bonding a ground and cut wafer to the section of an optical fiber, and the adhesive layer is easy to discolor and damage after long-time high-temperature aging, so that the signal is weakened and the wafer falls off finally.
(5) In the traditional multi-path temperature measurement, a light switch is added in each branch, all light sources are always on, and the opening and closing of the light switch are controlled by a program. The disadvantage of this working mode is that the light source is always on, and the service life is shortened; in addition, the cost is increased by adding an optical switch device to each path.
Disclosure of Invention
In order to solve the problems of high cost, small temperature measurement range, short service life of a light source and the like of the traditional semiconductor absorption type temperature measurement system, the invention provides a low-cost multichannel semiconductor absorption type temperature measurement system.
The technical scheme of the invention is to provide a low-cost multichannel semiconductor absorption temperature measurement system, which is characterized in that: the device comprises a light source module, an optical fiber coupling module, a temperature measurement module, a spectrum light splitting module and a control circuit board;
the light source module comprises n halogen tungsten lamp light sources, and leads of the halogen tungsten lamp light sources are connected with the control circuit board through leads and corresponding connectors; wherein n is a positive integer greater than or equal to 1;
the optical fiber coupling module is used for respectively coupling the n paths of optical signals output by the light source module to the corresponding temperature measuring modules; the temperature measuring modules correspond to each optical signal one by one;
the temperature measurement module is used for collecting optical signals absorbed by an environment to be measured and comprises a first optical fiber, a second optical fiber, a third optical fiber and a sensing probe; the input end of the first optical fiber is coupled with the output end of the optical fiber coupling module; the output end of the first optical fiber and the input end of the third optical fiber are both coupled with the same end of the second optical fiber, and the other end of the second optical fiber is coupled with the sensing probe; the output end of the third optical fiber is the output end of the temperature measuring module; the output end of the temperature measuring module is coupled with the input end of the spectrum light splitting module;
the output end of the spectrum light splitting module is connected with the control circuit board;
the spectrum light splitting module is used for converting the optical signal output by each road temperature measuring module into a corresponding absorption spectrum curve; the control circuit board is used for controlling the on-off of each path of halogen tungsten lamp light source according to a set time sequence and synchronously acquiring an absorption spectrum curve corresponding to each path of halogen tungsten lamp light source according to the on-off time sequence of each path of halogen tungsten lamp light source.
Furthermore, in order to further reduce the cost and the volume, the spectrum light splitting module comprises an introduction optical fiber, a collimation-focusing system, a grating and a detector; the collimation-focusing system and the grating share the optical axis; the leading-in optical fiber is coupled with the output end of the third optical fiber;
the optical signals are led into the optical fibers, are uniformly distributed on the front surface of the collimation-focusing system in the form of a light cone, and are uniformly distributed on the receiving surface of the grating through the collimation-focusing system after being collimated; the light beam split and reflected by the grating is focused by the rear surface of the collimation-focusing system and reaches the image surface of the detector after penetrating through the collimation-focusing system.
Further, the collimating-focusing system is an achromatic cemented lens, which is formed by combining a convex lens and a concave lens.
Further, the lead-in optical fiber is a single optical fiber or a plurality of optical fibers arranged in a certain array manner.
Further, the grating is a blazed grating or a holographic grating; the inclination angle of the grating relative to the optical axis is 15 degrees; the grating ruling number is 600 line pairs/millimeter, and the reference wavelength lambda is 900 nm.
Further, the core diameters of the first optical fiber and the third optical fiber are equal, and the core diameter of the second optical fiber is twice the core diameter of the first optical fiber.
Furthermore, the optical fiber coupling module comprises n quartz glass sphere focusing mirrors, and each quartz glass sphere focusing mirror couples one path of optical signal to the corresponding temperature measurement module.
Furthermore, the sensing probe comprises a semiconductor gallium arsenide wafer and a reflecting substance; the semiconductor gallium arsenide wafer is bonded on the end face of the second optical fiber, and the light reflecting substance wraps the semiconductor gallium arsenide wafer and the second optical fiber head.
Furthermore, the semiconductor gallium arsenide wafer is a cuboid with the thickness of 100-200 um and the length and width of 300 × 300um, the incident surface is plated with a high-transmittance dielectric film, and the reflecting surface is plated with a high-reflectance dielectric film.
Further, the invention also provides a preparation process of the sensing probe, which comprises the following steps:
firstly, adhering a semiconductor gallium arsenide wafer to the end face of a second optical fiber by using high-temperature-resistant and non-discoloring glue, and slowly curing the semiconductor gallium arsenide wafer in an oven; after the oven is taken out, mixing another glue with high temperature resistance and strong bonding force with the reflective powder TiO2After being uniformly stirred according to a certain proportion, the coating is coated outside the wafer, the wafer and the second optical fiber head are integrally wrapped, the bonding firmness is mainly enhanced, and the reflective powder can play a role in increasing signal return energy.
Compared with the prior art, the invention has the following beneficial effects:
1. the cost of the light source is low, and a larger temperature measurement range can be realized;
the light source of the halogen tungsten lamp with low cost is selected as the light source, and the light energy is coupled into the temperature measuring module as much as possible by matching with the high-efficiency optical fiber coupling module. The light-emitting spectrum range of the halogen tungsten lamp is wider, and is generally hundreds of nanometers, so that a larger temperature measurement range can be realized on the system.
2. The parallel double optical fibers are adopted to replace the optical fiber coupler, so that the cost is greatly reduced;
two ends of a light source and a detector are arranged in parallel by adopting two 100-um core diameter optical fibers, a common end of a sensing probe adopts a 200-um core diameter optical fiber, and a joint is connected through a coaxial ceramic ferrule. The design is not only low in cost which is one dozen times of that of the optical fiber coupler, but also simple in manufacture.
3. The spectral light splitting module realizes small volume, low cost and high-efficiency adjustment;
the light splitting module adopts a self-focusing transmission type light path structure, so that the size of the module is greatly reduced, the imaging quality aberration of the system is small, and the resolution is high.
4. The packaging process of the semiconductor gallium arsenide probe is improved, high-temperature falling is prevented, outer-layer reflecting layer wrapping and high-temperature-resistant glue are added, the performance is more efficient, and the quality is more reliable.
In the invention, two processes are decomposed in order to give consideration to the light permeability and firmness of the joint surface of the wafer and the optical fiber. The wafer is firstly bonded to the section of the optical fiber by using high-temperature-resistant and non-discoloring glue, after solidification, the high-temperature-resistant and high-bonding-force glue is used for mixing reflective powder, and after the wafer and the optical fiber head are uniformly stirred according to a certain proportion, the wafer and the optical fiber head are integrally wrapped, so that the effect of enhancing a reflective signal is achieved, the bonding firmness of the wafer of the sensing probe is greatly increased, and the risk degree of falling of the wafer is reduced.
5. The multichannel temperature measurement system controls the light source to be on or off through circuit time sequence and synchronously controls the detector to collect, so that multichannel measurement is realized, the traditional optical switch is removed, and the cost is greatly reduced;
the invention controls the on and off of each path of light source in a time sequence manner and the synchronous acquisition of the detector through reasonable circuit design, thereby greatly prolonging the service life of the light source and well controlling the cost.
Drawings
FIG. 1 is a schematic diagram of a multi-channel semiconductor absorption thermometry system according to one embodiment of the present invention;
FIG. 2 is a schematic diagram of a sensing probe package structure;
FIG. 3 is a schematic structural diagram of a self-collimating spectral splitting module according to the present invention;
fig. 4 is a sectional view taken along line a-a of fig. 3.
The reference numbers in the figures are: 1-light source module, 2-optical fiber coupling module, 3-temperature measuring module, 31-first optical fiber, 32-second optical fiber, 33-third optical fiber, 34-sensing probe, 341-semiconductor gallium arsenide wafer, 342-reflecting material, 4-spectrum light splitting module, 41-leading-in optical fiber, 42-collimation-focusing system, 43-grating, 44-detector and 5-control circuit board.
Detailed Description
The invention is further described with reference to the following figures and specific embodiments.
As shown in fig. 1, the low-cost multichannel semiconductor absorption temperature measurement system of this embodiment mainly includes a light source module 1, an optical fiber coupling module 2, a temperature measurement module 3, a spectrum spectroscopy module 4, and a control circuit board 5.
The light source module 1 is composed of four independent micro-miniature low-power tungsten halogen lamps, the number of the tungsten halogen lamps can be adjusted according to requirements in other embodiments, and leads of the tungsten halogen lamps are connected to the control circuit board 5 through welding wires and connectors. The optical fiber coupling module 2 selects four quartz glass sphere focusing mirrors corresponding to the number of the halogen tungsten lamps, each quartz glass sphere focusing mirror corresponds to one halogen tungsten lamp, and optical signals output by the halogen tungsten lamps are coupled to the corresponding temperature measuring modules. The temperature measuring module 3 comprises a first optical fiber 31, a second optical fiber 32, a third optical fiber 33 and a sensing probe 34; the first optical fiber 31, the second optical fiber 32 and the third optical fiber 33 are all high-temperature resistant quartz multimode optical fibers coated with polyimide, the core diameters of the first optical fiber and the third optical fiber are equal, and the core diameter of the second optical fiber is twice of that of the first optical fiber. In this embodiment, the core diameters of the first optical fiber 31 and the third optical fiber 33 are 100um, and the core diameter of the second optical fiber 32 is 200 um.
The sensing probe 34 is shown in fig. 2, the core of which is a semiconductor gallium arsenide wafer 341 with a thickness of 100-200 um, both surfaces of which are ground and cut into a cuboid of 300 × 300um, and the incident surface is coated with a high-transmittance dielectric film and the reflective surface is coated with a high-reflectance dielectric film, the band of the film system is designed to be consistent with the light source, or the required working wavelength range is calculated according to the required temperature measuring range2The reflecting powder and the glue with high temperature resistance and strong bonding force are mixed according to a specific proportion and then are solidified according to a specific baking process. Therefore, the wafer bonding method has the advantages that the effect of enhancing the light reflection signals is achieved, the bonding firmness of the sensing probe wafer is greatly increased, and the risk degree of falling of the wafer is reduced.
Referring to fig. 1, an input end of a first optical fiber 31 is coupled to an output end of the fiber coupling module 2; after the halogen tungsten lamp is turned on, the optical signal is efficiently coupled into the first optical fiber 31 through the optical fiber coupling module 2. The output end of the first optical fiber 31 and the input end of the third optical fiber 33 are both coupled with the same end of the second optical fiber 32, and the other end of the second optical fiber 32 is coupled with the sensing probe; the output end of the third optical fiber 33 is the output end of the temperature measuring module; the output end of the temperature measuring module is coupled with the input end of the spectrum light splitting module; since the core diameter of the first optical fiber 31 is smaller than that of the second optical fiber 32, the collected original spectrum signal is transmitted to the sensing probe 34 through the second optical fiber 32. The sensing probe 34 is placed in a constant temperature system, and the absorption spectrum of the semiconductor material is unique and linear at a specific temperature, so that the purpose of measuring temperature is achieved. A part of the absorption spectrum signal returned by the sensing probe 34 is coupled into the third optical fiber 33 and guided into the spectrum splitting module 4 through the guide optical fiber 41.
The structure of the spectral splitting module 4 in this embodiment is as shown in fig. 3 and 4, and a self-focusing transmission type optical path structure is adopted, so that the volume of the module is greatly reduced, and the system has small imaging quality aberration and high resolution. Mainly comprises a lead-in optical fiber 41, a collimation-focusing system 42, a grating 43 and a detector 44, wherein the collimation-focusing system 42 and the grating 43 share an optical axis. The introduction optical fiber 41 introduces the absorption spectrum signal into the module, and the numerical aperture NA of the introduction optical fiber is 0.22. The light beam introduced through the introduction optical fiber 41 is uniformly distributed in the form of a light cone to the front surface of the collimating-focusing system 42 (the surface where the light beam first reaches is defined as the front surface, and the surface where the light beam later reaches is defined as the back surface), and is uniformly distributed on the receiving surface of the grating 43 through the collimating-focusing system 42 after being collimated. The lead-in optical fiber 41 may be a single optical fiber, or a plurality of optical fibers arranged in a certain array. The collimating-focusing system 42 replaces the collimating system and the focusing system of a general spectrometer with a set of optical system, in this embodiment, an achromatic cemented lens composed of a concave lens and a convex lens is selected, the volume of the module can be reduced to a large extent, and a light beam firstly reaches the front surface of the concave lens, is refracted by three surfaces of the collimating-focusing system 42, and then is converted into a collimated light beam to reach the reflecting surface of the grating 43. The grating 43 is a blazed grating or a holographic grating for splitting parallel light. In this embodiment, the tilt angle of the grating relative to the optical axis is 15 degrees, the grating ruling number is 600 line pairs/mm, the reference wavelength λ is 900nm, and the relevant parameters can be adjusted according to specific requirements in other embodiments. The light beam split and reflected by the grating 43 reversely passes through the rear surface of the collimating-focusing system 42, i.e., the light beam first reaches the rear surface of the convex lens, and is refracted by three surfaces of the collimating-focusing system 42 and then accurately focused on the image surface of the detector 44. The position of the detector is fixed after the optimal resolution is achieved by adjusting the front-back, up-down and inclination angles of the image plane of the detector 44.
The main functions of the control circuit board 5 include time-sequential light source driving, synchronous driving of the detector 44 for normal operation and data acquisition, real-time data processing and nixie tube temperature display. The functions shown in the overall framework design are all realized by adopting an integrated circuit design. The core MCU can flexibly select an FPGA chip, an ARM chip or a single chip microcomputer according to the requirement. When the temperature measuring device works, an absorption spectrum curve returned by the sensing probe 34 corresponding to each path is synchronously acquired according to the on-off time sequence of each path of light source, and the acquired digital signals are subjected to a series of data processing work such as filtering and the like, so that the real-time temperature measuring function is finally realized.
Claims (10)
1. A low-cost multichannel semiconductor absorption temperature measurement system is characterized in that: the device comprises a light source module, an optical fiber coupling module, a temperature measurement module, a spectrum light splitting module and a control circuit board;
the light source module comprises n halogen tungsten lamp light sources, and leads of the halogen tungsten lamp light sources are connected with the control circuit board through leads and corresponding connectors; wherein n is a positive integer greater than or equal to 1;
the optical fiber coupling module is used for respectively coupling the n paths of optical signals output by the light source module to the corresponding temperature measurement modules; the temperature measuring modules correspond to each optical signal one by one;
the temperature measurement module is used for collecting optical signals absorbed by an environment to be measured and comprises a first optical fiber, a second optical fiber, a third optical fiber and a sensing probe; the input end of the first optical fiber is coupled with the output end of the optical fiber coupling module; the output end of the first optical fiber and the input end of the third optical fiber are both coupled with the same end of the second optical fiber, and the other end of the second optical fiber is coupled with the sensing probe; the output end of the third optical fiber is the output end of the temperature measuring module; the output end of the temperature measuring module is coupled with the input end of the spectrum light splitting module;
the output end of the spectrum light splitting module is connected with the control circuit board;
the spectrum light splitting module is used for converting the optical signal output by each road temperature measuring module into a corresponding absorption spectrum curve; the control circuit board is used for controlling the on-off of each path of halogen tungsten lamp light source according to a set time sequence and synchronously acquiring an absorption spectrum curve corresponding to each path of halogen tungsten lamp light source according to the on-off time sequence of each path of halogen tungsten lamp light source.
2. The low-cost multi-channel semiconductor absorption thermometry system of claim 1, wherein: the spectrum light splitting module comprises a lead-in optical fiber, a collimation-focusing system, a grating and a detector; the collimation-focusing system and the grating share the optical axis; the leading-in optical fiber is coupled with the output end of the third optical fiber;
the optical signals are led into the optical fibers, are uniformly distributed on the front surface of the collimation-focusing system in the form of a light cone, and are uniformly distributed on the receiving surface of the grating through the collimation-focusing system after being collimated; the light beam split and reflected by the grating is focused by the rear surface of the collimation-focusing system and reaches the image surface of the detector after penetrating through the collimation-focusing system.
3. The low-cost multi-channel semiconductor absorption thermometry system of claim 2, wherein: the collimation-focusing system is an achromatic cemented lens and is formed by combining a convex lens and a concave lens.
4. The low-cost multi-channel semiconductor absorption thermometry system of claim 3, wherein: the leading-in optical fiber is a single optical fiber or a plurality of optical fibers arranged according to a certain array mode.
5. The low-cost multi-channel semiconductor absorption thermometry system of claim 4, wherein: the grating is a blazed grating or a holographic grating; the inclination angle of the grating relative to the optical axis is 15 degrees; the grating ruling number is 600 line pairs/millimeter, and the reference wavelength lambda is 900 nm.
6. The low-cost multi-channel semiconductor absorption thermometry system according to any one of claims 1-5, wherein: the core diameters of the first optical fiber and the third optical fiber are equal, and the core diameter of the second optical fiber is twice of that of the first optical fiber.
7. The low-cost multi-channel semiconductor absorption thermometry system of claim 6, wherein: the optical fiber coupling module comprises n quartz glass ball focusing mirrors, and each quartz glass ball focusing mirror couples one path of optical signal to the corresponding temperature measuring module.
8. The low-cost multi-channel semiconductor absorption thermometry system of claim 7, wherein: the sensing probe comprises a semiconductor gallium arsenide wafer and a reflecting substance; the semiconductor gallium arsenide wafer is bonded on the end face of the second optical fiber, and the light reflecting substance wraps the semiconductor gallium arsenide wafer and the second optical fiber head.
9. The low-cost multichannel semiconductor absorption temperature measurement system as claimed in claim 8, wherein the semiconductor GaAs wafer is a cuboid with a thickness of 100-200 um and a length and width of 300 × 300um, the incident surface is coated with a high-transmittance dielectric film, and the reflective surface is coated with a high-reflectance dielectric film.
10. A preparation process of a sensing probe is characterized by comprising the following steps:
firstly, adhering a semiconductor gallium arsenide wafer to the end face of the second optical fiber, and putting the semiconductor gallium arsenide wafer into an oven for curing;
then taking out the mixture from the oven, and mixing the glue with the reflective powder TiO2Mixing and stirring uniformly according to a certain proportion, coating the mixture outside a semiconductor gallium arsenide wafer, and integrally wrapping the semiconductor gallium arsenide wafer and the second optical fiber head.
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