CN111365641A - Miniature LED lamp, lamp group, series and parallel miniature LED lamp group - Google Patents
Miniature LED lamp, lamp group, series and parallel miniature LED lamp group Download PDFInfo
- Publication number
- CN111365641A CN111365641A CN202010291336.3A CN202010291336A CN111365641A CN 111365641 A CN111365641 A CN 111365641A CN 202010291336 A CN202010291336 A CN 202010291336A CN 111365641 A CN111365641 A CN 111365641A
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- Prior art keywords
- light
- led lamp
- emitting component
- conductive metal
- micro led
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- 239000007787 solid Substances 0.000 claims abstract description 37
- 239000002184 metal Substances 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000011521 glass Substances 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 229910001174 tin-lead alloy Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims 2
- 238000004021 metal welding Methods 0.000 abstract description 15
- 239000000428 dust Substances 0.000 abstract description 8
- 238000000151 deposition Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 description 6
- 230000003670 easy-to-clean Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 101000905241 Mus musculus Heart- and neural crest derivatives-expressed protein 1 Proteins 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a miniature LED lamp, a lamp group, a serial and parallel miniature LED lamp group, which comprises a conductive metal welding foot, a light-emitting component and a contact, wherein the conductive metal welding foot is fixedly connected to a solid carrier, the contact is in electric contact with a power supply, the solid carrier and the light-emitting component are in point connection or line connection or surface connection through the conductive metal welding foot so that the light-emitting component is fixed on the solid carrier, the light-emitting component forms a built-in light-emitting surface, the built-in light-emitting surface is arranged towards the direction of the solid carrier, and a light-transmitting plate is arranged on the side surface. The light transmitting plate protects the built-in luminous surface formed by the luminous component, prevents the external world from directly contacting with the built-in luminous surface, prolongs the service life of the built-in luminous surface, and simultaneously can prevent dust from depositing on the built-in luminous surface. The single light beam emitted by the built-in light emitting surface of the light emitting component irradiates the surface of the solid object, and is dispersed into a plurality of light beams through reflection, so that the irradiation range of the miniature LED lamp is enlarged, the light intensity is reduced, and the light beams are prevented from dazzling.
Description
Technical Field
The invention relates to the technical field of LED lamps, in particular to a miniature LED lamp, a lamp set and serial and parallel miniature LED lamp sets.
Background
A light emitting diode (led), which is a solid semiconductor device capable of converting electrical energy into visible light, can directly convert electricity into light. The heart of the LED is a semiconductor wafer, one end of the wafer is attached to a support, the other end of the wafer is a cathode, and the other end of the wafer is connected with an anode of a power supply, so that the whole wafer is packaged by epoxy resin.
The semiconductor wafer is composed of two parts, one of which is a P-type semiconductor in which holes predominate and the other of which is an N-type semiconductor in which electrons predominate. When the two semiconductors are connected, a P-N junction is formed between them. When current is applied to the wafer through the wire, electrons are pushed to the P region where they recombine with holes and then emit energy in the form of photons, which is the principle of LED lamp illumination. The wavelength of the light, i.e., the color of the light, is determined by the material forming the P-N junction.
As shown in fig. 1, a plurality of micro LED lamps are often welded on a flexible tape or other solid carriers to form a colorful decorative lamp, and the micro LED lamps are electrically connected with each other through a conductive material coated on the flexible tape or other solid carriers. As shown in fig. 2, the micro LED lamp is fixedly connected to the fixed object 1 through the solder leg 2, and the external light emitting surface 4 of the micro LED lamp is arranged away from the solder leg 2. The external light emitting surface 4 of the miniature LED lamp with the structure is not covered by objects, and the internal light emitting surface 4 of the miniature LED lamp is easy to accumulate dust and is not easy to clean.
Disclosure of Invention
The invention aims to provide a micro LED lamp which is provided with a light transmitting plate and protects a built-in light emitting surface formed by a light emitting component.
In order to achieve the purpose, the invention adopts the technical scheme that: miniature LED lamp, including the contact that is used for electrically conductive metal leg, light-emitting component of fixed connection on the solid-state thing, with the power electrical contact, through electrically conductive metal leg point connection or line connection or face connection between solid-state thing and the light-emitting component so that light-emitting component is fixed in on the solid-state thing, light-emitting component forms a built-in light emitting area, built-in light emitting area sets up towards solid-state thing direction, light-emitting component is equipped with the light-passing board on deviating from the side of built-in light emitting area. The light transmitting plate protects the built-in luminous surface formed by the luminous component, prevents the external world from directly contacting with the built-in luminous surface, prolongs the service life of the built-in luminous surface, and simultaneously can prevent dust from depositing on the built-in luminous surface. The surface of the light-transmitting plate is flat, dust is easy to clean, and the miniature LED lamp can be kept clean for a long time. The single light beam emitted by the built-in light emitting surface of the light emitting component irradiates the surface of the solid object, and is dispersed into a plurality of light beams through reflection, so that the irradiation range of the miniature LED lamp is enlarged, the light intensity is reduced, and the light beams are prevented from dazzling.
As a further improvement of the present invention, the light-transmitting plate extends along the shape of the light-emitting assembly to form a groove for placing the light-emitting assembly, so that the protection effect of the light-transmitting plate on the light-emitting assembly is improved. The arrangement of the structure can increase the contact area of the light-transmitting plate to the light-emitting component and improve the protection effect of the light-transmitting plate to the light-emitting component.
As a further improvement of the invention, the light-transmitting plate is a glass plate. The glass plate has good light transmission, less energy absorption to the light source and reduced light energy loss of the LED lamp.
As a further improvement of the invention, the conductive metal welding foot extends along the side surface of the light-emitting component to form an L shape, and the conductive metal welding foot is electrically connected with the contact welding.
As a further improvement of the invention, the conductive metal leg extends along the side of the light emitting component to form an "Contraband" shape, and the conductive metal leg is electrically connected with the contact pad.
As a further improvement of the invention, the material of the conductive metal welding foot is at least one of copper, tin-lead alloy and nickel. The copper, tin-lead alloy or nickel has good welding performance and good conductivity, and is not easy to be oxidized to generate an oxide film layer.
The invention also aims to provide a miniature LED lamp set which is provided with a light transmitting plate and protects a built-in light emitting surface formed by a light emitting component.
In order to achieve the purpose, the invention adopts the technical scheme that: the miniature LED lamps are connected in a circuit mode through a circuit coated on the solid carrier. The contact of the miniature LED lamp is electrically connected with the circuit contact coated on the solid carrier, the miniature LED lamps are arranged according to a certain arrangement rule and are electrically connected on the circuit, and the closing of the miniature LED lamps can be simultaneously controlled by only one switch.
The invention further aims to provide a micro LED lamp group which is connected with the micro LED lamp group in series stably and electrically.
In order to achieve the purpose, the invention adopts the technical scheme that: series connection miniature LED banks, including miniature LED lamp, including be used for electrically conductive metal leg, light-emitting component of fixed connection on the solid matter, with the contact of power electrical contact, through electrically conductive metal leg point connection or line connection or face connection between solid matter and the light-emitting component so that light-emitting component is fixed in on the solid matter, light-emitting component forms a built-in light emitting area, built-in light emitting area sets up towards the solid matter direction, light-emitting component deviates from and is equipped with the light-passing board on the side of built-in light emitting area. The conductive metal welding foot extends along the side surface of the light-emitting component to form an L shape, and the conductive metal welding foot is in electric contact connection with the contact. The adjacent miniature LED lamps are electrically connected through conductive metal welding feet in a contact mode, and the miniature LED lamps are electrically connected in series.
The fourth purpose of the invention is to provide a parallel connection micro LED lamp set with stable electrical connection.
In order to achieve the purpose, the invention adopts the technical scheme that: parallelly connected miniature LED banks, including miniature LED lamp, including be used for conductive metal leg, the light-emitting component of fixed connection on the solid matter, with the contact of power electrical contact, through conductive metal leg point connection or line connection or face connection between solid matter and the light-emitting component so that light-emitting component is fixed in on the solid matter, light-emitting component forms a built-in light emitting area, built-in light emitting area sets up towards the solid matter direction, light-emitting component deviates from and is equipped with the light-passing board on the side of built-in light emitting area. The conductive metal leg extends along the side of the light emitting element to form an "Contraband" shape and is in electrical contact with the contact. The adjacent miniature LED lamps are electrically connected through conductive metal welding feet in a contact mode, and the miniature LED lamps are electrically connected in parallel.
The contact has a small theoretical area in contact with the circuit, and the surface of the contact is provided with an oxide film layer to form tiny bulges. Moreover, the conductivity of the oxide film layer is far lower than that of metal, so that the contact resistance between the contact and the circuit is large, the contact area is small, and the circuit stability is low. The conductive metal welding foot is directly connected with the contact in a welding way, so that the contact and the conductive metal welding foot have no contact resistance. Moreover, the miniature LED lamp array is arranged on the fixed object, and is directly electrically connected through the contact of the conductive metal welding feet (the connection without a flat cable), the electric connection contact area is large, the contact resistance is small, and the circuit stability is obviously improved.
Compared with the prior art, the invention has the beneficial effects that: the light transmitting plate protects the built-in luminous surface formed by the luminous component, prevents the external world from directly contacting with the built-in luminous surface, prolongs the service life of the built-in luminous surface, and simultaneously can prevent dust from depositing on the built-in luminous surface. The surface of the light-transmitting plate is flat, dust is easy to clean, and the miniature LED lamp can be kept clean for a long time. The single light beam emitted by the built-in light emitting surface of the light emitting component irradiates the surface of the solid object, and is dispersed into a plurality of light beams through reflection, so that the irradiation range of the miniature LED lamp is enlarged, the light intensity is reduced, and the light beams are prevented from dazzling.
Drawings
FIG. 1 is a schematic structural diagram of a micro LED lamp in the background art;
FIG. 2 is a cross-sectional view of a micro LED lamp according to example 1;
FIG. 3 is a cross-sectional view of a micro LED lamp according to example 3;
FIG. 4 is a cross-sectional view of a micro LED lamp according to example 4;
FIG. 5 is a cross-sectional view of a series micro LED lamp assembly according to example 3;
FIG. 6 is a cross-sectional view of a parallel micro LED lamp set according to embodiment 4.
The reference numerals are explained below: 1. fixing the object; 2. welding feet; 4. an external luminous surface; 5. a light emitting assembly; 6. a built-in luminous surface; 7. a light-transmitting plate; 8. a conductive metal leg; 9. and (4) a contact.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. In which like parts are designated by like reference numerals. It should be noted that as used in the following description, the terms "front," "back," "left," "right," "upper," and "lower" refer to directions in the drawings, and the terms "bottom" and "top," "inner," and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.
Example 1:
as shown in the figure, miniature LED lamp, including being used for conductive metal leg 8 of fixed connection on solid object 1, light-emitting component 5, with the contact 9 of power electrical contact, solid object 1 and light-emitting component 5 between through 8 point connections of conductive metal leg or line connection or surface connection so that light-emitting component 5 is fixed in on solid object 1, light-emitting component 5 forms a built-in light emitting area 6, built-in light emitting area 6 sets up towards 1 direction of solid object, be equipped with the glass board on the side that light-emitting component 5 deviates from built-in light emitting area 6. The glass plate protects the built-in luminous surface 6 formed by the luminous component 5, prevents the outside from directly contacting with the built-in luminous surface 6, prolongs the service life of the built-in luminous surface 6, and simultaneously can prevent dust from depositing on the built-in luminous surface 6. The surface of the glass plate is flat, dust is easy to clean, and the miniature LED lamp can be kept clean for a long time. The single light beam emitted by the light emitting surface 6 arranged in the light emitting component 5 irradiates the surface of the solid carrier 1, and is dispersed into a plurality of light beams through the reflection action, so that the irradiation range of the miniature LED lamp is enlarged, the light intensity is reduced, and the dazzling of the light beams is prevented.
The glass plate extends along the outline of the light emitting component 5 to form a groove for placing the light emitting component 5, so that the protection effect of the glass plate on the light emitting component 5 is improved. The arrangement of the structure can increase the contact area of the glass plate to the light-emitting component 5 and improve the protection effect of the glass plate to the light-emitting component 5.
Example 2:
the micro LED lamp group, the micro LED lamps in example 1, were electrically connected to each other by a circuit coated on the solid support 1. The contact 9 of the miniature LED lamp is electrically connected with a circuit coated on the solid carrier 1 in a contact manner, the miniature LED lamps are arranged according to a certain arrangement rule and are electrically connected on the circuit, and the miniature LED lamps can be simultaneously controlled to be closed only by one switch.
Example 3:
series connection miniature LED banks, including miniature LED lamp, including being used for conductive metal leg 8 of fixed connection on solid load 1, light emitting component 5, contact 9 with the power electrical contact, solid load 1 and light emitting component 5 between through 8 point connections of conductive metal leg or line connection or surface connection so that light emitting component 5 is fixed in solid load 1 on, light emitting component 5 forms a built-in light emitting area 6, built-in light emitting area 6 sets up towards 1 direction of solid load, be equipped with the glass board on the side that light emitting component 5 deviates from built-in light emitting area 6. The conductive metal leg 8 extends along the side of the light emitting element 5 to form an "L" shape, and the conductive metal leg 8 is electrically connected to the contact 9. The adjacent miniature LED lamps are electrically connected in a contact manner through the conductive metal welding feet 8, and the miniature LED lamps are electrically connected in series.
Example 4:
parallelly connected miniature LED banks, including miniature LED lamp, including being used for conductive metal leg 8 of fixed connection on solid-borne thing 1, light emitting component 5, contact 9 with the power electrical contact, solid-borne thing 1 and light emitting component 5 between through 8 point connections of conductive metal leg or line connection or surface connection so that light emitting component 5 is fixed in solid-borne thing 1 on, light emitting component 5 forms a built-in light emitting area 6, built-in light emitting area 6 sets up towards 1 direction of solid-borne thing, be equipped with the glass board on the side that light emitting component 5 deviates from built-in light emitting area 6. The conductive metal leg 8 extends along the side of the light emitting element 5 to form an "Contraband" shape, and the conductive metal leg 8 is electrically connected to the contact 9. The adjacent miniature LED lamps are in contact and electric connection through the conductive metal welding feet 8, and the miniature LED lamps are in parallel and electric connection.
While one embodiment of the present invention has been described in detail, the description is only a preferred embodiment of the present invention and should not be taken as limiting the scope of the invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
Claims (10)
1. Miniature LED lamp, including conductive metal leg (8), light-emitting component (5) that are used for fixed connection on solid object (1), with contact (9) of power electrical contact, its characterized in that, on solid object (1) is fixed in solid object (1) through conductive metal leg (8) point connection or line connection or face connection between solid object (1) and light-emitting component (5) so that light-emitting component (5), light-emitting component (5) form a built-in light emitting area (6), built-in light emitting area (6) set up towards solid object (1) direction, be equipped with light-passing board (7) on light-emitting component (5) deviates from the side of built-in light emitting area (6).
2. The micro LED lamp according to claim 1, wherein the light-transmitting plate (7) extends along the shape of the light-emitting component (5) to form a groove for placing the light-emitting component (5), so that the light-transmitting plate (7) has an improved protection effect on the light-emitting component (5).
3. The micro LED lamp according to claim 1, wherein the light-transmitting plate (7) is a glass plate.
4. The micro LED lamp according to claim 1, wherein the conductive metal leg (8) extends along a side surface of the light emitting component (5) to form an "L" shape, and the conductive metal leg (8) is electrically connected to the contact (9) by soldering.
5. The micro LED lamp according to claim 1, wherein the conductive metal leg (8) extends along the side of the light emitting assembly (5) to form an "Contraband" shape, and the conductive metal leg (8) is electrically connected to the contact (9) by soldering.
6. The micro LED lamp according to claim 4, wherein the conductive metal solder foot (8) is made of at least one of copper, tin-lead alloy and nickel.
7. The micro LED lamp according to claim 5, wherein the conductive metal solder foot (8) is made of at least one of copper, tin-lead alloy and nickel.
8. The micro LED lamp group comprises the micro LED lamps as claimed in any one of claims 1 to 7, and the micro LED lamps are connected with each other through a circuit coated on a solid object (1).
9. Series micro LED lamp group comprising the micro LED lamps of claim 4 or 6, adjacent micro LED lamps are electrically connected through conductive metal leg (8) contacts, and the micro LED lamps are electrically connected in series.
10. Parallel micro LED lamp group comprising micro LED lamps according to claim 5 or 7, adjacent micro LED lamps being electrically connected by means of conductive metal foot (8) contacts, the micro LED lamps being electrically connected in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010291336.3A CN111365641A (en) | 2020-04-14 | 2020-04-14 | Miniature LED lamp, lamp group, series and parallel miniature LED lamp group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010291336.3A CN111365641A (en) | 2020-04-14 | 2020-04-14 | Miniature LED lamp, lamp group, series and parallel miniature LED lamp group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111365641A true CN111365641A (en) | 2020-07-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010291336.3A Pending CN111365641A (en) | 2020-04-14 | 2020-04-14 | Miniature LED lamp, lamp group, series and parallel miniature LED lamp group |
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| CN (1) | CN111365641A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10308890A1 (en) * | 2003-02-28 | 2004-09-09 | Opto Tech Corporation | A housing structure with a substrate, two electrodes, and a transparent insulated carrier with a depression useful for light emitting diodes |
| JP2012109529A (en) * | 2010-09-16 | 2012-06-07 | Hitachi Cable Ltd | Substrate for mounting semiconductor light-emitting element, and semiconductor light-emitting device using the same |
| CN104241502A (en) * | 2014-09-22 | 2014-12-24 | 圆融光电科技有限公司 | LED packaging structure |
| JP2015038963A (en) * | 2013-07-19 | 2015-02-26 | 日亜化学工業株式会社 | Light emitting device and manufacturing method of the same |
| CN209101064U (en) * | 2018-10-24 | 2019-07-12 | 铜陵国展电子有限公司 | A kind of LED light strip of multifaceted light-emitting |
| CN212132090U (en) * | 2020-04-14 | 2020-12-11 | 杭州亿奥光电有限公司 | Miniature LED lamp, lamp group, series and parallel miniature LED lamp group |
-
2020
- 2020-04-14 CN CN202010291336.3A patent/CN111365641A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10308890A1 (en) * | 2003-02-28 | 2004-09-09 | Opto Tech Corporation | A housing structure with a substrate, two electrodes, and a transparent insulated carrier with a depression useful for light emitting diodes |
| JP2012109529A (en) * | 2010-09-16 | 2012-06-07 | Hitachi Cable Ltd | Substrate for mounting semiconductor light-emitting element, and semiconductor light-emitting device using the same |
| JP2015038963A (en) * | 2013-07-19 | 2015-02-26 | 日亜化学工業株式会社 | Light emitting device and manufacturing method of the same |
| CN104241502A (en) * | 2014-09-22 | 2014-12-24 | 圆融光电科技有限公司 | LED packaging structure |
| CN209101064U (en) * | 2018-10-24 | 2019-07-12 | 铜陵国展电子有限公司 | A kind of LED light strip of multifaceted light-emitting |
| CN212132090U (en) * | 2020-04-14 | 2020-12-11 | 杭州亿奥光电有限公司 | Miniature LED lamp, lamp group, series and parallel miniature LED lamp group |
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